EP2164090B1 - Panneau d'affichage à plasma - Google Patents

Panneau d'affichage à plasma Download PDF

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Publication number
EP2164090B1
EP2164090B1 EP08721766A EP08721766A EP2164090B1 EP 2164090 B1 EP2164090 B1 EP 2164090B1 EP 08721766 A EP08721766 A EP 08721766A EP 08721766 A EP08721766 A EP 08721766A EP 2164090 B1 EP2164090 B1 EP 2164090B1
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EP
European Patent Office
Prior art keywords
display panel
plasma display
hermetically
sealing
panels
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
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EP08721766A
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German (de)
English (en)
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EP2164090A4 (fr
EP2164090A1 (fr
Inventor
Eiichi Iijima
Muneto Hakomori
Toshiharu Kurauchi
Takanobu Yano
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Ulvac Inc
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Ulvac Inc
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Publication of EP2164090A4 publication Critical patent/EP2164090A4/fr
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/10—AC-PDPs with at least one main electrode being out of contact with the plasma
    • H01J11/12—AC-PDPs with at least one main electrode being out of contact with the plasma with main electrodes provided on both sides of the discharge space
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/48—Sealing, e.g. seals specially adapted for leading-in conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/26—Sealing together parts of vessels
    • H01J9/261—Sealing together parts of vessels the vessel being for a flat panel display

Definitions

  • the present invention relates to a technical field of a plasma display panel, and particularly to a technique which prevents impurity gas from entering a plasma display panel.
  • a main stream of the PDP is a three electrode surface discharge type panel which is made by adhering together a first panel (back plate) having an address electrode formed on a glass substrate and a second panel (front plate) having a sustain electrode and a scan electrode formed on a glass substrate.
  • reference numeral 110 shows a plasma display panel of conventional art and the plasma display panel 110 has first and second panels 120 and 130.
  • Fig. 11(a) is a plan view for illustrating the inside thereof and Fig. 11(b) is a cross-sectional view thereof.
  • the first and second panels 120 and 130 have first and second substrates 121 and 131 made of glass substrates and first and second wiring layers 122 and 132 arranged on the first and second substrates 121 and 131, respectively.
  • Partition walls 124 in a projecting bar shape are arranged on the first wiring layer 122, and the first and second panels 120 and 130 are arranged opposite to each other so as to have the partition walls 124 therebetween, with the first and second wiring layers 122 and 132 facing each other.
  • a ring-shaped sealing part 141 is disposed in the peripheries of the first and second panels 120 and 130 and the first and second panels 120 and 130 are fixed to each other by the sealing part 141.
  • Discharge gas is encapsulated between the first and second panels 120 and 130.
  • Discharge gas plasma is formed by forming plasma at a predetermined position between the partition wall 124 and the partition wall 124 when a voltage is applied across electrodes in the first and second wiring layers 122 and 132.
  • ultraviolet light emitted from the plasma irradiates a fluorescent layer disposed on the partition wall 124, the fluorescent layer emits light so as to output visible light to the outside.
  • Reference numeral 115 in Figs. 11 (a) and 11 (b) denotes a light emitting region from which the visible light is output to the outside.
  • Low melting point glass is used for the sealing material to form the sealing part 141, but the sealing material extricates a lot of impurity gas when heated and solidified because the low melting point glass contains an organic binder.
  • degassing is required to be carried out before the sealing and also, long time aging is necessary even after the first and second panels 120 and 130 have been sealed because a lot of gas is extricated in the sealing even if the degassing had been performed. This causes the panel production to have a limited throughput and to require large amounts of electricity.
  • the purity deterioration of the discharge gas causes a discharge voltage to increase.
  • Patent document 1 Japanese Patent Application Laid-Open Publication No. 2002-75197
  • Patent document 2 Japanese Patent Application Laid-Open Publication No. 2002-156160
  • Patent document 3 Japanese Patent Application Laid-Open Publication No. 2002-231129
  • Patent document 4 Japanese Patent Application Laid-Open Publication No. 2001-210258
  • JP-A-2002 163997 discloses a flat-panel display having a metal block located between two metal layers.
  • US-A-2008/0211408 discloses a plasma display panel (PDP) wherein the front panel and the back panel are sealed by a double sealing layer composed of a first enclosing layer and a second enclosing layer.
  • the present invention has been created for solving the above problem of the conventional technique, and aims for providing a technique which prevents impurity gas from entering the plasma display panel.
  • the operation principle of the plasma display panel utilizes gas discharge in an electric field similarly to that of a fluorescent tube for illumination.
  • the start voltage of the fluorescent tube becomes twice when H 2 molecules of the impurity gas are contained in even less than 1% in a discharge gas.
  • the impurity gas such as H 2 O H 2 , O 2 , CO, CO 2 , and N 2 affects various characteristics of the operation such as a start voltage, an operation voltage, brightness or the like.
  • H 2 O sometimes oxidizes a metal electrode of a DC-type PDP or affects the characteristic of an MgO film in an AC-type PDP.
  • the impurity gas such as H 2 O, or, CO 2 , or N 2 increases the operation voltage of the AC-type PDP when these impurity gasses are contained in 20 ppm or more. Further, there is a problem that some impurity gases deteriorate the material within a PDP cell.
  • the impurity gas is sometimes generated from the internal structure material or in the production process, in addition to the case that the impurity gas is originally contained in the discharge gas, and further, the impurity gas is sometimes extricated during light emission or comes from residual gas after exhaust.
  • the present invention provides a plasma display panel according to claim 1.
  • an embodiment of the present invention provides the plasma display panel wherein the resin in the sealing part is a thermosetting resin.
  • an embodiment of the present invention provides the plasma display panel wherein the resin in the sealing part is an ultraviolet curable resin.
  • an embodiment of the present invention provides the plasma display panel wherein the sealing part has a ring shape and surrounds the hermetically-sealed part.
  • an embodiment of the present invention provides the plasma display panel further including an exhaust opening provided between the sealing part and the hermetically-sealed part.
  • the present invention can prevent both of the impurity gases from entering the light emitting region.
  • the impurity gas which is transmitted through the adhesive sealing material enter the panels and the impurity gas which is extricated from the resin sealing material between the panels during the panel sealing process.
  • the ultraviolet light generated in the discharge is blocked by the hermetically-sealed part and does not irradiate the resin in the sealing part, it is possible to protect the resin in the sealing part and prevent the decomposition of the resin material, thereby enabling to prevent the purity deterioration of the discharge gas.
  • the ultraviolet curable resin can be used for the sealing part, it is possible to reduce the processing time required for the sealing.
  • the panels are made to adhere to each other with the resin sealing part, it is possible to minimize the amount of the low melting point metal required for the hermetically-sealed part compared to the case of making the panels adhere to each other by use of the hermetically-sealed part.
  • the hermetically-sealed part is provided with metal layers on the respective first and second panels and the metal layers are made to adhere to each other with the low melting point metal layer, it is possible to reduce the amount of the low melting point metal, such as, indium or the like used for the adhesion and hermetic sealing, and since the ultraviolet curable resin can be used for the sealing part, so that it is possible to reduce the processing time required for the sealing.
  • the low melting point metal such as, indium or the like used for the adhesion and hermetic sealing
  • the ultraviolet curable resin can be used for the sealing part, so that it is possible to reduce the processing time required for the sealing.
  • Fig. 1 is a cross-sectional view for illustrating a sealing state of a plasma display panel of the present invention, and the plasma display panel has first and second panels 20 and 30.
  • the first and second panels 20 and 30 have first and second substrates 21 and 31 made of transparent plates such as glass and fist and second wiring layers 22 and 32 arranged on the first and second substrates 21 and 31, respectively.
  • the shapes of the first and second substrates are rectangles or squares.
  • Partition walls 24 in a projecting bar shape are arranged on the first wiring layer 22, and the first and second panels 20 and 30 are arranged opposite to each other so as to have the partition walls 24 therebetween, with the first and second wiring layers 22 and 32 facing each other.
  • Each of the first and second panels 20 and 30 has a protection film of a SrO-20 mol% CaO evaporated film (thickness: 8,000 ⁇ ) formed on the surface thereof by EB evaporation, but the protection film is omitted from the drawing.
  • a ring-shaped hermetically-sealed part 17 is disposed in periphery of the first and second panels 20 and 30, and the light emitting region 15 where the partition wall 24 is located is surrounded by the hermetically-sealed part 17.
  • the ring-shaped hermetically-sealed part 17 has only to surround the inside, and the shape thereof includes various ring shapes such as a circular ring shape, rectangular ring shape, and other polygonal ring shape.
  • a sealing part 41 is disposed outside the hermetically-sealed part 17, and the first and second panels 20 and 30 are fixed to each other by the sealing part 41.
  • the hermetically-sealed part 17 has first and second ring-shaped metal layers 27 and 37 formed at positions facing each other on the first and secondpanels 20 and 30, respectively, and a ring-shaped low melting point metal layer 18 disposed between the first and second metal layers 27 and 37.
  • Fig. 2 is a diagram for illustrating the light emitting region 15 where the partition wall 24 is located. This light emitting region 15 is positioned between the first and second substrates 21 and 31, and performs the display of characters, graphics, or the like using the light emission of the plasma.
  • the first wiring layer 22 has a plurality of address electrodes 23 and an insulating film 26 disposed on the surface thereof.
  • the second wiring layer 32 has a plurality of surface discharge electrodes 33 (such as, a scan electrode and a sustain electrode) and an insulating film 36 disposed on the surface of the surface discharge electrode 33.
  • surface discharge electrodes 33 such as, a scan electrode and a sustain electrode
  • insulating film 36 disposed on the surface of the surface discharge electrode 33.
  • Fluorescent material is disposed on the side of the partition wall 24 and between the partition walls 24, and discharge gas is encapsulated in the light emitting region 15.
  • the address electrodes 23 and the surface discharge electrodes 33 are arranged in a lattice shape, and when a voltage is applied between the desired address electrode 23 and surface discharge electrode 33, the plasma 51 of the discharge gas is formed in a region sandwiched by the address electrode 23 and the surface discharge electrode 33 so as to emit ultraviolet light.
  • the emitted ultraviolet light irradiates the fluorescent material and visible light 52 is emitted from the fluorescent material.
  • the visible light 52 is transmitted through the second panel 30 and output to the outside.
  • the region sandwiched by the address electrode 23 and the surface discharge electrode 33 is called a cell, and the plurality (here, 300) of cells is formed in the plasma display panel 10 of the present invention similar to the plasma display panel 110 of the prior art shown in Figs. 11(a) and 11(b) .
  • Each of the cells is configured to emit light individually and characters or graphics are configured to be displayed by the light emission of the cell at a position indicated by the address electrode 23.
  • the first and second metal layers 27 and 37 are made to tightly adhere to the insulating films 26 and 36 on the first and second panels 20 and 30, respectively, and the first and second metal layers 27 and 37 are connected to each other with a low melting point metal layer 18 which is formed by melting and solidification.
  • the plasma display panel 10 is configured such that gas or moisture of atmosphere outside the plasma display panel 10 may not enter the light emitting region 15.
  • the production process of the plasma display panel 10 will be described as follows using the flowchart of Fig. 10 and the process charts of Figs. 8(a) to 8(c) and Figs. 9(a) and 9(b) . That is, as shown in Fig. 8(a) , the first wiring layer 22 and the partition wall 24 are formed on the first panel 20 (Step R 1 in Fig. 10 ), Cr vapor and Ag vapor are evaporated sequentially in this order from an evaporation source where Cr is applied and an evaporation source where Ag is applied, with a metal mask being placed onto the surface of the first panel 20, by the vacuum evaporation method so that the first metal layer 27 which is composed of a Cr thin film and an Ag thin film is formed as shown in Fig.
  • Step R 2 The film formation conditions of the Cr thin film and the Ag thin film are shown in the following Table 1.
  • Table 1 Formation condition of Cr thin film and Ag thin film Film forming material Cr Ag Attained pressure (Pa) 5. 0 ⁇ 10 -4 1.3 ⁇ 10 -4 Substrate heating temperature (°C) 250 250 EB output power (kw) 0.3 0.5 Pressure during evaporation (Pa) 1.3 ⁇ 10 -4 6.0 ⁇ 10 -4 Film forming rate (nm/s) 1 10
  • the thickness of the Cr thin film is 50 nm and the thickness of the Ag thin film is 1, 000 nm.
  • the first metal layer 27 may be formed by a printing method using Ag paste.
  • the Cr thin film is made to tightly adhere to the first substrate 21 and the Ag thin film is exposed on the surface of the first metal layer 27.
  • the ring-shaped low melting point metal 16 is disposed on the surface of the first metal layer 27 (Step R 3 ).
  • the low melting point metal 16 it is possible to use a metal or an alloy having a melting point of 250°C or lower (such as, In (melting point: 157°C), In 50%-Sn 50% alloy (melting point: 120°C), Sn 96.5%-Ag 3%-Cu 0.5% alloy (melting point 210°C), Sn 96.5%-Ag 3.5% alloy (melting point: 220°C) and Sn 100% (melting point: 232°C), or the like).
  • the low melting point metal 16 may be formed by screen printing, or a wire having a diameter of about 0.5 to 1 mm may be disposed on the surface of the first metal layer 27.
  • the first panel 20 is carried into a vacuum heating chamber, and vacuum exhaust and degassing are carried out (Step R 4 ).
  • the sealing material is an ultraviolet curable type epoxy resin.
  • the second wiring layer 32 is formed on the second substrate 31 (Step S 1 ) ; a metal mask is placed on the second panel 30, a ring-shaped Cr thin film and Ag thin film are accumulated sequentially in this order by the evaporation method similar to the first panel 20, and then, the second metal layer 37 composed of the Cr thin film and Ag thin film is formed as shown in Fig. 9(b) (Step S 2 ).
  • the first metal layer 27, the low melting point metal 16, and the second metal layer 37 have the same size ring shapes and are configured to overlap with each other.
  • the second panel 30 after the formation of the second metal layer 37 is carried into a degassing chamber and heated in a vacuum ambience to be degassed (Step S 3 ) .
  • a protection film such as, Sr-CaO or MgO is formed on a region inside the second metal layer 37 on the second panel 30 by EB evaporation (Step S 4 ), and the second panel 30 is carried into the vacuum heating chamber in which the first panel 20 has been carried.
  • the surfaces thereof where the first and second metal layers 27 and 37 are formed are made to face each other, and the first and second panels 20 and 30 are overlapped with each other by alignment so as to position the second metal layer 37 onto the low melting point metal 16 on the first panel 20.
  • first and second metal layers 27 and 37 face each other sandwiching the low melting point metal 16 and the first and second metal layers 27 and 37 are in close contact with the low melting point metal 16.
  • the first and second panels 20 and 30 are pressurized in a vacuum ambience while the first and second panels 20 and 30 are heated at a part where the first and second metal layers 27 and 37 are disposed.
  • the low melting point metal 16 is composed of a metal (either single metal or alloy) having a melting point lower than the melting points of the first and second metal layers 27 and 37.
  • the surfaces of the first and second metal layers 27 and 37 and the melted low melting point metal 16 have a good wettability, and when the low melting point metal 16 is melted, the melted material spreads over the first and second metal layers 27 and 37 and is solidified to form the low melting point metal layer 18.
  • the first and second metal layers 27 and 37 are made to adhere to each other by the low melting point metal layer 18.
  • the ring-shaped hermetically-sealed part 17 is formed by a metal film (accumulated film) accumulated with the first and second metal layers 27 and 37 and the low melting point metal layer 18, each of which has a ring shape, and the light emitting region 15 is surrounded by the hermetically-sealed part 17.
  • the first and second metal layers 27 and 37 are fixed to the first and second panels 20 and 30, respectively.
  • the formation condition of the hermetically-sealed part is shown in the following Table 2.
  • Table 2 Formation condition of hermetically-sealed part Attained pressure (Pa) 5.0 ⁇ 10 -4 Panel temperature increasing rate (°C/min) 20 Panel sealing temperature (°C) 175 Pressure at sealing (Pa) 5.0 ⁇ 10 -4 Sealing time (min) 1.0 Panel temperature decreasing rate(°C/min) 20 Take-out temperature (°C) 50
  • the first and second panels 20 and 30 are carried into a sealing chamber and the sealing material is applied.
  • the sealing material In the state after the formation of the hermetically-sealed part 17, the sealing material is in contact with both of the first and second panels 20 and 30, and when the sealing material is irradiated with ultraviolet light and solidified to form the ring-shaped sealing part 41 outside the hermetically-sealed part 17, the first and second panels 20 and 30 are fixed to each other with a sufficient strength by the sealing part 41 (Step T 1 ).
  • the light emitting region 15 is surrounded by the hermetically-sealed part 17 and the light emitting region 15 has a vacuum ambience.
  • Reference numeral 20a of Fig. 3 shows an example of the arrangement state of the light emitting region 15, the hermetically-sealed part 17, and the sealing part 41 on the first substrate 21.
  • the sealing part 41 has a ring shape.
  • the hermetically-sealed part 17 and the light emitting region 15 are disposed within the sealing part 41.
  • the first and second panels 20 and 30 may be fixed to each other by a plurality of sealing parts 41 1 to 41 4 separated from each other as shown by reference numerals 20c and 20d in Figs. 5(a) and 5(b) .
  • the spacing between the plurality of sealing parts 41 1 to 41 4 may be disposed at a corner part of the first substrate 21 as shown by reference numeral 20c in Fig. 5(a) , or may be disposed in a side part as shown by reference numeral 20d in Fig. 5(b) .
  • dot-like sealing parts 41n may be disposed around the hermetically-sealed part 17 as shown by reference numeral 20e in Fig. 5(c) .
  • the discharge gas is introduced into the light emitting region 15.
  • a gas introduction opening is provided passing through the first panel 20 in the thickness direction at a position inside the hermetically-sealed part 17 in the first panel 20.
  • Thedischarge gas enters a region surrounded by the hermetically-sealed part 17 from the gas introduction opening, and the light emitting region 15 is filled with the discharge gas.
  • the light emitting region is hermetically sealed by the first and second panels 20 and 30 and the hermetically-sealed part 17 so that the light emitting region is isolated from the outside atmosphere while being filled with the discharge gas. Then, the plasma display panel 10 of Fig. 1 is obtained (Step T 2 ). After hermetically sealed, the plasma display panel 10 is carried outside the sealing chamber.
  • an auxiliary exhaust opening 28 is provided passing through the first or second panel 20 or 30 in the thickness direction at a position between the hermetically-sealed part 17 and the sealing part 41 in either one of or both of the first and second panels 20 and 30, so that the portion between the hermetically-sealed part 17 and the sealing part 41 is not provided with an increased pressure or reduced pressure by the change of atmosphere temperature.
  • the discharge voltage of the conventional plasma display panel 110 ( Fig. 11 ), which does not have the hermetically-sealed part 17 and has the light emitting region isolated from the outside atmosphere by use of the resin material sealing part, was measured under the same condition.
  • a relationship between the storage time and the discharge voltage is shown in Fig. 6(b) .
  • the final cell light-on voltage is a drive voltage required for starting the discharge of all the cells.
  • the first cell light-off voltage is a voltage at which the first cell puts the light off when the drive voltage is reduced gradually from the state of the light-on in all the cells.
  • both of the final cell light-on voltage and the first cell light-off voltage increase considerably in a short time storage for the plasma display panel 110 of the conventional art. This is supposedly because moisture in the constant temperature-and-humidity chamber was transmitted through the sealing part 141 to enter between the first and second panels 120 and 130 and the purity of the discharge gas was deteriorated.
  • the voltage change is within 5 V even when the storage time is increased, and it is apparent that the impurity gas (moisture) transmitted through the sealing part 41 was prevented from entering the light emitting region 15 by the hermetically-sealed part 17.
  • the conventional plasma display panel 110 as well as the plasma display panel of the present invention was processed within the vacuum ambience without being taken out to the air atmosphere from the protection film formation to the discharge gas introduction and sealing.
  • the plasma display panel 10 of the present invention was carried into the constant temperature-and-humidity chamber at 50°C and 50% humidity and stored in the state that the light was emitted by the voltage application to the electrode, and the discharge voltage was measured.
  • a relationship between a time of voltage application to the electrode (aging time) and the discharge voltage is shown in Fig. 7(a) .
  • the discharge voltage of the conventional plasma display panel 110 ( Fig. 11 ), which does not have the hermetically-sealed part 17 and has the light emitting region isolated from the outside atmosphere by use of the resin material sealing part, was measured under the same condition.
  • a relationship between the aging time and the discharge voltage is shown in Fig. 7(b) .
  • the voltage increase is 10 V or smaller even when the aging time reaches 2,000 hours. This is supposedly because the ultraviolet light emitted from the plasma was blocked by the hermetically-sealed part 17 not to irradiate the sealing part 41 so that the sealing part 41 was not decomposed, and the impurity gas was prevented from being extricated.
  • the discharge voltage increases along with the increase of the aging time and the final cell light-on voltage increases by about 30 V after an aging time of 2,000 hours. This is supposedly because the ultraviolet light generated by the PDP discharge irradiated into the sealing material for long hours to decompose the resin material contained in the sealing material, and the impurity gas of the CH-series was extricated into the PDP to deteriorate the purity of the discharge gas.
  • thermosetting type may be used.
  • first and second substrates 21 and 31 were glass substrates in the above examples, the present invention is not limited thereto and another material can be used as far as the second substrate 31 is transparent.
  • a method of producing a plasma display panel which is not part of the present invention can be applied to the PDP production process using MgO protection film which includes an air atmosphere process, in addition to a PDP production process by vacuum consecutive processing equipment. Furthermore, such a process can be utilized for the sealing methods of FED (Field Emission Display) and SED (Surface-Conduction Electron-Emitter Display).
  • FED Field Emission Display
  • SED Surface-Conduction Electron-Emitter Display

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)

Claims (5)

  1. Panneau d'affichage à plasma comprenant:
    des premier et second panneaux (20; 30) ayant des premier et second substrats (21; 31), respectivement, et agencés pour se faire face;
    une région émettrice de lumière (15) située entre les premier et second substrats;
    une partie d'étanchéité (41) située à l'extérieur de la région émettrice de lumière et incluant de la résine qui fixe les premier et second panneaux l'un à l'autre; et
    une partie hermétiquement scellée (17) incluant un film métallique de forme annulaire entourant la région d'émission de lumière, où la partie d'étanchéité est située à l'extérieur de la partie hermétiquement scellée, et la région émettrice de lumière (15) et la partie hermétiquement scellée (17) se situent à l'intérieur de la partie d'étanchéité (41), caractérisé en ce que
    la partie hermétiquement scellée comprend en outre:
    des première et seconde couches métalliques (27; 37) adhérant étroitement au premier et second panneaux, respectivement; et
    une couche métallique d'un point de fusion bas (18) située entre les première et seconde couches métalliques et ayant un point de fusion inférieur à celui des première et seconde couches métalliques de manière à amener les première et seconde couches métalliques à adhérer l'une à l'autre, où les première et seconde couches métalliques (27; 37) sont fixées au premier et second panneau (20; 30), respectivement.
  2. Panneau d'affichage à plasma selon la revendication 1, dans lequel la résine dans la partie de scellement est une résine thermodurcissable.
  3. Panneau d'affichage à plasma selon la revendication 1, dans lequel la résine dans la partie d'étanchéité est une résine durcissable par les rayons ultraviolets.
  4. Panneau d'affichage à plasma selon la revendication 1, dans lequel la partie d'étanchéité a une forme annulaire et entoure la partie hermétiquement scellée.
  5. Panneau d'affichage à plasma selon la revendication 4, comprenant en outre une ouverture d'échappement réalisée entre la partie d'étanchéité et la partie hermétiquement scellée.
EP08721766A 2007-03-19 2008-03-11 Panneau d'affichage à plasma Not-in-force EP2164090B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007071006 2007-03-19
PCT/JP2008/054350 WO2008114645A1 (fr) 2007-03-19 2008-03-11 Panneau d'affichage à plasma

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EP2164090A1 EP2164090A1 (fr) 2010-03-17
EP2164090A4 EP2164090A4 (fr) 2010-07-28
EP2164090B1 true EP2164090B1 (fr) 2012-11-28

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EP (1) EP2164090B1 (fr)
JP (1) JP4505548B2 (fr)
KR (1) KR101109094B1 (fr)
CN (1) CN101669185B (fr)
RU (1) RU2401476C1 (fr)
WO (1) WO2008114645A1 (fr)

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WO2011142138A1 (fr) * 2010-05-13 2011-11-17 パナソニック株式会社 Panneau d'affichage plasma et son procédé de production

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JP4654520B2 (ja) 2001-02-06 2011-03-23 パナソニック株式会社 プラズマディスプレイパネルおよびその製造方法
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EP2164090A4 (fr) 2010-07-28
CN101669185B (zh) 2012-08-01
EP2164090A1 (fr) 2010-03-17
KR101109094B1 (ko) 2012-05-30
JPWO2008114645A1 (ja) 2010-07-01
KR20090116800A (ko) 2009-11-11
RU2401476C1 (ru) 2010-10-10
CN101669185A (zh) 2010-03-10
WO2008114645A1 (fr) 2008-09-25

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