EP2127507A1 - Procédé de fabrication de surfaces structurées électro-conductrices - Google Patents

Procédé de fabrication de surfaces structurées électro-conductrices

Info

Publication number
EP2127507A1
EP2127507A1 EP08701541A EP08701541A EP2127507A1 EP 2127507 A1 EP2127507 A1 EP 2127507A1 EP 08701541 A EP08701541 A EP 08701541A EP 08701541 A EP08701541 A EP 08701541A EP 2127507 A1 EP2127507 A1 EP 2127507A1
Authority
EP
European Patent Office
Prior art keywords
base layer
laser
particles
dispersion
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08701541A
Other languages
German (de)
English (en)
Inventor
Rene Lochtman
Jürgen Kaczun
Norbert Wagner
Jürgen PFISTER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF SE
Original Assignee
BASF SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BASF SE filed Critical BASF SE
Priority to EP08701541A priority Critical patent/EP2127507A1/fr
Publication of EP2127507A1 publication Critical patent/EP2127507A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Definitions

  • the invention relates to a method for producing structured, electrically conductive surfaces on a substrate.
  • the method according to the invention is suitable, for example, for producing conductor tracks on printed circuit boards, RFID antennas, transponder antennas or other antenna structures, chip card modules, flat cables, seat heaters, foil conductors, printed conductors in solar cells or in LCD or plasma picture screens, or galvanically coated products in any desired form , Also, the method is useful for making decorative or functional surfaces on products that can be used, for example, to shield from electromagnetic radiation, to conduct heat, or to package. Finally, thin metal foils or one or two-sided metal-clad polymer carriers can also be produced by the process.
  • a method for producing images on printed circuit boards is known, for example, from DE-A 40 10 244.
  • a conductive ink is first applied to the generally electrically non-conductive printed circuit board.
  • the conductor pattern is machined out of the conductive ink.
  • the pattern is metallized.
  • the conductive ink is a two-component paint containing metal particles.
  • suitable metal particles for example, iron or nickel powder may be mentioned.
  • a method for producing printed conductors in which first a printed circuit board is coated with a conductive ink and subsequently the printed conductors are modeled from the ink with a laser, is also known, for example, from US-A 2003/0075532.
  • the ink contains a paste loaded with conductive particles.
  • conductive particles are, for example, metal particles or non-metallic particles, such as carbon particles called.
  • a thickness of about 75 to 100 microns is called.
  • EP-A 0 415 336 also relates to a method for producing printed conductors in which a conductive paste is first applied to a non-conductor and subsequently the printed conductors are modeled using a laser. Again, a large layer thickness is necessary to produce a conductor track.
  • an activation layer with a sufficient electrical potential is first of all produced Conductivity applied. From this, the desired trace course is structured using a laser. For example, thin metal films may be applied to the activation layer.
  • the conductivity of the activation layer is achieved, for example, by using polymerized or copolymerized pyrrole, furan, thiophene or other derivatives.
  • metal sulfide or metal polysulfide layers as well as palladium or copper catalysts.
  • the disadvantage of many organic activation layers is the low adhesion to many carriers and the low thermal stability in the application, for example, soldering to printed circuit boards.
  • the object of the invention is to provide a simple, cost-effective and productive alternative method by which electrically conductive, structured surfaces can be produced on a support, these surfaces being homogeneous and continuously electrically conductive.
  • the object is achieved by a method for producing structured, electrically conductive surfaces on a substrate, which comprises the following steps:
  • An advantage of the method according to the invention is that in addition to two-dimensional and three-dimensional electronic circuit substrate, for example 3D molded interconnect devices or the interior of device housings with tracks can be provided with an extremely fine structure.
  • all surfaces can be processed one after another by either bringing the object to be coated into the correct position or by controlling the laser beam accordingly.
  • a substrate to which the electrically conductive, structured surface is applied for example, rigid or flexible substrates are suitable.
  • the substrate is not electrically conductive.
  • Suitable substrates are, for example, reinforced or unreinforced polymers, as are commonly used for printed circuit boards.
  • Suitable polymers are epoxy resins, or modified epoxy resins, for example bifunctional or polyfunctional bisphenol A or bisphenol F resins, epoxy novolac resins, brominated epoxy resins, aramid-reinforced or glass-fiber reinforced or paper-reinforced epoxy resins (for example FR4), glass fiber reinforced plastics, liquid cristal polymers (LCP), polyphenylene sulfides (PPS), polyoxymethylenes (POM), polyaryletherketones (PAEK), polyetheretherketones (PEEK), polyamides (PA), polycarbonates (PC), polybutylene terephthalates (PBT), polyethylene terephthalates (PET), polyimides (PI) , Polyimide resins, cyanate esters, bismaleimide
  • suitable substrates composites, foam-like polymers, polystyrene ®, styrodur ®, polyurethanes (PU), ceramic surfaces, textiles, paperboard, cardboard, paper, polymer coated paper, wood, mineral materials, silicon, glass, plant tissue and animal tissue.
  • a base layer is applied, which contains electroless and / or galvanically coatable particles.
  • the base layer is patterned by ablation in accordance with a predetermined structure with a laser.
  • Suitable lasers are commercially available. All lasers, such as pulsed or continuous gas, solid-state, diode or excimer lasers can be used, provided that the base layer sufficiently absorbs the laser radiation and the laser power is sufficient, the ablation threshold at which the material of the base layer at least partially decomposes or at least partially evaporated, to exceed.
  • pulsed or continuous IR lasers for example CO 2 lasers, Nd-Y AG lasers, Yb: YAG lasers, fiber or diode lasers.
  • a suitable laser generally has a power consumption of at least 30 W.
  • lasers with wavelengths in the visible or UV frequency range.
  • Such lasers are, for example, Ar lasers, HeNe lasers, frequency-multiplied solid-state IR lasers or excimer lasers, such as ArF lasers, KrF lasers, XeCI lasers or XeF lasers.
  • the focal diameter of the laser beam is between 1 ⁇ m and 100 ⁇ m, preferably between 5 ⁇ m and 50 ⁇ m.
  • the wavelength of the laser light is preferably in the range of 150 to 10,600 nm, particularly preferably in the range of 600 to 10,600 nm.
  • the regions of the base layer to be removed are removed from the base layer by means of a focused laser. It is also possible to produce the structure of the base layer using a mask arranged in the beam path of the laser or by means of an imaging method.
  • a dispersion which is currentless and / or galvanically coatable Contains particles in a matrix material, applied to the substrate to form the base layer.
  • the electrolessly and / or electrolytically coatable particles may be particles of any desired geometry made of any electrically conductive material, of mixtures of different electrically conductive materials or of mixtures of electrically conductive and non-conductive materials.
  • Suitable electrically conductive materials are, for example, carbon black, for example in the form of carbon black, graphite, graphenes or carbon nanotubes, electrically conductive metal complexes, conductive organic compounds or conductive polymers or metals, preferably zinc, nickel, copper, tin, cobalt, manganese , Iron, magnesium, lead, chromium, bismuth, silver, gold, aluminum, titanium, palladium, platinum, tantalum and alloys thereof, or metal mixtures containing at least one of these metals.
  • suitable alloys are CuZn, CuSn, CuNi, SnPb, SnBi, SnCo, NiPb, SnFe, ZnNi, ZnCo and ZnMn.
  • Particularly preferred are aluminum, iron, copper, silver, nickel, zinc, tin, carbon and mixtures thereof.
  • the electrolessly and / or electrolytically coatable particles preferably have an average particle diameter of from 0.001 to 100 ⁇ m, preferably from 0.005 to 50 ⁇ m, and particularly preferably from 0.01 to 10 ⁇ m.
  • the average particle diameter can be determined by means of laser diffraction measurement, for example on a Microtrac X100 device.
  • the distribution of the particle diameter depends on their production method. Typically, the diameter distribution has only one maximum, but several maxima are also possible.
  • electrolessly and / or electrolytically coatable particles are used which have a strong reflection in the range of the laser wavelength used, they are preferably provided with a coating ("coating").
  • Suitable coatings can be inorganic or organic.” Inorganic Coatings are, for example, SiC> 2 , phosphates or phosphides The material for the coating is chosen such that it only weakly reflects the laser light used.
  • the electrolessly and / or electrolytically coatable particles may also be coated with a metal or metal oxide.
  • the metal that makes up the particles may be partially oxidized, for example, in the case of iron, an iron oxide layer is applied to the iron particles by oxidizing the iron at the surface of the carbonyl iron powder is thus obtained.
  • an iron oxide layer is applied to the iron particles by oxidizing the iron at the surface of the carbonyl iron powder is thus obtained.
  • balls that are made of iron inside and have an oxide layer on the outer surface Due to the weak reflection of the surface of the particles contained in the base layer, the majority of the laser energy enters the base layer. Only the fraction reflected by the particles is lost for the removal of the base layer. As a result, the desired structure can be formed from the base layer with little expenditure of energy.
  • the metals are selected from the group consisting of aluminum, iron, copper, silver, nickel, tin and zinc.
  • the electrolessly and / or electrolytically coatable particles may also contain a first metal and a second metal, wherein the second metal is in the form of an alloy (with the first metal or one or more other metals), or the electroless and / or electrodepositable Particles containing two different alloys.
  • the shape of the electrolessly and / or electrolytically coatable particles has an influence on the properties of the dispersion after a coating.
  • the shape of the electrolessly and / or electrolytically coatable particles may be, for example, acicular, cylindrical, plate-shaped or spherical. These particle shapes represent idealized shapes, wherein the actual shape, for example due to production, may vary more or less strongly therefrom.
  • drop-shaped particles in the context of the present invention are a real deviation of the idealized spherical shape.
  • Electroless and / or electroplated particles having various particle shapes are commercially available.
  • the individual mixing partners can also have different particle shapes and / or particle sizes. It is also possible to use mixtures of only one type of electrolessly and / or electrolytically coatable particles having different particle sizes and / or particle shapes. In the case of different particle shapes and / or particle sizes, the metals aluminum, iron, copper, silver, nickel and zinc, and carbon are also preferred. When mixtures of particle shapes are used, mixtures of spherical particles with platelet particles are preferred. In one embodiment, for example, spherical carbonyl iron powder particles with platelet-shaped iron and / or copper particles and / or carbon nanotubes are used.
  • the electrolessly and / or electrolytically coatable particles in the form of their powders can be added to the dispersion.
  • Such powders for example metal powders
  • Such powders are common commercial products and can easily be produced by known methods, for example by electrolytic deposition or chemical relocation from solutions of metal salts or by reduction of an oxidic powder, for example by means of hydrogen, by spraying or atomizing a molten metal. especially in cooling media, such as gases or water. Preference is given to the gas and water atomization and the reduction of metal oxides.
  • Metal powders of the preferred grain size can also be made by grinding coarser metal powders. For example, a ball mill is suitable for this purpose.
  • the carbonyl iron powder process is preferred for producing carbonyl iron powder.
  • This is done by thermal decomposition of iron pentacarbonyl. This is described, for example, in Ullmann's Encyclopedia of Industrial Chemistry, 5th edition, vol. A14, page 599 described.
  • the decomposition of the iron pentacarbonyl can be carried out, for example, at elevated temperatures and elevated pressures in a heatable decomposer comprising a tube made of a heat-resistant material, such as quartz glass or V2A steel in a preferably vertical position, which is heated by a heating device, for example consisting of heating baths, heating wire or from a heating medium flowed through by a heating jacket, is surrounded.
  • a heating device for example consisting of heating baths, heating wire or from a heating medium flowed through by a heating jacket, is surrounded.
  • Carbonyl nickel powder can also be produced by a similar method.
  • Platelet-shaped electrolessly and / or electrolytically coatable particles can be controlled by optimized conditions in the manufacturing process or subsequently obtained by mechanical treatment, for example by treatment in a stirred ball mill.
  • the proportion of electrolessly and / or electrolytically coatable particles in the range of 20 to 98 wt .-%.
  • a preferred range of the proportion of electrolessly and / or electrolytically coatable particles is from 30 to 95% by weight, based on the total weight of the dried base layer.
  • suitable matrix materials include binders having a pigment-affine anchoring group, natural and synthetic polymers and their derivatives, natural resins and synthetic resins and their derivatives, natural rubber, synthetic rubber, proteins, cellulose derivatives, drying and non-drying oils and the like. These can, but do not have to be, chemically or physically curing, for example air-hardening, radiation-curing or temperature-curing.
  • the matrix material is a polymer or polymer mixture.
  • Preferred polymers as the matrix material are ABS (acrylonitrile-butadiene-styrene); ASA (acrylonitrile-styrene-acrylate); acrylated acrylates; alkyd resins; Alkylvinylacetate; Alkylene vinyl acetate copolymers, especially methylene vinyl acetate, ethylene vinyl acetate, butylene vinyl acetate; Alkylenvinylchlorid copolymers; amino resins; Aldehyde and ketone resins; Cellulose and cellulose derivatives, in particular hydroxyalkylcellulose, cellulose esters, such as acetates, propionates, butyrates, carboxyalkylcelluloses, cellulose nitrate; epoxy acrylates; epoxy resins; modified epoxy resins, for example bifunctional or polyfunctional bisphenol A or bisphenol F resins, epoxy novolac resins, brominated epoxy resins, cycloalipha
  • Particularly preferred polymers as matrix material are acrylates, acrylate resins, cellulose derivatives, methacrylates, methacrylate resins, melamine and amino resins, polyalkylenes, polyimides, epoxy resins, modified epoxy resins, for example bifunctional or polyfunctional bisphenol A or bisphenol F resins, epoxy novolaks.
  • Resins brominated epoxy resins, cycloaliphatic epoxy resins; aliphatic epoxy resins, glycidyl ethers, vinyl ethers, and phenolic resins, polyurethanes, polyesters, polyvinyl acetals, polyvinyl acetates, polystyrenes, polystyrene copolymers, polystyrene acrylates, styrene-butadiene block copolymers, alkylene vinyl acetates and vinyl chloride copolymers, polyamides and their copolymers.
  • the matrix material for the dispersion is preferably thermally or radiation-curing resins, for example modified epoxy resins, such as bifunctional or polyfunctional bisphenol A or bisphenol F resins, epoxy novolac resins, brominated epoxy resins, cycloaliphatic epoxy resins; aliphatic epoxy resins, glycidyl ethers, cyanate esters, vinyl ethers, phenolic resins, polyimides, melamine resins and amino resins, polyurethanes, polyesters and cellulose derivatives.
  • modified epoxy resins such as bifunctional or polyfunctional bisphenol A or bisphenol F resins, epoxy novolac resins, brominated epoxy resins, cycloaliphatic epoxy resins; aliphatic epoxy resins, glycidyl ethers, cyanate esters, vinyl ethers, phenolic resins, polyimides, melamine resins and amino resins, polyurethanes, polyesters and cellulose derivatives.
  • the proportion of the organic binder component is from 0.01 to 60% by weight.
  • the proportion is 0.1 to 45 wt .-%, more preferably 0.5 to 35 wt .-%.
  • the dispersion may furthermore be admixed with a solvent or a solvent mixture in order to adjust the viscosity of the dispersion which is suitable for the respective application method.
  • Suitable solvents are, for example, aliphatic and aromatic hydrocarbons (for example n-octane, cyclohexane, toluene, xylene), alcohols (for example methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, amyl alcohol ), polyhydric alcohols such as
  • Glycerol ethylene glycol, propylene glycol, neopentyl glycol, alkyl esters (for example methyl acetate, ethyl acetate, propyl acetate, butyl acetate, isobutyl acetate, isopropyl acetate,
  • Methyl butanol alkoxy alcohols (for example methoxypropanol, methoxybutanol, ethoxypropanol), alkylbenzenes (for example ethylbenzene, isopropylbenzene), butylglycol, butyl diglycol, alkylglycol acetates (for example butylglycol acetate, butyldiglycol acetate, propylene glycol methyl ether acetate), diacetone alcohol, diglycol dialkyl ethers, diglycol monoalkyl ethers, Dipropylene glycol dialkyl ethers, dipropylene glycol monoalkyl ethers, diglycol alkyl ether acetates, dipropylene glycol alkyl ether acetates, dioxane, dipropylene glycol and ethers, diethylene glycol and ethers, DBE (dibasic esters), ethers (for example die
  • Example butyrolactone ketones (for example acetone, 2-butanone, cyclohexanone, methyl ethyl ketone (MEK), methyl isobutyl ketone (MIBK)), methyl diglycol, methylene chloride, methylene glycol, methyl glycol acetate, methylphenol (ortho-, meta-, para-cresol ), Pyrrolidones (for example N-methyl-2-pyrrolidone), propylene glycol, propylene carbonate, carbon tetrachloride, toluene, trimethylolpropane (TMP), aromatic hydrocarbons and mixtures, aliphatic hydrocarbons and mixtures, alcoholic monoterpenes (such as terpineol), water and mixtures of two or more of these solvents.
  • ketones for example acetone, 2-butanone, cyclohexanone, methyl ethyl ketone (MEK), methyl isobutyl
  • Preferred solvents are alcohols (for example ethanol, 1-propanol, 2-propanol, butanol), alkoxyalcohols (for example methoxypropanol, ethoxypropanol, butylglycol, butyl diglycol), butyrolactone, diglycol dialkyl ethers, diglycol monoalkyl ethers, dipropylene glycol dialkyl ethers, dipropylene glycol monoalkyl ethers, esters (for example ethyl acetate, butyl acetate, butyl glycol acetate, butyl diglycol acetate, diglycol alkyl ether acetates, dipropylene glycol alkyl acetates, DBE, propylene glycol methyl ether acetate), ethers (for example tetrahydrofuran), polyhydric alcohols such as glycerol, ethylene glycol, propylene glycol, neopentyl
  • liquid matrix materials for example liquid epoxy resins, acrylate esters
  • the respective viscosity can alternatively also be adjusted via the temperature during application or via a combination of solvent and temperature
  • the dispersion may further contain a dispersant component. This consists of one or more dispersants.
  • dispersants known to the person skilled in the art for use in dispersions and described in the prior art are suitable.
  • Preferred dispersants are surfactants or surfactant mixtures, for example anionic, cationic, amphoteric or nonionic surfactants.
  • Cationic and anionic surfactants are described, for example, in “Encyclopedia of Polymer Science and Technology”, J. Wiley & Sons (1966), Vol. 5, pp. 816-818, and in “Emulsion Polymerization and Emulsion Polymers", editors P. Lovell and M. El-Asser, published by Wiley & Sons (1997), pages 224-226.
  • the dispersant may be used in the range of 0.01 to 50% by weight based on the total weight of the dispersion.
  • the proportion is preferably 0.1 to 20% by weight, more preferably 0.2 to 10% by weight.
  • the dispersion of the invention may contain a filler component.
  • This may consist of one or more fillers.
  • the filler component of the metallizable composition may contain fibrous, layered or particulate fillers or mixtures thereof. These are preferably commercially available products, for example mineral fillers.
  • fillers or reinforcing materials such as glass powder, mineral fibers, whiskers, aluminum hydroxide, metal oxides such as alumina or iron oxide, mica, quartz, calcium carbonate, barium sulfate, titanium dioxide or wollastonite can be used.
  • thixotropic agents for example silicic acid, silicates, such as aerosils or bentonites, or organic thixotropic agents and thickeners, such as polyacrylic acid, polyurethanes, hydrogenated castor oil, dyes, fatty acids, fatty acid amides, plasticizers, wetting agents, defoamers , Lubricants, drying agents, crosslinkers, photoinitiators, complexing agents, waxes, pigments, conductive polymer particles, can be used.
  • thixotropic agents for example silicic acid, silicates, such as aerosils or bentonites
  • organic thixotropic agents and thickeners such as polyacrylic acid, polyurethanes, hydrogenated castor oil, dyes, fatty acids, fatty acid amides, plasticizers, wetting agents, defoamers , Lubricants, drying agents, crosslinkers, photoinitiators, complexing agents, waxes, pigments, conductive polymer particles.
  • the proportion of Medstoffkomponente- and / or additives, based on the total weight of the dry base layer is preferably 0.01 to 50 wt .-%. Further preferred are 0.1 to 30 wt .-%, particularly preferably 0.3 to 20 wt .-%.
  • processing aids and stabilizers such as UV stabilizers, lubricants, corrosion inhibitors and flame retardants can be present in the dispersion.
  • their proportion based on the total weight of the dispersion, 0.01 to 5 wt .-%.
  • the proportion is 0.05 to 3 wt .-%.
  • absorbers can be added to the dispersion. Depending on the laser beam source used, it may be necessary to select different absorbents or mixtures of absorbents which effectively absorb the laser radiation.
  • the absorbent is either added to the dispersion, or it is applied between the substrate and the dispersion, an additional separate absorption layer containing the absorbent. In the latter case, the energy is absorbed locally in the absorption layer and transferred to the dispersion by heat conduction.
  • Suitable absorbents for laser radiation have a high absorption in the range of the laser wavelength.
  • absorbents are suitable which have a high absorption in the near infrared and in the longer wavelength Vis range of the electromagnetic spectrum.
  • Such absorbents are particularly useful for absorbing the radiation from high performance solid state lasers, such as Nd-YAG lasers having a wavelength of 1064 nm, and IR diode lasers typically having wavelengths in the range of 700 to 1600 nm.
  • suitable absorbents for the laser radiation are highly absorbing dyes in the infrared spectral range, for example phthalocyanines, naphthalocyanines, cyanines, quinones, metal complex dyes, such as dithiolenes or photochromic dyes.
  • suitable absorbents are inorganic pigments, in particular intensively colored, inorganic pigments, such as chromium oxides, iron oxides, iron oxide hydrates or carbon in the form of, for example, carbon black, graphite, graphenes or carbon nanotubes.
  • Particularly suitable as absorbers for laser radiation are finely divided carbon species and finely divided lanthanum hexaboride (LaB 6 ).
  • absorbent in general, from 0.005 to 20% by weight of absorbent, based on the weight of the electrolessly and / or electrolytically coatable particles, is used in the dispersion. Preference is given to using from 0.01 to 15% by weight of absorbent and particularly preferably from 0.1 to 10% by weight of absorbent, in each case based on the weight of the electrolessly and / or electrically coatable particles, in the dispersion.
  • the amount of absorbent added is chosen by the skilled person depending on the particular desired properties of the base layer. In this context, the skilled person will further take into account that the added absorbents not only influence the speed and efficiency of ablation of the base layer by laser, but also other properties of the base layer, such as its carrier adhesion, curing or metal adhesion.
  • the absorption layer In the case of a separate absorption layer this contains in the best case, the absorbent and the same matrix material, as well as the overlying base layer to ensure a good layer adhesion.
  • the absorption layer In order to effect an effective conversion of light energy into heat energy and to achieve rapid heat conduction into the base layer, the absorption layer should be applied as thinly as possible and the absorption medium should be present in the highest possible concentration, without the layer properties, such as adhesion to the support and the base layer, and to negatively influence the curing. Suitable concentrations of the absorbent in the absorption layer are at least 1 to 95 wt .-%, particularly preferably 50 to 85 wt .-%.
  • the energy required for ablation can be applied either on the side coated with the dispersion or on the side of the substrate opposite the dispersion.
  • the removal is removed by means of a suction or by blowing away the Abtrages. If necessary, a combination of the two process variants can also be used.
  • the coating of the substrate with the base layer can be carried out both on one side and on two sides.
  • the two sides can be structured in succession in the laser ablation step or simultaneously by at least two laser beam sources from both sides.
  • more than one laser beam source can be used. It is also possible to divide the laser beam of a laser source, whereby with only one laser source also the productivity can be increased.
  • the structuring can be achieved, for example, by either moving the substrate on an XY stage or by the laser beam moving, for example by the use of a movable mirror. Also, a combination of both methods is possible.
  • the application of the full-surface base layer takes place, for example, according to the coating method known to the person skilled in the art. Such coating methods include, for example, casting such as curtain coating, roll coating, brushing, knife coating, brushing, spraying, dipping, rolling, powdering, fluidized bed or the like.
  • the full-surface base layer is printed with the dispersion by any printing process on the support, wherein the later structures can be roughly pre-formed.
  • the printing method by which the base layer is printed is, for example, a roll or sheet printing method such as screen printing, direct or indirect gravure printing, flexographic printing, letterpress printing, pad printing, ink jet printing, laser sonic method® as in DE 100 51 850 described, offset printing or magnetographic printing.
  • a roll or sheet printing method such as screen printing, direct or indirect gravure printing, flexographic printing, letterpress printing, pad printing, ink jet printing, laser sonic method® as in DE 100 51 850 described, offset printing or magnetographic printing.
  • the layer thickness of the base layer produced by the printing or the coating method preferably varies between 0.01 and 50 ⁇ m, more preferably between 0.05 and 25 ⁇ m and particularly preferably between 0.1 and 20 ⁇ m.
  • the layers can be applied both over the entire surface as well as structured. The layers can be applied on one side or on both sides if necessary.
  • a structured application of the dispersion is then advantageous and preferred if, for example, predetermined structures are produced in large quantities and the size of the surface to be ablated is reduced by the structured application. This can be produced at a higher speed and more cost-effective, since less material of the base layer must be ablated.
  • the dispersion is stirred or recirculated in a receiver tank prior to application to the substrate.
  • a possible sedimentation of the particles contained in the dispersion is prevented.
  • more homogeneous base layers i. Base layers in which the electrically conductive particles are homogeneously distributed, obtained.
  • a homogeneous base layer leads in the electroless and / or galvanic coating step to significantly better, more homogeneous and more continuous structures.
  • the dispersion is heated in the reservoir. This makes it possible to achieve a more homogeneous base layer on the carrier, since a constant viscosity can be set by the tempering.
  • the temperature control is particularly necessary when the dispersion is heated, for example, by the stirring and / or pumping due to the energy input of the stirrer or the pump and thereby changes the viscosity thereof.
  • the substrate at its top and bottom with an electrically conductive structured surface. With the aid of plated-through holes, the structured, electrically conductive surfaces on the upper side and the underside of the substrate can be electrically connected to one another.
  • a wall of a bore in the substrate is provided with an electrically conductive surface.
  • the through-connection it is possible, for example, to form bores in the support, on the wall of which the dispersion containing the electrolessly and / or electrolytically coatable particles is applied during the printing of the base layer.
  • a sufficiently thin substrate for example, a thin PET film
  • the bore can be made, for example, by staking, punching or laser drilling.
  • the dispersion with which the base layer is applied to the substrate at least partially dries after application and / or at least partially cures.
  • the drying and / or curing is carried out as described above, for example by the action of heat, light (UVA / is) and / or radiation, for example infrared radiation, electron radiation, gamma radiation, X-radiation, microwaves.
  • a suitable activator must be added to trigger the curing reaction.
  • Curing can also be achieved by combining various methods, for example by combining UV radiation and heat. The combination of the curing processes can be carried out simultaneously or sequentially.
  • UV radiation can initially only harden the layer so that the formed structures no longer flow apart. Thereafter, the layer can be cured by the action of heat.
  • the action of heat can take place directly after UV curing and / or after electroless and / or galvanic metallization. After at least partial drying and / or hardening and exposure of the desired structure by means of ablation are in a preferred variant, the electroless and / or galvanically coatable particles at least partially exposed.
  • the exposure of the electroless and / or electrodepositable particles can be effected both mechanically, for example by brushing, grinding, milling, sand blasting or supercritical carbon dioxide irradiation, physically, for example by heating, laser, UV light, corona discharge or plasma discharge, or chemically.
  • a suitable chemical or chemical mixture is preferably used for the matrix material.
  • the matrix material can be at least partially dissolved and washed down by a solvent on the surface, or the chemical structure of the matrix material can be at least partially destroyed by means of suitable reagents, whereby the electrolessly and / or electrolytically coatable particles be exposed.
  • Reagents that swell the matrix material are also suitable for exposing the electrolessly and / or electrolytically coatable particles.
  • swelling arise cavities into which the metal ions to be deposited can penetrate from the electrolyte solution, whereby a larger number of electrolessly and / or galvanically coatable particles can be metallized.
  • the adhesion, the homogeneity and the continuity of the subsequent electroless and / or electrodeposited metal layer is significantly better than in the methods described in the prior art. Due to the higher number of electrolessly and / or electrolytically coatable particles, the process speed in the metallization is also significantly higher, whereby additional cost advantages can be achieved.
  • the electroless and / or electrodepositable particles are preferably exposed to an oxidizing agent.
  • the oxidizing agent breaks up bonds in the matrix material, which allows the binder to be peeled off and thereby expose the particles.
  • Suitable oxidizing agents are, for example, manganates, for example potassium permanganate, potassium manganate, sodium permanganate, sodium manganate, hydrogen peroxide, oxygen, oxygen in the presence of catalysts such as manganese, molybdenum, bismuth, tungsten and cobalt salts, ozone, vanadium pentoxide.
  • manganates for example potassium permanganate, potassium manganate, sodium permanganate, sodium manganate, hydrogen peroxide, oxygen, oxygen in the presence of catalysts such as manganese, molybdenum, bismuth, tungsten and cobalt salts, ozone, vanadium pentoxide.
  • manganates for example potassium permanganate, potassium manganate, sodium permanganate, sodium manganate, hydrogen peroxide, N-methyl morpholine N-oxide, percarbonates, for example sodium or potassium percarbonate, perborates, for example sodium or potassium perborate, persulfates, for example Sodium or potassium persulfate, sodium, potassium and ammonium peroxodis and monosulfates, sodium hypochlorite, urea-hydrogen peroxide adducts, salts of oxohalogenic acids, for example chlorates, bromates or iodates, salts of haloperacids, for example sodium periodate or sodium perchlorate, tetrabutylammonium peroxydisulfate, quinones , Iron (III) salt solutions, vanadium pentoxide, pyridinium dichromate, hydrochloric acid, bromine, chlorine, dichromates.
  • iron (III) salt solutions vanadium pentoxide,
  • potassium permanganate potassium manganate, sodium permanganate, sodium manganate, hydrogen peroxide and its adducts
  • perborates percarbonates, persulfates, peroxodisulfates, sodium hypochlorite and perchlorates.
  • acidic or alkaline chemical chemicals and / or chemical mixtures are, for example, concentrated or dilute acids, such as hydrochloric acid, sulfuric acid, phosphoric acid or nitric acid. Also organic acids, such as formic acid or acetic acid, may be suitable depending on the matrix material.
  • Suitable alkaline chemicals and / or chemical mixtures are, for example, bases, such as sodium hydroxide solution, potassium hydroxide solution, ammonium hydroxide or carbonates, for example sodium carbonate or potassium carbonate.
  • bases such as sodium hydroxide solution, potassium hydroxide solution, ammonium hydroxide or carbonates, for example sodium carbonate or potassium carbonate.
  • the temperature may be increased during the process.
  • Solvents can also be used to expose the electrolessly and / or electrolytically coatable particles in the matrix material.
  • the solvent must be matched to the matrix material as the matrix material must dissolve in the solvent and swell through the solvent. If a solvent is used in which the matrix material dissolves, the base layer is only brought into contact with the solvent for a short time, so that the upper layer of the matrix material is dissolved and thereby becomes detached.
  • Preferred solvents are xylene, toluene, halogenated hydrocarbons, acetone, methyl ethyl ketone (MEK), methyl isobutyl ketone (MIBK), diethylene glycol monobutyl ether.
  • MEK methyl ethyl ketone
  • MIBK methyl isobutyl ketone
  • diethylene glycol monobutyl ether diethylene glycol monobutyl ether.
  • the temperature during the dissolution process can be increased.
  • Suitable mechanical methods include, for example, brushing, grinding, abrasive polishing, or jet blasting, blasting, or supercritical carbon dioxide blasting.
  • Abrasives for polishing it is possible to use all abrasives known to the person skilled in the art.
  • a suitable abrasive is, for example, pumice.
  • the water jet preferably contains small solid particles, for example pumice flour (Al 2 O 3 ) having an average particle size distribution of 40 to 120 ⁇ m, preferably 60 to 80 ⁇ m, or quartz flour (SiO 2 ) with a particle size> 3 ⁇ m.
  • pumice flour Al 2 O 3
  • quartz flour SiO 2
  • the electrolessly and / or electrolytically coatable particles contain a material which can easily oxidize, in a preferred variant of the method, before the formation of the metal layer on the base layer, the oxide layer is at least partially removed. The removal of the oxide layer can take place, for example, chemically and / or mechanically.
  • Suitable substances with which the base layer can be treated in order to chemically remove an oxide layer from the electrolessly and / or electrolytically coatable particles are, for example, acids, such as concentrated or dilute sulfuric acid or concentrated or dilute hydrochloric acid, citric acid, phosphoric acid, aminosulfonic acid , Formic acid or acetic acid.
  • acids such as concentrated or dilute sulfuric acid or concentrated or dilute hydrochloric acid, citric acid, phosphoric acid, aminosulfonic acid , Formic acid or acetic acid.
  • Suitable mechanical methods for removing the oxide layer from the electroless and / or electrodepositable particles are generally the same as the mechanical methods of exposing the particles.
  • the dispersion In order for the dispersion to adhere firmly to the substrate, in a preferred embodiment it is cleaned prior to the application of the base layer by a dry process, a wet-chemical process and / or a mechanical process.
  • the wet-chemical method and the mechanical method make it possible, in particular, to roughen the surface of the substrate so that the dispersion adheres better to it.
  • a wet-chemical method is particularly suitable rinsing the substrate with acidic or alkaline reagents or with suitable solvents. Also water in conjunction with ultrasound can be used.
  • Suitable acidic or alkaline reagents are, for example, hydrochloric acid, sulfuric acid or nitric acid, phosphoric acid or sodium hydroxide solution, potassium hydroxide solution or carbonates, such as potassium carbonate.
  • Suitable solvents are the same as may also be present in the dispersion for applying the base layer. Preferred solvents are alcohols, ketones and hydrocarbons, which are to be selected depending on the carrier material. The oxidants already mentioned during activation can also be used.
  • Mechanical methods of cleaning the substrate prior to applying the patterned or all-over base layer are generally the same as they can be used to expose the electrically conductive particles and remove the oxide layer of the particles.
  • dry cleaning processes are particularly suitable. These are, for example, the dedusting by means of and / or deionized air, corona discharge or low-pressure plasma and the particle removal by means of rollers and / or rollers, which are provided with an adhesive layer.
  • the substrate may be provided with an additional adhesive / adhesive layer according to methods known to the person skilled in the art before the transfer of the base layer if necessary.
  • the structure After application and at least partial curing and / or drying of the base layer, the structure is worked up by ablation. For this purpose, the parts of the base layer which are not part of the structure are removed.
  • the removal takes place according to the invention by means of a laser beam.
  • the matrix material of the base layer is at least partially decomposed and / or evaporated.
  • the electrolessly and / or electrolytically coatable particles contained in the matrix material are also released. The material removed from the base layer can be sucked off and / or blown off.
  • interconnects are to be produced by the method according to the invention, in one embodiment it is possible to additionally expose contacting lines, which are connected to the interconnect structure, by the laser ablation method in addition to the desired interconnect structure.
  • These contacting aids are processed just as well as the desired structure of the tracks.
  • the contacting lines exposed by laser ablation are likewise electrolessly and / or galvanically metallized, preferably after the exposure of the electrolessly and / or electrolytically coatable particles contained on the surface.
  • the contact lines serve, for example, that even short, insulated tracks can be easily contacted.
  • the Kunststoff musclessslinien are at least partially removed after electroless and / or galvanic metallization. The removal can also be done by laser ablation, for example.
  • an electrically conductive coating is applied to the patterned base layer.
  • the electrically conductive surface after the electrically conductive particles have been exposed, min. at least one metal layer formed on the structured base layer by electroless and / or electroplated coating.
  • the coating can be carried out by any method known to those skilled in the art. Also, any conventional metal coating can be applied by the method of coating. In this case, the composition of the electrolyte solution used for the coating depends on which metal the electrically conductive structures are to be coated on the substrate. In principle, all metals which are nobler or the same as the least noble metal of the dispersion can be used for electroless and / or electroplating.
  • Typical metals which are deposited by electroless and / or electroplating on electrically conductive surfaces are, for example, gold, nickel, palladium, platinum, silver, tin, copper or chromium.
  • the thicknesses of the one or more deposited layers are in the usual range known to the person skilled in the art.
  • Suitable electrolyte solutions which can be used for coating electrolessly and / or electrolytically coatable structures are those skilled in the art, for example, Werner Jillek, Gustl Keller, Manual of printed circuit board technology, Eugen G. Leuze Verlag, 2003, Volume 4, pages 332- 352, known.
  • the substrate is first fed to a bath with the electrolyte solution.
  • the carrier is then conveyed through the bath, the electrolessly and / or electrolytically coatable particles contained in the previously applied structured base layer being contacted with at least one cathode.
  • any conventional, known in the art, suitable cathode can be used.
  • metal ions are deposited from the electrolyte solution to form a metal layer on the base layer.
  • the contacting can also be done via the Kunststoffmaschines- help lines.
  • a thin layer of the base layer immediately forms by electroless deposition.
  • the base layer itself e.g. when using carbonyl iron powder as a currentless and / or galvanically coatable particles, is not sufficiently conductive, the necessary conductivity for the galvanic coating is achieved by this electroless deposited layer.
  • a suitable device in which the structured, electrically conductive base layer is galvanically coated generally comprises at least one bath, one anode and one cathode, wherein the bath comprises an electrolyte solution containing at least one metal salt. holds. From the electrolyte solution, metal ions are deposited on electrically conductive surfaces of the substrate or the base layer to form a metal layer. The at least one cathode is for this purpose brought into contact with the base layer of the substrate to be coated, while the substrate is conveyed through the bath.
  • electroplating processes for galvanic coating, all electroplating processes known to those skilled in the art are suitable. Such electroplating processes are, for example, those in which the cathode is formed by one or more rollers which contact the material to be coated.
  • the cathodes can also be designed in the form of segmented rollers, in which in each case at least the segment of the roller, which is in communication with the base layer to be coated, is connected cathodically.
  • segmented rolls In order to remove metal deposited on the roll, it is possible for segmented rolls to anodize the segments which do not contact the base layer to be coated, thereby depositing the metal deposited thereon into the electrolyte solution.
  • the Kunststoff muscles When using Griffin michifsllslinien the Kunststoff musclessslinien be contacted with the cathode for electroplating.
  • the Kunststoff musclessslinien serve to contact even short, insulated from each other interconnects in a simple manner.
  • the contacting aids are preferably removed again after the galvanic coating.
  • the removal of the Dies michellessllslinien can be done for example by laser ablation.
  • the same laser beam sources are used as well as for the generation of the structure of the base layer.
  • the device of the galvanic coating can furthermore be equipped with a device with which the substrate can be rotated.
  • the axis of rotation of the device with which the substrate can be rotated is perpendicular to the to be coated
  • Structures which are initially wide and short, as viewed in the direction of transport of the substrate, aligned so that they are narrow and long after being turned, seen in the direction of transport.
  • the layer thickness of the metal layer deposited on the electrolessly and / or electrolytically coatable structure by the method according to the invention is dependent on the contact time, which results from the passage speed of the substrate through the device and the number of cathodes positioned behind one another, and the current intensity with which the device is operated. For example, a higher contact time can be achieved be achieved that several devices are connected in at least one bath in a row.
  • two rollers may be arranged so that the substrate to be coated can be passed between them.
  • endless films which are initially unwound from a roll, passed through the device for electroplating and then wound up again, this can, for example, zig-zag or in shape a meander to several devices for electroplating, which can then be arranged, for example, one above the other or next to each other, are passed through the bath.
  • the galvanic coating device may be equipped with any additional device known to those skilled in the art as needed.
  • ancillary devices include, for example, pumps, filters, chemical feeders, unwinding devices, etc.
  • the device according to the invention can also be operated, for example, in the pulse method known from Werner Jillek, Gustl Keller, Handbuch der Porterplattentechnik, Eugen G. Leuze Verlag, 2003, Vol. 4, pages 192, 260, 349, 351, 352 and 359.
  • the substrate can be further processed according to all steps known to those skilled in the art. For example, existing electrolyte residues can be removed from the substrate by rinsing and / or the substrate can be dried.
  • the process according to the invention for the production of electrically conductive, structured surfaces on a support can be operated in a continuous, partially continuous or discontinuous manner. It is also possible that only individual steps of the process are carried out continuously while other steps are carried out discontinuously.
  • the substrate can be further processed according to all steps known to those skilled in the art. For example, existing electrolyte residues can be removed from the substrate by rinsing and / or the substrate can be dried.
  • the inventive method is suitable for example for the production of printed conductors on printed circuit boards.
  • printed circuit boards are, for example, those with multi-layer inner and outer layers, micro via chip on-board, flexible and rigid printed circuit boards, and are incorporated, for example, in products such as computers, telephones, televisions, automotive electrical components, keyboards , Radios, video, CD, CD-Rom and DVD players, game consoles, measuring and control devices, sensors, electrical kitchen appliances, electric toys, etc.
  • the method according to the invention is suitable for the production of RFI D antennas, transponder antennas or other antenna structures, chip card modules, flat cables, seat heaters, foil conductors, printed conductors in solar cells or in LCD or plasma picture screens, capacitors, film capacitors, resistors, convectors, electrical fuses or for the production of electroplated products in any desired form, for example single- or double-sided metal-coated polymer supports with defined layer thickness, 3D molded interconnect devices or also for the production of decorative or functional surfaces on products, for example for the coordination of electromagnetic radiation , used for heat conduction or as packaging. Furthermore, the production of contact points or contact pads or wiring on an integrated electronic component is possible.
  • antennas with contacts for organic electronic components as well as coatings on surfaces consisting of electrically non-conductive material for electromagnetic shielding, possible.
  • Use is also possible in the field of flow fields of bipolar plates for use in fuel cells.
  • the scope of application of the method according to the invention enables a cost-effective production of metallized, even non-conductive substrates, in particular for use as switches and sensors, gas barriers or decorative parts, in particular decorative parts for motor vehicles, plumbing, toys, household and office use and packaging as well as slides. Also in the field of security printing for bills, credit cards, identity papers, etc., the invention may find application. Textiles can be electrically and magnetically functionalized by means of the method according to the invention (antennas, transmitters, RFID and transponder antennas, sensors, heating elements, antistatic (also for plastics), shielding, etc.).
  • the method according to the invention can also be used for the metallization of holes, vias, blind holes, etc., for example in printed circuit boards, RFID antennas or transponder antennas, flat cables, foil conductors with the aim of a through-connection of the upper and lower sides. This also applies if other substrates are used.
  • the metallized articles produced according to the invention - insofar as they comprise magnetizable metals - are used in areas of metallizable functional parts, such as magnetic boards, magnetic games, magnetic surfaces, for example refrigerator cabinet doors.
  • they find application in areas where a good thermal conductivity is advantageous, for example in films for seat heaters, underfloor heating and insulation materials.
  • Preferred uses of the surfaces metallized according to the invention are those in which the products produced in this way are printed circuit boards, RFID antennas, transponder antennas, flat cables, seat heating, contactless chip card, 3D molded interconnect device, thin metal foil or polymer backing laminated on one or two sides, foil conductors , Ladder- be used in solar cells or in LCD or plasma screens, integrated circuits, resistive, capacitive or inductive elements, diodes, transistors, sensors, actuators, optical components, receiver / transmitter devices or as a decorative application, for example for packaging materials.

Abstract

Procédé de fabrication de surfaces structurées électro-conductrices sur un substrat, qui consiste (a) à structurer sur le substrat une couche de base contenant des particules pouvant être déposées sans courant et / ou de manière galvanique, par élimination de la couche de base selon une structure prédéterminée à l'aide d'un laser, (b) à activer la surface des particules pouvant être déposées sans courant et / ou de manière galvanique et (c) à appliquer un revêtement électro-conducteur sur la couche de base structurée.
EP08701541A 2007-01-19 2008-01-17 Procédé de fabrication de surfaces structurées électro-conductrices Withdrawn EP2127507A1 (fr)

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PCT/EP2008/050479 WO2008087172A1 (fr) 2007-01-19 2008-01-17 Procédé de fabrication de surfaces structurées électro-conductrices
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CA2675033A1 (fr) 2008-07-24
TW200845845A (en) 2008-11-16
JP2010517256A (ja) 2010-05-20
US20100009094A1 (en) 2010-01-14
BRPI0806629A2 (pt) 2011-09-13
IL199769A0 (en) 2010-04-15
WO2008087172A1 (fr) 2008-07-24
CN101584258A (zh) 2009-11-18
RU2009131220A (ru) 2011-02-27
KR20090103949A (ko) 2009-10-01

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