CN114786342B - 一种基于激光技术的柔性可弯折金属图案及其制备方法和用途 - Google Patents
一种基于激光技术的柔性可弯折金属图案及其制备方法和用途 Download PDFInfo
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- CN114786342B CN114786342B CN202210454194.7A CN202210454194A CN114786342B CN 114786342 B CN114786342 B CN 114786342B CN 202210454194 A CN202210454194 A CN 202210454194A CN 114786342 B CN114786342 B CN 114786342B
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- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- 229910052691 Erbium Inorganic materials 0.000 description 1
- 229910021380 Manganese Chloride Inorganic materials 0.000 description 1
- GLFNIEUTAYBVOC-UHFFFAOYSA-L Manganese chloride Chemical compound Cl[Mn]Cl GLFNIEUTAYBVOC-UHFFFAOYSA-L 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- 244000062793 Sorghum vulgare Species 0.000 description 1
- 229910052775 Thulium Inorganic materials 0.000 description 1
- FMRLDPWIRHBCCC-UHFFFAOYSA-L Zinc carbonate Chemical compound [Zn+2].[O-]C([O-])=O FMRLDPWIRHBCCC-UHFFFAOYSA-L 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- QGJOPFRUJISHPQ-NJFSPNSNSA-N carbon disulfide-14c Chemical compound S=[14C]=S QGJOPFRUJISHPQ-NJFSPNSNSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- QYCVHILLJSYYBD-UHFFFAOYSA-L copper;oxalate Chemical compound [Cu+2].[O-]C(=O)C([O-])=O QYCVHILLJSYYBD-UHFFFAOYSA-L 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- UYAHIZSMUZPPFV-UHFFFAOYSA-N erbium Chemical compound [Er] UYAHIZSMUZPPFV-UHFFFAOYSA-N 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- RUTXIHLAWFEWGM-UHFFFAOYSA-H iron(3+) sulfate Chemical compound [Fe+3].[Fe+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O RUTXIHLAWFEWGM-UHFFFAOYSA-H 0.000 description 1
- 229910000360 iron(III) sulfate Inorganic materials 0.000 description 1
- 235000002867 manganese chloride Nutrition 0.000 description 1
- 239000011565 manganese chloride Substances 0.000 description 1
- 229940099607 manganese chloride Drugs 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 235000019713 millet Nutrition 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- VLAPMBHFAWRUQP-UHFFFAOYSA-L molybdic acid Chemical compound O[Mo](O)(=O)=O VLAPMBHFAWRUQP-UHFFFAOYSA-L 0.000 description 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- DHRLEVQXOMLTIM-UHFFFAOYSA-N phosphoric acid;trioxomolybdenum Chemical compound O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.OP(O)(O)=O DHRLEVQXOMLTIM-UHFFFAOYSA-N 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910003451 terbium oxide Inorganic materials 0.000 description 1
- SCRZPWWVSXWCMC-UHFFFAOYSA-N terbium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[Tb+3].[Tb+3] SCRZPWWVSXWCMC-UHFFFAOYSA-N 0.000 description 1
- 238000003878 thermal aging Methods 0.000 description 1
- CMPGARWFYBADJI-UHFFFAOYSA-L tungstic acid Chemical compound O[W](O)(=O)=O CMPGARWFYBADJI-UHFFFAOYSA-L 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 235000004416 zinc carbonate Nutrition 0.000 description 1
- 239000011667 zinc carbonate Substances 0.000 description 1
- 229910000010 zinc carbonate Inorganic materials 0.000 description 1
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
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- H05K2201/05—Flexible printed circuits [FPCs]
Abstract
本发明提供了一种基于激光技术的柔性可弯折金属图案及其制备方法和用途,属于柔性电路领域。本发明制备方法是利用激光活化选择性金属化在涂覆了激光敏化剂的柔性聚合物膜上制备导电金属图案或线路。本发明所制备的柔性金属图案具有超高的耐弯折性能,在经过弯曲半径为1mm的10000次弯曲后,其电阻值保持基本不变,并且可以在完全折叠情况下保持金属电路的连通。本发明的制备方法无需掩膜,不需要昂贵的设备,与传统的刻蚀法、丝网印刷工艺以及喷墨打印工艺相比,本发明的方法生产灵活性好,操作简单,成本可控,普适性好,具有大规模工业化应用的前景。
Description
技术领域
本发明属于柔性电路领域,具体涉及一种基于激光技术的柔性可弯折金属图案及其制备方法和用途。
背景技术
随着我国电子信息产业的快速发展,我国已成为世界电子信息产品制造和出口大国。传统的硬质电路板具有刚度大、集成化程度高、互联性强等优点,在使用过程中能实现电子器件的高度集成,能有效的保护电子元件不被物理破坏,但也存在电子产品不具备弯曲和折叠功能等不足。当今社会消费类电子产品更新换代的脚步不断加快,且不断朝着柔性化趋势向前推进。近年来华为、三星、小米等厂商相继推出折叠屏手机,且都在市场上引起了不小的轰动。不断发展的新式电子产品对导电线路板提出的要求越来越高。为了满足仪器设备的柔性化、轻量化、小型化要求,提高导电线路的柔韧性,在柔性材料表面成型出具有弯曲能力甚至折叠功能的图案的思路逐渐被人们所关注。
传统的柔性电路制备方法以刻蚀法为主,发展也最为成熟。但是刻蚀法的工艺流程非常复杂繁琐,需要经过成膜、涂覆光刻胶、曝光、显影、烘焙、刻蚀、去除光刻胶、清洗等流程,耗时较长且环境污染较大。此外,线路侧蚀现象严重,刻蚀法无法稳定生产超精细高精度柔性电路。为解决刻蚀法工艺所带来的一系列问题,陆续发展出丝网印刷工艺、喷墨打印工艺等。丝网印刷工艺是指经过感光制版措施,用丝网为版基制成带有图文的丝网印版。丝网印刷能够达到微米级的图案分辨率,成本低且操作简单但是导电线路与基板的结合性较差。喷墨打印是采用输入设备将导电图案的图文信息导入到计算机,经计算机系统编辑处理后输入至喷墨打印设备,喷嘴在计算机控制下喷射雾状导电油墨至柔性基底表面,根据电荷效应在柔性基底表面直接成像,形成最终的柔性导电线路。虽然喷墨打印工艺的应用广泛、工艺简单、成本低,对环境更加友好,但是喷墨打印工艺会受到油墨性质的限制,制备出的导电线路的精度也受限于喷嘴的尺寸。
激光活化选择性金属化(LISM)是利用计算机按照导电图形的轨迹控制激光的运动,将激光投射到预先制备的器件上,在几秒钟到几分钟的时间内,活化出电路图案,然后对活化表面进行化学镀,使得铜、镍、银、金等金属沉积在活化区,形成导电线路。采用这种工艺,不仅可以实现高灵活性生产,而且可以使超微细电路制造和微细装配成为可能。中国专利ZL201610154118.9公开了一种含铋敏化助剂,通过在聚合物中添加激光敏化剂实现了聚合物表面激光活化选择性金属化,当聚合物基底为弹性体时,在一定程度上实现了柔性电路的制备。但是,该工艺制备的金属电路在弯曲情况下,由于刚性的铜层容易断裂而失去导电性。且激光敏化剂的添加会破坏聚合物基体原有性能如力学性能,透明性能等。
因此,亟需开发出一种在弯曲甚至折叠条件下都具有优异的导电性能,同时制备成本可控,适合大规模工业化生产的柔性金属图案制备方法。
发明内容
本发明的目的在于提供一种基于激光活化选择性金属化的柔性可弯折金属图案及其制备方法和用途。
本发明提供了一种基于激光技术的柔性可弯折金属图案的制备方法,它包括如下步骤:
步骤1:将激光敏化剂与溶剂混合得到激光敏化剂悬浮液或溶液,然后将该悬浮液或溶液刮涂在柔性聚合物膜材表面,随后干燥去除溶剂;
步骤2:利用激光对步骤1中得到的柔性聚合物膜材表面进行辐照,并在辐照区域形成活化图案,然后用溶剂清洗掉多余激光敏化剂;
步骤3:将步骤2中得到的激光活化后的柔性聚合物膜材浸入金属镀液中进行化学镀,随即在活化表面得到柔性金属图案。
进一步地,步骤1中,所述激光敏化剂为铜的盐、铜的氧化物、铜的氢氧化物、铜的有机络合物、铋的盐、铋的氧化物、铋的氢氧化物、铋的有机络合物、铬的盐、铬的氢氧化物、铬的有机络合物、锡的盐、锡的氧化物、锡的氢氧化物、锡的有机络合物、锡的掺杂氧化物、锑的盐、锑的氧化物、锑的氢氧化物、锑的有机络合物、钼的盐、钼的氧化物、钼的氢氧化物、钼的硫化物、钼的氢氧化物、含钼的酸、铟的盐、铟的氧化物、铟的氢氧化物、铟的有机络合物、锌的氧化物、锌的硫化物、锌的氢氧化物、锌的盐、钨的氧化物、钨的硫化物、含钨的酸、钨的盐、镝的氧化物、铥的氧化物、铒的氧化物、镧的氧化物、铌的氧化物、钕的氧化物、镨的氧化物、钐的氧化物、铈的氧化物、铽的氧化物、钇的氧化物、铕的氧化物、镍的氧化物、镍的盐、碲的氧化物、锆的氧化物、银的氧化物、银的盐中的一种或两种以上;
和/或,步骤1中,所述溶剂为水、甲酰胺、乙腈、甲醇、乙醇、丙醇、丙酮、二氧六环、四氢呋喃、甲乙酮、正丁醇、醋酸乙酯、乙醚、异丙醚、二氯甲烷、氯仿、溴乙烷、苯、氯丙烷、甲苯、四氯化碳、二硫化碳、环己烷、己烷、庚烷中的一种或两种以上;
和/或,步骤1中,所述聚合物为醋酸纤维素、芳香聚酰胺、氟化乙烯丙烯共聚物、硅橡胶、聚酰胺、聚羟基丁酸酯、聚碳酸酯、聚偏二氯乙烯、聚氯乙烯、聚醚酰亚胺、聚醚醚酮、聚醚酮、聚醚醚酮、聚对苯二甲酸乙二醇酯、聚对苯二甲酸丁二醇酯、聚乙烯、聚四氟乙烯、聚氟乙烯、聚酰亚胺、聚甲基丙烯酸甲酯、聚甲基戊烯、聚乳酸、聚甲醛、聚丙烯、聚苯乙烯、聚醚砜、聚苯硫醚、聚砜、乙烯-三氟氯乙烯共聚物、乙烯-四氟乙烯共聚物中的任意一种或两种以上;
和/或,步骤3中,所述金属为导电金属,选自铜、镍、银、铬或金。
进一步地,步骤1中,所述激光敏化剂悬浮液或溶液是由以下重量百分比的组分组成:激光敏化剂2%-80%、溶剂20%-98%。
进一步地,步骤1中,所述聚合物膜材分为无孔膜和有孔膜;
优选地,步骤1中,所述有孔聚合物膜材孔径为0.05-15μm。
进一步地,步骤2中,所述激光的波长为190~1200nm。
进一步地,步骤2中,所述激光的波长为192nm、355nm或1064nm,所述激光功率1-20W,激光扫描速度500-2000mm/s,激光频率20-80kHz。
进一步地,步骤3中,所述图案包括电路、有装饰作用的花纹或图形。
本发明还提供了前述方法制备得到的柔性可弯折金属图案。
本发明还提供了前述的柔性可弯折金属图案在制备柔性电子设备中的用途。
本发明还提供了一种柔性电子设备,它包含前述的柔性可弯折金属图案。
本发明所述的柔性可弯折金属图案可以是柔性电子设备中的电路图,也可以是有装饰作用的花纹或图形。
现有技术中,利用激光活化选择性金属化制备电路图案,采用的方法都是将激光敏化剂与聚合物共混成组合物后成型再进行激光活化,最后利用化学镀制备金属图案。一方面激光敏化剂的加入会对聚合物基体的耐热老化性、机械性能等带来不同程度的负面影响;另一方面这种方式成本相对较高,这是由于激光活化仅是对聚合物表层进行活化,也就是说只有靠近表层的那部分激光敏化剂在激光辐照时起作用,而组合物其它部位的激光敏化剂处于浪费状态,而激光敏化剂的价格昂贵;再者,现有技术总是要先将激光敏化剂与聚合物共混制备成组合物,而对于现成的标准聚合物制品或制件(如薄膜、片、板、棒等)完全不适用于,使用受到局限。因此现有技术目前没有办法解决上述问题。而本发明通过大量研究意外地发现,将激光敏化剂制备成悬浮液或溶液涂覆在聚合物膜表面后,仍然可以通过激光辐照进行激光活化,从而利用后续化学镀在聚合物表面形成特定金属图案。
该方法省略了先制备组合物的前置步骤,也不会对聚合物基体的性能有负面影响,并且完全适用于各种现成的标准聚合物制品或制件(如薄膜、片、板、棒等),同时激光敏化剂的用量控制在最少水平,对于聚合物制件具有普适性,应用范围广。
与现有技术相比,本发明提供的技术方案的有益效果在于:
(1)本发明的制备方法不需要制造掩膜,图案可通过软件自由设计,如要制备不同图案的柔性可弯折金属图案,只需在激光控制软件中更换需要打印的图案即可;与传统的刻蚀法、丝网印刷工艺以及喷墨打印工艺相比,本发明的方法生产灵活性好,操作简单,成本可控,具有大规模工业化应用的前景。
(2)本发明的制备方法不需要使用价格昂贵的设备,所使用的激光器成本较低。
(3)与传统方法制备的柔性金属图案相比,通过本发明方法制备的柔性金属图案具有更好的柔性,在经过弯曲半径为1mm的10000次弯曲后,电阻保持不变,并且在折叠情况下仍能保持电路连通。
(4)本发明制备方法省略了先制备组合物的前置步骤,也不会对聚合物基体的性能有负面影响,并且完全适用于各种现成的标准聚合物制品或制件(如薄膜、片、板、棒等),同时激光敏化剂的用量控制在最少水平。发明人经过验证还发现本发明制备方法对于有孔聚合物膜材尤其适用。
综上,本发明提供了一种基于激光活化选择性金属化的柔性可弯折金属图案及其制备方法,本发明的制备方法无需掩膜,图案可通过软件自由设计,生产灵活性好,操作简单,成本可控,具有普适性,适合大规模工业化应用。利用本发明的方法制得的柔性金属图案柔性好,在柔性电路领域具有广阔的应用前景。
显然,根据本发明的上述内容,按照本领域的普通技术知识和惯用手段,在不脱离本发明上述基本技术思想前提下,还可以做出其它多种形式的修改、替换或变更。
以下通过实施例形式的具体实施方式,对本发明的上述内容再作进一步的详细说明。但不应将此理解为本发明上述主题的范围仅限于以下的实例。凡基于本发明上述内容所实现的技术均属于本发明的范围。
附图说明
图1为本发明实施例3所得到柔性可弯折金属线路照片;
图2为本发明实施例6所得到柔性可弯折金属线路照片;
图3为本发明实施例18所得到柔性可弯折金属线路折叠性能测试照片。
具体实施方式
本发明具体实施方式中使用的原料、设备均为已知产品,通过购买市售产品获得。
(1)本发明所用原料如下:
无孔聚酰亚胺(PI)、聚丙烯(PP)、聚乙烯(PE)、聚对苯二甲酸乙二醇酯(PET)以及聚氯乙烯(PVC)膜购自东莞欧承,有孔聚酰胺(PA)、聚四氟乙烯(PTFE)、聚偏氟乙烯(PVDF)、聚丙烯(PP)以及聚醚砜(PES)膜购自奇观潮。化学镀铜液、镀镍液购买于大展吉源新材料科技有限公司。
(2)本发明所用设备信息如下:
平面激光打标机,型号MF-E-A,脉冲激光,激光器最大功率20W,激光波长1064nm,广东大族粤铭激光集团股份有限公司。
平面激光打标机,型号MUV-E-R,脉冲激光,激光器最大功率5W,激光波长355nm,广东大族粤铭激光集团股份有限公司。
平面激光打标机,型号MV-U,脉冲激光,激光器最大功率2W,激光波长192nm,匹克国际激光公司。
实施例1.柔性可弯折金属图案的制备
将2wt.%锌钡白与98wt.%去离子水搅拌混合得到激光敏化剂悬浮液,利用刮涂棒将该悬浮液刮涂在孔径为0.05μm的有孔PA膜上,干燥去除溶剂,利用脉冲激光(192nm)辐照刮涂有激光敏化剂的PA膜表面进行激光活化,激光功率2W,扫描速度500mm/s,激光频率20kHz,去离子水清洗掉多余激光敏化剂,将清洗后的PA膜浸入化学镀铜液中,在40℃下镀铜30min制得导电金属图案。
实施例2.柔性可弯折金属图案的制备
将2wt.%氢氧化锌与98wt.%去离子水搅拌混合得到激光敏化剂悬浮液,利用刮涂棒将该悬浮液刮涂在孔径为0.05μm的有孔PA膜上,干燥去除溶剂,利用脉冲激光(355nm)辐照刮涂有激光敏化剂的PA膜表面进行激光活化,激光功率5W,扫描速度1000mm/s,激光频率50kHz,去离子水清洗掉多余激光敏化剂,将清洗后的PA膜浸入化学镀铜液中,在40℃下镀铜30min制得导电金属图案。
实施例3.柔性可弯折金属图案的制备
将2wt.%磷酸铜与98wt.%去离子水搅拌混合得到激光敏化剂悬浮液,利用刮涂棒将该悬浮液刮涂在孔径为0.05μm的有孔PA膜上,干燥去除溶剂,利用脉冲激光(1064nm)辐照刮涂有激光敏化剂的PA膜表面进行激光活化,激光功率8W,扫描速度2000mm/s,激光频率80kHz,去离子水清洗掉多余激光敏化剂,将清洗后的PA膜浸入化学镀铜液中,在40℃下镀铜30min制得导电金属图案。
实施例4.柔性可弯折金属图案的制备
聚合物膜材为无孔PI膜,其他条件与实施例1一致。
实施例5.柔性可弯折金属图案的制备
聚合物膜材为无孔PI膜,其他条件与实施例2一致。
实施例6.柔性可弯折金属图案的制备
聚合物膜材为无孔PI膜,其他条件与实施例3一致。
实施例7.柔性可弯折金属图案的制备
将2wt.%磷酸铜与98wt.%甲醇搅拌混合得到激光敏化剂悬浮液,利用刮涂棒将该悬浮液刮涂在孔径为0.05μm的有孔PTFE膜上,干燥去除溶剂,利用脉冲激光(1064nm)辐照刮涂有激光敏化剂的PTFE膜表面进行激光活化,激光功率8W,扫描速度2000mm/s,激光频率80kHz,去离子水清洗掉多余激光敏化剂,将清洗后的PTFE膜浸入化学镀铜液中,在40℃下镀铜30min制得导电金属图案。
实施例8.柔性可弯折金属图案的制备
所用溶剂为乙醇,其他条件与实施例7一致。
实施例9.柔性可弯折金属图案的制备
所用溶剂为丙醇,其他条件与实施例7一致。
实施例10.柔性可弯折金属图案的制备
所用溶剂为四氢呋喃,其他条件与实施例7一致。
实施例11.柔性可弯折金属图案的制备
所用溶剂为二氯甲烷,其他条件与实施例7一致。
实施例12.柔性可弯折金属图案的制备
所用溶剂为氯仿,聚合物膜材为无孔PP,其他条件与实施例7一致。
实施例13.柔性可弯折金属图案的制备
所用溶剂为环己烷,聚合物膜材为无孔PP,其他条件与实施例7一致。
实施例14.柔性可弯折金属图案的制备
所用溶剂为甲苯,聚合物膜材为无孔PP,其他条件与实施例7一致。
实施例15.柔性可弯折金属图案的制备
所用溶剂为四氯化碳,聚合物膜材为无孔PP,其他条件与实施例7一致。
实施例16.柔性可弯折金属图案的制备
将2wt.%磷酸铜与98wt.%四氯化碳搅拌混合得到激光敏化剂悬浮液,利用刮涂棒将该悬浮液刮涂在孔径为0.05μm的有孔PVDF膜上,干燥去除溶剂,利用脉冲激光(1064nm)辐照刮涂有激光敏化剂的PVDF膜表面进行激光活化,激光功率8W,扫描速度2000mm/s,激光频率80kHz,去离子水清洗掉多余激光敏化剂,将清洗后的PVDF膜浸入化学镀铜液中,在40℃下镀铜30min制得导电金属图案。
实施例17.柔性可弯折金属图案的制备
悬浮液中激光敏化剂含量为5wt.%,其他条件与实施例16一致。
实施例18.柔性可弯折金属图案的制备
悬浮液中激光敏化剂含量为10wt.%,其他条件与实施例16一致。
实施例19.柔性可弯折金属图案的制备
悬浮液中激光敏化剂含量为20wt.%,聚合物膜材为无孔PE,其他条件与实施例16一致。
实施例20.柔性可弯折金属图案的制备
悬浮液中激光敏化剂含量为50wt.%,聚合物膜材为无孔PE,其他条件与实施例16一致。
实施例21.柔性可弯折金属图案的制备
悬浮液中激光敏化剂含量为75wt.%,聚合物膜材为无孔PE,其他条件与实施例16一致。
实施例22.柔性可弯折金属图案的制备
将75wt.%磷酸铜与25wt.%四氯化碳搅拌混合得到激光敏化剂悬浮液,利用刮涂棒将该悬浮液刮涂在孔径为0.05μm的有孔PP膜上,干燥去除溶剂,利用脉冲激光(1064nm)辐照刮涂有激光敏化剂的PP膜表面进行激光活化,激光功率8W,扫描速度2000mm/s,激光频率80kHz,去离子水清洗掉多余激光敏化剂,将清洗后的PP膜浸入化学镀铜液中,在40℃下镀铜30min制得导电金属图案。
实施例23.柔性可弯折金属图案的制备
激光敏化剂为二氧化锡,其他条件与实施例22一致。
实施例24.柔性可弯折金属图案的制备
激光敏化剂为氧化铋,其他条件与实施例22一致。
实施例25.柔性可弯折金属图案的制备
激光敏化剂为焦磷酸铜,悬浮液中激光敏化剂含量为80wt.%,其他条件与实施例22一致。
实施例26.柔性可弯折金属图案的制备
激光敏化剂为草酸铜,其他条件与实施例22一致。
实施例27.柔性可弯折金属图案的制备
激光敏化剂为二硫化钼,其他条件与实施例22一致。
实施例28.柔性可弯折金属图案的制备
激光敏化剂为氢氧化钼,其他条件与实施例22一致。
实施例29.柔性可弯折金属图案的制备
激光敏化剂为钼酸,聚合物膜材为无孔PET,其他条件与实施例22一致。
实施例30.柔性可弯折金属图案的制备
激光敏化剂为磷钼酸,聚合物膜材为无孔PET,其他条件与实施例22一致。
实施例31.柔性可弯折金属图案的制备
激光敏化剂为三氧化钼,聚合物膜材为无孔PET,其他条件与实施例22一致。
实施例32.柔性可弯折金属图案的制备
激光敏化剂为碳酸锌,聚合物膜材为无孔PET,其他条件与实施例22一致。
实施例33.柔性可弯折金属图案的制备
激光敏化剂为钨酸,悬浮液中激光敏化剂含量为80wt.%,聚合物膜材为无孔PET,其他条件与实施例22一致。
实施例34.柔性可弯折金属图案的制备
激光敏化剂为氧化铋,聚合物膜材为无孔PET,其他条件与实施例22一致。
实施例35.柔性可弯折金属图案的制备
将75wt.%氧化铽与25wt.%四氯化碳搅拌混合得到激光敏化剂悬浮液,利用刮涂棒将该悬浮液刮涂在孔径为0.05μm的有孔PES膜上,干燥去除溶剂,利用脉冲激光(1064nm)辐照刮涂有激光敏化剂的PES膜表面进行激光活化,激光功率8W,扫描速度2000mm/s,激光频率80kHz,去离子水清洗掉多余激光敏化剂,将清洗后的PES膜浸入化学镀铜液中,在40℃下镀铜30min制得导电金属图案。
实施例36.柔性可弯折金属图案的制备
有孔PES孔径为0.5μm,悬浮液中激光敏化剂含量为80wt.%,其他条件与实施例35一致。
实施例37.柔性可弯折金属图案的制备
有孔PES孔径为2μm,悬浮液中激光敏化剂含量为80wt.%,其他条件与实施例35一致。
实施例38.柔性可弯折金属图案的制备
有孔PES孔径为5μm,其他条件与实施例35一致。
实施例39.柔性可弯折金属图案的制备
有孔PES孔径为15μm,其他条件与实施例35一致。
实施例40.柔性可弯折金属图案的制备
将20wt.%硝酸银与80wt.%水搅拌混合得到激光敏化剂溶液,利用刮涂棒将该悬浮液刮涂在孔径为15μm的有孔PES膜上,干燥去除溶剂,利用脉冲激光(1064nm)辐照刮涂有激光敏化剂的PES膜表面进行激光活化,激光功率8W,扫描速度2000mm/s,激光频率80kHz,去离子水清洗掉多余激光敏化剂,将清洗后的PES膜浸入化学镀铜液中,在40℃下镀铜30min制得导电金属图案。
实施例41.柔性可弯折金属图案的制备
聚合物膜材为无孔PVC,其他条件与实施例40一致。
实施例42.柔性可弯折金属图案的制备
激光敏化剂为乙酸银,其他条件与实施例40一致。
实施例43.柔性可弯折金属图案的制备
聚合物膜材为无孔PVC,激光敏化剂为乙酸银,其他条件与实施例40一致。
实施例44.柔性可弯折金属图案的制备
将20wt.%氧化镍与80wt.%水搅拌混合得到激光敏化剂溶液,利用刮涂棒将该悬浮液刮涂在孔径为15μm的有孔PES膜上,干燥去除溶剂,利用脉冲激光(1064nm)辐照刮涂有激光敏化剂的PES膜表面进行激光活化,激光功率8W,扫描速度2000mm/s,激光频率80kHz,去离子水清洗掉多余激光敏化剂,将清洗后的PES膜浸入化学镀镍液中,在70-80℃下镀镍90min制得导电金属图案。
实施例45.柔性可弯折金属图案的制备
聚合物膜材为无孔PVC,悬浮液中激光敏化剂含量为80wt.%,其他条件与实施例44一致。
实施例46.柔性可弯折金属图案的制备
激光敏化剂为乙酸镍,其他条件与实施例44一致。
实施例47.柔性可弯折金属图案的制备
聚合物膜材为无孔PVC,激光敏化剂为乙酸镍,其他条件与实施例44一致。
对比例1.柔性可弯折金属图案的制备
激光敏化剂为四氧化三铁,其他条件与实施例1一致。
对比例2.柔性可弯折金属图案的制备
激光敏化剂为氧化锰,其他条件与实施例2一致。
对比例3.柔性可弯折金属图案的制备
激光敏化剂为硅酸镁,其他条件与实施例3一致。
对比例4.柔性可弯折金属图案的制备
激光敏化剂为四氧化三铁,其他条件与实施例4一致。
对比例5.柔性可弯折金属图案的制备
激光敏化剂为氧化锰,其他条件与实施例5一致。
对比例6.柔性可弯折金属图案的制备
激光敏化剂为硅酸镁,其他条件与实施例6一致。
对比例7.柔性可弯折金属图案的制备
激光敏化剂为四氧化三铁,其他条件与实施例7一致。
对比例8.柔性可弯折金属图案的制备
激光敏化剂为硝酸铁,其他条件与实施例8一致。
对比例9.柔性可弯折金属图案的制备
激光敏化剂为三氧化二铬,其他条件与实施例9一致。
对比例10.柔性可弯折金属图案的制备
激光敏化剂为氯化锰,其他条件与实施例10一致。
对比例11.柔性可弯折金属图案的制备
激光敏化剂为硫酸锰,其他条件与实施例11一致。
对比例12.柔性可弯折金属图案的制备
激光敏化剂为硫酸锰,其他条件与实施例16一致。
对比例13.柔性可弯折金属图案的制备
激光敏化剂为硫酸锰,其他条件与实施例17一致。
对比例14.柔性可弯折金属图案的制备
激光敏化剂为硫酸锰,其他条件与实施例18一致。
对比例15.柔性可弯折金属图案的制备
激光敏化剂为硫酸锰,悬浮液中激光敏化剂含量为20wt.%,其他条件与实施例18一致。
对比例16.柔性可弯折金属图案的制备
激光敏化剂为硫酸锰,悬浮液中激光敏化剂含量为50wt.%,其他条件与实施例18一致。
对比例17.柔性可弯折金属图案的制备
激光敏化剂为氧化亚锰,其他条件与实施例35一致。
对比例18.柔性可弯折金属图案的制备
激光敏化剂为氧化亚锰,其他条件与实施例36一致。
对比例19.柔性可弯折金属图案的制备
激光敏化剂为氧化亚锰,其他条件与实施例37一致。
对比例20.柔性可弯折金属图案的制备
激光敏化剂为氧化亚锰,其他条件与实施例38一致。
对比例21.柔性可弯折金属图案的制备
激光敏化剂为氧化亚锰,其他条件与实施例39一致。
对比例22.柔性可弯折金属图案的制备
激光敏化剂为硫酸锰,其他条件是实施例40一致。
对比例23.柔性可弯折金属图案的制备
激光敏化剂为三氧化二铬,其他条件与实施例42一致。
对比例24.柔性可弯折金属图案的制备
激光敏化剂为硫酸铁,其他条件与实施例44一致。
对比例25.柔性可弯折金属图案的制备
激光敏化剂为四氧化三铁,其他条件与实施例46一致。
对比例26.柔性可弯折金属图案的制备
不添加激光敏化剂,其他条件与实施例40一致。
对比例27.柔性可弯折金属图案的制备
不添加激光敏化剂,其他条件与实施例41一致。
对比例28.柔性可弯折金属图案的制备
不用激光进行活化,其他条件与实施例40一致。
对比例29.柔性可弯折金属图案的制备
不用激光进行活化,其他条件与实施例41一致。
对比例30.柔性可弯折金属图案的制备
悬浮液或溶液中激光敏化剂含量为1.7%,其他条件与实施例2一致。
对比例31.柔性可弯折金属图案的制备
悬浮液或溶液中激光敏化剂含量为0.8%,其他条件与实施例4一致。
对比例32.柔性可弯折金属图案的制备
悬浮液或溶液中激光敏化剂含量为1.9%,其他条件与实施例10一致。
对比例33.柔性可弯折金属图案的制备
悬浮液或溶液中激光敏化剂含量为0.5%,其他条件与实施例26一致。
对比例34.柔性可弯折金属图案的制备
悬浮液或溶液中激光敏化剂含量为1.3%,其他条件与实施例45一致。
以下通过实验例证明本发明的有益效果。
实验例1、柔性可弯折金属图案的性能测试
1、实验方法
化学镀效果:目测。
化学镀的镀层厚度:依据ASTMB568(2009)进行测试。
镀层牢度测试:依据ASTM D3359,使用划格器在镀层区域划出大小为1mm×1mm的正方形小网格。接着,将Scotch 3M 600-1PK测试胶带粘贴到划格区域,快速撕下胶带。根据金属层脱落的面积判断粘附强度的等级。在ASTM D3359分级标准中,级别越高,表示聚合物基材与镀层之间的粘附力越高。其中:
0B网格的剥落面积大于65%;
1B网格的剥落面积为35%-65%;
2B网格的剥落面积为15%-35%;
3B网格的剥落面积为5%-15%;
4B网格的剥落面积为5%;
5B无任何网格剥落;
弯曲性能测试:用万用表检测金属图案在弯曲情况下的电阻。若在弯曲情况下电阻变大且仍保持连通,表示弯曲性能“良好”;若在弯曲情况下电阻不变,表示弯曲性能“优秀”。
折叠性能测试:金属图案作为导线连通LED小灯泡与电池,将金属图案进行对折,若LED灯熄灭,说明金属图案折叠性能“差”;若LED灯不熄灭且亮度未发生肉眼可查的亮度变化,则说明金属图案折叠性能“优秀”。
本实验例中弯曲性能测试的金属图案为长50mm,宽1mm的四根导线并联;折叠性能测试的金属图案为长80mm,宽1mm的两根导线串联。
2、实验结果
测试结果如表1所示。
聚合物表面无法进行激光活化选择性金属化或无测试价值时,无法进行性能测试,故以“无性能”表示。
表1原料参数汇总“无”表示没有使用相应物质。
表1各金属图案的性能测试结果。
表1.各金属图案的性能测试结果
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从表1可以看出,实施例1-47通过使用多种不同聚合物薄膜、不同孔径、特定激光敏化剂、不同溶剂、不同激光敏化剂含量以及不同激光波长,成功地在聚合物膜材表面实现了柔性金属图案的制备。当聚合物膜材为无孔膜时,所制得的柔性金属图案弯曲性能良好;当聚合物膜材为多孔膜时,所制得的柔性金属图案弯曲性能突出,在1mm的弯曲半径下弯曲10000次电阻保持不变,在折叠情况下电路仍能保持连通。
从实验结果中可以看到并不是所有的激光敏化剂都有效果,对比例1~25的激光敏化剂在激光活化后的化学镀时甚至无法上镀,对比例26~27不加激光敏化剂以及对比例28~29不进行激光活化,均无法上镀,无法成功制备得到柔性金属图案。同时,对比例30~34的实测数据也说明悬浮液或溶液中激光敏化剂含量低于2wt.%时,进行激光活化后要么不能上镀,要么少量上镀后镀层牢度极低而没有实际价值。在实际实验中,当悬浮液中的激光敏化剂含量大于80wt.%时,由于整体呈现半干态或干态,因此没办法利用其对聚合物薄膜进行有效刮涂而无法进行后续操作。
综上,本发明提供了一种基于激光活化选择性金属化的柔性可弯折金属图案及其制备方法,本发明的制备方法无需掩膜,图案可通过软件自由设计,生产灵活性好,操作简单,成本可控,具有普适性,适合大规模工业化应用。利用本发明的方法制得的柔性金属图案柔性好,在柔性电路领域具有广阔的应用前景。
Claims (9)
1.一种基于激光技术的柔性可弯折金属图案的制备方法,其特征在于:它包括如下步骤:
步骤1:将激光敏化剂与溶剂混合得到激光敏化剂悬浮液或溶液,然后将该悬浮液或溶液刮涂在柔性聚合物膜材表面,随后干燥去除溶剂;
步骤2:利用激光对步骤1中得到的柔性聚合物膜材表面进行辐照,并在辐照区域形成活化图案,然后用溶剂清洗掉多余激光敏化剂;
步骤3:将步骤2中得到的激光活化后的柔性聚合物膜材浸入金属镀液中进行化学镀,随即在活化表面得到柔性金属图案;
步骤1中,所述激光敏化剂悬浮液或溶液是由以下重量百分比的组分组成:激光敏化剂2%-80%、溶剂20%-98%;
步骤1中,所述激光敏化剂为铜的氧化物、铜的氢氧化物、铜的有机络合物、铋的盐、铋的氧化物、铋的氢氧化物、铋的有机络合物、铬的盐、铬的氢氧化物、铬的有机络合物、锡的盐、锡的氧化物、锡的氢氧化物、锡的有机络合物、锡的掺杂氧化物、锑的盐、锑的氧化物、锑的氢氧化物、锑的有机络合物、钼的盐、钼的氧化物、钼的氢氧化物、钼的硫化物、钼的氢氧化物、含钼的酸、铟的盐、铟的氧化物、铟的氢氧化物、铟的有机络合物、锌的氧化物、锌的硫化物、锌的氢氧化物、锌的盐、钨的氧化物、钨的硫化物、含钨的酸、钨的盐、镝的氧化物、铥的氧化物、铒的氧化物、镧的氧化物、铌的氧化物、钕的氧化物、镨的氧化物、钐的氧化物、铈的氧化物、铽的氧化物、钇的氧化物、铕的氧化物、镍的氧化物、碲的氧化物、锆的氧化物、银的氧化物、银的盐中的一种或两种以上;
步骤1中,所述溶剂为水、甲酰胺、乙腈、甲醇、乙醇、丙醇、丙酮、二氧六环、四氢呋喃、甲乙酮、正丁醇、醋酸乙酯、乙醚、异丙醚、二氯甲烷、氯仿、溴乙烷、氯丙烷中的一种或两种以上;
步骤1中,所述聚合物为醋酸纤维素、芳香聚酰胺、氟化乙烯丙烯共聚物、硅橡胶、聚酰胺、聚羟基丁酸酯、聚碳酸酯、聚偏二氯乙烯、聚氯乙烯、聚醚酰亚胺、聚醚醚酮、聚醚酮、聚醚醚酮、聚对苯二甲酸乙二醇酯、聚对苯二甲酸丁二醇酯、聚乙烯、聚四氟乙烯、聚氟乙烯、聚酰亚胺、聚甲基丙烯酸甲酯、聚甲基戊烯、聚乳酸、聚甲醛、聚丙烯、聚苯乙烯、聚醚砜、聚苯硫醚、聚砜、乙烯-三氟氯乙烯共聚物、乙烯-四氟乙烯共聚物中的任意一种或两种以上;
步骤3中,所述金属为导电金属,选自铜、镍、银、铬或金。
2.根据权利要求1所述的制备方法,其特征在于:步骤1中,所述聚合物膜材分为无孔膜和有孔膜。
3.根据权利要求2所述的制备方法,其特征在于:步骤1中,所述有孔聚合物膜材孔径为0.05-15μm。
4.根据权利要求1所述的制备方法,其特征在于:步骤2中,所述激光的波长为190~1200nm。
5.根据权利要求4所述的制备方法,其特征在于:步骤2中,所述激光的波长为192nm、355nm或1064nm,所述激光功率1-20W,激光扫描速度500-2000mm/s,激光频率20-80kHz。
6.根据权利要求1所述的制备方法,其特征在于:步骤3中,所述图案包括电路、有装饰作用的花纹或图形。
7.权利要求1~6任一项所述方法制备得到的柔性可弯折金属图案。
8.权利要求7所述的柔性可弯折金属图案在制备柔性电子设备中的用途。
9.一种柔性电子设备,其特征在于:它包含权利要求7所述的柔性可弯折金属图案。
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5545308A (en) * | 1995-06-19 | 1996-08-13 | Lynntech, Inc. | Method of using conductive polymers to manufacture printed circuit boards |
JP2006140376A (ja) * | 2004-11-15 | 2006-06-01 | Konica Minolta Holdings Inc | 導電性パターンの形成方法 |
WO2006085669A1 (en) * | 2005-02-08 | 2006-08-17 | Fujifilm Corporation | Metallic pattern forming method, metallic pattern obtained thereby, printed wiring board using the same, and tft wiring board using the same |
JP2007134396A (ja) * | 2005-11-08 | 2007-05-31 | Fujifilm Corp | プリント配線板用積層体、それを用いた多層金属配線パターン形成方法及び金属薄膜 |
JP2012234013A (ja) * | 2011-04-28 | 2012-11-29 | Fujifilm Corp | 金属パターン材料及びその製造方法 |
WO2015024775A1 (en) * | 2013-08-19 | 2015-02-26 | Total Marketing Services | Method for depositing metal on a substrate, in particular for metallization of solar cells and modules |
CN110344030A (zh) * | 2019-08-08 | 2019-10-18 | 四川大学 | 一种用于激光拉曼增强的高灵敏基底材料及其制备方法 |
CN113727531A (zh) * | 2021-08-31 | 2021-11-30 | 四川大学 | 一种基于激光活化选择性金属化的柔性液态金属图案及其制备方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100009094A1 (en) * | 2007-01-19 | 2010-01-14 | Basf Se Patents, Trademarks And Licenses | Method for the producing structured electrically conductive surfaces |
-
2022
- 2022-04-27 CN CN202210454194.7A patent/CN114786342B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5545308A (en) * | 1995-06-19 | 1996-08-13 | Lynntech, Inc. | Method of using conductive polymers to manufacture printed circuit boards |
JP2006140376A (ja) * | 2004-11-15 | 2006-06-01 | Konica Minolta Holdings Inc | 導電性パターンの形成方法 |
WO2006085669A1 (en) * | 2005-02-08 | 2006-08-17 | Fujifilm Corporation | Metallic pattern forming method, metallic pattern obtained thereby, printed wiring board using the same, and tft wiring board using the same |
JP2007134396A (ja) * | 2005-11-08 | 2007-05-31 | Fujifilm Corp | プリント配線板用積層体、それを用いた多層金属配線パターン形成方法及び金属薄膜 |
JP2012234013A (ja) * | 2011-04-28 | 2012-11-29 | Fujifilm Corp | 金属パターン材料及びその製造方法 |
WO2015024775A1 (en) * | 2013-08-19 | 2015-02-26 | Total Marketing Services | Method for depositing metal on a substrate, in particular for metallization of solar cells and modules |
CN110344030A (zh) * | 2019-08-08 | 2019-10-18 | 四川大学 | 一种用于激光拉曼增强的高灵敏基底材料及其制备方法 |
CN113727531A (zh) * | 2021-08-31 | 2021-11-30 | 四川大学 | 一种基于激光活化选择性金属化的柔性液态金属图案及其制备方法 |
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