EP2153708A1 - Procédé de réalisation de laminés de base dotés d'un revêtement métallique - Google Patents

Procédé de réalisation de laminés de base dotés d'un revêtement métallique

Info

Publication number
EP2153708A1
EP2153708A1 EP08759762A EP08759762A EP2153708A1 EP 2153708 A1 EP2153708 A1 EP 2153708A1 EP 08759762 A EP08759762 A EP 08759762A EP 08759762 A EP08759762 A EP 08759762A EP 2153708 A1 EP2153708 A1 EP 2153708A1
Authority
EP
European Patent Office
Prior art keywords
substrate
carrier
release agent
metal
base layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08759762A
Other languages
German (de)
English (en)
Inventor
Rene Lochtman
Jürgen Kaczun
Norbert Wagner
Jürgen PFISTER
Dieter Hentschel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF SE
Original Assignee
BASF SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BASF SE filed Critical BASF SE
Priority to EP08759762A priority Critical patent/EP2153708A1/fr
Publication of EP2153708A1 publication Critical patent/EP2153708A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0036—Heat treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/243—Coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0072—Orienting fibers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0092—Metallizing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/08—Dimensions, e.g. volume
    • B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
    • B32B2309/105—Thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/14—Corona, ionisation, electrical discharge, plasma treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2519/00—Labels, badges
    • B32B2519/02—RFID tags
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/16—Drying; Softening; Cleaning
    • B32B38/164—Drying
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method

Definitions

  • the metal-coated base laminates produced in this way are very expensive.
  • the handling of copper foils with a thickness of less than 10 microns and especially less than 5 microns is very difficult to impossible, since the film breaks. Therefore, for thin copper foils, i. H. Copper foils with a thickness of less than 12 ⁇ m, always a thicker copper foil, generally with a thickness of 18 ⁇ m or 36 ⁇ m, additionally used as carrier. In order for the copper to dissolve from the carrier, a thin chromium layer is generally used as the separating layer.
  • An advantage of using the substrate is that it is recyclable as it generally will not be damaged after removal of the coated base laminate. Furthermore, it is also possible to produce the substrate with a defined surface quality and structure, so that according to the surface quality of the substrate, a predetermined surface quality and structure for the metal-coated base laminate is achieved.
  • the metals are selected from the group consisting of aluminum, iron, copper, nickel, silver and zinc.
  • Platelet-shaped, electrolessly and / or electrolytically coatable particles can be controlled by optimized conditions in the production process or, in hindsight be obtained by mechanical treatment, for example by treatment in a stirred ball mill.
  • Suitable electrolyte solutions which can be used for coating electrically conductive structures are known to those skilled in the art, for example from Werner Jillek, Gustl Keller, Manual of printed circuit board technology, Eugen G. Leuze Verlag, 2003, Volume 4, pages 332-352.
  • any reinforced or unreinforced polymer as is commonly used for printed circuit boards.
  • Suitable polymers are, for example, bifunctional and polyfunctional bisphenol A and F based epoxy resins, epoxy novolak resins, brominated epoxy resins, cycloaliphatic epoxy resins, bismuth triazine resins, polyimides, phenolic resins, cyanate esters, melamine resins or amino resins , Phenoxy resins, allylated polyphenylene ethers (APPE), polysulfones, polyamides, silicone and fluorine resins, and combinations thereof.
  • bifunctional and polyfunctional bisphenol A and F based epoxy resins epoxy novolak resins, brominated epoxy resins, cycloaliphatic epoxy resins, bismuth triazine resins, polyimides, phenolic resins, cyanate esters, melamine resins or amino resins , Phenoxy resins, allylated polyphenylene ethers (APPE), polysulf
  • metal-coated base laminate After pressing and curing the moldable, electrically non-conductive material and laminating the metal layer, such metal-coated base laminate is preferably further processed.
  • metal-coated base laminate it is possible to assemble the metal-coated base laminate.
  • the individual layers can be cut into plates of predetermined size.
  • the electrolytic solution for the electroless and / or galvanic coating is not sprayed on, as shown here in FIG. 1, but the substrate 3, which is coated with the release agent 1 and the base layer 11, becomes the electrolyte solution immersed.
  • any further method known to the person skilled in the art with which the base layer 1 1 can be electrolessly and / or galvanically coated is also suitable.
  • the exposure of the electrolessly and / or electrolytically coatable particles in the base layer 11 can also be done by immersion in the oxidation or solvent. It is also possible to carry out the rinsing not by spraying the substrate 3 but by immersing it in a rinsing solution.
  • Any further suitable method known to the person skilled in the art to expose the electrolessly and / or electrolytically coatable particles from the base layer 11 and to rinse the substrate 3 which is coated with the release agent 1 and the base layer 11 can also be used.
  • the moldable electrically nonconductive material 37 is, for example, as mentioned above, a reinforced or unreinforced plastic, for example a glass fiber reinforced epoxy resin.
  • the conclusion of the stack 35 forms an upper substrate 39, which is coated on one side only with the base layer 1 1, which contains the electroless and / or galvanically coatable particles, and the metal layer 25.
  • the base layer 1 1 and the metal layer 25 are directed in the direction of the moldable electrically non-conductive material 37.
  • the lower end of the stack 35 forms a lower substrate 41, which is likewise coated on one side only with the base layer 11 and the metal layer 25, wherein the base layer 1 1 and the metal layer 25 point in the direction of the moldable, electrically non-conductive material 37.
  • the upper substrate 39 and the lower substrate 41 are provided both on their upper side and on their underside with the base layer 11 and the metal layer 25.
  • the upper substrate 39 and the lower substrate 41 are preferably plates.
  • the substrates 3 can be removed after curing in a simple manner again.
  • a layer of the metal layer 25 and possibly also a portion of the base layer 1 1 containing the electroless and / or electrodepositable particles remains on the cured, non-conductive material which forms the carrier.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Fluid Mechanics (AREA)
  • Laminated Bodies (AREA)
  • Chemically Coating (AREA)

Abstract

La présente invention concerne un procédé de réalisation de laminés de base dotés d'un revêtement métallique, comprenant un support (51) constitué d'un matériau (37) électriquement non conducteur et dont au moins un côté est revêtu d'une couche métallique (25, 53). Au cours d'une première phase, une couche de base (11) est appliquée sur un substrat (3) avec une dispersion (5) qui contient des particules qui peuvent être appliquées sous forme de couche sans courant et/ou par galvanisation, dans une matière matricielle. La matière matricielle est durcie et/ou asséchée au moins partiellement. Puis une couche métallique est formée sur la couche de base (11) par revêtement sans courant et/ou galvanisation. Le support (51) en matériau (37) électriquement non conducteur est laminé sur la couche métallique (25). Pour finir, le support (51) et la couche métallique (25) sur laquelle il est laminé, ainsi qu'au moins une partie de la couche de base (11) sont retirés du substrat (3).
EP08759762A 2007-05-24 2008-05-20 Procédé de réalisation de laminés de base dotés d'un revêtement métallique Withdrawn EP2153708A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP08759762A EP2153708A1 (fr) 2007-05-24 2008-05-20 Procédé de réalisation de laminés de base dotés d'un revêtement métallique

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP07108827 2007-05-24
EP08759762A EP2153708A1 (fr) 2007-05-24 2008-05-20 Procédé de réalisation de laminés de base dotés d'un revêtement métallique
PCT/EP2008/056146 WO2008142064A1 (fr) 2007-05-24 2008-05-20 Procédé de réalisation de laminés de base dotés d'un revêtement métallique

Publications (1)

Publication Number Publication Date
EP2153708A1 true EP2153708A1 (fr) 2010-02-17

Family

ID=39639214

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08759762A Withdrawn EP2153708A1 (fr) 2007-05-24 2008-05-20 Procédé de réalisation de laminés de base dotés d'un revêtement métallique

Country Status (11)

Country Link
US (1) US20100176090A1 (fr)
EP (1) EP2153708A1 (fr)
JP (1) JP2010527811A (fr)
KR (1) KR20100016622A (fr)
CN (1) CN101682995A (fr)
BR (1) BRPI0811243A2 (fr)
CA (1) CA2685517A1 (fr)
IL (1) IL201633A0 (fr)
RU (1) RU2009147813A (fr)
TW (1) TW200902304A (fr)
WO (1) WO2008142064A1 (fr)

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EP2163146A2 (fr) * 2007-05-24 2010-03-17 Basf Se Procédé de réalisation de feuilles de métal à revêtement polymère et leur utilisation
DE102007027999A1 (de) * 2007-06-14 2008-12-18 Leonhard Kurz Gmbh & Co. Kg Heißprägen von Strukturen
US20110204382A1 (en) * 2008-05-08 2011-08-25 Base Se Layered structures comprising silicon carbide layers, a process for their manufacture and their use
JP5419265B2 (ja) * 2009-06-30 2014-02-19 信越化学工業株式会社 熱圧着用シリコーンゴムシート及びその製造方法
KR20120025156A (ko) * 2010-09-07 2012-03-15 삼성전자주식회사 사출물의 외관 표면 처리 방법
TWI509882B (zh) * 2011-06-30 2015-11-21 Jieng Tai Internat Electric Corp 形成天線的方法
DE102011108531A1 (de) * 2011-07-26 2013-01-31 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines Kartenkörpers
CN102480842A (zh) * 2011-09-05 2012-05-30 深圳光启高等理工研究院 一种介质基板的制备方法
KR101469683B1 (ko) * 2013-05-31 2014-12-05 주식회사 불스원신소재 무전해 및 전해 연속 공정에 의해 제조된 구리 및 니켈 도금 탄소 섬유를 이용한 전자파 차폐 복합재의 제조 방법 및 전자파 차폐 복합재
KR101578640B1 (ko) * 2015-08-25 2015-12-17 선호경 부분 강화된 이송롤러를 구비한 pcb 도금장치
US10751821B2 (en) * 2015-08-28 2020-08-25 Edison Welding Institute, Inc. Methods for assembling metallic sandwich and honeycomb structures
CN112054216A (zh) * 2020-08-14 2020-12-08 上海文施绿极科技有限公司 燃料电池用的电极浆料及其制造方法
AU2021329906A1 (en) 2020-08-18 2023-04-27 Enviro Metals, LLC Metal refinement
CN112662314B (zh) * 2020-12-10 2022-08-23 深圳市柳鑫实业股份有限公司 一种环保型pcb钻孔用盖板及其制备方法
CN112792339A (zh) * 2020-12-23 2021-05-14 东莞市新饰界材料科技有限公司 钨合金薄片的制备方法
TWI806699B (zh) * 2022-07-11 2023-06-21 超能高新材料股份有限公司 推板式薄型生胚製造機構

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Also Published As

Publication number Publication date
WO2008142064A1 (fr) 2008-11-27
CA2685517A1 (fr) 2008-11-27
JP2010527811A (ja) 2010-08-19
CN101682995A (zh) 2010-03-24
TW200902304A (en) 2009-01-16
KR20100016622A (ko) 2010-02-12
US20100176090A1 (en) 2010-07-15
RU2009147813A (ru) 2011-06-27
IL201633A0 (en) 2010-05-31
BRPI0811243A2 (pt) 2014-11-04

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