EP2057864B9 - Heizelement - Google Patents

Heizelement Download PDF

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Publication number
EP2057864B9
EP2057864B9 EP07801293.7A EP07801293A EP2057864B9 EP 2057864 B9 EP2057864 B9 EP 2057864B9 EP 07801293 A EP07801293 A EP 07801293A EP 2057864 B9 EP2057864 B9 EP 2057864B9
Authority
EP
European Patent Office
Prior art keywords
heating element
electrodes
ceramic body
element according
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP07801293.7A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2057864B1 (de
EP2057864A1 (de
Inventor
Werner Kahr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of EP2057864A1 publication Critical patent/EP2057864A1/de
Publication of EP2057864B1 publication Critical patent/EP2057864B1/de
Application granted granted Critical
Publication of EP2057864B9 publication Critical patent/EP2057864B9/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/022—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances
    • H01C7/023—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances containing oxides or oxidic compounds, e.g. ferrites
    • H01C7/025—Perovskites, e.g. titanates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/02—Heaters using heating elements having a positive temperature coefficient
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49083—Heater type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49087—Resistor making with envelope or housing
    • Y10T29/49098—Applying terminal

Definitions

  • Heating elements with ceramic PTC resistors are for example from the document US 4,899,032 and JP 11297504 known.
  • the heating element has a ceramic body specified, which has PTC properties.
  • PTC Positive Temperature Coefficient.
  • the heating element has electrodes which are arranged on the ceramic body. Both the ceramic body and the electrodes are lead-free.
  • the heating element can be used in automotive applications in 12/24/42 V operation preferably for heating the vehicle interior, especially in diesel vehicles (cars, trucks, commercial vehicles) and gasoline-powered vehicles.
  • a plurality of identical heating elements are arranged on a common carrier, conductively connected to one another and thus combined to form a heating arrangement.
  • the ceramic body is sintered. To produce the ceramic body ceramic raw materials are used without lead additives.
  • the ceramic raw material preferably contains BaTiO 3 .
  • the ceramic raw material contains in a variant (for example, next the barium titanate) a proportion of SrTiO 3 .
  • the body may be free of SrTiO 3 .
  • the electrodes or their sublayers are preferably produced in a metal deposition process. Examples are sputtering, vapor deposition, galvanic deposition, chemical deposition. However, the electrodes can also be produced by burning in a metal paste. Depending on the variant, the thickness of the electrodes can be between 2 ⁇ m and 25 ⁇ m.
  • the electrodes may contain metallic Al as the base material.
  • the base material of the electrodes may be enriched with glass flux.
  • the proportion of glass flux is preferably about 5%.
  • the thickness of an electrode comprising Al as a base material and a glass flux as an additive is preferably 20 ⁇ m.
  • the glass flow can be dispensed with, so that the electrodes are free of glass additives.
  • the thickness of an electrode made of Al without glass flow is preferably 4 ⁇ m.
  • the electrodes may have a layer sequence comprising a plurality of partial layers.
  • the layer sequence may in particular comprise a base layer, which functions as an inner contact layer, and a diffusion barrier layer.
  • the inner contacting layer serves for ohmic contacting of the ceramic body.
  • chromium or a zinc-containing layer suitable.
  • a nickel layer is suitable which, depending on the variant, can be applied directly to the ceramic body or to the contacting layer.
  • the layer sequence preferably also comprises a conductive layer (outer contact layer) which has a good electrical conductivity which is higher than that of the underlying layers.
  • a conductive layer for example, a silver layer or a silver-containing layer is suitable. Further layer sequences not mentioned here can also be considered for the electrodes of the specified heating element.
  • the electrodes produced in a baking process are produced with stoving pastes which have a glass content.
  • a metal paste is used with a glass additive that is lead-free.
  • the metal paste also contains organic binders, which are preferably completely burned out when the electrodes are burned in.
  • the heating element preferably has two major surfaces.
  • a first electrode is arranged on the first main surface and a second electrode is arranged on the second main surface.
  • the heating element may be formed as a surface mountable device.
  • the specific resistance of the heating element may for example be set between 10 and 500 ohm cm.
  • the resistance value is not limited to the specified range.
  • heating element comprises a ceramic body 1, a first electrode 2 and a second electrode 3.
  • the electrode 2 is disposed on the lower main surface and the electrode 3 on the upper main surface of the body 1. Both the body 1 and the electrodes 2, 3 are lead-free.
  • each electrode consists of several layers.
  • the lower electrode has an inner contact layer 2a, a diffusion barrier layer 2b and an outer contact layer 2c.
  • the upper electrode similarly has an inner contact layer 3a, a diffusion barrier layer 3b, and an outer contact layer 3c.
  • the diffusion barrier layer 2b, 3b is disposed between the contact layers 2a, 3a and 2c, 3c.
  • the inner contacting layer 2a, 3a is disposed between the body 1 and the diffusion barrier layer 2b, 3b.
  • Each of the layers 2a, 2b, 2c, 3a, 3b, 3c is lead-free.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Resistance Heating (AREA)
  • Thermistors And Varistors (AREA)
EP07801293.7A 2006-09-01 2007-08-31 Heizelement Active EP2057864B9 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006041054A DE102006041054A1 (de) 2006-09-01 2006-09-01 Heizelement
PCT/DE2007/001556 WO2008025348A1 (de) 2006-09-01 2007-08-31 Heizelement

Publications (3)

Publication Number Publication Date
EP2057864A1 EP2057864A1 (de) 2009-05-13
EP2057864B1 EP2057864B1 (de) 2017-08-09
EP2057864B9 true EP2057864B9 (de) 2018-02-21

Family

ID=38787569

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07801293.7A Active EP2057864B9 (de) 2006-09-01 2007-08-31 Heizelement

Country Status (7)

Country Link
US (1) US8373100B2 (ja)
EP (1) EP2057864B9 (ja)
JP (1) JP2010501988A (ja)
KR (1) KR101465809B1 (ja)
CN (1) CN101507350A (ja)
DE (1) DE102006041054A1 (ja)
WO (1) WO2008025348A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2015002197A1 (ja) 2013-07-02 2017-02-23 日立金属株式会社 Ｐｔｃ素子および発熱モジュール
US20160264100A1 (en) * 2013-10-22 2016-09-15 Byd Company Limited Positive temperature coefficient heating assembly and defroster for a vehicle
CN111111961B (zh) * 2019-12-29 2021-07-16 苏州路之遥科技股份有限公司 一种马桶圈用ptc加热材料的喷涂装置及喷涂方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1415406B1 (de) * 1958-04-30 1970-08-20 Siemens Ag Keramischer Widerstand mit hohem positiven Temperaturkoeffizienten seines Gesamtwiderstandswertes
US3437789A (en) * 1965-10-07 1969-04-08 Roger Charbonnier Thermally stabilized electronic assembly
US3748439A (en) * 1971-12-27 1973-07-24 Texas Instruments Inc Heating apparatus
JPS5148815B2 (ja) * 1973-03-09 1976-12-23
US4899032A (en) * 1987-03-12 1990-02-06 Siemens Aktiengesellschaft Electric heating element utilizing ceramic PTC resistors for heating flooring media
DE3708056A1 (de) * 1987-03-12 1988-09-22 Siemens Ag Heizelement zum erwaermen stroemender medien
DE3900787A1 (de) * 1989-01-12 1990-07-19 Siemens Ag Verfahren zur herstellung eines keramischen elektrischen bauelementes
JPH0621191U (ja) * 1992-03-26 1994-03-18 積水化成品工業株式会社 ヒーター
JPH08148262A (ja) * 1994-11-18 1996-06-07 Matsushita Electric Ind Co Ltd 正特性サーミスタ発熱体
US5663702A (en) * 1995-06-07 1997-09-02 Littelfuse, Inc. PTC electrical device having fuse link in series and metallized ceramic electrodes
JPH10101413A (ja) * 1996-09-27 1998-04-21 Toyota Central Res & Dev Lab Inc Ｐｔｃセラミック、その製造法およびヒータ
IL121449A0 (en) * 1997-08-01 1998-02-08 Body Heat Ltd Adhesive composition for electrical PTC heating device
JPH11297504A (ja) * 1998-04-10 1999-10-29 Murata Mfg Co Ltd 電子装置
JPH11345704A (ja) * 1998-06-02 1999-12-14 Murata Mfg Co Ltd セラミック電子部品素子及びそれを用いたセラミック電子部品
US6380627B1 (en) * 1998-06-26 2002-04-30 The Regents Of The University Of California Low resistance barrier layer for isolating, adhering, and passivating copper metal in semiconductor fabrication
JP2000095562A (ja) * 1998-07-24 2000-04-04 Murata Mfg Co Ltd 正特性サ―ミスタ用原料組成物、正特性サ―ミスタ用磁器、および正特性サ―ミスタ用磁器の製造方法
JP3424742B2 (ja) * 1998-11-11 2003-07-07 株式会社村田製作所 正の抵抗温度特性を有する積層型半導体セラミック電子部品
JP3855611B2 (ja) * 2000-07-21 2006-12-13 株式会社村田製作所 半導体セラミック及び正特性サーミスタ
JP4252231B2 (ja) * 2001-09-05 2009-04-08 日本碍子株式会社 半導体ウェハー支持部材接合体の製造方法および半導体ウェハー支持部材接合体
JP4204773B2 (ja) * 2001-09-17 2009-01-07 株式会社日立製作所 空燃比検出装置
US20030056584A1 (en) * 2001-09-27 2003-03-27 Park Tae-Won Mass flow sensor and measuring apparatus
KR20040084940A (ko) * 2002-02-28 2004-10-06 고지마 가가쿠 야쿠힌 가부시키가이샤 저항기
JP3630144B2 (ja) * 2002-02-28 2005-03-16 小島化学薬品株式会社 抵抗器
DE10310722A1 (de) * 2003-03-10 2004-09-23 Tesa Ag Elektrisch erwärmbare Haftklebemasse
CN100386829C (zh) * 2004-07-28 2008-05-07 王克政 Ptc厚膜电路可控电热元件

Also Published As

Publication number Publication date
CN101507350A (zh) 2009-08-12
US20090212041A1 (en) 2009-08-27
EP2057864B1 (de) 2017-08-09
US8373100B2 (en) 2013-02-12
KR101465809B1 (ko) 2014-11-26
WO2008025348A1 (de) 2008-03-06
EP2057864A1 (de) 2009-05-13
DE102006041054A1 (de) 2008-04-03
KR20090043590A (ko) 2009-05-06
JP2010501988A (ja) 2010-01-21

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