EP2011599B1 - Procede et appareil de traitement laser - Google Patents

Procede et appareil de traitement laser Download PDF

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Publication number
EP2011599B1
EP2011599B1 EP07741875A EP07741875A EP2011599B1 EP 2011599 B1 EP2011599 B1 EP 2011599B1 EP 07741875 A EP07741875 A EP 07741875A EP 07741875 A EP07741875 A EP 07741875A EP 2011599 B1 EP2011599 B1 EP 2011599B1
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EP
European Patent Office
Prior art keywords
laser
workpiece
mirror
laser beams
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
EP07741875A
Other languages
German (de)
English (en)
Other versions
EP2011599A1 (fr
EP2011599A4 (fr
Inventor
Naoaki Fukuda
Kazuyoshi Kunishio
Shigeaki Nakayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Zosen Corp
Original Assignee
Hitachi Zosen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Zosen Corp filed Critical Hitachi Zosen Corp
Publication of EP2011599A1 publication Critical patent/EP2011599A1/fr
Publication of EP2011599A4 publication Critical patent/EP2011599A4/fr
Application granted granted Critical
Publication of EP2011599B1 publication Critical patent/EP2011599B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths

Definitions

  • the present invention relates to a method for performing processing of a workpiece using laser beams, and an apparatus which implements this method.
  • Japanese Patent Application Kokai Publication No. H08-10970 discloses a technology for raising the processing efficiency in such cases, which uses an array of as many laser oscillators as the number of layers to be processed, each emitting a laser beam effective to a specific layer, for example.
  • Japanese Patent Application Kokai Publication No. 2002-270994 discloses a technology in which a plurality of laser oscillators for emitting laser beams of differing wavelengths are disposed so that the laser beams are emitted along the same axis, and ON/OFF control of the various laser beams is used to irradiate laser beams of differing wavelengths onto a workpiece.
  • WO 00/64623 A1 discloses a material machining system for machining a workpiece for drilling blind vias. The system includes a laser supply system for supplying discrete machining beams) that are separate from each other.
  • Deflecting devices are provided for deflecting each of the discrete machining beams to generate multiple independent beams at a plurality of positions within a field of operation on the workpiece.
  • a scan lens (34) having an entrance pupil configured to receive the multiple independent beams from the deflecting devices is provided proximate to the entrance pupil of the scan lens.
  • a computer is used for controlling the deflecting devices to change the respective positions of the multiple independent beams in at least one co-ordinate direction within the field of operation.
  • the deflecting devices include galvo/mirror pairs at the entrance pupil of the scan lens. This is accomplished since the scan lens has a relatively large entrance pupil and the mirror parts are small.
  • US 2003/006221 A1 discloses a method and apparatus for cutting a substrate using dual laser irradiation. Two lasers are provided, one focussed on a first substrate layer and one on a second layer so as to ablate the said layers. The wavelength and other parameters of the lasers are selected so as to correspond with the layer material to be ablated.
  • laser processing is carried out by moving either a board or a laser beam irradiation in an X-Y direction, for example.
  • the problems to be solved by embodiments of the present invention are the reduced processing efficiency and the reduced productivity that result when the prior art is employed in patterning of an electronic circuit board, using laser beams of differing intensities and wavelengths irradiated in multiple stages.
  • the laser beams and the workpiece when the laser beams and the workpiece are caused to move relative to each other, in particular, when the laser beams are caused to move, this can be achieved by either adjusting the laser oscillators which emit the laser beams and the optical devices or adjusting the optical device while the lasers are made stationary.
  • laser processing can be accomplished efficiently, without limiting the direction of their relative motion between the laser beams and the workpiece, and without excessive movement, even in cases where laser beams with differing intensities and wavelengths are irradiated in multiple stages in patterning of an electronic circuit board.
  • the described embodiment of the present invention utilizes the following constitution to achieve the objective of efficient processing in patterning of an electronic circuit board when laser beams of differing intensities and wavelengths are irradiated in multiple stages.
  • the laser beam irradiation position is changed according to the direction of their relative motion, so that the laser beams irradiate the workpiece in the sequential order of the above-mentioned differing wavelengths and intensities.
  • FIG. 1 is a diagram illustrating an example of the basic structure of a laser processing apparatus being an embodiment of the present invention.
  • FIG. 2 is a diagram of the laser processing apparatus of FIG. 1 , illustrating the case where motion is in the direction opposite to that in FIG. 1 .
  • FIG. 3 is a schematic diagram illustrating the basic structure of an alternative example of a laser processing apparatus being an embodiment of the present invention.
  • FIG. 1 shows an example of a laser processing apparatus being an embodiment of the present invention, for removing first and second metal layers 1a and 1b formed on a surface of a workpiece 1, such as a circuit board.
  • 2a and 2b are examples of a first and a second YAG laser oscillator (referred to below simply as laser oscillators).
  • the first laser oscillator 2a emits a laser beam 3a which has a wavelength and intensity suitable for removing the first metal layer 1a.
  • the second laser oscillator 2b emits a laser beam 3b which has a wavelength or intensity suitable for removing the second metal layer 1b.
  • the first and second laser beams 3a and 3b emitted from the first and second laser oscillators 2a and 2b are mediated by first and second optical systems 4a and 4b, respectively, and are irradiated onto a surface of the workpiece 1 which is moved to the left, for example, in the drawing, being mounted on a stage device 5, so as to remove the first and second metal layers 1a and 1b.
  • FIG. 1 shows the first optical system 4a is formed from a first beam-forming optical system 4aa, a first reflecting mirror 4ab, and a condenser lens 4c
  • the second optical system 4b is formed from a second beam-forming optical system 4ba, a second reflecting mirror 4bb, and a condenser lens 4c.
  • the workpiece 1 is moved by the stage device 5 additionally to the right in the drawing, but when so moved, if the first and second optical systems 4a and 4b remain disposed as shown in FIG. 1 , removal of the first and second metal layers 1a and 1b of the workpiece 1 cannot be performed properly, as is also the case in Patent Reference 1.
  • the constitution of the instant embodiment of the present invention makes it possible to irradiate the first laser beam 3a on the right side as well as on the left side of the second laser beam 3b in FIG. 1 , by using an adjusting mechanism 6 to change the angular position of the first reflecting mirror 4ab of the first optical system 4a, for example.
  • the first and second metal layers 1a and 1b formed on the surface of the workpiece 1 are removed as described below.
  • the position of the first reflecting mirror 4ab is set so that the first laser beam 3a irradiates the left side in the drawing, and the second laser beam 3b irradiates on the right side of the first laser beam 3a in the drawing.
  • a control device 8 drives the stage device 5, moving the workpiece 1 to the right side in the drawing, emits the first and second laser beams 3a and 3b from the first laser oscillator 2a and the second laser oscillator 2b to remove the first and second metal layers 1a and 1b.
  • the control device 8 When a detector 7 detects the arrival of the workpiece 1 at a return point, the control device 8 generates a command to the first and second laser oscillators 2a and 2b to suspend emission of the first and second laser beams 3a and 3b, on the basis of a signal from the detector 7.
  • the control device 8 generates a command to the adjusting mechanism 6 to adjust the first reflecting mirror 4ab, so that the irradiation positions of the first and second laser beams 3a and 3b are the inverse of those of FIG. 1 .
  • the control device 8 After inversion, the control device 8 generates a command to the first and second laser oscillators 2a and 2b to re-start emission of the first and second laser beams 3a and 3b, and the control device 8 also generates a command to the stage device 5 to move the workpiece 1 to the right in FIG. 2 .
  • the first reflecting mirror 4ab is adjusted, but instead the second reflecting mirror 4bb may be adjusted.
  • the processing area can be enlarged by adding an optical element 4d to the first and second optical systems 4a and 4b of the laser processing apparatus shown in FIG. 1 and FIG. 2 in order to split laser beams 3a and 3b.
  • the first metal layer 1a when removing thin-films from the workpiece 1, the first metal layer 1a is removed, followed by the second metal layer 1b, but the first metal layer 1a may be removed after removing the second metal layer 1b.
  • Embodiments of the present invention can be used not only for the removal of thin-films, but also for any type of laser processing such as micromachining, as long as the processing requires the irradiation of laser beams onto a workpiece.

Claims (2)

  1. Procédé de traitement par laser dans lequel une pluralité de faisceaux laser, incluant un premier faisceau (3a) et un second faisceau (3b) dont au moins une longueur d'onde ou une intensité diffèrent l'une de l'autre, sont irradiés sur une pièce de travail (1) dans un ordre séquentiel de longueur d'onde ou d'intensité qui diffèrent pour traiter la pièce de travail
    en déplaçant les faisceaux laser et la pièce de travail les uns par rapport aux autres ;
    le procédé étant caractérisé par :
    des systèmes optiques (4a, 4b) ayant une lentille de condenseur en commun pour irradier les faisceaux laser sur la pièce de travail à travers la lentille de condenseur ; et
    le changement des positions d'irradiation de faisceau laser selon un sens du déplacement de la pièce de travail par rapport aux positions d'irradiation de faisceau laser, de sorte que la pluralité de faisceaux laser irradie la pièce de travail dans l'ordre séquentiel ; dans lesquels :
    le premier faisceau est obtenu par l'intermédiaire d'un premier miroir (4ab),
    le second faisceau est obtenu par l'intermédiaire d'un second miroir (4bb), et
    l'un du premier miroir et du second miroir est muni d'un mécanisme de réglage (6) pour changer la position angulaire de ce miroir
    de sorte que lorsque la pièce de travail se déplace dans un premier sens, la position d'irradiation du premier faisceau laser est sur le côté particulier de la position d'irradiation du second faisceau laser, tandis que lorsque la pièce de travail se déplace dans un second sens opposé au premier sens, la position d'irradiation du premier faisceau laser est sur le côté opposé de la position d'irradiation du second faisceau laser.
  2. Appareil pour mettre en oeuvre le procédé de traitement par laser selon la revendication 1, comprenant :
    une pluralité d'oscillateurs laser (2a, 2b) qui émettent des faisceaux laser (3a, 3b) dont au moins une longueur d'onde ou une intensité diffèrent l'une de l'autre ;
    un dispositif formant platine (5) qui déplace soit les faisceaux laser soit la pièce de travail (1) les uns par rapport aux autres ;
    des systèmes optiques (4a, 4b) qui guident les faisceaux laser émis à partir de la pluralité d'oscillateurs laser vers une position prédéterminée sur la pièce de travail, les systèmes optiques ayant une lentille de condenseur en commun, dans lesquels les faisceaux laser passent à travers la lentille de condenseur, et
    dans lequel :
    le premier faisceau est obtenu par l'intermédiaire d'un premier miroir (4ab),
    le second faisceau est obtenu par l'intermédiaire d'un second miroir (4bb), et
    l'un du premier miroir et du second miroir est muni d'un mécanisme de réglage (6) pour changer la position angulaire de ce miroir
    de sorte que lorsque la pièce de travail se déplace dans un premier sens, la position d'irradiation du premier faisceau laser est sur le côté particulier de la position d'irradiation du second faisceau laser, tandis que lorsque la pièce de travail se déplace dans un second sens opposé au premier sens, la seconde position d'irradiation du premier faisceau laser est sur le côté opposé de la position d'irradiation du second faisceau laser afin d'irradier les faisceaux laser à une position prédéterminée sur la pièce de travail dans le même ordre séquentiel de la longueur d'onde et de l'intensité qui diffèrent.
EP07741875A 2006-04-27 2007-04-18 Procede et appareil de traitement laser Expired - Fee Related EP2011599B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006124084A JP5025158B2 (ja) 2006-04-27 2006-04-27 レーザ加工方法及び装置
PCT/JP2007/058439 WO2007125799A1 (fr) 2006-04-27 2007-04-18 Procede et appareil de traitement laser

Publications (3)

Publication Number Publication Date
EP2011599A1 EP2011599A1 (fr) 2009-01-07
EP2011599A4 EP2011599A4 (fr) 2009-11-18
EP2011599B1 true EP2011599B1 (fr) 2012-11-21

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EP07741875A Expired - Fee Related EP2011599B1 (fr) 2006-04-27 2007-04-18 Procede et appareil de traitement laser

Country Status (7)

Country Link
US (1) US8097829B2 (fr)
EP (1) EP2011599B1 (fr)
JP (1) JP5025158B2 (fr)
KR (1) KR101372350B1 (fr)
CN (1) CN101432094B (fr)
TW (1) TWI395629B (fr)
WO (1) WO2007125799A1 (fr)

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KR101372350B1 (ko) 2014-03-12
JP2007296533A (ja) 2007-11-15
US20090057284A1 (en) 2009-03-05
TW200800456A (en) 2008-01-01
JP5025158B2 (ja) 2012-09-12
TWI395629B (zh) 2013-05-11
US8097829B2 (en) 2012-01-17
EP2011599A1 (fr) 2009-01-07
CN101432094A (zh) 2009-05-13
EP2011599A4 (fr) 2009-11-18
WO2007125799A1 (fr) 2007-11-08
CN101432094B (zh) 2012-10-31
KR20090013785A (ko) 2009-02-05

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