EP1987534A1 - Verfahren zum austauschen eines halbleiterchips eines flip-chip-moduls und ein hierfür geeignetes flip-chip-modul - Google Patents
Verfahren zum austauschen eines halbleiterchips eines flip-chip-moduls und ein hierfür geeignetes flip-chip-modulInfo
- Publication number
- EP1987534A1 EP1987534A1 EP07703419A EP07703419A EP1987534A1 EP 1987534 A1 EP1987534 A1 EP 1987534A1 EP 07703419 A EP07703419 A EP 07703419A EP 07703419 A EP07703419 A EP 07703419A EP 1987534 A1 EP1987534 A1 EP 1987534A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- contact
- semiconductor chip
- flip
- substrate
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Definitions
- the invention relates to a method for exchanging a semiconductor chip of such a flip-chip module as well as a flip-chip module suitable for this purpose.
- the flip-chip module includes a semiconductor chip having contact pillars disposed on a surface approximately perpendicular to the surface, and a substrate having contact pads soldered to the free ends of the contact pillars.
- Such a flip-chip module is known from US 6,578,754 B1.
- the contact posts consist of a section containing substantially copper and a shorter section consisting of the solder material associated with the contact pads of the substrate.
- the length of the copper section is at least 50 microns.
- contact points should be contactable, which are arranged in a regular grid whose pitch is less than 100 microns, preferably in the range of 80 to 100 microns.
- this flip-chip module has all the advantages of conventional flip-chip modules over wire connections (wire-bonding).
- the path of the electrical conduction between the semiconductor chip and the substrate and thus the signal path is very short.
- the contact points of these DRAM memory chips are arranged with a pitch of less than 100 ⁇ m, which is known in the jargon as "fine pitch.” Such a fine pitch can be contacted with the contact pillars explained above.
- Conventional contacting technologies for flip-chip Furthermore, it should be taken into account that increasingly low-k passivation materials are used for the printed conductors within the chip, which are mechanically weak, which is why a mechanical stress exerted on such a semiconductor chip causes cracks and fractures in the passivation layer leads.
- German Patent Applications DE 10 2005 043910 and DE 10 2005 050150 which have not yet been published, disclose a flip-chip module with a semiconductor chip having contact posts, wherein the contact posts are electrically and mechanically connected to a substrate. Between the substrate and the semiconductor chip, a spacer is provided, which is mechanically coupled at least to the substrate. As a result, thermal stresses in the flip-chip module are absorbed by the spacer and prevented from the semiconductor chip.
- US Pat. No. 6,225,206 B1 discloses a flip-chip module which has a first substrate which is a chip or a module and a second substrate which, if the first substrate is a chip, a chip carrier or a circuit card ).
- the chip in each case a guide body made of solder material in the form of a column is formed at the contact points.
- the column may have a height of 50 mils to about 87 mils.
- US 6,050,476 discloses a flip-chip module in which a chip is connected to a substrate by means of cold soldering.
- a chip is connected to a substrate by means of cold soldering.
- thin layers of indium are provided on the surfaces of the contact points of the chip and the substrate. If two such contact points are brought into contact with each other and pressurized, then they connect mechanically and electrically (cold soldering).
- the contact points of the chip are in this case, preferably substantially larger than the contact points of the substrate, whereby it is possible to position the contact points of the substrate at a plurality of different points of the respective contact surface of the chip, which do not overlap. This allows the removal of a chip from a substrate and the re-use of the chip, with each reuse other areas of the pads are associated with the contact points of the new substrate.
- US Pat. No. 6,182,884 B1 and DE 199 03 957 A1 disclose relatively complicated devices and methods for reprocessing flip-chip modules with which a solder connection can be separated and the corresponding solder can be removed.
- a flip-chip module with a contact semiconductor chip having a layer of solidified solder is disposed between the contact points of the substrate and the contact columns.
- the semiconductor chips once attached to a substrate can not be exchanged.
- flip-chip modules with arranged perpendicular to the surface of a semiconductor chip contact columns as well as conventional flip-chip modules, such as BGA flip-chip modules (ball grid array), in which the Semiconductor chips are connected directly by means of a solder ball with the contact points on the substrate.
- BGA flip-chip modules ball grid array
- the soldering methods used in this case are also very complex, since a mask of insulating material must be provided, which ensures that the solder of a particular contact point does not come into contact with another contact point during soldering and generates a short circuit.
- All these flip-chip modules have in common that when separating the solder connection, a remainder of solder remains on the respective contact points of the substrate. The amount of this remainder is not defined, whereby at the contact points different elevations are formed by the remainders of solder. A substrate with such uneven contact points can no longer be reliably contacted with a semiconductor chip.
- flip-chip modules for some time, which comprise a plurality of semiconductor chips on a substrate. If it turns out that a semiconductor chip is not working properly, then the entire flip-chip module is waste, even if the other semiconductor chips on the flip-chip module should be fine, since a single semiconductor chip can not be replaced. To avoid such problems, all semiconductor chips would have to be individually tested in advance. However, the testing of semiconductor chips is very expensive. The testing of a flip-chip module, however, is much cheaper than performing several separate tests for the respective semiconductor chips, since in a test process, the entire flip-chip module can be tested and the contact points of a flip-chip module much more easily accessible are than those of a semiconductor chip.
- the invention has for its object to provide a method for exchanging a semiconductor chip of a flip-chip module, which is simple and reliable executable.
- the invention has for its object to provide a flip-chip module, comprising at least one semiconductor chip and a substrate, in which it is possible to remove the semiconductor chip from the substrate and reliably connect the substrate with another semiconductor chip again.
- the inventive method is used to replace a semiconductor chip of a flip-chip module.
- the flip-chip module is made of a semiconductor chip, which has contact surfaces arranged on a surface approximately perpendicular to the surface, which have end faces at their free ends, and a substrate which has contact areas on a surface, which in each case has one of the end faces of a the contact- columns are connected by means of solder joints, is formed, wherein the contact points are raised with respect to the surface of the substrate and the end faces of the contact columns completely cover the respective contact point.
- the procedure comprises the following steps:
- the existing solder joints are thus heated above the floating point, the semiconductor chip and the substrate are compressed such that the solder is almost completely pressed out of the areas between the end faces of the contact posts and the contact points , the semiconductor chip removed from the substrate and another semiconductor chip mounted thereon.
- the flip-chip module according to the invention comprises:
- At least one semiconductor chip which has contact pillars arranged on a surface approximately perpendicular to the surface and which have end faces at their free ends,
- a substrate having contact points on a surface, which are connected to one of the end faces of one of the contact columns, wherein the end faces of the contact columns completely cover the respective contact point with supernatant.
- the semiconductor chip and the substrate can be pressed together, whereby the intermediate region between the end faces of the contact pillars and the contact points entire solder is pressed out. Since the contact points of the contact surfaces are completely covered by the end faces of the contact columns in the compressed state, whereby the contact points are almost completely free of solder and again form a planar contact surface.
- Such a flip-chip module thus allows the replacement of the semiconductor chip thereon.
- the contact points of the substrate are formed somewhat raised with respect to the surface of the substrate. This ensures that the remainder of solder, which remains on the substrate after the separation of a semiconductor chip, attaches to the peripheral region of the contact points and does not remain on the surfaces facing the semiconductor chip, the contact surfaces, the contact points. The remainder of solder is thus below the level of the contact surfaces of the contact points.
- FIGS. 1a and 1b the fastening of a semiconductor chip on a substrate of a flip-chip module according to the invention
- a flip-chip module 1 according to the invention (FIGS. 1a, 1b) comprises a semiconductor chip 2 which has 3 I / O contact points on a surface. At the I / O pads contact pillars 4 are arranged, each standing perpendicular to the surface 3.
- the contact columns 4 have at their free ends end faces 9, on each of which a solder portion 6 is arranged ( Figure 1a).
- the length of the contact columns is at least 20 microns and is preferably in the range of 50 microns to 100 microns.
- the metal column 5 is formed mainly of copper and / or gold, is disposed directly on the semiconductor chip 2 and is in electrical contact with a conductor track of the semiconductor chip 2.
- the solder sections 6 are arranged at the remote from the semiconductor chip 2 ends of the contact columns 4 and serve for mechanical and electrical connection with contact points 7 of a substrate 8.
- the solder portions 6 are arranged on end faces 9 of the free ends of the substrate 8.
- the solder of the solder sections 6 is for example a tin / lead alloy or may also be lead-free solder.
- the end faces 9 of the contact columns 4 completely cover the contact points 7 with some projection. This means that the end faces 9 are at least slightly larger than the surface of the respective contact point 7 in plan view and are arranged so that the respective contact point 7 is completely below the corresponding end face 9.
- the end face 9 and the respective contact point 7 need not be in contact.
- the end face 9 can and should, as a rule, also be arranged somewhat spaced from the contact point 7.
- the projection of the contact columns is preferably formed on the entire circumference with respect to the contact points.
- the contact points 7 are formed somewhat raised with respect to the surface of the substrate 8.
- FIG. 1a the flip-chip module according to the invention is shown during the soldering process.
- the solder portion 6 and the contact points 7 are wetted with flux material 10.
- the Flow material 10 can be applied in advance to the contact points 7 and / or on the solder sections 6.
- the solder is brought into the flowable state and in contact with the respective contact point 7 by heating.
- the solder flows around the contact point 7 and forms with it an intermetallic compound.
- the solder solidifies and the semiconductor chip 2 is connected both mechanically and electrically to the substrate (FIG. 1b).
- soldering process no masks must be used, as is usual with BGA flip-chip modules.
- the solder remains in the intermediate region between the end faces and the respective contact point 7, whereby the solidified solder 11 can also comprise the peripheral region of the contact point 7.
- FIGS. 2 a to 2 c show the release of the semiconductor chip 2 from the substrate 8.
- solder 11 again assumes a flowable state.
- the heating takes place by means of a hot stamp 12, which is placed from above onto the semiconductor chip 2 to be removed. The heat then flows from the stamp 12 via the semiconductor chip 2 and the contact pillars 4 to the solder 11.
- the solder 11 is in the flowable state, the semiconductor chip 2 and the substrate 8 are compressed. This is carried out by means of the punch 12 which presses on the semiconductor chip 2 from above. As a result, the flowable solder is pressed out of the areas between the end faces 9 and the surfaces of the contact points 7 opposite the end faces 9, the contact surfaces 5. As a result, the faces are
- the semiconductor chip 2 is removed from the substrate, for example by applying a vacuum to the stamp, with which the semiconductor chip 2 to the stamp 12th is sucked, so that when lifting the punch 12 of the semiconductor chip 2 is taken.
- a vacuum to the stamp, with which the semiconductor chip 2 to the stamp 12th is sucked, so that when lifting the punch 12 of the semiconductor chip 2 is taken.
- a mechanical gripper for lifting off the semiconductor chip 2.
- the supernatant of the contact columns 4 with respect to the contact surfaces 5 is advantageous, since the solder adheres to the contact column above all when cooling the solder below the pour point, since it has a larger contact surface with the contact column.
- Figure 3a shows the contact area between a contact column 4 and the corresponding contact point 7, which are in contact here.
- the solder 11 is pushed out of the intermediate region and adheres to the circumference of the contact column 4, the portion of the end face 9 projecting beyond the contact point 7 and at the periphery of the contact point 7.
- the solder adheres much weaker to the substrate than at the metallic pad 7 and the metallic contact column 4.
- the flip-chip module according to the invention thus allows in a simple manner a safe removal of a semiconductor chip, reusable contact points 7 are exposed on the substrate. What is essential for this is that the end faces 9 completely cover the contact points 7 or their contact surfaces 5, so that the solder can be almost completely pushed out of the intermediate region by compressing the end faces 9 and the contact surfaces 5.
- the end faces 9 are larger than the contact surfaces 5 are formed so that they survive, for example on average about 2 microns to 10 microns and preferably about 3 microns to 5 microns at the edge of the contact points. This ensures that no solder adhering to the contact points 7 comes into contact again with the contact surfaces 5 when lifting off.
- the contact points 7 are raised with respect to the surface of the substrate 8, since then after the separation of a semiconductor chip 2 from the substrate 8, the solder residues 16 may remain on the substrate, but they are below the level of the contact surfaces 5 and so no longer interfere with another contact.
- the height of the contact points is about 10 microns to 50 microns and is preferably in the range of 15 microns to 25 microns.
- the quality of the connection between the substrate and the semiconductor chip 2 after the replacement of a semiconductor chip 2 is just as good as after the first connection of the semiconductor chip to the substrate.
- the contact points 7 each form a stop element against which the contact pillars 4 strike.
- the invention further provides an apparatus for carrying out the above-explained method for exchanging a semiconductor chip in a flip-chip module.
- This device has the punch 12 for acting on the semiconductor chip 2.
- the star- pel is formed with a heater for heating the semiconductor chip 2 and a handling device for applying a mechanical pressure to the punch 12.
- the stamp is provided with a vacuum device for sucking the semiconductor chip.
- an additional gripping device is provided for automatically gripping and moving a semiconductor chip.
- the present invention can also be applied to a flip-chip module, as described in German Patent Application DE 10 2005 043 910 or DE 10 2005 050 150 or PCTVE P2006 / 008921. These patent applications are therefore incorporated by reference and incorporated in the present application by reference.
- the present invention relates to a flip-chip module, a method for exchanging a semiconductor chip of such a flip-chip module and a device for carrying out the method.
- the flip-chip module comprises at least a semiconductor chip and a substrate.
- the semiconductor chip has on a surface approximately perpendicular to the surface arranged contact columns. With these contact posts he is connected via a solder connection with contact points of the substrate.
- the contact pillars completely cover the contact points with their end faces. This makes it possible to press the solder between the contact posts and contact points after reheating completely from the intermediate region between the contact points and the contact posts. This allows a new attachment of another semiconductor chip.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006006561A DE102006006561B4 (de) | 2006-02-13 | 2006-02-13 | Flip-Chip-Modul und Verfahren zum Austauschen eines Halbleiterchips eines Flip-Chip-Moduls |
PCT/EP2007/001190 WO2007093350A1 (de) | 2006-02-13 | 2007-02-12 | Verfahren zum austauschen eines halbleiterchips eines flip-chip-moduls und ein hierfür geeignetes flip-chip-modul |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1987534A1 true EP1987534A1 (de) | 2008-11-05 |
Family
ID=38123914
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP07703419A Withdrawn EP1987534A1 (de) | 2006-02-13 | 2007-02-12 | Verfahren zum austauschen eines halbleiterchips eines flip-chip-moduls und ein hierfür geeignetes flip-chip-modul |
Country Status (5)
Country | Link |
---|---|
US (1) | US8084298B2 (de) |
EP (1) | EP1987534A1 (de) |
KR (1) | KR20090055519A (de) |
DE (1) | DE102006006561B4 (de) |
WO (1) | WO2007093350A1 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8288871B1 (en) * | 2011-04-27 | 2012-10-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Reduced-stress bump-on-trace (BOT) structures |
SG10201903641TA (en) * | 2014-10-23 | 2019-05-30 | Agency Science Tech & Res | Method of bonding a first substrate and a second substrate |
US11641717B2 (en) * | 2021-08-30 | 2023-05-02 | International Business Machines Corporation | Soldering of end chip components in series |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4858820A (en) * | 1987-02-18 | 1989-08-22 | Plato Products, Inc. | Desoldering aid and method |
DE1025587T1 (de) * | 1997-07-21 | 2001-02-08 | Aguila Technologies, Inc. | Halbleiter-flipchippackung und herstellungsverfahren dafür |
US5920464A (en) * | 1997-09-22 | 1999-07-06 | Trw Inc. | Reworkable microelectronic multi-chip module |
JPH11126799A (ja) * | 1997-10-24 | 1999-05-11 | Matsushita Electric Ind Co Ltd | Icチップの取り外し方法 |
US6182884B1 (en) * | 1998-12-10 | 2001-02-06 | International Business Machines Corporation | Method and apparatus for reworking ceramic ball grid array or ceramic column grid array on circuit cards |
DE19903957B4 (de) * | 1999-01-25 | 2008-05-21 | Finetech Gmbh & Co.Kg | Verfahren und Vorrichtung zum Entfernen von Lot |
US6225206B1 (en) * | 1999-05-10 | 2001-05-01 | International Business Machines Corporation | Flip chip C4 extension structure and process |
US6592019B2 (en) | 2000-04-27 | 2003-07-15 | Advanpack Solutions Pte. Ltd | Pillar connections for semiconductor chips and method of manufacture |
US6578754B1 (en) | 2000-04-27 | 2003-06-17 | Advanpack Solutions Pte. Ltd. | Pillar connections for semiconductor chips and method of manufacture |
US6360940B1 (en) * | 2000-11-08 | 2002-03-26 | International Business Machines Corporation | Method and apparatus for removing known good die |
US6550666B2 (en) | 2001-08-21 | 2003-04-22 | Advanpack Solutions Pte Ltd | Method for forming a flip chip on leadframe semiconductor package |
DE102005043910A1 (de) | 2005-09-14 | 2007-03-15 | Weissbach, Ernst-A. | Flip-Chip-Modul und Verfahren zum Erzeugen eines Flip-Chip-Moduls |
US8026583B2 (en) | 2005-09-14 | 2011-09-27 | Htc Beteiligungs Gmbh | Flip-chip module and method for the production thereof |
-
2006
- 2006-02-13 DE DE102006006561A patent/DE102006006561B4/de not_active Expired - Fee Related
-
2007
- 2007-02-12 WO PCT/EP2007/001190 patent/WO2007093350A1/de active Application Filing
- 2007-02-12 KR KR1020087022314A patent/KR20090055519A/ko not_active Application Discontinuation
- 2007-02-12 EP EP07703419A patent/EP1987534A1/de not_active Withdrawn
-
2008
- 2008-08-12 US US12/190,342 patent/US8084298B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
WO2007093350A1 (de) | 2007-08-23 |
US8084298B2 (en) | 2011-12-27 |
DE102006006561B4 (de) | 2009-03-05 |
DE102006006561A1 (de) | 2007-08-23 |
US20090085203A1 (en) | 2009-04-02 |
KR20090055519A (ko) | 2009-06-02 |
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