EP1957247B1 - Dispositif et procédé de nettoyage d'un bloc scie de galettes semi-conductrices - Google Patents

Dispositif et procédé de nettoyage d'un bloc scie de galettes semi-conductrices Download PDF

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Publication number
EP1957247B1
EP1957247B1 EP06829352A EP06829352A EP1957247B1 EP 1957247 B1 EP1957247 B1 EP 1957247B1 EP 06829352 A EP06829352 A EP 06829352A EP 06829352 A EP06829352 A EP 06829352A EP 1957247 B1 EP1957247 B1 EP 1957247B1
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EP
European Patent Office
Prior art keywords
cleaning
sawn
outlet port
basin
wafer block
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP06829352A
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German (de)
English (en)
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EP1957247A1 (fr
Inventor
Wolfgang Stangl
Hans-Jürgen STANGL
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Singulus Technologies AG
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Stangl Semiconductor Equipment AG
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Publication of EP1957247A1 publication Critical patent/EP1957247A1/fr
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work

Definitions

  • the present application relates to a device according to the preamble of each of independent claims 1, 5 and 7 and a method according to the preamble of independent claim 13 for cleaning a sawed wafer block, and more particularly to an apparatus and a method for cleaning by means of a wire saw sawn wafer blocks is suitable to remove slurry residues and saw residues from the kerfs between the wafers.
  • a device and such a method are the JP 10 172 947 refer to.
  • the object underlying the present invention is to provide an improved apparatus and method for removing contaminants from cuttings of sawn wafer blocks.
  • the present invention is thus based on a cleaning effect based on the suction effect of a cleaning basin effluent cleaning fluid (typically water) based to remove impurities, such as slurry residues and saw residues, which are located between the wafers in the crevices, or remove.
  • a cleaning basin effluent cleaning fluid typically water
  • sprayers may be provided in the cleaning basin to spray cleaning liquid from one or two sides into the sawing column.
  • Spray processes can take place both while the wafers are in the cleaning liquid and when the cleaning tank is empty, ie when the wafers are not in the cleaning liquid.
  • the spraying device may, for example, have spray bars on both sides of the wafer block, so that cleaning liquid can be sprayed into all the kerfs. The spray bars can be raised and lowered to further improve the cleaning of the block.
  • the cleaning of the block can be improved.
  • water is used as cleaning liquid.
  • surfactant may be added.
  • the cleaning liquid may be heated to assist the cleaning process.
  • the device according to the invention and the method according to the invention can be designed to enable automated cleaning of wafer blocks.
  • an automatic handling system may be provided, through which the sawn wafer blocks from a previous processing station to a station having the cleaning device according to the invention, supplies and after cleaning, the sawn wafer blocks from this cleaning station to a post-processing station.
  • the device according to the invention can have a suitable control device in order to implement different cleaning concepts, each with one or more spraying processes and / or emptying processes.
  • the device according to the invention may further comprise a plant for the treatment and recycling of the resulting contaminated cleaning liquid.
  • a recycling plant may, for example, comprise a centrifuge to which the polluted cleaning liquid is supplied to discharge solids therefrom to produce a purified cleaning liquid, which in turn is supplied to the cleaning device.
  • Wafer blocks are first attached using a pressure-sensitive adhesive or kit to support beams made of glass or plastic. By means of the support beams, the wafer blocks are fed to a wire saw, where the wafer blocks are sawed into wafers glued to the support beams at one end thereof.
  • the sawn wafer blocks can be used out of the wire saw, for example, in a transport and process basket, which in turn can be used in a special trolley, for example, take up to four process baskets and transport to the cleaning system.
  • the trolley can be docked to the cleaning system via a docking station.
  • the container of the trolley, in which the baskets are used, can be filled with a cleaning medium, which when docking to the Cleaning system can be emptied and filled with a fresh medium.
  • a 3-axis handling system can be provided for removing the process baskets from the transport trolley by means of receiving hooks, inserting them into an input buffering station and from there through the cleaning system. After the cleaning process, the process baskets are automatically transferred to Entkittungsbecken.
  • the process baskets used can be equipped with retractable brushes, which are applied to the wafers only when inserted into the Entkittungsbecken via a lever mechanism, whereby the wafers are held in a vertical position (for automatic separation) after detachment from the support beam.
  • the Enttittungsbecken is executed with a water-sealed lid, in which the wafers are dissolved in about 70 ° C hot acetic acid / formic acid from the support beam and de-cemented.
  • the adhesive in this case remains completely adhere to the support beam, so that no glue residue left on the wafer.
  • the support beams with the adhesive adhering thereto are automatically removed from the process basket along with a machine carrier to which they are attached, after detachment of the wafers, to be prepared for reuse.
  • FIGS. 1 . 2 and 3 represent schematic cross-sectional views, in which hidden parts are partially shown by dashed lines to allow an explanation of the invention, and in which for the sake of clarity not all cut surfaces are hatched.
  • the illustrated embodiment of the cleaning device according to the invention comprises a cleaning basin 10 with a back wall 12, side walls 14 and a front wall, which is not shown in the figures.
  • the cleaning basin further comprises a bottom portion formed by a bottom plate 16 in which outlet openings 18 are formed.
  • the outlet openings 18 have inclined edges 20, so that the outlet openings 18 at the in Fig. 2 shown section are trapezoidal.
  • FIG Fig. 3 A plan view of the bottom 16 of the cleaning basin 10 with the outlet openings 18 formed therein is shown in FIG Fig. 3 shown.
  • the length 1 represents the dimension in the drawing plane according to the Fig. 1 and 2
  • the outlet openings 18 extend over the entire length 1 along the two sides of the bottom of the cleaning chamber 10.
  • the bottom plate has a roof-shaped course with inclined surfaces 19a and 19b, the obliquely to the outlet openings 18 after run down.
  • the outlet openings adjoin the side walls of the cleaning basin.
  • sloping bottom regions could again be provided there.
  • the outlet openings 18 are closable by a closure device 21 which has closure elements 22 and a drive mechanism for moving the closure elements 22 in the vertical direction.
  • the closure elements 22 are attached to carrier elements 24 which are attached to one or more yokes 26.
  • a bracket 28 is connected via guide rods 30 (FIG. Fig. 2 ) rigidly attached to the pelvic floor 16, for example via screw, as indicated in the figures.
  • the guide rods 30 extend through recesses 26a in the yokes 26.
  • spring and cylinder mechanisms 32 are provided, through which the yoke and thus the rigidly attached to the yokes closure elements 22 are movable in the vertical direction ,
  • the closure elements are pressed by the springs and cylinder 32 against the pelvic floor 16, so that the cleaning basin 10 is sealed down and thus closed for a cleaning liquid 34 located therein.
  • Fig. 2 For example, when the pelvis is in the open state, the springs are compressed so that the yokes 26 and the rigidly connected closure members 22 are moved vertically downwardly so that the openings 18 in the pelvic floor 16 are open. Thus, the cleaning liquid along the in Fig. 2 arrows 34 shown escape from the cleaning basin.
  • the closure elements 22 have a roof-shaped construction, wherein the Roof surfaces at a substantially same angle as the inclined portions 20 of the outlet openings 18, so that in the in Fig. 1 shown hibernation the bottom of the cleaning basin is sealed.
  • sprayers 42 are furthermore arranged in the cleaning basin on both sides of a sawn wafer arranged in the cleaning basin.
  • the spraying devices 42 each have a number of spray nozzles, which in the illustrations after Fig. 1 and 2 extend into the image plane, so that can be sprayed through these spray nozzles in a plurality of successively arranged in the representations crevices.
  • drive means 44 are provided for the sprayers 42, so that they can be moved in the vertical direction.
  • the sawn wafer block 40 is glued to a support beam 50 as discussed above.
  • a bracket 52 which may be part of a 3-axis automatic handling system, holds the sawn wafer block 40 in the cleaning basin.
  • the wafer block 40 can be arranged in a process basket adapted for this purpose, which is configured so as not to impair the rinsing and spraying processes described below.
  • closable inlet openings 52 are provided in the embodiment shown, through which the cleaning basin 10 with a cleaning liquid, preferably water, can be filled.
  • the cleaning basin 10 is first of all via the inlets 52 filled with water.
  • the basin is filled until the complete block 40 is under water.
  • the filling process is controlled by a sensor. After filling, the block can stay in the water for a predetermined time to thereby improve the penetration of the water between the individual wafers and thus the cleaning effect.
  • spraying may take place under water, such as by spraying 60 from both sides Fig. 1 is indicated. Thus, the penetration into the crevices can be improved.
  • the drive means for the closure elements 22 is actuated, so that the closure elements 22 are moved vertically downwards.
  • the outlet openings 18 of the basin are opened abruptly and the downwardly moving closure elements release a large discharge cross section.
  • the cleaning basin is completely emptied in about 1 second. Due to the rapid emptying, a suction effect is created between the wafer slices, as a result of which sludge residues and saw residue, which are located between the wafer slices, are rinsed out.
  • the rapid emptying is thereby supported by the outlet openings 18 towards obliquely rearwardly extending surfaces 19a and 19b in the cleaning basin. Further, by constructing the cleaning tank completely in the area where cleaning liquid is located without horizontal surfaces, deposition of contaminants can be substantially completely prevented.
  • nozzles directed onto the wafer block such as flat jet nozzles or the like, which may be screwed into a spray bar and installed in two rows on either side of the basin.
  • sprayers 42 By spraying the block both under water and when emptying the cleaning basin with water, the dirt that is between the wafers is detached and rinsed out.
  • a mutual spraying by the liftable and lowerable spray bars can significantly improve the cleaning result.
  • the dirt By alternating left-sided and right-side spraying, the dirt can be moved to the left and right while being transported downwards out of the kerfs.
  • the zone under the glue bar 50 can also be achieved.
  • the cleaning device according to the invention preferably has a suitable control, by means of which the described processes can be carried out automatically.
  • a programmable logic controller can be used in which various cleaning recipes are stored.
  • Such different cleaning recipes may relate to different suction process steps and spray process steps for different wafer sizes, block sticking situations, and the like.
  • the wafer block is first inserted into the filled cleaning basin 10. Subsequently, the wafer block is left in the cleaning basin for one exposure time, whereby six sequences of underwater spraying are performed.
  • the individual spray processes may involve different lengths of simultaneous two-way spray variants, in which the spray nozzles are lifted and lowered along the block. This is followed by three Sogquelsvone in which after filling the basin can also be sprayed under water.
  • the cleaning time was about 20 to 25 minutes, in the production plant, for example, four basins can be provided, resulting in a process time per block of about 5 to 6 minutes.
  • spray nozzles could be provided with adjustable spray angles, so that a lowering and raising the same is no longer essential.
  • outlet ports the closure elements, and the bottom region.
  • the outlet ports, the closure members, and the bottom portion may have a different shape as long as the openings can be opened quickly and the drainage cross section ensures that the cleaning basin can be emptied quickly enough to provide a suction effect reach, which is suitable to remove impurities from the crevices.
  • outlet openings could be provided with flaps that opened sufficiently quickly can be.
  • horizontally movable closure elements can be provided relative to outlet openings, as long as they can be moved sufficiently fast to release the outlet openings.
  • FIG. 3 shown two mutually parallel outlet openings 18 merely exemplary in nature, wherein outlet openings of a different shape and size can be provided as long as the empty cross section remains sufficiently large to allow a sufficiently rapid emptying to cause the described suction effect.
  • a single outlet opening could be provided in the center of the bottom of the cleaning basin, onto which wall areas sloping from two or more sides taper.
  • the cleaning device according to the invention may further comprise a system for recycling contaminated cleaning liquid resulting from the cleaning of the sawn wafer blocks.
  • This may include, for example, a centrifuge for discharging solids from the dirty cleaning liquid to produce a purified cleaning liquid, a feeding device for supplying dirty cleaning liquid from the cleaning device to the centrifuge and a return device for returning the cleaned cleaning liquid from the centrifuge to the cleaning device.
  • the plant comprises a device 100 according to the invention for cleaning sawn wafer blocks, a dirt container 102, a centrifuge 104 and a clean container 106.
  • a filter 108 which may be filtered by a band filter or a chamber filter press, may additionally be provided.
  • the waste water arising during the emptying of the cleaning basin of the cleaning device 100 is collected in a collecting trough (not shown) of the cleaning device 100.
  • the dirty water in a storage tank ie the dirt container 102
  • the centrifuge 104 is continuously charged, as indicated by the arrow 112 in FIG Fig. 4 is implied.
  • an outlet of the dirt container 102 is connected to an inlet of the centrifuge 104 via a fluid line.
  • a corresponding pumping device for continuously feeding the centrifuge is also provided.
  • the dirty water (the cleaning medium) is subjected to a rotation, so that solids are discharged from the water.
  • the centrifuge further conveys the water into a receiver tank, the clean tank 106, after separation of the solids. This is indicated by an arrow 114 in FIG Fig. 4 indicated.
  • an outlet of the centrifuge 104 is connected to an inlet of the clean container 106 via a corresponding fluid line.
  • An outlet of the clean container 106 is in turn connected to an inlet of the cleaning system (for example, via a corresponding fluid line), so that the purified water is traceable to the cleaning system 100, as indicated by an arrow 116 in FIG Fig. 4 is indicated.
  • the water is thus available again for further purification processes.
  • the centrifuge 104 may be designed so that it does not discharge particles having a size or diameter of less than 5 ⁇ m from the cleaning liquid, usually water. It has been shown that particles of less than 5 ⁇ m agglomerate and thus at a later, eg next, run can also be deposited via the centrifuge 104.
  • the filter 108 may be provided.
  • the filter 108 is run in parallel to the above-described recycling cycle, wherein cleaning liquid is conveyed from the clean container 106 to the filter 108, as indicated by an arrow 118, and then pumped back out of the filter 106 into the clean container 106, see arrow 120 in Fig. 4 .
  • a corresponding inlet and outlet of the filter 108 may be connected to corresponding fluid lines.
  • corresponding pumps may be provided to pump the water through the parallel circuit including the filter 108.
  • an addition of fresh water in the circulation takes place, with simultaneous discarding of circulating water from the clean container 106, which due to the very low solids content can be passed directly into the sewer.
  • fresh water per addition of approximately 50 liters of fresh water can be made per sawed wafer block cleaned by the cleaning system.
  • the present invention is particularly suitable for cleaning a sawn silicon wafer blocks to a mixture of silicon carbide, silicon particles, iron particles from the saw wire and the carrier medium (eg PEG), which after the sawing process between the discs is to clean.
  • the carrier medium eg PEG
  • the present invention may also be used to clean sawn wafer blocks of other materials.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Claims (15)

  1. Dispositif de nettoyage d'un bloc scié de galettes semi-conductrices (40), aux caractéristiques suivantes:
    un bassin de nettoyage (10);
    un support (50, 52) pour maintenir un bloc scié de galettes semi-conductrices (40) dans le bassin de nettoyage (10) de sorte que, lorsqu'un liquide de nettoyage (34) se trouve dans le bassin de nettoyage (10), au moins un segment du bloc de galettes semi-conductrices (40) présentant des interstices de sciage soit disposé dans le liquide de nettoyage;
    au moins une ouverture de sortie (18) dans une zone de fond (16) du bassin de nettoyage (10); et
    un moyen d'obturation (21, 22) de l'ouverture de sortie (18) par lequel l'ouverture de sortie (18) peut être ouverte et fermée,
    caractérisé par le fait que le moyen d'obturation (21, 22), l'ouverture de sortie (18) et la zone de fond du bassin de nettoyage sont conçus de sorte que par une ouverture du moyen d'obturation (21, 22) le liquide de nettoyage puisse être vidangé si rapidement au moins de la zone du bassin de nettoyage (10) dans laquelle est disposé le bloc de galettes semi-conductrices que, par un effet de dépression dynamique du liquide de nettoyage, les impuretés puissent être éliminées des interstices de sciage,
    l'ouverture de sortie (18) et le moyen d'obturation (21, 22) étant réalisés de sorte que le bassin de nettoyage puisse, partant d'un état rempli contrôlé par un capteur, être vidé en moins de 2 secondes, de préférence en moins de 1,5 seconde.
  2. Dispositif selon la revendication 1, dans lequel le support (50, 52) est réalisé pour maintenir le bloc scié de galettes semi-conductrices (40) de sorte que les interstices de sciage soient orientés de manière sensiblement verticale.
  3. Dispositif selon l'une des revendications 1 ou 2, dans lequel la zone de fond du bassin de nettoyage présente des zones de paroi (20) s'étendant obliquement vers le bas vers l'ouverture de sortie.
  4. Dispositif selon la revendication 3, dans lequel le bassin de nettoyage (10) présente deux ouvertures de sortie (18), la zone de fond (20) étant, entre les ouvertures de sortie, en forme de toit avec des surfaces retombant vers le bas vers les ouvertures de sortie.
  5. Dispositif de nettoyage d'un bloc scié de galettes semi-conductrices (40), aux caractéristiques suivantes:
    un bassin de nettoyage (10);
    un support (50, 52) pour maintenir un bloc scié de galettes semi-conductrices (40) dans le bassin de nettoyage (10) de sorte que, lorsqu'un liquide de nettoyage (34) se trouve dans le bassin de nettoyage (10), au moins un segment du bloc de galettes semi-conductrices (40) présentant des interstices de sciage soit disposé dans le liquide de nettoyage;
    au moins une ouverture de sortie (18) dans une zone de fond (16) du bassin de nettoyage (10); et
    un moyen d'obturation (21, 22) de l'ouverture de sortie (18), par lequel l'ouverture de sortie (18) peut être ouverte et fermée,
    caractérisé par le fait que le moyen d'obturation (21, 22), l'ouverture de sortie (18) et la zone de fond du bassin de nettoyage sont réalisés de sorte que par une ouverture du moyen d'obturation (21, 22) le liquide de nettoyage puisse être vidangé si rapidement au moins de la zone du bassin de nettoyage (10) dans laquelle est disposé le bloc de galettes semi-conductrices que, par un effet de dépression dynamique du liquide de nettoyage, les impuretés puissent être éliminées des interstices de sciage,
    le bassin de nettoyage (10) présentant une longueur et une largeur, l'au moins une ouverture de sortie (18) s'étendant en continu sur toute la longueur du bassin de nettoyage (10).
  6. Dispositif selon la revendication 5, dans lequel le bassin de nettoyage (10) ne présente pas de faces intérieures horizontales, afin d'éviter un dépôt d'impuretés.
  7. Dispositif de nettoyage d'un bloc scié de galettes semi-conductrices (40), aux caractéristiques suivantes:
    un bassin de nettoyage (10);
    un support (50, 52) pour maintenir un bloc scié de galettes semi-conductrices (40) dans le bassin de nettoyage (10) de sorte que, lorsqu'un liquide de nettoyage (34) se trouve dans le bassin de nettoyage (10), au moins un segment du bloc de galettes semi-conductrices (40) présentant des interstices de sciage soit disposée dans le liquide de nettoyage;
    au moins une ouverture de sortie (18) dans une zone de fond (16) du bassin de nettoyage (10); et
    un moyen d'obturation (21, 22) de l'ouverture de sortie (18), par lequel l'ouverture de sortie (18) peut être ouverte et fermée,
    caractérisé par le fait que le moyen d'obturation (21, 22), l'ouverture de sortie (18) et la zone de fond du bassin de nettoyage sont réalisés de sorte que par une ouverture du moyen d'obturation (21, 22) le liquide de nettoyage puisse être vidangé si rapidement au moins de la zone du bassin de nettoyage (10) dans laquelle est disposé le bloc de galettes semi-conductrices que, par un effet de dépression dynamique du liquide de nettoyage, les impuretés puissent être éliminées des interstices de sciage, l'ouverture de sortie (18) étant formée dans une plaque de fond (16) du bassin de nettoyage (10), le moyen d'obturation (21, 22) présentant un élément d'obturation (22) et un moyen d'entraînement destiné à déplacer l'élément d'obturation en direction verticale, des surfaces d'étanchéité (20) de l'ouverture de sortie (18) auxquelles l'élément d'obturation, lorsqu'il est en position d'obturation, obture l'ouverture de sortie (18) étant disposées obliquement, de sorte que l'ouverture de sortie (18) soit plus petite du côté supérieur de la plaque de fond (16) que du côté inférieur de cette dernière, l'élément d'obturation (22) présentant des faces d'étanchéité disposées de manière oblique adaptée à cet effet.
  8. Dispositif selon l'une des revendications 1 à 7, présentant un moyen de pulvérisation (42) dans le bassin de nettoyage (10), pour pulvériser du liquide de nettoyage d'un ou de deux côtés dans les interstices de sciage.
  9. Dispositif selon la revendication 8, présentant un moyen (44) pour déplacer le moyen de pulvérisation (42) en direction verticale.
  10. Dispositif selon la revendication 8 ou 9, dans lequel le moyen de pulvérisation (42) est conçu pour pulvériser du liquide de nettoyage de deux côtés dans les interstices de sciage, un moyen de commande étant prévu pour commander le moyen de pulvérisation (42) pour pulvériser alternativement de deux côtés.
  11. Dispositif selon l'une des revendications 1 à 10, présentant par ailleurs un dispositif de préparation du liquide de nettoyage vidangé.
  12. Dispositif selon la revendication 11, dans lequel le dispositif de préparation présente une centrifugeuse.
  13. Procédé de nettoyage d'un bloc scié de galettes semi-conductrices (40), aux étapes suivantes consistant à:
    introduire le bloc scié de galettes semi-conductrices (40) dans un bassin de nettoyage (10);
    remplir le bassin de nettoyage (10) d'un liquide de nettoyage (34) avant, pendant ou après l'introduction du bloc scié de galettes semi-conductrices (40), de sorte qu'au moins un segment du bloc de galettes semi-conductrices (40) présentant des interstices de sciage se trouve dans le liquide de nettoyage (34);
    ouvrir au moins une ouverture de sortie disposée dans la zone de fond du bassin de nettoyage (10), l'ouverture de sortie et la zone de fond du bassin de nettoyage étant réalisées de sorte que le liquide de nettoyage soit, par l'ouverture de cette dernière, vidangé si rapidement que, par un effet de dépression dynamique du liquide de nettoyage, les impuretés soient éliminées des interstices de sciage,
    caractérisé par le fait que le bassin de nettoyage (10) est vidé en moins de 2 secondes, de préférence en moins de 1,5 secondes.
  14. Procédé selon la revendication 13, présentant par ailleurs une étape consistant à pulvériser (60) du liquide de nettoyage dans les interstices de sciage avant et/ou pendant qu'au moins le segment du bloc de galettes semi-conductrices (40) présentant les interstices de sciage se trouve dans le liquide de nettoyage (34).
  15. Procédé selon la revendication 14, dans lequel l'étape de pulvérisation a lieu alternativement de deux côtés du bloc de galettes semi-conductrices (40).
EP06829352A 2005-12-06 2006-12-06 Dispositif et procédé de nettoyage d'un bloc scie de galettes semi-conductrices Not-in-force EP1957247B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005058269A DE102005058269B4 (de) 2005-12-06 2005-12-06 Vorrichtung zum Reinigen eines gesägten Waferblocks
PCT/EP2006/011724 WO2007065665A1 (fr) 2005-12-06 2006-12-06 Dispositif et procédé de nettoyage d'un bloc scie de galettes semi-conductrices

Publications (2)

Publication Number Publication Date
EP1957247A1 EP1957247A1 (fr) 2008-08-20
EP1957247B1 true EP1957247B1 (fr) 2010-11-17

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EP06829352A Not-in-force EP1957247B1 (fr) 2005-12-06 2006-12-06 Dispositif et procédé de nettoyage d'un bloc scie de galettes semi-conductrices

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Country Link
US (1) US20080308125A1 (fr)
EP (1) EP1957247B1 (fr)
AT (1) ATE488345T1 (fr)
CA (2) CA2632387C (fr)
DE (2) DE102005058269B4 (fr)
MY (1) MY141037A (fr)
WO (1) WO2007065665A1 (fr)

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JP3209403B2 (ja) * 1996-12-24 2001-09-17 株式会社東京精密 ウェーハ洗浄装置
JP3697063B2 (ja) * 1997-05-15 2005-09-21 東京エレクトロン株式会社 洗浄システム
US6164297A (en) * 1997-06-13 2000-12-26 Tokyo Electron Limited Cleaning and drying apparatus for objects to be processed
JP3494202B2 (ja) * 1997-09-30 2004-02-09 荒川化学工業株式会社 ウェハー状ワーク洗浄方法並びに当該洗浄方法に用いる洗浄バスケット及び洗浄ハウジング
US6514355B1 (en) * 1999-02-08 2003-02-04 International Business Machines Corporation Method and apparatus for recovery of semiconductor wafers from a chemical tank
US6837253B1 (en) * 2002-04-22 2005-01-04 Imtec Acculine, Inc. Processing tank with improved quick dump valve
US20050061775A1 (en) * 2003-09-19 2005-03-24 Kuo-Tang Hsu Novel design to eliminate wafer sticking

Also Published As

Publication number Publication date
MY141037A (en) 2010-02-25
DE102005058269B4 (de) 2011-12-01
CA2632387A1 (fr) 2007-12-06
CA2719395A1 (fr) 2007-12-06
US20080308125A1 (en) 2008-12-18
WO2007065665A1 (fr) 2007-06-14
EP1957247A1 (fr) 2008-08-20
DE502006008357D1 (de) 2010-12-30
ATE488345T1 (de) 2010-12-15
CA2632387C (fr) 2012-04-17
DE102005058269A1 (de) 2007-06-14

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