EP1917509A1 - Dispositif de detection comportant un substrat et un boitier et procede de fabrication d'un dispositif de detection - Google Patents

Dispositif de detection comportant un substrat et un boitier et procede de fabrication d'un dispositif de detection

Info

Publication number
EP1917509A1
EP1917509A1 EP06777639A EP06777639A EP1917509A1 EP 1917509 A1 EP1917509 A1 EP 1917509A1 EP 06777639 A EP06777639 A EP 06777639A EP 06777639 A EP06777639 A EP 06777639A EP 1917509 A1 EP1917509 A1 EP 1917509A1
Authority
EP
European Patent Office
Prior art keywords
substrate
housing
region
sensor arrangement
substrate region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06777639A
Other languages
German (de)
English (en)
Inventor
Frieder Haag
Thomas-Achim Boes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP1917509A1 publication Critical patent/EP1917509A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/141—Monolithic housings, e.g. molded or one-piece housings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
    • B81B7/0048—Packages or encapsulation for reducing stress inside of the package structure between the MEMS die and the substrate
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Definitions

  • German patent application DE 199 29 026 A1 discloses a method for producing a pressure sensor in which a semiconductor pressure sensor is applied to a mounting section of a cable grid, the semiconductor pressure sensor is electrically connected to contact sections of the cable grid, the line grid is inserted into an injection molding tool with the semiconductor pressure sensor and then the Halbleitdruckaufillon is surrounded in the injection mold with a housing of injection molding compound, wherein in the injection mold means are provided by which a pressure feed for the Halbleitdruckaufillon of the casing and spray compound is recessed, wherein a punch in the injection mold through a gap to that of spaced apart from the semiconductor pressure transducer side of the mounting portion is arranged.
  • sensors that need access to external media, such.
  • pressure sensors should be packaged in preform housings.
  • the housing mold is injected and subsequently the chip is mounted in the already prefabricated housing and contacted accordingly.
  • premold housing shapes are relatively expensive compared to standard mold housings
  • attempts have already been made by means of the aforementioned disclosure to package pressure sensors in standard gold housings as well.
  • a partial area of the component surface is kept free for this purpose by a stamp or the like.
  • a disadvantage of all existing housing forms is that the sensor element is at least partially embedded in a plastic compound. Due to thermal expansion, the characteristic of the sensor element can be greatly influenced. This is possible, for example, in that different thermal expansion coefficients lead to stresses in the sensor element, which gives rise to incorrect measurements or functional failures.
  • the substrate has a first substrate region and a second substrate region, wherein an active sensor region, for example a pressure sensor membrane or the like, is located in the second substrate region and the second substrate region is projecting out of the housing.
  • an active sensor region for example a pressure sensor membrane or the like
  • the housing has an opening in the second substrate region.
  • the first and second substrate region are preferably a continuous substrate material, the division between the first substrate region and the second substrate region being achieved only in that parts of the substrate are embedded in the housing (first substrate region) and parts thereof Protrude housing (second substrate area).
  • the substrate can also be a composite substrate material, for example a semiconductor substrate with a cap wafer or else composite or bonded or grown substrates such as SOI substrates or the like.
  • an injection molding compound is provided as the housing is. This can be based on proven manufacturing processes for the provision of packages for semiconductor devices or in general for electronic components are used, in particular to the method of the so-called transfer molding (transfer molding method), which is also referred to as transfer forms.
  • transfer molding method transfer molding method
  • a housing made of a molding compound (molding compound) is produced by embedding the component or a semiconductor sensor arrangement in the housing.
  • the housing at least partially surrounds the second substrate region at least in a main plane of the substrate.
  • the second substrate region projecting out of the housing is protected by mechanical stresses that could be caused by the housing, but at the same time also by the housing itself, which, however, is spaced apart from the second substrate region Substrate is arranged, is protected, especially against external forces, such as by falling or otherwise.
  • the second substrate region has an active region for sensing a detectable variable or several detectable variables, the size or the sizes being detectable only by means of at least indirect contact of at least part of the sensor arrangement with a medium.
  • the active sensor region is accessible, on the one hand, for a medium, for example a fluid which is under pressure and whose pressure is to be measured, and, on the other hand, nevertheless a cost-effective, simple and rapid production of the entire sensor arrangement , That is, including a housing for the substrate with the active region according to the invention is possible.
  • a medium for example a fluid which is under pressure and whose pressure is to be measured
  • the sensor arrangement according to the invention for sensor principles in which no media contact is present or required, for example inertial sensors. Even with such, no media contact requiring sensor principles, it is particularly advantageous that a stress introduction from the housing to the active sensor area is largely avoided.
  • the first substrate region has contact means for electrical contacting and / or circuit means, and that only comparatively insensitive structures are provided in the substrate at the transition between the first substrate region and the second substrate region are.
  • Such comparatively insensitive structures are, for example, conduction paths which lead or provide contacting lines from the circuit part in the first substrate region to the active region in the second substrate region. According to the invention it is thereby possible that without loss of yield or the like.
  • a functionally correct transition from the first substrate region to the second substrate region is possible, ie in particular one successful sealing between an injection mold and the substrate of the sensor arrangement during encapsulation of the first substrate region with the potting compound is possible.
  • a sealing material in particular a gel or a film, is provided at the transition between the first substrate region and the second substrate region.
  • Another object of the present invention is a method for producing a sensor arrangement according to the invention, wherein in particular the housing is produced by encapsulation of the substrate and wherein the substrate is substantially completely surrounded by the housing only in its first substrate region. The remaining substrate region (second substrate region) projects out of the housing opposite.
  • a part of the injection molding tool either has direct contact with the substrate or that during encapsulation for sealing an injection molding tool between the first substrate region and the second substrate region, a part of the injection molding tool presses on a sealing material.
  • the sealing material can be incorporated either in the manufacture of the housing in the sensor assembly, for example by applying the Sealing material on the substrate (between the first and the second substrate portion) and then casting of the housing material, ie, then at least partially embedding also the sealing material in the housing (consumption of the sealing material in the manufacture of the housing).
  • the sealing material may also be provided as part of an injection molding tool or at least attached thereto for sealing (for example as a sealing film or as a soft sealing compound). In this case, the sealing material is at least not substantially embedded in the housing.
  • FIG. 2 shows a schematic illustration of a sectional view through a sensor arrangement according to the invention, based on the section line AA from FIG. 1
  • FIG. 3 shows a schematic plan view of a sensor arrangement according to the invention with further details on the interior of the sensor arrangement
  • FIG. 4 shows a schematic plan view of a second embodiment of a sensor arrangement according to the invention
  • Figure 5 is a schematic sectional view of the second embodiment of the sensor arrangement according to the invention based on the section line AA of Figure 4 and
  • Figure 6 is a schematic sectional view of a third embodiment of a sensor arrangement according to the invention.
  • FIG. 1 shows a schematic plan view of a sensor arrangement 10 according to the invention.
  • This sensor arrangement 10 comprises a housing 30 and a substrate 20.
  • the substrate material is provided in particular as a semiconductor material or as a composite substrate, for example, of wafers of different or identical materials.
  • the substrate material is referred to as substrate 20.
  • the substrate 20 has a first region 21 and a second region 22 on, wherein in the second region 22, an active region 23 is shown separately, which serves for sensing or for detecting a size to be measured by means of the sensor arrangement 10 according to the invention.
  • an opening 33 is provided in the housing 30 in the transition region to the first substrate region 21, so that the second substrate region 22 can protrude.
  • the variable which can be detected by means of the active region 23 is, in particular, one which can be detected only by means of at least indirect contact between the second substrate region 22 or in particular the active region 23 and a medium not shown in the figures.
  • the medium may be, for example, a gas whose pressure is to be measured by means of a pressure measuring membrane as the active region 23.
  • the medium, some air or another gas, must have access to the region 23, ie in particular to the pressure measuring membrane.
  • This access to the active region 23 is realized according to the invention in that the second substrate region 22 protrudes from the housing 30 and that the first substrate region 21 is embedded in the housing 30.
  • FIG. 1 shows a section line AA, with FIG.
  • FIG. 1 it can still be seen that, in particular, connecting elements 31, such as, for example, pins or contacting legs or the like, protrude from the housing 30.
  • connecting elements 31, such as, for example, pins or contacting legs or the like protrude from the housing 30.
  • no contacting elements 31 protrude from the housing 30, but that on the top, the bottom and / or the lateral surfaces of the housing 30 contact surfaces (not shown) are present, the contact of the device or the Sensor arrangement serve, for example by means of a flip-chip mounting option or the like.
  • FIG. 3 shows a further schematic plan view of the sensor arrangement according to the invention, with further details of the interior of the sensor arrangement 10 being visible in FIG. 3, for example next to the substrate 20, the first substrate region 21, the second substrate region 22, the active region 23 further substrate 26 and the bonding wires 27, further bonding wires 32 for contacting the further substrate 26 with the connecting elements 31.
  • the leadframe 25 is shown in FIG.
  • FIG. 4 shows a second embodiment of the sensor arrangement 10 according to the invention in a schematic plan view.
  • the substrate 20 has the first substrate region 21 and the second substrate region 22, wherein the second substrate region 22 on the one hand comprises the active region 23 and on the other hand protrudes from the housing 30 at the opening 33.
  • the housing 30 has an extension region 35, which extends essentially in the main plane of the substrate 20 around the second substrate region 22 and thus protects the second substrate region 22, in particular against mechanical influences.
  • the advantages of the present sensor arrangement according to the invention are realized insofar as the additional region 35 or extension region 35 of the housing protects the second substrate region 22, but no mechanical forces, for example due to different temperature coefficients or the like on the second substrate region 22 and in particular on the active region 23 of the sensor arrangement exerts.
  • the extension region 35 maintains a distance from the second substrate region 22, this distance being indicated by the reference numeral 24 in FIG.
  • FIG. 4 also has a section line AA, with FIG. 5 essentially showing a sectional illustration (with certain deviations) along section line AA from FIG.
  • FIG. 5 shows the above-mentioned, schematic sectional representation along the section line AA (with deviations) from FIG. 4, wherein the sensor arrangement 10 according to the invention again comprises the substrate 20, the first substrate region 21, the second substrate region 22, the active region 23, the other Substrate 26, the extension portion 35 and the wiring grid 25 and the leadframe 25 includes.
  • FIG. 6 schematically illustrates a third embodiment of the sensor arrangement according to the invention, the substrate 20 again comprising the first substrate region 21, the second substrate region 22 and the active region 23, but in the transition region between the first substrate region 21 and the second substrate region 22, ie in the region of the opening 33, a sealing material 29 is provided, which is used in the manufacture of the housing 30 of the sensor assembly 10 insofar as an injection molding tool or injection molding tool, not shown, of a device for encapsulation of the first substrate portion 21 with the housing material no direct contact or does not have to exert direct compressive forces on the substrate 20 in the transition region between the first substrate region 21 and the second substrate region 22, but presses on the sealing material 29 and thus the structures present in this substrate region in front of these applied pressure force protects.
  • a sealing material 29 is provided, which is used in the manufacture of the housing 30 of the sensor assembly 10 insofar as an injection molding tool or injection molding tool, not shown, of a device for encapsulation of the first substrate portion 21 with the housing material no direct contact or does
  • the material of the housing 30 can thus be filled in the area to be extrusion-coated (first substrate area 21) with the required pressure and the required temperature, which furthermore does not lead to an impairment of the speed of the production process of the sensor arrangement 10 according to the invention. Namely, it is one of the main problems in coating only a portion 21 of the substrate 20, that the sealing of the tool against the molding compound or against the potting compound of the housing 30 has potential problems. Due to tolerances must be over-pressed during sealing, otherwise excess plastic material (Flash) flows into the active region 23 of the sensor or the substrate 20 and causes disturbing deposits of the potting compound there.
  • Flash excess plastic material
  • the sealing material 29 according to the invention either - as shown in Figure 6 - are embedded in the housing 30 (ie remain on the finished sensor assembly 10) or in an alternative embodiment, not shown, in particular the method according to the invention, only be provided on the injection mold, so that In the latter case, the sealing material 29 does not (or at least not substantially) penetrate into the housing 30 embedded.
  • the side of the silicon is thereby more difficult to seal, since possibly an angular rotation contributes to the formation of a gap.
  • the active area of the sensor is arranged on the upper side of the beam or the substrate 20 projecting in the second substrate area 22 and thus does not cause a slight lateral flash formation (ie on the lateral narrow sides of the substrate 20) for the function of the sensor is critical.
  • the third embodiment of the sensor arrangement 10 according to the invention can of course be combined with the first and / or the second embodiment.
  • the senor it is possible for the sensor to be separated from the evaluation electronics, ie a so-called two-chip module is provided within the sensor arrangement 10, as shown in FIGS. 2, 3 and 5, or for the sensor or the substrate 20 already includes the evaluation and therefore a further substrate 26 is not required, so that the sensor assembly 10 can be implemented as a single-chip module.
  • the first embodiment of the sensor arrangement 10 according to the invention is particularly advantageous if the smallest possible dimension of the sensor arrangement is desired or if the sensor element, for example for biosensors or the like, is to dip into a liquid or generally into a fluid which the Moldcom pound or the potting compound of the housing 30 should not touch.
  • the housing shape of the sensor arrangement 10 according to the second embodiment in which the extension area 35 of the housing 30 is guided all around the second substrate area 22 and protects the active area 23, offers maximum protection against mechanical influences on the sensor element 23 or the active region 23 of the sensor assembly 10.
  • the second substrate region 22 only contacts the housing 30 on one of its sides (or the extension region 35 at all).
  • the housing 30 may be a housing form with pins or with connection legs or even a modern "leadless" form.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

L'invention concerne un dispositif de détection comportant un substrat et un boîtier et un procédé de fabrication d'un dispositif de détection. Selon l'invention, le boîtier entoure essentiellement l'ensemble du substrat dans une première zone de substrat, et dans une deuxième zone de subtsrat, le boîtier est au moins partiellement ouvert au moyen d'une ouverture. Dans la zone de l'ouverture, la deuxième zone de substrat fait saillie hors du boîtier.
EP06777639A 2005-08-16 2006-07-07 Dispositif de detection comportant un substrat et un boitier et procede de fabrication d'un dispositif de detection Withdrawn EP1917509A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200510038443 DE102005038443A1 (de) 2005-08-16 2005-08-16 Sensoranordnung mit einem Substrat und mit einem Gehäuse und Verfahren zur Herstellung einer Sensoranordnung
PCT/EP2006/063999 WO2007020132A1 (fr) 2005-08-16 2006-07-07 Dispositif de detection comportant un substrat et un boitier et procede de fabrication d'un dispositif de detection

Publications (1)

Publication Number Publication Date
EP1917509A1 true EP1917509A1 (fr) 2008-05-07

Family

ID=36942399

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06777639A Withdrawn EP1917509A1 (fr) 2005-08-16 2006-07-07 Dispositif de detection comportant un substrat et un boitier et procede de fabrication d'un dispositif de detection

Country Status (6)

Country Link
US (1) US20090072333A1 (fr)
EP (1) EP1917509A1 (fr)
JP (1) JP2009505088A (fr)
CN (1) CN101253399A (fr)
DE (1) DE102005038443A1 (fr)
WO (1) WO2007020132A1 (fr)

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JP2009505088A (ja) 2009-02-05
CN101253399A (zh) 2008-08-27
WO2007020132A1 (fr) 2007-02-22
US20090072333A1 (en) 2009-03-19

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