EP1846253B1 - Procede de production d'un corps multicouche et corps multicouche correspondant - Google Patents

Procede de production d'un corps multicouche et corps multicouche correspondant Download PDF

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Publication number
EP1846253B1
EP1846253B1 EP06706766A EP06706766A EP1846253B1 EP 1846253 B1 EP1846253 B1 EP 1846253B1 EP 06706766 A EP06706766 A EP 06706766A EP 06706766 A EP06706766 A EP 06706766A EP 1846253 B1 EP1846253 B1 EP 1846253B1
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EP
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Prior art keywords
layer
region
multilayer body
replication
body according
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EP06706766A
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German (de)
English (en)
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EP1846253A2 (fr
Inventor
René Staub
Wayne Robert Tompkin
Andreas Schilling
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OVD Kinegram AG
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OVD Kinegram AG
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Priority to PL06706766T priority Critical patent/PL1846253T3/pl
Priority to SI200630134T priority patent/SI1846253T1/sl
Publication of EP1846253A2 publication Critical patent/EP1846253A2/fr
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/405—Marking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/328—Diffraction gratings; Holograms
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S359/00—Optical: systems and elements
    • Y10S359/90—Methods

Definitions

  • the invention relates to a method for producing a multilayer body having a partially formed first layer and to a multilayer body having a replication layer and a first layer partially arranged on the replication layer.
  • Such components are suitable as optical components or as lens systems in the field of telecommunications.
  • the GB 2 136 352 A describes a manufacturing method for producing a sealed with a hologram security feature sealing film.
  • a plastic film is metallized over the entire area after the impressing of a diffractive relief structure and then demetallized in register with register to the embossed diffractive relief structure.
  • EP 0 537 439 B2 describes methods for producing a security element with filigree patterns.
  • the patterns are formed from diffractive structures covered with a metal layer and surrounded by transparent areas in which the metal layer is removed. It is intended to introduce the outline of the filigree pattern as a recess in a metal-coated substrate, while at the same time to provide the bottom of the wells with the diffractive structures and then to fill the wells with a protective varnish. Excess protective varnish should be removed by means of a doctor blade.
  • the protective lacquer After the protective lacquer has been applied, it is intended to remove the metal layer in the unprotected transparent regions by etching.
  • the depressions are about 1 ⁇ m to 5 ⁇ m, while the diffractive structures can have height differences of more than 1 ⁇ m. With finer structures, this method fails, which requires adjustment steps for register-accurate alignment during repetition steps. In addition, flat contiguous metallic areas are difficult to realize, since the "spacers" are missing for stripping the protective lacquer.
  • EP-A-758 587 also shows a process for producing a multi-layered body.
  • Object of the present invention is to provide a multilayer body and a method for producing a multi-layer body, in which the register with high accuracy and cost, a layer can be applied, which has areas in which the layer is not present.
  • the object is achieved by a method for adjusting a multilayer body having a partially formed first layer, wherein it is provided that in a first region of a replication of the multilayer body, a diffractive first relief structure with a depth-to-width ratio of the individual structural elements of > 0.3, and the first layer is applied to the replication layer in the first region and in a second region in which the first relief structure is not formed in the replication layer, with a constant surface density relative to a plane spanned by the replication layer, and that the first layer is determined by the first relief structure is partially removed, so that the first layer in the first region, but not in the second region, or in the second region, but not in the first region is removed.
  • the object is achieved by a multilayer body having a replication layer and at least one first layer partially arranged on the replication layer, it being provided that in a first region of the replication layer a diffractive first relief structure with a depth-to-width ratio of the individual structural elements of FIG > 0.3, is formed that in a second region of the replication layer, the first relief structure is not formed in the replication layer, and that the partial arrangement of the first layer is determined by the first relief structure, so that the first layer in the first region, not However, in the second area, or in the second area, but not in the first area is removed.
  • the invention is based on the finding that physical properties of the first layer applied to the replication layer in this region, such as transmission properties, in particular transparency, or effective thickness of the first layer, are influenced by the special diffractive relief structure in the first region, so that the physical properties of the first layer are affected Properties of the first layer in the first and second range differ.
  • the first layer is now used as a kind of masking layer for the partial removal of the first layer itself or for the partial removal of another layer.
  • the advantage is achieved that this mask layer is aligned in register without additional adjustment effort.
  • the first layer is an integral part of the structure molded in the replication layer. A lateral displacement between the first relief structure and regions of the first layer with the same physical properties does not occur.
  • the arrangement of regions of the first layer with the same physical properties is exactly in register with the first relief structure. Therefore, only the tolerances of this relief structure influence the tolerances of the position of the first layer. Additional tolerances do not arise.
  • the first layer is a layer which preferably fulfills a double function. On the one hand it provides the function of a high-precision mask layer, for example a high-precision exposure mask for the manufacturing process, on the other hand (at the end of the manufacturing process) represents a highly accurately positioned functional layer, such as an OVD layer or a conductor or a functional layer of an electrical component, such as one organic semiconductor device.
  • structured layers of very high resolution can be achieved by means of the invention.
  • the achievable resolution is about 100 times better than achievable by known demetallization resolutions.
  • the Width of the structural elements of the first relief structure in the range of the wavelength of visible light (about 380 to 780 nm), but also may be below, metallized pattern areas can be formed with very fine contours.
  • lines and / or dots with high resolution, for example with a width or a diameter of less than 5 ⁇ m, in particular up to approximately 200 nm.
  • resolutions in the range from approximately 0.5 ⁇ m to 5 ⁇ m, in particular in the Range of about 1 micron, generated.
  • line widths smaller than 10 microns can be realized only with great effort.
  • the first layer may be a very thin layer of the order of a few nm.
  • the first layer applied with uniform areal density relative to the plane defined by the replication layer is made substantially thinner in areas having a high depth-to-width ratio than in areas having a low depth-to-width ratio.
  • the dimensionless depth-to-width ratio is a characteristic feature for the enlargement of the surface, preferably of a periodic structure, for example with a sine-squared profile.
  • Depth is the distance between the highest and the lowest consecutive point of such a structure, ie the distance between "mountain” and “valley”.
  • Width is the distance between two adjacent highest points, ie between two "mountains”.
  • they may be discretely distributed line-shaped areas that are only one "Valley” are formed, wherein the distance between two "valleys” is many times higher than the depth of the "valleys".
  • the thus calculated depth-to-width ratio would be close to zero and would not reflect the characteristic physical behavior. Therefore, with discretely arranged structures formed essentially only of a "valley”, the depth of the "valley” should be related to the width of the "valley".
  • Such multilayer bodies are suitable, for example, as optical components, such as lens systems, exposure and projection masks or as security elements for securing documents or ID cards, by covering critical areas of the document, such as a passport photograph or a signature of the owner or the entire document. They can also be used as components or decorative elements in the field of telecommunications.
  • the multilayer body may be a foil element or a rigid body.
  • Foil elements are used, for example, to documents, banknotes or similar. provided with security features. It may also be security threads for weaving in paper or insertion into a card, which can be formed with the method according to the invention with a partial demetallization in perfect register to an OVD design.
  • the multilayer body is arranged as a security feature in a window of a value document or the like.
  • it is possible to produce semi-transparent images by forming a screening of the first layer in transmitted light. It is also possible to have a first information in reflection in such a window and a second information in transmitted light.
  • rigid bodies such as a badge, a base plate for a sensor element or a housing shell for a mobile phone, with the invention, possibly teildemetallelleen, layers be provided in the register to functional structures or elements or to a diffractive design element. It can be provided to introduce the replication layer directly with the injection molding tool or by means of molding a stamp in UV varnish and to structure.
  • first regions in which the diffractive relief structure is provided with a high depth-to-width ratio
  • second regions in which an optically active diffractive structure having a conventional, lower depth-to-width ratio is obtained.
  • Width ratio is provided.
  • the first relief structure in the first region has a depth of 5 ⁇ m and a width of 2.5 ⁇ m, respectively.
  • a high depth-to-width ratio of 2 and in the second range a depth of 0.15 ⁇ m and a width of 2.5 ⁇ m, i. a low depth-to-width ratio of 0.06.
  • filigree patterns such as guilloche patterns, which accurately diffractive structures which creative designs of a hologram or Kinegram ® s correspond be aligned.
  • the first layer is preferably applied to the replication layer by sputtering, vapor deposition or spraying.
  • sputtering is due to the process, a directed material order, so that when sputtering material of the first layer in a constant area density based on the plane spanned by the replication layer on the provided with the relief structure replication layer, the material is locally deposited differently thick.
  • an at least partially directed material application is preferably also produced in terms of process technology.
  • the first layer is partially removed by a time-controlled etching process.
  • the starting point is the fact that relief structures with a high depth-to-width ratio have a significantly larger surface than flat surfaces or areas with relief structures that have a low depth-to-width ratio.
  • the etching process is terminated when the first layer in the high depth-to-width ratio regions is completely removed or at least the layer thickness is reduced. Due to the special relief structure in the first region caused different physical properties of the first layer in the first and second region (lower effective thickness), the first layer still covers the second region, when the first layer is already completely removed in the first region.
  • etchant for example, alkalis or acids may be provided.
  • the first layer is only partially removed and the etching is stopped as soon as a predetermined transmission or transparency is reached.
  • security features can be generated which are based on locally different transmission or transparency.
  • a multilayer body with a vapor-deposited reflection layer as the first layer is exposed to an etching medium which etches primarily isotropically, the reflection layer is already completely removed in regions with a high depth-to-width ratio, whereas in regions with low depth-to-width Ratio still exists a residual layer.
  • etching medium which etches primarily isotropically
  • the reflection layer is already completely removed in regions with a high depth-to-width ratio, whereas in regions with low depth-to-width Ratio still exists a residual layer.
  • alkalis such as NaOH or KOH can be used as isotropic etchants.
  • acidic media such as PAN (a mixture of phosphoric acid, nitric acid and water) is also possible.
  • the reaction rate typically increases with the concentration of the liquor and the temperature.
  • the choice of process parameters depends on the reproducibility of the process and the durability of the multilayer body.
  • the optical density is preferably chosen to be> 1.5.
  • the compensation may be a multiple of the targeted optical density.
  • an Al layer is vapor-deposited as the first layer, which is opaque in a second, planar region or has an optical density of 6 and forms a metallic mirror there, and the Al layer is etched accordingly, then after the etching process in FIG second region an opaque layer with still specularly reflective properties and with an optical density of 2 achievable, while the Al layer in adjacent first areas, which are provided with a first relief structure with a high depth-to-width ratio, already was completely etched.
  • Factors influencing the etching with lye are typically the composition of the etching bath, in particular the concentration of etchant, the temperature of the etching bath and the flow conditions of the layer to be etched in the etching bath.
  • Typical parameter ranges of the concentration of the etchant in the etching bath are in the range of 0.1 to 10% and the temperature is in the range of 20 ° C to 80 ° C.
  • the etching of the first layer can be supported electrochemically. By applying an electrical voltage, the etching process is enhanced. The effect is typically isotropic, so the structure dependent Surface enlargement additionally intensifies the etching effect.
  • Typical electrochemical additives such as wetting agents, buffering agents, inhibitors, activators, catalysts and the like, for example, to remove oxide layers, can assist the etching process.
  • etching medium there may be a depletion of etching medium, respectively accumulation of the etching products, in the boundary layer to the first layer, whereby the speed of the etching is slowed down.
  • a forced mixing of the etching medium optionally by forming a suitable flow or an ultrasonic excitation, improves the etching behavior.
  • the etching process can furthermore have a temporal temperature profile in order to optimize the etching result.
  • a temporal temperature profile in order to optimize the etching result.
  • this is preferably realized by a spatial temperature gradient, wherein the multilayer body is drawn through an elongated etching bath with different temperature zones.
  • the last few nanometers of the first layer may prove to be relatively persistent and resistant to etching in the etching process. For removing residues of the first layer, therefore, a slight mechanical support of the etching process is advantageous.
  • the tenacity is based on possibly slightly different composition of the first layer, presumably due to interfacial phenomena in forming the first layer on the replication layer.
  • the last nanometer of the first layer are in this case preferably removed by means of a wiping process by passing the multilayer body over a roller covered with a fine cloth. The cloth wipes off the remains of the first layer without damaging the multi-layer body.
  • a first layer which is embodied, for example, as a metallic reflection layer, is removed in regions by direct irradiation with a suitable laser in regions in which the absorption behavior of the different relief structures in the different regions of the multilayer body is utilized.
  • the reflection layer is irradiated, wherein in the strongly absorbing regions, which have the mentioned structures with a high depth-to-width ratio, the laser radiation is increasingly absorbed and the reflection layer is heated accordingly.
  • the reflection layer can chip off locally, wherein a removal or ablation of the reflection layer or coagulation of the material of the reflection layer occurs. If the energy input by the laser is only for a short time and the effect of the heat conduction is thus small, the ablation or coagulation takes place only in the areas predefined by the relief structure.
  • Factors influencing laser ablation are the design of the relief structures (period, depth, orientation, profile), the wavelength, the polarization and the angle of incidence of the incident laser radiation, the duration of the exposure (time-dependent power) and the local dose of the laser radiation Properties and the absorption behavior of the first layer, as well as a possible over- and underfilling of the first layer with further layers.
  • Nd: YAG lasers have proved suitable for the laser treatment. These radiate at about 1064nm and are preferably operated pulsed. Furthermore, diode lasers can be used. By means of a frequency change, e.g. a frequency doubling, the wavelength of the laser radiation can be changed.
  • the laser beam is detected by means of a so-called scanning device, e.g. by means of galvanometric mirror and focusing lens, guided over the multilayer body. Pulses lasting from nano to microseconds are emitted during the scan and result in the ablation or coagulation of the first layer as previously described by the structure.
  • the pulse durations are typically below milliseconds, advantageously in the range of a few microseconds or less. Pulse durations from nanoseconds to femtoseconds can be used. Precise positioning of the laser beam is not necessary because the process is self-referencing.
  • the process is preferably further optimized by a suitable choice of the laser beam profile and the overlap of adjacent pulses.
  • a focused on a point or a line laser flat radiators can be used, which emit a short-term, controlled pulse, such as flash lamps.
  • One of the advantages of the laser ablation method is, inter alia, that the partial removal of the first layer registered to a relief structure can also take place if it is provided on both sides with one or more further layers Coated layers and thus not directly accessible for etching media.
  • the first layer is only broken up by the laser.
  • the material of the first layer settles again in the form of small conglomerates or small globules, which do not visually appear to the viewer and only insignificantly affect the transparency in the irradiated area.
  • Residues of the first layer still remaining on the replication layer after the laser treatment can optionally be removed by means of a subsequent washing process, provided that the first layer is directly accessible.
  • the first layer is applied to the replication layer in an areal density which is selected so that the transparency of the first layer in the first region is increased by the first relief structure compared to the transparency of the first layer in the second region.
  • the opaque first layer formed in this way with transparent regions can still be changed by further method steps or used as a mask to form further layers.
  • it may be provided to remove the first layer in the transparent areas. This can be done by an etch or ablation method described above.
  • an etching mask is produced as a 1: 1 copy of the first layer, which covers the areas of the first layer to be protected from the action of the etchant.
  • the multilayer bodies according to the invention may have further regions which are formed by conventional methods, for example to form decorative color effects which extend over regions or over the entire multilayer body.
  • the formation of the first layer is not bound to any specific material.
  • the first layer should advantageously be made opaque outside transparent regions, unless the above-described time-controlled etching process for setting a defined transmission is provided.
  • Transparent materials can be colored to make them opaque.
  • it may be provided to form the first layer from a metal or a metal alloy.
  • the opacity of the metallic layer can be adjusted by the amount applied per unit area, by the type of metal and by the relief structure in the first area.
  • Metallic first layers can be re-reinforced by electroplating, for example, to increase the reflectivity or conductivity of the remaining layer.
  • connection lines for electronic circuits or electronic components, such as antennas and coils with high electrical quality can be formed.
  • the first metallic layer is reinforced by applying the same metal.
  • the first layer is formed from a first metal or a first metal alloy and a second metal is applied for reinforcement.
  • a layer composed of different metals or metal alloys can be produced in layers. It may be, for example, a miniaturized bimetallic element.
  • the first layer of partial layers with different metals or metal alloys in layers in order to utilize the different physical and / or chemical properties of the partial layers for the formation of the method steps and / or the properties of the end product.
  • the first layer of aluminum and chromium may be constructed, wherein the highly reflective aluminum can improve the optical properties of the final product and allows the more chemically stable chromium advantageous embodiment of the etching processes.
  • the layered structure of the first layer is not limited to metallic layers. These may also be dielectric layers or polymer layers. It can also be provided that successive layers of different material and / or with different thickness are formed, for example, to produce the well-known color change effects on thin layers.
  • the polymer layer may be an organic semiconductor layer that may be part of an organic semiconductor device or an organic circuit.
  • Such polymer layers may be formed as liquids in the broadest sense and applied for example by means of printing processes. Because the application of the polymer layer by the process according to the invention does not have to be carried out in register, it is particularly cost-effective.
  • the replication layer is formed as a photoactive washing mask, which is exposed and activated through the first layer, and that the exposed areas of the washing mask and disposed there on the washing mask areas of the first layer are removed.
  • Wash masks are characterized by environmental friendliness, since, for example, water can also be used as a solvent to remove the exposed areas of the washing mask. However, it is important to ensure that the washing mask is sufficiently durable, so as not to limit the formed with the washing mask multilayer body in its life and / or reliability. It can be advantageous that the removal of the exposed areas of the washing mask at the same time also removes the surface structure formed there with a high depth-to-width ratio. This may be advantageous with regard to the introduction of a second layer into the washed-out regions of the first layer.
  • a photosensitive layer is applied to the first layer.
  • the thickness of the photosensitive layer may be in the range of 0.05 ⁇ m to 50 ⁇ m, advantageously in the range of 0.1 ⁇ m to 10 ⁇ m.
  • This can be a photoresist, as it is known from the semiconductor industry.
  • the photoresist may be a liquid applied by means of a coating system can. Alternatively, a dry thin photopolymer layer can be laminated.
  • the photoresist may be formed as a positive photoresist or as a negative photoresist.
  • the positive photoresist is a photoresist in which exposed areas are soluble in a developer. Accordingly, the negative photoresist is a photoresist in which unexposed areas are soluble in the developer. In this way, different multilayer bodies can be formed with a first layer.
  • the first layer may be formed as a metallic layer, which is removed in the unexposed areas by etching and then replaced by a second layer.
  • first the second layer can be applied over the entire surface and then removed in the exposed areas together with the remaining photoresist.
  • the first layer can now be galvanically reinforced. In this way, the partially transparent first layer can be transformed into an opaque first layer which is embedded in a transparent environment. Also in this case, the register-accurate assignment of the areas formed in this way is maintained.
  • the choice of suitable photoresist may depend on the type of first layer used, the wavelength of the light source, and the desired resolution. It can be advantageously provided that the light source emits UV light in the range of 300 nm to 400 nm.
  • the transmission of the layers arranged above the photoresist must be taken into account, in particular that of the first layer.
  • the etching characteristic is the dependence of the etching rate, ie the removal of the exposed photosensitive Layer understood per unit time of the applied by the exposure to the photosensitive layer energy density.
  • the photosensitive layer may be used as an etching mask for the first layer.
  • the first layer can thus be removed by the action of the etchant in the areas in which the photosensitive layer is removed by the development.
  • a photoactivatable layer can also be provided. Such a layer can be changed by exposure so that it forms an etchant in the exposed areas and in this way is able to detach the first layer.
  • an absorption layer is applied which, for example, absorbs laser light and is thereby thermally destroyed in the areas irradiated with laser light.
  • the absorption layer irradiated with laser light now forms the etching mask for removing the regions of the first layer that are permeable to the laser light.
  • the absorption layer can also be the first layer itself.
  • a relatively thick, appropriately structured aluminum layer absorbs over 90% of the incident laser light, which absorption may be wavelength dependent.
  • Particularly suitable for laser ablation are structures which have only a few diffraction orders for the incident laser light, ie in which, for example, the distance between adjacent valleys is smaller than the wavelength of the incident laser light.
  • a second layer is applied in the areas in which the first layer is removed. It may be, for example, a color layer or an electrochromic layer. In this way, colored patterns or display elements can be formed.
  • the second layer can be applied over the entire surface following the etching of the first layer. Thereafter, the remnants of the etching mask are removed, in which Areas in which the etching mask covers the first layer, with the etching mask at the same time the second layer is removed. In this way, the second layer is inserted register-accurate in the areas of the multilayer body, in which the first layer is removed.
  • Colored areas can also be formed by the method described below.
  • a multilayer body with a partial first layer of metal is produced, wherein the first layer is radiation-permeable in the first region, for example for UV radiation, and serves as a mask for a colored photoresist layer applied to the first layer.
  • the coloring of the photoresist layer can be effected by means of pigments or soluble dyes.
  • the photoresist by means of, for example, UV irradiation, is exposed through the first layer and, depending on whether it is a positive or a negative resist, cured or destroyed in the first regions. It can also positive and negative resist layers are applied side by side and exposed simultaneously.
  • the first layer serves as a mask and is preferably arranged in direct contact with the photoresist, so that a precise exposure can take place.
  • the photoresist As the photoresist is developed, eventually the uncured areas are washed out or the damaged areas are removed. Depending on the photoresist used, the developed colored photoresist is now either exactly in those areas where the first layer is transparent to UV radiation or impermeable. In order to increase the durability of the remaining photoresist layer patterned according to the first layer, residual areas are preferably post-cured after development.
  • the first layer used as a mask can be removed by a further etching step, so that the multi-layer body only has a high-resolution "color print" of photoresist for the viewer, but is otherwise transparent.
  • such high-resolution display elements can be formed.
  • a screening of the first layer is also possible to the effect that in addition to raster elements, which are lined with a reflective layer and - optionally different - diffractive diffraction structures are provided in addition to raster elements that represent transparent areas without reflection layer.
  • an amplitude or area modulated screening can be selected.
  • a combination of such reflective / diffractive regions and non-reflective, transparent - possibly also diffractive - regions can be achieved interesting optical effects. If such a raster image is arranged, for example, in a window of a value document, a transparent raster image can be recognized in transmitted light. In incident light, this raster image is visible only at a certain angle range in which no light is diffracted / reflected by the reflecting surfaces.
  • the colored imprint is visible, for example, in the form of the raster image, while it is not visible in another angular range due to the light reflected by the diffraction structures or other (macro) structures.
  • a plurality of reflectivity decreasing, expiring reflective areas are formed by a correspondingly selected screening.
  • regions of graded transparency can be formed by varying the depth-to-width ratio in the first layer, it is also contemplated be to remove the first layer in successive steps, so first to expose the areas in which the first layer is thinnest and there apply a second layer, then remove the next thicker formed areas of the first layer and there apply a third layer and repeating these steps until new layers are applied to all areas of the first high-aspect-to-width layer.
  • These may be optically hardenable layers which are not dissolved after hardening by an etchant.
  • the first layer may be formed from a dielectric having a first refractive index and the second layer may be formed from a dielectric having a second refractive index.
  • the second layer in the first layer can form a pattern or vice versa.
  • the pattern can be perceived in the incident light because of the different refraction of light of both layers.
  • Such a pattern is optically less conspicuous than a pattern formed by metallic layers and may therefore be preferred as a security feature for passports or other security documents. For example, it may appear to the viewer as a translucent pattern in green or red.
  • a thin-film layer system is distinguished in principle by an interference layer structure which generates viewing angle-dependent color shifts. It can be constructed as a reflective element, for example with a highly reflective metal layer, or as a transmissive element with a transparent optical separating layer to the individual layers.
  • the basic structure of a thin film layer system has an absorption layer (preferably with 30% to 65% transmission), a transparent spacer layer as a color change generating layer (eg ⁇ / 4 or ⁇ / 2 layer) and a metal layer as a reflective layer or an optical separation layer.
  • a thin film layer system from a sequence of high and low refractive layers.
  • Examples of conventional layer thicknesses of the individual layers of a thin-film layer system and examples of materials that are principally usable for the layers of a thin-film layer system are described, for example, in US Pat WO 01/03945 , Page 5 / line 30 to page 8 / line 5, disclosed.
  • the carrier layer is formed as a replication layer.
  • a fourth layer may be applied to the layers arranged on the replication layer in an areal density such that the transparency of the fourth layer in the first region is increased by the first relief structure over the transparency of the fourth layer in the second region, and the fourth layer is replaced by the fourth layer
  • the first relief structure is perforated so that the fourth layer is perforated in the first region or in the second region, but not in the second region or in the first region.
  • This fourth layer is thus formed as the first layer as a mask layer, so that the method steps described above can be repeated in order to form the multilayer body with further register perforated layers.
  • the sequence of material removal and the assignment to the structures in the first and in the second regions is selected so that regions are formed in which different diffractive structures are interlocked. It may, for example, a first Kinegram ® and a second act Kinegram ®, which have a different depth-to-width ratio and which are arranged in front of a background.
  • a To remove vapor deposited copper layer only in the area of the first Kinegram ® s then evaporate aluminum over the entire surface and remove by appropriate process control in the background areas. In this way, two registered partially metallized designs are formed, which differ in the viewer facing metal layer.
  • differences in the transmission properties of the above-mentioned regions can be utilized by polarization effects and / or wavelength dependencies and / or dependencies on the angle of incidence of the light.
  • the relief structures introduced into the replication layer can also be chosen so that they can serve to align liquid crystal (polymers).
  • the replication layer and / or the first layer can then be used as an orientation layer for liquid crystals.
  • orientation layers for example, groove-shaped structures are introduced, on which the liquid crystals align, before they are fixed in this position by crosslinking or otherwise in their orientation. It may be provided that the crosslinked liquid crystal layer forms the second layer.
  • the orientation layers can have regions in which the orientation direction of the structure changes continuously. If a region formed by means of such a diffractive structure is viewed through a polarizer with, for example, a rotating polarization direction, various easily recognizable security features, for example motion effects, can be generated on account of the linearly changing polarization direction of the region. It may also be provided that the orientation layer diffractive structures for the orientation of the liquid crystals, which are locally differently oriented so that the liquid crystals under polarized light considered information, such as a logo represent.
  • a multilayer body 100 is shown in which a functional layer 2, a replication layer 3, a metallic layer 3m and an adhesive layer 12 are arranged on a carrier film 1.
  • the functional layer 2 is a layer which primarily serves to increase the mechanical and chemical stability of the multilayer body, but which can also be designed in known manner to produce optical effects. However, it can also be provided to dispense with this layer and to arrange the replication layer 3 directly on the carrier film 1. It can further be provided to form the carrier film 1 itself as a replication layer.
  • the multilayer body 100 may be a section of a transfer film, for example a hot stamping foil, which may be applied to a substrate by means of the adhesive layer 12.
  • the adhesive layer 12 may be a hot-melt adhesive which melts when exposed to heat and permanently bonds the multilayer body to the surface of the substrate.
  • the carrier film 1 may be formed as a mechanically and thermally stable film made of PET.
  • areas with different structures can be molded by known methods.
  • the metallic layer 3m arranged on the replication layer 3 has demetallized areas 10d which coincide with the diffractive areas Structures 5 are arranged. In the regions 10d, the multilayer body 100 appears transparent or partially transparent.
  • Fig. 2 to 8 now show the manufacturing stages of the multi-layer body 100. Same elements as in Fig. 1 are designated with the same positions.
  • Fig. 2 shows a multi-layer body 100a, in which on the carrier film 1, the functional layer 2 and the replication layer 3 are arranged.
  • the replication layer 3 is structured in its surface by known methods such as thermal embossing.
  • the replication layer 3 can be a UV-curable replication lacquer, which is structured, for example, by a replication roller.
  • the structuring can also be produced by UV irradiation through an exposure mask.
  • the regions 4, 5 and 6 may be formed in the replication layer 3.
  • the region 4 may be, for example, the optically active portions of a hologram or a Kinegram ® s.
  • Fig. 3a now shows a multi-layer body 100b, which consists of the multi-layer body 100a in Fig. 2 is formed by the metallic layer 3 m is applied to the replicating layer 3 with uniform area density, for example by sputtering.
  • the metallic layer 3m has a layer thickness of several 10 nm in this exemplary embodiment.
  • the layer thickness of the metallic layer 3m may preferably be selected so that the regions 4 and 6 have a low transmission, for example between 10% and 0.001%, ie an optical density between 1 and 5, preferably between 1.5 and 3.
  • the optical Density of the metallic layer 3m, ie the negative decadic logarithm of the transmission, is therefore in the ranges 4 and 6 between 1 and 3.
  • it can be provided to form the metallic layer 3m with an optical density between 1.5 and 2.5.
  • the areas 4 and 6 therefore appear to the eye of the observer opaque or reflective.
  • the metallic layer 3m is formed in the region 5 with reduced optical density.
  • the dimensionless depth-to-width ratio is a characteristic feature of the surface enlargement, preferably of periodic structures. Such a structure forms “mountains” and “valleys” in a periodic sequence. Depth is here the distance between “mountain” and “valley”, as width the distance between two “mountains”. The higher the depth-to-width ratio, the steeper the "mountain flanks" and the thinner the metallic layer 3m deposited on the "mountain flanks".
  • FIG. 3b is now the responsible for the formation of transparency thickness change effect of the metal layer 3m shown in detail.
  • Fig. 3b shows in a schematic sectional view of an enlarged section IIIb Fig. 3a
  • the replication layer 3 has a relief structure 5h with a high depth-to-width ratio in the region 5, and a relief structure 6n with a depth-to-width ratio equal to zero in the region 6.
  • Arrows 3s denote the application direction of the metal layer 3m, which may be applied by sputtering as described above.
  • the metal layer 3m is formed in the region of the relief structure 6n with the nominal thickness t 0 and is formed in the region of the relief structure 5t with the thickness t, which is smaller than the nominal thickness t 0 .
  • the thickness t is to be understood as an average value, since the thickness t is formed as a function of the angle of inclination of the surface of the relief structure 5t relative to the horizontal. This angle of inclination can be mathematically described by the first derivation of the function of the relief structure 5t.
  • the metal layer 3m having the nominal thickness to is deposited as the amount of the inclination angle becomes larger is zero, the metal layer 3m is deposited with the thickness t, that is, smaller in thickness than the nominal thickness t 0 .
  • the transparency of the metal layer by means of relief structures which have a complex surface profile with elevations and depressions of different heights.
  • Such surface profiles may also be stochastic surface profiles.
  • the transparency is generally achieved when the average distance between adjacent structural elements is smaller than the average profile depth of the relief structure and adjacent structural elements less than 200 microns apart.
  • the average spacing between adjacent elevations is preferably chosen to be smaller than 30 ⁇ m, so that the relief structure 5t is a special diffractive relief structure.
  • silver and gold have a high maximum reflectance R max and require a relatively small depth to width ratio to form transparency.
  • aluminum also has a high maximum reflectance R max , it requires a higher depth-to-width ratio.
  • it may be provided to form the metal layer of silver or gold. But it can also be provided to form the metal layer of other metals or of metal alloys.
  • Table 2 now shows the calculation results obtained from strict diffraction calculations for relief structures formed as linear, sinusoidal gratings with a grid spacing of 350 nm with different depth-to-width ratios.
  • the degree of transparency or the reflectance of the metal layer 3m with the relief structure 5t is wavelength dependent. This effect is especially good for TE polarized light.
  • the degree of transparency decreases when the angle of incidence of the light differs from the normal angle of incidence, i. the degree of transparency decreases when the light is not incident vertically.
  • the metal layer 3m in the region of the relief structure 5t can be made transparent only in a limited incidence cone of the light. It can therefore be provided that the metal layer 3m is formed opaque when viewed obliquely, whereby this effect can be used for the selective formation of further layers.
  • Fig. 4 shows a multi-layer body 100c formed from the in Fig. 3a This may be an organic layer, which is applied in liquid form by conventional coating methods, such as gravure printing. It may also be provided that the photosensitive layer is vapor-deposited or laminated as a dry film.
  • the order can be provided over the entire area. However, it may also be an order in sub-areas, i. in areas located outside the above-mentioned areas 4 to 6. These may be areas that need only be relatively coarsely registered in the register for design, such as decorative pictorial representations, such as those shown in FIG. Random patterns or patterns formed from repeated images or texts.
  • Fig. 5 now shows a multilayer body 100d, which by the exposure of the multi-layer body 100c in Fig. 4 is formed through the carrier film 1 therethrough.
  • UV light 9 may be provided for exposure.
  • the ultraviolet irradiation in the photosensitive layer 8 produces highly exposed regions 10 extending from low-exposure regions 11 in their photosensitive layers differentiate chemical properties.
  • the areas 10 and 11 may differ, for example, by the solubility of the photosensitive layer arranged there in solvents. In this way, the photosensitive layer 8 can be "developed" after exposure to UV light, as described hereinafter Fig. 6 is shown.
  • the inventive method is always applicable if between In the regions with high depth-to-width ratio and the remaining areas, a difference in the optical density sufficient for the processing of the photosensitive layer is formed.
  • the metallic layer 3m so thin that the regions 5 appear transparent when viewed visually.
  • a relatively low total transmission of the vapor-deposited carrier film can be compensated by an increased exposure dose of the photosensitive layer 8.
  • the exposure of the photosensitive layer is typically provided in the near UV region, so that the visual viewing impression is not critical to the evaluation of the transmission.
  • a modified embodiment is shown in the multi-layer body 100d ⁇ in Fig. 5a is the in Fig. 5 shown photosensitive layer 8 is not provided. Instead, a replication layer 3 'is provided, which is a photosensitive wash mask. The multilayer body 100d 'is exposed from below, whereby in the heavily exposed areas 10, the replication layer 3' is changed so that it can be washed out.
  • Fig. 5b now shows a multi-layer body 100d ", the functional of the below in Fig. 8 corresponds to multi-layer body shown. However, not only the metallic layer 3m is removed in the regions 10, but also the replication layer 3 '. As a result, the transparency in these areas is opposite to that in Fig. 8 shown improved multilayer body and there are fewer manufacturing steps needed.
  • Fig. 6 shows the multi-layer body 100e formed of the multi-layer body 100d by the action of a solvent applied to the surface of the exposed photosensitive layer 8.
  • regions 10e are now formed in which the photosensitive layer 8 is removed. It is in the areas 10e to the in Fig. 3 described regions 5 with high depth-to-width ratio of the structural elements.
  • areas 11 the photosensitive layer 8 is obtained, because it is the in Fig. 3a described areas 4 and 6, which do not have the high depth-to-width ratio.
  • the photosensitive layer 8 is formed of a positive photoresist.
  • the exposed areas are soluble in the developer.
  • the unexposed areas are soluble in the developer, as described below in US Pat Fig. 9 to 12 illustrated embodiment.
  • the metallic layer 3m are removed in the areas 10e, not by the developed as an etching mask developed photosensitive layer are protected from the attack of the etchant.
  • the etchant may be, for example, an acid or alkali. In this way, the in Fig. 1 formed demetallillonen areas 10d.
  • the metallic layer 3m can be accurately demetallized without additional technological effort.
  • no complex precautions are to be taken, such as when applying an etching mask by mask exposure or pressure.
  • tolerances> 0.2 mm are common.
  • tolerances in the ⁇ m range up to the nm range are possible with the method according to the invention, i. Tolerances limited only by the replication method chosen to pattern the replication layer and the origination, i. the production of the stamp, are determined.
  • the metallic layer 3m may be provided to form the metallic layer 3m as a sequence of different metals and to use the differences in the physical and / or chemical properties of the metallic sublayers. For example, it may be provided to deposit aluminum as the first metallic sub-layer, which has a high reflection and therefore makes it possible to clearly emerge from the carrier side when the multilayer body is viewed. Chromium may be deposited as the second metallic sublayer, which has a high chemical resistance to various etchants. The etching process of the metallic layer 3m can now be provided in two stages.
  • chromium layer in the first stage, wherein the developed photosensitive layer 8 is provided as an etching mask and then etch in the second stage, the aluminum layer, wherein the chromium layer is now provided as an etching mask.
  • Such multilayer systems allow greater flexibility in selecting the materials used in the fabrication process for the photoresist, the photoresist etch, and the metallic layer.
  • Fig. 8 shows the optional possibility of the photosensitive layer after the in Fig. 7 remove the production step shown.
  • Fig. 8 is a Multilayer body 100g shown formed from the carrier film 1, the functional layer 2, the replication layer 3 and the structured metallic layer 3m.
  • the multi-layer body 100g can be inserted into the in Fig. 1 shown multilayer body 100 are transferred.
  • a second embodiment of a multi-layer body 100e is shown in which the photosensitive layer 8 is formed of a negative photoresist.
  • a multilayer body 100e has regions 10e' in which the exposed photosensitive layer 8 is removed by development.
  • the areas 10e ' are opaque areas of the metallic layer 3m (see items 4 and 6 in FIG Fig. 3a ).
  • regions 11 the exposed photosensitive layer 8 is not removed, these are transparent regions of the metallic layer 3m (see item 5 in FIG Fig. 3a ).
  • Fig. 10 is a multi-layer body 100f ⁇ shown by removal of the metallic layer 3m by an etching process from the multi-layer body 100e '( Fig. 9 ) is formed.
  • the developed photosensitive layer 8 is provided as an etching mask, which in the areas 10e '( Fig. 9 ) is removed, so that the etchant there decomposes the metallic layer 3m. In this way, regions 10d 'are formed which no longer have a metallic layer 3m.
  • a multi-layer body 100f is now formed from the multi-layer body 100f 'with a second layer 3p covering the exposed replication layer 3 in the regions 10d'.
  • the layer 3p may be a dielectric such as TiO 2 or ZnS.
  • Such a layer can, for example, be vapor-deposited surface-wide, wherein provision may be made to form this layer from a plurality of thin films arranged one above the other, which may differ, for example, in their refractive index and in this way in the apparent light color effects can train.
  • a thin film having color effects may be formed of three thin films with high-low-high-index characteristics. The color effect appears less conspicuous in comparison with metallic reflective layers, which is advantageous, for example, when forming patterns on passports or identcards in this way. For example, the patterns may appear to the viewer as transparent green or red.
  • Polymer layers may be formed, for example, as organic semiconductor layers. By combining with further layers, such an organic semiconductor device can be formed.
  • Fig. 12 now shows a multi-layer body 100f "'formed from the multi-layer body 100f" ( Fig. 11 ) after removal of the residual photosensitive layer.
  • This may be the well-known "lift-off” process, whereby the second layer 3p applied in the previous step is removed there again, so that adjacent areas with layers 3p and 3m are now on the multilayer body 100f "' formed, which may differ from each other, for example, in their optical refractive index and / or their electrical conductivity.
  • the regions 11 provided with the metallic layer 3m appear partially transparent because of the high depth-to-width ratio of the structural elements.
  • the metallic layer 3m can then also be removed chemically if the chemical properties of the layers 3m and 3p are appropriately different from one another.
  • a third layer which may be formed of a dielectric or a polymer.
  • a photosensitive layer which, after exposure and development, covers the multi-layer body 100f "'outside the areas 11.
  • the third layer can be applied as above and then the remainders of the In this way, for example, layers of organic semiconductor components can be structured in a particularly fine and register-accurate manner.
  • Fig. 13 now shows a multi-layer body 100 ', which consists of the multi-layer body 100f "( Fig. 12 ) by adding the in Fig. 1 illustrated adhesive layer 12 is formed.
  • the multilayer body 100 ' is like that in FIG Fig. 1 shown multilayer body 100 has been prepared by using the same replication layer 3. It is thus possible with the method according to the invention to produce differently configured multilayer bodies starting from a layout.
  • the method according to the invention can be continued without loss of quality in order to structure further layers in register.
  • further optical effects such as total reflection, polarization and spectral transmittance of the previously applied layers to form regions of different transparency, in order to form register-accurate exposure masks.
  • the Fig. 14a to 14d now show an embodiment, as of the in Fig. 12
  • the multilayer body 100f '"which is arranged in the regions 11 can be removed in exact register and can be replaced by a non-metallic layer 3p' in the register 3.
  • the layer 3p ' can be a dielectric layer whose optical refractive index is different from the 3p layer.
  • Fig. 14a shows a multi-layer body 100g, in which the metallic layer 3m is galvanically reinforced so that it is opaque.
  • the layer 3m is a metallic layer which is arranged in a region of the replication layer 3 with a high depth-to-width ratio and which was therefore formed before the galvanic reinforcement as a partially transparent metallic layer.
  • a photosensitive layer 8 covers the areas 3p and 3m disposed on the replication layer 3 (see also FIG Fig. 12 ).
  • Fig. 14b now shows a multi-layer body 100g ', by exposure and development of the photosensitive layer 8, as described above in Fig. 5 and 6 described, is obtained.
  • the areas 11 covered with the developed photosensitive layer 8 forms an etching mask, so that in the areas 10e where the photosensitive layer is removed after development, the metal layer can be removed by etching.
  • Fig. 14c shows after a further process step, a multi-layer body 100g ", on which now a layer 3p 'is applied over the entire surface, which may be formed as a dielectric.
  • the layer 3p' can also be used as a thin layer system of several successively applied layers be formed, whereby the layer 3p 'can form color change effects in a known manner.
  • the layer 3p ' may be made more or less transparent, so that the color-changing effect is little or not observed.
  • Fig. 14d Now, after removing the remnants of the photosensitive layer 8 and the portions of the layer 3p 'thereon, it shows a multilayer body 100g''obtained, for example, by adding an adhesive layer as described above Fig. 13 described, can be formed into a complete multi-layer body.
  • the multi-layer body 100g '" has on the replication layer 3 areas covered with the layer 3p and areas covered with the layer 3p'.
  • the layers 3p and / or 3p ' can be thin-layer systems, they can, as already described above, form color-change effects.
  • the layer 3p which in the embodiment in Fig. 14d covers the regions of the replication layer 3 with high depth-to-width ratio to form a thin film system.
  • filigree patterns such as guilloches, can be designed as security features that stand out discreetly from their surroundings and make it easy to recognize underlying images.
  • Fig. 14a to 14d described method can be used for applying further layers. Because the layers 3p and 3p 'are thin layers of the order of a few ⁇ m or nm, the structures introduced into the replication layer 3 are preserved, so that, for example, a further metallic layer can be applied in the regions of the replication layer 3 is formed transparent with high depth-to-width ratio. Thus, the further metallic layer can be used as a mask layer, which can be partially removed with the method steps described above or as temporary Intermediate layer may be provided to register one or more non-metallic layers register.
  • Fig. 15 Now shows in schematic diagram two etching characteristics of developers, which are intended for the formation of the etching mask of the photosensitive layer.
  • the etching characteristics represent the etching rate, ie the removal of material per unit of time, as a function of the energy density with which the photosensitive layer was exposed.
  • a first etching characteristic 150l is linear. Such an etching characteristic may be preferable when developing according to time.
  • a binary etch characteristic 150b may be preferred because only small differences in energy density are needed to form a significantly different etch rate and, thus, complete removal of the mask layer in the high-depth-to-width ratio regions Security.
  • a third bell-shaped etching characteristic 150g can be used to selectively remove structures depending on the transmissivity of the region.
  • Fig. 16 now shows an application example with a multi-layer body 160 according to the invention.
  • the multi-layer body 160 is applied as a security feature on an ID card 161. It covers all over the front side of the ID card 161, which in this embodiment is a plastic card with a base layer 162, containing a cardholder's photo 162p, alphanumeric characters 162a, for example personal information about the cardholder and / or an ID Number and a copy of the cardholder's own signature 162u. It can also be provided that the base layer 162 is formed as a layer of the multi-layer body 160.
  • the multilayer body 160 is as in FIG Fig. 1 illustrated with a metallic layer comprising a diffractive structure 164, specular structures 166g and 166s and transparent areas 165 in which the metallic layer is removed.
  • the diffractive structure is in the in Fig. 16 illustrated application example to a hologram, for example, a company logo representing.
  • the reflecting structures 166g cover areas of the base layer 162 which are to be protected from being tampered with, in the form of guilloches. Reflecting structures may also be formed as decorative elements, as in Fig. 16 shown as a star-shaped element 166s.

Claims (39)

  1. Procédé de production d'un corps multicouche (100, 100') avec une première couche (3m) partiellement façonnée,
    caractérisé en ce
    que lors du procédé dans une première zone (5) d'une couche de réplication (3) du corps multicouche (100, 100'), une première structure en relief diffractive est moulée avec un rapport profondeur - largeur de chaque élément structurel > 0,3 et la première couche (3m) est appliquée sur la couche de réplication (3) dans la première zone (5) et dans une deuxième zone (4, 6), dans laquelle la première structure en relief n'est pas moulée dans la couche de réplication (3), avec une densité superficielle constante par rapport à un plan défini par la couche de réplication (3), et en ce que la première couche (3m) est enlevée partiellement de manière déterminée par la première structure en relief, si bien que la première couche (3m) est enlevée dans la première zone (5), mais pas dans la deuxième zone (4, 6) ou dans la deuxième zone (4, 6), mais pas dans la première zone (5).
  2. Procédé selon la revendication 1,
    caractérisé en ce
    que la première couche (3m) est exposée dans un processus de corrosion aussi bien dans la première zone que dans la deuxième zone à un agent caustique, en particulier à un acide ou une lessive, et le temps d'action de l'agent caustique est sélectionné de sorte que la première couche (3m) est enlevée dans la première zone mais pas dans la deuxième zone.
  3. Procédé selon l'une quelconque des revendications 1 ou 2,
    caractérisé en ce
    que la première couche (3m) est appliquée sur la couche de réplication (3) en une densité superficielle, en ce qu'une transmission, en particulier une transparence de la première couche (3m) dans la première zone est augmentée par la première structure en relief par rapport à une transmission, en particulier une transparence de la première couche (3m) dans la deuxième zone.
  4. Procédé selon la revendication 3,
    caractérisé en ce
    que la couche de réplication (3) est réalisée sous la forme d'un masque de lavage photoactif, en ce que le masque de lavage est insolé à travers la première couche (3m) et activé dans la première zone, dans laquelle la transmission, en particulier la transparence de la première couche (3m) est augmentée par la première structure en relief et en ce que les zones activées du masque de lavage et les zones de la première couche (3m) agencées dessus sont enlevées dans un processus de lavage.
  5. Procédé selon la revendication 3,
    caractérisé en ce
    qu'une couche photoactivable est appliquée sur la première couche (3m), en ce que la couche photoactivable est insolée à travers la première couche (3m) et activée dans la première zone, dans laquelle la transmission, en particulier la transparence de la première couche (3m) est augmentée par la première structure en relief et en ce que la couche photoactivable activée forme un agent caustique pour la première couche (3m).
  6. Procédé selon la revendication 3,
    caractérisé en ce
    qu'une couche photosensible (8) est appliquée sur la première couche (3m), en ce que la couche photosensible (8) est insolée à travers la première couche (3m) et activée dans la première zone, dans laquelle la transmission, en particulier la transparence de la première couche (3m) est augmentée par la première structure en relief, en ce que la couche photosensible (8) est développée de sorte que la couche photosensible (8) développée forme un masque caustique pour la première couche (3m) et en ce que dans un processus de corrosion, les zones de la première couche (3m) non recouvertes par le masque caustique sont enlevées.
  7. Procédé selon la revendication 6,
    caractérisé en ce
    que la couche photosensible (8) est réalisée à partir d'un photorésist.
  8. Procédé selon la revendication 7,
    caractérisé en ce
    que le photorésist est réalisé sous forme de photorésist positif.
  9. Procédé selon la revendication 7,
    caractérisé en ce
    que le photorésist est réalisé sous forme de photorésist négatif.
  10. Procédé selon la revendication 6,
    caractérisé en ce
    que la couche photosensible (8) est réalisée sous forme de photopolymère.
  11. Procédé selon la revendication 3,
    caractérisé en ce
    qu'une couche d'absorption est appliquée sur la première couche (3m), en ce que la couche d'absorption est irradiée à travers la première couche (3m) avec de la lumière laser et enlevée de manière thermique dans la première zone (5) de la première couche (3m), dans laquelle la transmission, en particulier la transparence de la première couche (3m) est augmentée par la première structure en relief, et en ce que la couche d'absorption partiellement enlevée forme un masque caustique pour la première couche (3m).
  12. Procédé selon l'une quelconque des revendications 6 à 11,
    caractérisé en ce
    que les restes des masques caustiques sont enlevés.
  13. Procédé selon l'une quelconque des revendications précédentes,
    caractérisé en ce
    qu'une deuxième couche (3p) est introduite dans les zones, dans lesquelles la première couche (3m) a été enlevée.
  14. Procédé selon la revendication 1 et 13,
    caractérisé en ce
    que la première couche (3m) partiellement façonnée est enlevée et remplacée par une troisième couche (3p') partiellement façonnée.
  15. Procédé selon l'une quelconque des revendications précédentes,
    caractérisé en ce
    que la première couche (3m) et/ou la deuxième couche (3p) et/ou la troisième couche (3p') sont renforcées par voie galvanique.
  16. Procédé selon l'une quelconque des revendications précédentes,
    caractérisé en ce
    qu'une quatrième couche est appliquée sur les couches disposées sur la couche de réplication (3) en une densité superficielle par rapport au plan défini par la couche de réplication (3), en ce qu'une transmission, en particulier une transparence de la quatrième couche dans la première zone est augmentée par la première structure en relief par rapport à une transmission, en particulier une transparence de la quatrième couche dans la deuxième zone et en ce que la quatrième couche est enlevée partiellement de façon déterminée par la première structure en relief, si bien que la quatrième couche est enlevée dans la première zone, mais pas dans la deuxième zone ou dans la deuxième zone, mais pas dans la première zone.
  17. Corps multicouche comportant une couche de réplication (3) et au moins une première couche (3m) disposée partiellement sur la couche de réplication (3),
    caractérisé en ce
    que dans une première zone (5) de la couche de réplication (3), une première structure en relief diffractive est moulée avec un rapport profondeur - largeur de chaque élément structurel > 0,3, en ce que dans une deuxième zone (4, 6) de la couche de réplication (3), la première structure en relief n'est pas moulée dans la couche de réplication (3), et en ce que la disposition partielle de la première couche (3m) est déterminée par la première structure en relief, si bien que la première couche (3m) est enlevée dans la première zone (5), mais pas dans la deuxième zone (4, 6) ou dans la deuxième zone (4, 6), mais pas dans la première zone (5).
  18. Corps multicouche selon la revendication 17,
    caractérisé en ce
    qu'une deuxième couche (3p) est disposée dans les zones de la couche de réplication (3), dans lesquelles il n'y a pas de première couche (3m).
  19. Corps multicouche selon l'une quelconque des revendications 17 ou 18,
    caractérisé en ce
    que la première couche (3m, 3p') et/ou la deuxième couche (3p) est/sont réalisée/s à partir d'un métal ou d'un alliage métallique.
  20. Corps multicouche selon l'une quelconque des revendications 17 à 19,
    caractérisé en ce que
    la première couche (3m) et/ou la deuxième couche (3p) est /sont réalisée/s à partir d'un diéletrique, en particulier à partir de TiO2 ou ZnS.
  21. Corps multicouche selon la revendication 20,
    caractérisé en ce
    que la première couche (3m) et la deuxième couche (3p) sont réalisées avec différents indices de réfraction.
  22. Corps multicouche selon l'une quelconque des revendications 17 à 21,
    caractérisé en ce
    que la première couche (3m) et/ou la deuxième couche (3p) est/sont réalisée/s à partir d'un polymère.
  23. Corps multicouche selon l'une quelconque des revendications 17 à 22,
    caractérisé en ce
    que la première couche (3m) et/ou la deuxième couche (3p) se composent d'un matériau à cristaux liquides, en particulier d'un matériau à cristaux liquides cholestérique.
  24. Corps multicouche selon l'une quelconque des revendications 17 à 23,
    caractérisé en ce
    que la première couche (3m) et/ou la deuxième couche (3p) est/sont réalisée/s sous forme de couche de couleur.
  25. Corps multicouche selon l'une quelconque des revendications 17 à 24,
    caractérisé en ce
    que la première couche (3m) et/ou la deuxième couche (3p) est/sont réalisée/s à partir de plusieurs couches partielles.
  26. Corps multicouche selon la revendication 25,
    caractérisé en ce
    que les couches partielles forment un système de couches à film mince.
  27. Corps multicouche selon l'une quelconque des revendications 25 ou 26,
    caractérisé en ce
    que les couches partielles sont formées à partir de différents matériaux.
  28. Corps multicouche selon la revendication 27,
    caractérisé en ce
    que les couches partielles sont réalisées à partir de différents métaux et/ou de différents alliages métalliques.
  29. Corps multicouche selon l'une quelconque des revendications 25 à 28,
    caractérisé en ce
    qu'au moins une des couches partielles est enlevée par zones.
  30. Corps multicouche selon l'une quelconque des revendications 17 à 29,
    caractérisé en ce
    que la première couche (3m) et/ou la deuxième couche (3p) forme/forment un motif optique.
  31. Corps multicouche selon l'une quelconque des revendications 17 à 30,
    caractérisé en ce
    que la première couche (3m) et/ou la deuxième couche (3p) forme/forment un masque d'exposition.
  32. Corps multicouche selon l'une quelconque des revendications 17 à 31,
    caractérisé en ce
    que la première couche (3m) et/ou la deuxième couche (3p) forme/forment un masque d'image.
  33. Corps multicouche selon l'une quelconque des revendications 17 à 32,
    caractérisé en ce
    que la première couche (3m) et/ou la deuxième couche (3p) forme/forment une image tramée.
  34. Corps multicouche selon l'une quelconque des revendications 17 à 33,
    caractérisé en ce
    que dans la deuxième zone, une structure en relief est réalisée avec un rapport profondeur - largeur plus faible, de préférence en forme de structure diffractive, par exemple comme hologramme, Kinegram® ou réseau de diffraction.
  35. Corps multicouche selon l'une quelconque des revendications 17 à 34,
    caractérisé en ce
    que la première couche (3m) et/ou la deuxième couche (3p) forme/forment un composant électronique, en particulier une antenne, un condensateur, une bobine ou un semi-conducteur organique.
  36. Corps multicouche selon l'une quelconque des revendications 17 à 35,
    caractérisé en ce
    que la première couche (3m) et/ou la deuxième couche (3p) forme/forment un film de blindage de préférence partiellement transparent contre le rayonnement électromagnétique.
  37. Corps multicouche selon l'une quelconque des revendications 17 à 36,
    caractérisé en ce
    que la première couche (3m) et/ou la deuxième couche (3p) forment une puce d'analyse de liquides et/ou de gaz ou une partie d'une telle puce.
  38. Corps multicouche selon l'une quelconque des revendications 17 à 37,
    caractérisé en ce
    que la couche de réplication (3) et/ou la première couche (3m) forment une couche d'orientation pour l'orientation des cristaux liquides, et en ce que la deuxième couche est formée d'une couche en un matériau à cristaux liquides.
  39. Corps multicouche selon la revendication 38,
    caractérisé en ce
    que la couche d'orientation présente des structures diffractives pour l'orientation des cristaux liquides, qui sont orientés différemment au niveau local, de sorte que les cristaux liquides observés sous une lumière polarisée représentent une information, telle que par exemple un logo.
EP06706766A 2005-02-10 2006-02-09 Procede de production d'un corps multicouche et corps multicouche correspondant Active EP1846253B1 (fr)

Priority Applications (2)

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PL06706766T PL1846253T3 (pl) 2005-02-10 2006-02-09 Sposób wytwarzania korpusu wielowarstwowego oraz korpus wielowarstwowy
SI200630134T SI1846253T1 (sl) 2005-02-10 2006-02-09 Postopek za pripravo večslojnega telesa kot tudivečslojno telo

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DE102005006231A DE102005006231B4 (de) 2005-02-10 2005-02-10 Verfahren zur Herstellung eines Mehrschichtkörpers
PCT/EP2006/001126 WO2006084685A2 (fr) 2005-02-10 2006-02-09 Procede de production d'un corps multicouche et corps multicouche correspondant

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JP (1) JP5068182B2 (fr)
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AT (1) ATE408524T1 (fr)
CA (1) CA2596996C (fr)
DE (2) DE102005006231B4 (fr)
DK (1) DK1846253T3 (fr)
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PL (1) PL1846253T3 (fr)
PT (1) PT1846253E (fr)
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US10189295B2 (en) 2014-05-06 2019-01-29 Giesecke + Devrient Currency Technology Gmbh Layer element
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DE102021000879A1 (de) 2021-02-19 2022-08-25 Giesecke+Devrient Currency Technology Gmbh Verfahren zur Herstellung eines Sicherheitselements mit Mikroabbildungselementen
WO2022174982A1 (fr) 2021-02-19 2022-08-25 Giesecke+Devrient Currency Technology Gmbh Procédé de production d'un élément de sécurité comprenant des éléments de micro-imagerie

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CN100491134C (zh) 2009-05-27
DE502006001597D1 (de) 2008-10-30
WO2006084685A2 (fr) 2006-08-17
CN101166633A (zh) 2008-04-23
PT1846253E (pt) 2008-11-18
CA2596996A1 (fr) 2006-08-17
SI1846253T1 (sl) 2009-02-28
RU2007133604A (ru) 2009-03-20
US20080310025A1 (en) 2008-12-18
US7821716B2 (en) 2010-10-26
ATE408524T1 (de) 2008-10-15
EP1846253A2 (fr) 2007-10-24
RU2374082C2 (ru) 2009-11-27
CA2596996C (fr) 2013-09-17
JP2008530600A (ja) 2008-08-07
DE102005006231B4 (de) 2007-09-20
DK1846253T3 (da) 2009-01-19
DE102005006231A1 (de) 2006-08-24
JP5068182B2 (ja) 2012-11-07
PL1846253T3 (pl) 2009-03-31
WO2006084685A3 (fr) 2006-09-28

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