Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
  • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
  • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
  • B42D25/40—Manufacture
  • B42D25/405—Marking
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
  • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
  • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
  • B42D25/30—Identification or security features, e.g. for preventing forgery
  • B42D25/328—Diffraction gratings; Holograms
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10S359/00—Optical: systems and elements
  • Y10S359/90—Methods

Definitions

• the invention relates to a method for producing a multilayer body having a partially formed first layer and to a multilayer body having a replication layer and a first layer partially arranged on the replication layer.
• Such components are suitable as optical components or as lens systems in the field of telecommunications.
• EP 0 537 439 B2 describes methods for producing a security element with filigree patterns.
• the patterns are formed from diffractive structures covered with a metal layer and surrounded by transparent areas in which the metal layer is removed. It is envisaged to introduce the outline of the filigree pattern as a recess in a metal-coated carrier material, while at the same time to provide the bottom of the wells with the diffractive structures and then to expire the wells with a protective lacquer. Excess protective varnish should be removed by means of a doctor blade. After the protective lacquer has been applied, it is intended to remove the metal layer in the unprotected transparent regions by etching.
• the depressions are about 1 ⁇ m to 5 ⁇ m, while the diffractive structures can have height differences of more than 1 ⁇ m. With finer structures, this method fails, which requires adjustment steps for register-accurate alignment during repetition steps. In addition, flat contiguous metallic areas are difficult to realize, since the "spacers" are missing for stripping the protective lacquer.
• Object of the present invention is to provide a multilayer body and a method for producing a multi-layer body, in which the register with high accuracy and cost, a layer can be applied, which has areas in which the layer is not present.
• the object is achieved by a method for producing a
• a multilayer body having a partially formed first layer in which it is provided that in a first region of a replication layer of the multilayer body a diffractive first relief structure having a high depth-to-width ratio of the individual structure elements, in particular with a depth-to-width ratio Ratio of> 0.3, and the first layer is applied to the replication layer in the first region and in a second region in which the first relief structure is not formed in the replication layer, with a constant surface density relative to a plane spanned by the replication layer is determined, and that the first layer determined by the first relief structure is partially removed, so that the first layer in the first region, but not in the second region, or in the second region, but not in the first region is removed.
• the invention is based on the finding that physical properties of the first layer applied to the replication layer in this region, such as transmission properties, in particular transparency, or effective thickness of the first layer, are influenced by the special diffractive relief structure in the first region, so that the physical properties of the first layer are affected Properties of the first layer in the first and second range differ.
• the first layer is now used as a kind of masking layer for the partial removal of the first layer itself or for the partial removal of another layer. This is compared with those applied by conventional methods
• Mask layers achieved the advantage that this mask layer is aligned register-accurate without additional adjustment.
• the first layer is an integral part of the structure molded in the replication layer. A lateral displacement between the first relief structure and regions of the first layer with the same physical properties does not occur.
• the first layer is a layer which preferably fulfills a double function. On the one hand it provides the function of a high-precision mask layer, for example a high-precision exposure mask for the manufacturing process, on the other hand (at the end of the manufacturing process) represents a highly accurately positioned functional layer, such as an OVD layer or a conductor or a functional layer of an electrical component, such as one organic semiconductor device.
• a high-precision mask layer for example a high-precision exposure mask for the manufacturing process
• a highly accurately positioned functional layer such as an OVD layer or a conductor or a functional layer of an electrical component, such as one organic semiconductor device.
• lines and / or dots with high resolution, for example with a width or a diameter of less than 5 ⁇ m, in particular up to approximately 200 nm.
• resolutions in the range from approximately 0.5 ⁇ m to 5 ⁇ m, in particular in the Range of about 1 micron, generated.
• line widths smaller than 10 microns can be realized only with great effort.
• an Al layer is vapor-deposited as the first layer, which is opaque in a second, planar region or has an optical density of 6 and forms a metallic mirror there, and if the Al layer is etched accordingly, then after the etching process in FIG second region an opaque layer with still specularly reflective properties and with an optical density of 2 achievable, while the Al layer in adjacent first areas, which are provided with a first relief structure with a high depth-to-width ratio, already was completely etched.
• etching medium there may be a depletion of etching medium, respectively accumulation of the etching products, in the boundary layer to the first layer, whereby the speed of the etching is slowed down.
• a forced mixing of the etching medium optionally by forming a suitable flow or an ultrasonic excitation, improves the etching behavior.
• the last nanometers of the first layer are preferably removed by means of a wiping process by passing the multilayer body over a roller covered with a fine cloth. The cloth wipes off the remains of the first layer without damaging the multi-layer body.
• Factors influencing laser ablation are the design of the relief structures (period, depth, orientation, profile), the wavelength, the polarization and the angle of incidence of the incident laser radiation, the duration of the exposure (time-dependent power) and the local dose of the laser radiation Properties and the absorption behavior of the first layer, as well as a possible over- and underfilling of the first layer with further layers.
• a focused on a point or a line laser flat radiators can be used, which emit a short-term, controlled pulse, such as flash lamps.
• the multilayer bodies according to the invention may have further regions which are formed by conventional methods, for example to form decorative color effects which extend over regions or over the entire multilayer body.
• the formation of the first layer is not bound to any specific material.
• the first layer should advantageously be made opaque outside transparent regions, unless the above-described time-controlled etching process for setting a defined transmission is provided.
• Transparent materials can be colored to make them opaque.
• it may be provided to form the first layer from a metal or a metal alloy.
• the opacity of the metallic layer can be adjusted by the amount applied per unit area, by the type of metal and by the relief structure in the first area.
• Metallic first layers can be re-reinforced by electroplating, for example, to increase the reflectivity or conductivity of the remaining layer.
• connection lines for electronic circuits or electronic components, such as antennas and coils with high electrical quality can be formed.
• the first layer of partial layers with different metals or metal alloys in layers in order to utilize the different physical and / or chemical properties of the partial layers for the formation of the method steps and / or the properties of the end product.
• the first layer of aluminum and chromium may be constructed, wherein the highly reflective aluminum can improve the optical properties of the final product and allows the more chemically stable chromium advantageous embodiment of the etching processes.
• the replication layer is formed as a photoactive washing mask, which is exposed and activated through the first layer, and that the exposed areas of the washing mask and disposed there on the washing mask areas of the first layer are removed.
• a photosensitive layer is applied to the first layer.
• the thickness of the photosensitive layer may be in the range of 0.05 .mu.m to 50 .mu.m, advantageously in
• This can be a photoresist, as it is known from the semiconductor industry.
• the photoresist may be a liquid applied by means of a coating system can.
• a dry thin photopolymer layer can be laminated.
• the first layer may be formed as a metallic layer, which is removed in the unexposed areas by etching and then replaced by a second layer.
• first the second layer can be applied over the entire surface and then removed in the exposed areas together with the remaining photoresist.
• the first layer can now be galvanically reinforced. In this way, the partially transparent first layer can be transformed into an opaque first layer which is embedded in a transparent environment. Also in this case, the register-accurate assignment of the areas formed in this way is maintained.
• the choice of suitable photoresist may depend on the type of first layer used, the wavelength of the light source, and the desired resolution. It can be advantageously provided that the light source emits UV light in the range of 300 nm to 400 nm.
• the transmission of the layers arranged above the photoresist must be taken into account, in particular that of the first layer.
• the etching characteristic is the dependence of the etching rate, ie the removal of the exposed photosensitive Layer understood per unit time of the applied by the exposure to the photosensitive layer energy density.
• the photosensitive layer may be used as an etching mask for the first layer.
• the first layer can thus be removed by the action of the etchant in the areas in which the photosensitive layer is removed by the development.
• a photoactivatable layer can also be provided. Such a layer can be changed by exposure so that it forms an etchant in the exposed areas and in this way is able to detach the first layer.
• the second layer can be applied over the entire surface following the etching of the first layer. Thereafter, the remnants of the etching mask are removed, in which Areas in which the etching mask covers the first layer, with the etching mask at the same time the second layer is removed. In this way, the second layer is inserted register-accurate in the areas of the multilayer body, in which the first layer is removed.
• the colored imprint is visible, for example, in the form of the raster image, while it is not visible in another angular range due to the light reflected by the diffraction structures or other (macro) structures.
• a plurality of reflectivity decreasing, expiring reflective areas are formed by a correspondingly selected screening.
• Examples of conventional layer thicknesses of the individual layers of a thin-film layer system and examples of materials that are principally usable for the layers of a thin-film layer system are disclosed, for example, in WO 01/03945, page 5 / line 30 to page 8 / line 5.
• the carrier layer is formed as a replication layer.
• the sequence of material removal and the assignment to the structures in the first and in the second regions is selected so that regions are formed in which different diffractive structures are interlocked. It may, for example, be a first Kinegram® and a second Kinegram® having a different depth-to-width ratio and arranged in front of a background.
• a To remove vapor deposited copper layer only in the area of the first Kinegram® then evaporate aluminum over the entire surface and remove by appropriate process control in the background areas. In this way, two registered partially metallized designs are formed, which differ in the viewer facing metal layer.
• differences in the transmission properties of the above-mentioned regions can be utilized by polarization effects and / or wavelength dependencies and / or dependencies on the angle of incidence of the light.
• the relief structures introduced into the replication layer can also be chosen so that they can serve to align liquid crystal (polymers).
• the replication layer and / or the first layer can then be used as an orientation layer for liquid crystals.
• groove-shaped structures are introduced, for example, where the
• the orientation layers may have areas in which the
• Orientation direction of the structure constantly changes. If a region formed by means of such a diffractive structure is viewed through a polarizer with, for example, a rotating polarization direction, various easily recognizable security features, for example motion effects, can be generated on account of the linearly changing polarization direction of the region. It may also be provided that the orientation layer diffractive structures for the orientation of the liquid crystals, which are locally differently oriented so that the liquid crystals under polarized light considered information, such as a logo represent.
• Fig. 2 is a schematic sectional view of the first manufacturing stage of
• FIG. 3a is a schematic sectional view of the second manufacturing stage of the multi-layer body in FIG. 1;
• Fig. 4 is a schematic sectional view of the third manufacturing stage of
• Fig. 5 is a schematic sectional view of the fourth manufacturing stage of
• 5a is a schematic sectional view of a modified embodiment of the manufacturing stage shown in FIG. 5;
• Fig. 6 is a schematic sectional view of the fifth manufacturing stage of
• FIG. 10 is a schematic sectional view of the sixth manufacturing stage of a second embodiment of the multilayer body in FIG.
• FIG. 11 is a schematic sectional view of the seventh manufacturing stage of a second embodiment of the multilayer body in FIG. 1;
• FIG. 12 is a schematic sectional view of the eighth manufacturing stage of a second embodiment of the multilayer body in FIG.
• Fig. 13 is a schematic sectional view of a second
• FIG. 14a shows schematic sectional representations of the production steps of a to 14d third embodiment of a multilayer body according to the invention
• Fig. 15 is a schematic diagram of etching rates of a photosensitive
• layer Fig. 16 is an application example of an inventive
• Multi-layer body Multi-layer body.
• FIG. 1 shows a multilayer body 10O in which a functional layer 2, a replication layer 3, a metallic layer 3m and an adhesive layer 12 are arranged on a carrier film 1.
• the functional layer 2 is a layer which primarily serves to increase the mechanical and chemical stability of the multilayer body, but which can also be designed in known manner to produce optical effects. However, it can also be provided to dispense with this layer and to arrange the replication layer 3 directly on the carrier film 1. It can further be provided to form the carrier film 1 itself as a replication layer.
• the multilayer body 100 may be a section of a transfer film, for example a hot stamping foil, which may be applied to a substrate by means of the adhesive layer 12.
• the adhesive layer 12 may be a hot-melt adhesive which melts when exposed to heat and permanently bonds the multilayer body to the surface of the substrate.
• the carrier film 1 may be formed as a mechanically and thermally stable film made of PET.
• areas with different structures can be molded by known methods.
• the metallic layer 3m arranged on the replication layer 3 has demetallized areas 10d which coincide with the diffractive areas Structures 5 are arranged. In the regions 10d, the multilayer body 100 appears transparent or partially transparent.
• FIGS. 2 to 8 now show the production stages of the multilayer body 100.
• the same elements as in FIG. 1 are designated by the same positions.
• FIG. 2 shows a multilayer body 100a, in which the functional layer 2 and the replication layer 3 are arranged on the carrier foil 1.
• the replication layer 3 is structured in its surface by known methods such as thermal embossing.
• the replication layer 3 can be a UV-curable replication lacquer, which is structured, for example, by a replication roller.
• the structuring can also be produced by UV irradiation through an exposure mask.
• the regions 4, 5 and 6 may be formed in the replication layer 3.
• the region 4 may be, for example, the optically active portions of a hologram or a Kinegram ® s action.
• the metallic layer 3m has a layer thickness of several 10 nm in this exemplary embodiment.
• the layer thickness of the metallic layer 3m may preferably be chosen such that the regions 4 and 6 have a low transmission, for example between 10% and 0.001%, i.e. between 10% and 0.001%. an optical density between 1 and 5, preferably between 1.5 and 3.
• the optical density of the metallic layer 3m i. the negative decadic logarithm of the transmission, therefore, lies in the ranges 4 and 6 between 1 and 3. It may be preferable to form the metallic layer 3m with an optical density between 1, 5 and 2.5.
• the areas 4 and 6 therefore appear to the eye of the observer opaque or reflective.
• the metallic layer 3m is formed in the region 5 with reduced optical density.
• the dimensionless depth-to-width ratio is a characteristic feature of the surface enlargement, preferably of periodic structures. Such a structure forms "mountains” and “valleys” in a periodic sequence.
• Depth is here the distance between “mountain” and “valley”, as width the distance between two “mountains.”
• This effect is also observed when it is discretely distributed "valleys", which can be arranged at a distance to each other many times greater than the depth of the " In such a case, the depth of the "valley” should be related to the width of the "valley” in order to correctly describe the geometry of the "valley” by specifying the depth-to-width ratio.
• FIG. 3b now shows in detail the change in thickness effect of the metal layer 3m responsible for the formation of the transparency.
• FIG. 3b shows a schematic sectional view of an enlarged detail IMb from FIG. 3a.
• the replication layer 3 has in the region 5 a
• Arrows 3s denote the application direction of the metal layer 3m, which may be applied by sputtering as described above.
• the metal layer 3m is formed in the region of the relief structure 6n with the nominal thickness t 0 and is formed in the region of the relief structure 5t with the thickness t smaller than the nominal thickness t0.
• the thickness t is to be understood as an average value, since the thickness t is formed as a function of the angle of inclination of the surface of the relief structure 5t relative to the horizontal. This angle of inclination can be mathematically described by the first derivation of the function of the relief structure 5t.
• the degree of transparency is dependent on the polarization of the radiated light, except from the depth-to-width ratio.
• the degree of transparency or the degree of reflection of the metal layer 3m with the relief structure 5t is wavelength-dependent. This effect is especially good for TE polarized light.
• the degree of transparency decreases when the angle of incidence of the light differs from the normal angle of incidence, i. of the
• the degree of transparency decreases when the light is not incident vertically.
• the metal layer 3m in the region of the relief structure 5t can be made transparent only in a limited incidence cone of the light. It can therefore be provided that the metal layer 3m is formed opaque when viewed obliquely, whereby this effect can be used for the selective formation of further layers.
• UV light 9 may be provided.
• the ultraviolet irradiation in the photosensitive layer 8 produces highly exposed regions 10 extending from low-exposure regions 11 in their photosensitive layers differentiate chemical properties.
• the areas 10 and 11 may differ, for example, by the solubility of the photosensitive layer arranged there in solvents. In this way, the photosensitive layer 8 can be "developed" after exposure to UV light, as shown further in FIG.
• the inventive method is always applicable if between In the regions with high depth-to-width ratio and the remaining areas, a difference in the optical density sufficient for the processing of the photosensitive layer is formed.
• the metallic layer 3m so thin that the regions 5 appear transparent when viewed visually.
• a relatively low total transmission of the vapor-deposited carrier film can be compensated by an increased exposure dose of the photosensitive layer 8.
• the exposure of the photosensitive layer is typically provided in the near UV region, so that the visual viewing impression is not critical to the evaluation of the transmission.
• FIG. 5a and 5b show a modified exemplary embodiment.
• the photosensitive layer 8 shown in Fig. 5 is not provided. Instead, a replication layer 3 'is provided, which is a photosensitive wash mask.
• the multilayer body 100d ' is exposed from below, whereby in the heavily exposed areas 10, the replication layer 3' is changed so that it can be washed out.
• Areas 10 not only removed the metallic layer 3m, but also the replication layer 3 '. As a result, the transparency in these areas is improved compared to the multilayer body shown in FIG. 8 and fewer production steps are required.
• FIG. 6 shows the multilayer body 100e formed of the multilayer body 100d by the action of a solvent applied on the surface of the exposed photosensitive layer 8.
• regions 10e are now formed in which the photosensitive layer 8 is removed.
• the regions 10e are the areas 5 described in FIG. 3 with a high depth-to-width ratio of the structural elements.
• regions 11 the photosensitive layer 8 is obtained because these are the regions 4 and 6 described in Fig. 3a, which do not have the high depth to width ratio.
• the photosensitive layer 8 is formed of a positive photoresist.
• the exposed areas are soluble in the developer.
• the unexposed areas are soluble in the developer, as explained later in the embodiment shown in Figs. 9-12.
• the metallic layer 3m may be removed in the regions 10e not covered by the developed as an etching mask developed photosensitive layer are protected from the attack of the etchant.
• the etchant may be, for example, an acid or alkali. In this way, the demetallized areas 10d shown in Fig. 1 are formed.
• the metallic layer 3m can be accurately demetallized without additional technological effort.
• no complex precautions are to be taken, such as when applying an etching mask by mask exposure or pressure.
• tolerances> 0.2 mm are common.
• tolerances in the ⁇ m range up to the nm range are possible with the method according to the invention, i. Tolerances limited only by the replication method chosen to pattern the replication layer and the origination, i. the production of the stamp, are determined.
• the metallic layer 3m may be provided to form the metallic layer 3m as a sequence of different metals and to use the differences in the physical and / or chemical properties of the metallic sublayers. For example, it may be provided to deposit aluminum as the first metallic sub-layer, which has a high reflection and therefore makes it possible to clearly emerge from the carrier side when the multilayer body is viewed. Chromium may be deposited as the second metallic sublayer, which has a high chemical resistance to various etchants. The etching process of the metallic layer 3m can now be provided in two stages.
• chromium layer in the first stage, wherein the developed photosensitive layer 8 is provided as an etching mask and then etch in the second stage, the aluminum layer, wherein the chromium layer is now provided as an etching mask.
• Such multilayer systems allow greater flexibility in selecting the materials used in the fabrication process for the photoresist, the photoresist etch, and the metallic layer.
• Fig. 8 shows the optional possibility of removing the photosensitive layer after the manufacturing step shown in Fig. 7.
• Fig. 8 is a Multilayer body 100g shown formed from the carrier film 1, the functional layer 2, the replication layer 3 and the structured metallic layer 3m.
• Fig. 10 shows a multilayer body 100f formed by removing the metallic layer 3m by an etching process from the multilayer body 100e '(Fig. 9).
• the developed photosensitive layer 8 is therefor provided as an etching mask, which is removed in the regions 10e '(FIG. 9), so that the etchant there decomposes the metallic layer 3m.
• regions 10d ' are formed which no longer have a metallic layer 3m.
• Polymer layers may be formed, for example, as organic semiconductor layers. By combining with further layers, such an organic semiconductor device can be formed.
• Fig. 12 now shows a multi-layer body 100f "formed of the multi-layer body 100f" (Fig. 11) after removal of the residual photosensitive layer.
• This may be the well-known "lift-off” process, whereby the second layer 3p applied in the previous step is removed there again, so that adjacent areas with layers 3p and 3m are now formed on the multilayer body 100f " , which may differ from each other, for example, in their optical refractive index and / or their electrical conductivity.
• the regions 11 provided with the metallic layer 3m appear partially transparent because of the high depth-to-width ratio of the structural elements.
• the metallic layer 3m can then also be removed chemically if the chemical properties of the layers 3m and 3p are appropriately different from one another.
• a third layer which may be formed from a dielectric or a polymer, onto the multilayer body 10Of "(FIG. 12) .
• a photosensitive layer which, after exposure and development, covers the multi-layer body 100f "outside the areas 11.
• the third layer can be applied as above and then the remnants of the photosensitive layer are removed and thus at the same time in these areas, the third layer.
• layers of organic semiconductor components can be structured in a particularly fine and register-accurate manner.
• Fig. 13 now shows a multilayer body 100 'formed from the multilayer body 100f "(Fig. 12) by adding the adhesive layer 12 shown in Fig. 1.
• the multilayer body 100' is like the multilayer body 100 shown in Fig. 1 Using the same replication layer 3. It is thus possible with the inventive method to produce starting from a layout differently shaped multi-layer body.
• a photosensitive layer 8 covers the areas 3p and 3m disposed on the replication layer 3 (see also Fig. 12).
• Fig. 14b now shows a multilayer body 100g 'obtained by exposure and development of the photosensitive layer 8 as described above in Figs. 5 and 6.
• the regions 11 covered with the developed photosensitive layer e forms an etching mask, so that in the regions 10e where the photosensitive layer is removed after development, the metal layer can be removed by etching.
• Fig. 14d now shows, after removing the remnants of the photosensitive layer 8 and the areas of the layer 3p 'disposed thereon, a multilayer body 100g' 'which has been made into a complete multilayer body, for example, by adding an adhesive layer as described above in Fig. 13 can be trained.
• the method described with reference to FIGS. 14a to 14d can be used to apply further layers. Because the layers 3p and 3p 'are thin layers of the order of a few ⁇ m or nm, the structures introduced into the replication layer 3 are preserved, so that, for example, a further metallic layer can be applied in the regions of the replication layer 3 is formed transparent with high depth-to-width ratio. Thus, the further metallic layer can be used as a mask layer, which can be partially removed with the method steps described above or as temporary Intermediate layer may be provided to register one or more non-metallic layers register.
• Fig. 15 is a schematic diagram showing two etching characteristics of developers intended to form the etching mask of the photosensitive layer.
• the etch characteristics set the etch rate, i. the removal of material per unit time, depending on the energy density with which the photosensitive layer was exposed.
• a first etching characteristic 1501 is linear. Such an etching characteristic may be preferable when developing according to time.
• a binary etch characteristic 150b may be preferred because only small differences in energy density are needed to form a significantly different etch rate and, thus, complete removal of the mask layer in the high depth-to-width ratio regions Security.
• a third bell-shaped etching characteristic 150g can be used to selectively remove structures depending on the transmissivity of the region.
• the diffractive structure is a hologram, for example, in the example of application shown in FIG. 16
• the reflecting structures 166g cover areas of the base layer 162 which are to be protected from being tampered with, in the form of guilloches. Reflecting structures may also be designed as decorative elements, as shown in FIG. 16 as star-shaped element 166s.

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• Engineering & Computer Science (AREA)
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• Diffracting Gratings Or Hologram Optical Elements (AREA)
• Laminated Bodies (AREA)
• Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
• Superconductors And Manufacturing Methods Therefor (AREA)
• Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)

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• 2005
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