EP1844629A1 - Heizeinrichtung mit temperatursensor und kochfeld mit heizeinrichtungen - Google Patents
Heizeinrichtung mit temperatursensor und kochfeld mit heizeinrichtungenInfo
- Publication number
- EP1844629A1 EP1844629A1 EP06701480A EP06701480A EP1844629A1 EP 1844629 A1 EP1844629 A1 EP 1844629A1 EP 06701480 A EP06701480 A EP 06701480A EP 06701480 A EP06701480 A EP 06701480A EP 1844629 A1 EP1844629 A1 EP 1844629A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- temperature sensor
- carrier
- heating device
- heating
- hob
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
- H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
- H05B3/748—Resistive heating elements, i.e. heating elements exposed to the air, e.g. coil wire heater
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/032—Heaters specially adapted for heating by radiation heating
Definitions
- the invention relates to a heating device, as it is advantageously used for hobs with a cover made of glass or glass ceramic, and a hob with a plurality of heaters.
- the invention has for its object to provide an aforementioned heating device and a hob, with which the disadvantages of the prior art can be avoided and in particular the arrangement of a temperature sensor can be simplified to a heater.
- This object is achieved by a heating device with the features of claim 1 and a hob with the features of claim 17.
- Advantageous and preferred embodiments of the invention are set forth in the further claims and are explained in more detail below. The wording of the claims is incorporated herein by express reference.
- the heating device has both a temperature sensor and a carrier, wherein an elongate heating conductor is arranged on or on or above the upper side of the carrier.
- the heating conductor is in particular designed and arranged so that it covers a substantial part of the surface of the carrier, for example spirally, meandering or a mixture thereof.
- the temperature sensor is predominantly or even exclusively fastened or held on the carrier only, whereby it is also arranged on the carrier, that is to say it touches it. This means that it is advantageously arranged with a substantial part of its length or extension on the carrier or bears against it. In this way, especially in comparison to the aforementioned prior art to a mounting on a receiving tray odgl. the carrier be waived.
- a pre-assembly of the carrier and temperature sensor can be made into a structural unit, regardless of the type of a receiving tray used, and in particular as well as training without receiving tray are possible.
- the temperature sensor is advantageously elongated.
- it has a kind of simple or double, in particular bent tube.
- a sensitive element can be arranged.
- the temperature sensor is advantageously designed for temperature detection via electrical evaluation, that is not via mechanical expansion behavior due to temperature change or the like.
- the temperature sensor may be at least partially embedded in the carrier or run in a channel in the carrier.
- it is in substantially complete contact with the material of the carrier and may rest against the carrier along a substantial part of its length.
- a substantially complete support or storage on the carrier can be made for the best possible support.
- An embedding of the temperature sensor in the carrier or the carrier material also allows a determination against lateral movements. It should be noted in particular that a holder of the temperature sensor on the support on the one hand in the lateral direction and on the other hand in the vertical direction can be realized in each case independently or in combination with each other in an advantageous manner. A channel or a recess in which the temperature sensor runs can be provided for this purpose.
- the carrier has a recess or a channel to accommodate electrical leads for the heating conductor on the carrier or lead.
- the temperature sensor can be introduced at the same time or the recess can have a double function. It is also possible to produce the recess for the temperature sensor by a sandwich construction with correspondingly preformed support parts. One of them then has the recess, overlying parts can cover the recess at least partially again, although windows can be provided upwards.
- the carrier has a substantially flat or uniform surface, at least in some or in essential areas.
- the temperature sensor something survive, so to speak not completely embedded in the carrier.
- the supernatant can either be only a small piece, for example, to make especially in this area the temperature detection.
- the aforementioned carrier having a substantially planar surface or flat shape has a survey or elevation, in which the temperature sensor extends.
- An embedding of the temperature sensor in such a survey can be advantageously designed so that a substantial part, in particular the largest, of the temperature sensor is embedded in the carrier or is covered by the carrier material of the survey.
- the temperature sensor can extend laterally free of the survey with substantial length ranges while resting on the support, but largely free to make undisturbed by effects of the wearer temperature detection. In this case, such a survey acts as a mechanical support of the temperature sensor.
- An elevation can also run at a distance and be designed as a lateral protection.
- the temperature sensor substantially below the plane or top of the flat carrier, so to speak, under the heating conductors.
- the temperature sensor can either be exposed upwards or be largely covered with carrier material.
- the temperature at the heating conductors or in an area above the heating conductors can not be detected directly by the embedding in the carrier material. Either correction factors can be used here.
- the temperature of the carrier are very well detected, if so desired.
- the temperature sensor can be arranged on the carrier, wherein it is substantially free or not embedded in the carrier. In any case, it is not embedded with functionally important parts or parts whose embedding means an effect on the temperature detection, for example because such a sensitive element of the temperature sensor is shielded from the carrier material.
- An attachment can be made by holding means which, for example, cross-brackets, protruding attachment members or the like. include.
- the temperature sensor is shielded from direct irradiation by the heat conductors lying laterally next to it. This can be done advantageously by a shield, for example in the form of a layer of carrier material. However, it is not necessary to embed the temperature sensor particularly deep in the carrier, but it can also be provided relatively narrow walls or webs. Above all, the temperature sensor should be exposed obliquely upwards to the side and directly upwards for the best possible detection of the temperature at, for example, a glass-ceramic hob plate extending above it.
- the temperature sensor advantageously has a sensitive element for the measurement.
- This is advantageously metallic or a piece of metal or metal wire.
- a sensitive element is advantageously elongated, in particular in order to be able to detect a temperature over a relatively large area.
- the sensitive element should be arranged in a sheath, which preferably consists of temperature and / or radiation-permeable material. Especially O 2006/081982 _ g _
- glass for example as a glass tube.
- the glass can e.g. by coloring, doping or the like be changed or optimized in its transmission properties.
- the sensitive element can advantageously be contacted electrically via connection wires of the temperature sensor to the outside. If it is arranged in a glass envelope, then the connecting wires must be inserted here, whereby they are usually melted down. It is advantageous if these melts are outside the heater or outside the carrier and especially outside the direct heating effect of the heater to avoid excessive thermal stress or destruction.
- the temperature sensor generally protrudes laterally beyond the heating device with one end, in particular a covering end with electrical connections. So a contact is possible, for example by welding or soldering or with a detachable connection.
- a sensitive element may be guided in an elongated form parallel to an aforementioned connecting wire, advantageously within the envelope. So it can be connected to this, advantageously welded.
- the enclosure in which the sensitive element extends.
- it can at least partially touch a wall of the capillary, wherein it can also rest in larger areas or on a longer section, in particular it can be supported.
- the temperature sensor can advantageously be arranged on the carrier in such a way that heating conductors, viewed in the plane of the carrier, are located only laterally next to the temperature sensor. However, they are not heat conductors present, which are higher or lower. In particular, all the heating conductors of the heating device run approximately in one plane or define such a plane.
- the temperature sensor may also be at an angle to the plane of the otherwise substantially flat carrier or its upper side. In this case, it is advantageously covered in a longitudinal region by a layer of the carrier material. In another longitudinal area it is exposed, for example at the end. There he can record the temperature very well.
- a compound of metal and ceramic can be used as a sensitive element.
- the ceramic may have PTC properties, wherein it may contain, for example, at least one high-temperature superconductor.
- the sensitive element can advantageously have a low heat capacity, whereby, above all, a rapid response of the temperature sensor is possible. It may have a temperature coefficient of resistivity greater than that of platinum, such as silver or tungsten. It can also be designed such that the temperature dependence of its electrical resistance compensates or reduces the deviation between the temperature of a glass ceramic plate extending above the heating device and that which detects the sensitive element itself within certain temperature ranges.
- Another possibility for a sensitive element is an optical temperature sensor.
- a sensitive element on its own sensor carrier, for example made of ceramic.
- it may be enveloped to the outside with a ceramic wrapper. ment, for example, consisting of several parts.
- the carrier may also be the sensor element itself.
- Such a sensitive element can be advantageously produced by conventional thick film or thin film processes. In particular, it can be applied to a sensor carrier.
- the temperature sensor can be placed on the support or even a piece embedded in it, it is possible to bring the heater or the heat conductor closer to the underside of an overlying hob plate.
- the size can be reduced and the transmission of heat output via radiation can be increased by reduced distance.
- the heating wire can radiate freely and be exposed or open at the top. So its heating effect is best.
- An inventive hob can have one or more heating devices, which are advantageously designed as described above. Furthermore, it has a cooktop plate, below which the one or more heating devices are arranged. In this case, the distance between the bottom of the hob plate and the heaters is reduced or very low in relation to known hobs. Advantageously, it is less than 2cm, more advantageously even only 1cm or even less. Thus, an aforementioned reduction of the overall height is possible. Furthermore, a higher power input of the heater through the hob plate can be made possible in a standing thereon cookware. In this case, all the heating devices are preferably constructed according to the same principle or each have, as it were, lowered temperature sensors.
- the heat insulation can be made stronger or cheaper.
- the thermal insulation can be completely or partially replaced by a foam glass or sandwiched structures.
- the heating of the cooking appliance containing the radiator can be reduced.
- a heating device for example, be prepared by the following steps: a) insert a simple filler material, such as glass powder or foam glass, in a receiving tray such as a sheet metal plate, b) introduce the temperature sensor and c) introduce an insulating layer with fumed silica over it.
- a heat conductor can then be attached over the insulating layer.
- FIG. 2 shows a representation of two possibilities, how a temperature sensor from FIG. 1 is arranged partially embedded in a heating device according to the invention
- FIG. 3 shows a variation of the heating device from FIG. 2, in which the temperature sensor is arranged in each case in a prefabricated channel,
- FIG. 4 shows a further variation of the heating device from FIG. 2, in which the temperature sensor is completely embedded in a carrier of the heating device, FIG.
- Fig. 5 shows two further variations of the heating device of Fig. 2, in which the temperature sensor on the one hand completely placed on the support of the heater and on the other hand partially protruding and
- Fig. 6 shows a cooking hob according to the invention in side section.
- a temperature sensor 11 is shown as an exemplary embodiment.
- the temperature sensor 11 is generally elongated, wherein it has a U-shaped glass tube 13 as a shell.
- the upper part 14a and the lower part 14b of the glass tube 13 run very close to each other. Alternatively, the two parts could have more distance. It is also possible to construct the temperature sensor with only one and substantially straight or elongated tube, preferably made of quartz glass.
- a schematically illustrated elongated sensitive element 15 This can be very varied and be both a kind of metal wire of the corresponding metal as well as a sensitive layer which is applied to a support.
- connecting wires 16a and 16b At the Ie, at which the connecting wires 16 exit from the glass tube 13, fuses 17a and 17b are provided.
- fuses 17a and 17b are provided.
- a heating device 20 has a disk-shaped or plate-shaped support 22, which consists of thermal insulation material, as described for example in DE 2551137 A or EP 750 444 A. Then a heating conductor 26, in the example shown, an upright Schuleitererband. This may be partially embedded in the carrier 22 or have holding members which extend into it.
- the carrier 22 is substantially flat at its top and all heating conductors 26 also extend in a plane.
- Fig. 2 The difference in Fig. 2 between the left-hand example and the right-hand example is the elongated elevation 23 in the right-hand example.
- the temperature sensor 11 is indeed completely embedded in the carrier 22 with the lower part 14b.
- the upper part 14a looks out about halfway or over the thermal insulation material of the carrier 22 via.
- the survey 23 in addition to a mechanical stabilizing effect bring a certain shield to the side. In particular, this is advantageous if it is not possible to embed the temperature sensor 11 deeper in the carrier 22.
- the ends of the glass tube 13 or of the upper part 14a and of the lower part 14b at least look out from the carrier 22 at least a small distance or are freely accessible.
- this also applies to the melts 17a and 17b, so that the connecting wires 16a and 16b are completely free or not covered by the material of the carrier 22.
- the shape of the survey 23 may vary. In addition to a shown, relatively gentle increase, the increase may also be steeper. Furthermore, the elevation 23 may also be wider or longer than shown. However, it advantageously extends only in the immediate area around the temperature sensor 11, since otherwise it could adversely affect the attachment of the heating conductors 26. So the production cost is low.
- the temperature sensor 11 is embedded in the carrier 22 and in its material, but still protrudes a bit beyond or survives. Above all, it is not covered at the top, so that it can detect, for example, heat radiation from a cooktop panel located above it.
- FIG. 3 once again shows, in a split representation, a heating device 120 according to the invention in accordance with a second basic embodiment.
- the carrier 122 each has elongated, approximately U-shaped channels 124. While in the illustration according to FIG. 2 the temperature sensor can already be compressed together with the loose heat-insulating material in the initial state together with the carrier 22, here the channel 124 is present even before the temperature sensor 111 is introduced.
- the attachment of the temperature sensor 111 in the channel 124 can be done by tailor-made training with pushing. Likewise, sticking or retaining clips or the like. possible.
- the ends of the upper part 114a and the lower part 114b or the connecting wires 116 should be easily accessible or a piece over the side edge of the carrier 122 projecting.
- a supply line 127 to the heating conductor 126 at least partially extends in the channel 124 and is guided to the outside.
- the channel 124 or a part thereof may also be led up to the heating conductor 126.
- the temperature sensor 111 occupies only a part of the entire length of the channel 124.
- the upper part 114a of the temperature sensor 111 protrudes a little beyond the upper side of the otherwise flat carrier 122.
- a survey 123 is provided on both sides of the channel 124. This causes the same depth of embedding of the temperature sensor in the carrier this is also completely shielded to the side by the thermal insulation material.
- the temperature sensor 111 is not above the carrier 122 or its material at any point. However, as can be seen, it is completely open at the top, ie in the direction in which it is to measure a temperature, or it can detect heat radiation very well.
- FIG. 4 shows in a third embodiment again in a split representation how the temperature sensor 211 is completely embedded in the carrier 222 or its material. In both cases it is not over or free at any point. Only the ends look out at the side again.
- the temperature sensor 211 can be pressed together either with the thermal insulation material together with the finished carrier.
- recesses could be provided, similar to the channels in Fig. 3, in which the temperature sensor is inserted. These are then not open at the top.
- a fourth basic embodiment is shown on the left.
- the temperature sensor 311 is placed on top of the carrier 322 and is completely on this on or above her.
- An attachment is made by the retaining clip 325, which surrounds it like a bow and is anchored in a manner not shown on the support 322. For this purpose, it can either be glued or extending into or protruding into it, for example, with protruding projections.
- heating elements On the representation of heating elements is omitted here.
- a fifth basic embodiment is shown on the right, in which the temperature sensor 411 extends obliquely to the surface of the carrier 422. With one end 411 'he protrudes from the carrier and can make the temperature measurement in this area, for example. The ends of the tubes 414 with the terminals 416 in turn protrude laterally and are accessible for contacting.
- a hob according to the invention 30 is shown with a hob plate 31, advantageously made of glass ceramic. Below this, a heater 20 similar to that in the left half in Fig. 2 is arranged. Shown here is also a receiving tray 29, in which the heater 20 is. The receiving tray 29 is pressed against the underside of the hob plate 31.
- the heating conductors 26 project beyond the upper part 14a of the temperature sensor. They have a certain distance to the underside of the hob plate 31, which is determined by the side edge of the receiving tray. However, this distance is in the range of a few millimeters or about one centimeter and is thus considerably smaller than in previous radiant heaters. For some of these, the temperature sensor still has to run between the heating conductors and the hob plate and must maintain a certain minimum distance.
- the connecting wires 16a and 16b of the temperature sensor 11 are guided to an evaluation or control, not shown. This evaluates together with the temperature sensor 11 and the sensitive element 15, the detected temperature.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Control Of Resistance Heating (AREA)
- Resistance Heating (AREA)
- Electric Stoves And Ranges (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Control Of High-Frequency Heating Circuits (AREA)
- Cookers (AREA)
- General Induction Heating (AREA)
- Surface Heating Bodies (AREA)
Description
Claims
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PL06701480T PL1844629T3 (pl) | 2005-02-01 | 2006-01-27 | Urządzenie grzejne z czujnikiem temperatury i pole grzejne płyty kuchennej z urządzeniami grzejnymi |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102005005520A DE102005005520A1 (de) | 2005-02-01 | 2005-02-01 | Heizeinrichtung mit Temperatursensor und Kochfeld mit Heizeinrichtungen |
| PCT/EP2006/000699 WO2006081982A1 (de) | 2005-02-01 | 2006-01-27 | Heizeinrichtung mit temperatursensor und kochfeld mit heizeinrichtungen |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP1844629A1 true EP1844629A1 (de) | 2007-10-17 |
| EP1844629B1 EP1844629B1 (de) | 2009-07-22 |
Family
ID=36087670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP06701480A Expired - Lifetime EP1844629B1 (de) | 2005-02-01 | 2006-01-27 | Heizeinrichtung mit temperatursensor und kochfeld mit heizeinrichtungen |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US7417207B2 (de) |
| EP (1) | EP1844629B1 (de) |
| JP (1) | JP5021500B2 (de) |
| KR (1) | KR101246012B1 (de) |
| CN (1) | CN101124851B (de) |
| AT (1) | ATE437552T1 (de) |
| DE (2) | DE102005005520A1 (de) |
| ES (1) | ES2330041T3 (de) |
| PL (1) | PL1844629T3 (de) |
| WO (1) | WO2006081982A1 (de) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005046703A1 (de) | 2005-09-29 | 2007-04-05 | Wacker Chemie Ag | Verfahren und Vorrichtung zur Hydrierung von Chlorsilanen |
| DE102007012379A1 (de) * | 2007-03-14 | 2008-09-18 | BSH Bosch und Siemens Hausgeräte GmbH | Kochfeldvorrichtung |
| EP2728322A1 (de) * | 2012-10-31 | 2014-05-07 | ams AG | Lichtsensoranordnung und Verfahren zum Ausgleichen der Temperatur in einer Lichtsensoranordnung |
| WO2014073545A1 (ja) * | 2012-11-06 | 2014-05-15 | 貞徳舎株式会社 | 電気ヒーター並びにこれを備えた加熱装置及び半導体製造装置 |
| DE202015104723U1 (de) * | 2015-09-04 | 2015-09-18 | Türk & Hillinger GmbH | Elektrische Heizpatrone mit Temperaturüberwachung und elektrische Heizung mit Temperaturüberwachung |
| DE102017222958A1 (de) * | 2017-09-04 | 2019-03-07 | E.G.O. Elektro-Gerätebau GmbH | Heizeinrichtung und Verfahren zur Herstellung einer Heizeinrichtung |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3267733A (en) | 1963-06-19 | 1966-08-23 | American Radiator & Standard | Thermometer |
| GB1257148A (de) | 1970-08-18 | 1971-12-15 | ||
| US3710076A (en) * | 1972-02-17 | 1973-01-09 | J Frazier | Radiant surface-heater and temperature sensing assembly |
| FR2261695A7 (en) * | 1974-02-19 | 1975-09-12 | Licentia Gmbh | Ceramic hot plate with heating coil - free ends of coil and expansion regulator housed in grooves in insulating block below |
| DE2729930C2 (de) * | 1977-07-02 | 1993-02-18 | E.G.O. Elektro-Geräte Blanc u. Fischer, 7519 Oberderdingen | Verfahren zur Herstellung eines elektrischen Strahlungs-Heizelementes |
| GB1562251A (en) | 1977-02-10 | 1980-03-05 | Micropore Internation Ltd | Electrical heating units |
| SE7806238L (sv) * | 1977-07-02 | 1979-01-03 | Fischer Karl | Elektriskt stralningsvermeelement, serskilt for glaskeramikkokhell |
| DE3163458D1 (en) | 1980-03-05 | 1984-06-14 | Kenwood Mfg Co Ltd | Cooking apparatus |
| GB2072334A (en) | 1980-03-24 | 1981-09-30 | Thorn Domestic Appliances Ltd | Temperature responsive apparatus |
| DE3049521A1 (de) * | 1980-12-30 | 1982-07-29 | Karl 7519 Oberderdingen Fischer | Elektrischer heizkoerper |
| DE3116771A1 (de) * | 1981-04-28 | 1982-11-11 | Karl 7519 Oberderdingen Fischer | Elektrische heizeinheit fuer kochgeraete mit einer glaskeramikplatte |
| DE3204001A1 (de) | 1982-02-05 | 1983-08-11 | Robert Bosch Gmbh, 7000 Stuttgart | Sensor |
| DE3302489A1 (de) | 1983-01-26 | 1984-07-26 | Ego Elektro Blanc & Fischer | Elektrischer strahlheizkoerper zur beheizung von koch- oder waermeplatten, insbesondere glaskeramikplatten |
| GB8323387D0 (en) | 1983-08-31 | 1983-10-05 | Thorn Emi Domestic Appliances | Heating apparatus |
| JPS61186733A (ja) * | 1985-02-13 | 1986-08-20 | Matsushita Electric Ind Co Ltd | 電気こんろ |
| DE3545445A1 (de) * | 1985-12-20 | 1987-06-25 | Bosch Siemens Hausgeraete | Heizelement insb. fuer kochstellen |
| DE3622415A1 (de) * | 1986-07-03 | 1988-01-07 | Ego Elektro Blanc & Fischer | Strahlheizkoerper |
| JPH04361714A (ja) * | 1991-06-06 | 1992-12-15 | Mitsubishi Materials Corp | 調理器 |
| US5220155A (en) | 1992-03-12 | 1993-06-15 | Emerson Electric Co. | Heating and sensing apparatus for range top |
| US5644284A (en) * | 1994-04-27 | 1997-07-01 | Matsushita Electric Industrial Co., Ltd. | Temperature sensor |
| DE19527825A1 (de) * | 1995-07-29 | 1997-01-30 | Ego Elektro Blanc & Fischer | Strahlungs-Kochstelleneinheit |
| JP2904066B2 (ja) | 1995-08-31 | 1999-06-14 | 松下電器産業株式会社 | 温度センサ及びその製造方法 |
| DE19537431C2 (de) | 1995-10-07 | 2000-06-21 | Ind Ofenbau Rudolf Brands Gmbh | Widerstandsthermometer |
| DE19604306C2 (de) * | 1996-02-07 | 2000-05-11 | Ako Werke Gmbh & Co | Strahlungsheizkörper |
| DE19925367A1 (de) | 1998-07-09 | 2000-01-13 | Electrovac | Temperatursensor |
| SI1187512T1 (en) * | 2000-09-07 | 2005-04-30 | E.G.O. Elektro-Geraetebau Gmbh | Radiant electric heater being placed under a cooking plate, particularly under a glass-ceramic plate |
| GB0115831D0 (en) | 2001-06-28 | 2001-08-22 | Ceramaspeed Ltd | Radiant electric heater |
| US6538238B1 (en) | 2002-02-12 | 2003-03-25 | General Electric Company | Long term calibration of sensor assembly for glass-ceramic cooktop appliance |
| DE102004004022B4 (de) | 2004-01-20 | 2013-12-24 | E.G.O. Elektro-Gerätebau GmbH | Kochfeld |
-
2005
- 2005-02-01 DE DE102005005520A patent/DE102005005520A1/de not_active Withdrawn
-
2006
- 2006-01-27 JP JP2007552580A patent/JP5021500B2/ja not_active Expired - Fee Related
- 2006-01-27 DE DE502006004300T patent/DE502006004300D1/de not_active Expired - Lifetime
- 2006-01-27 AT AT06701480T patent/ATE437552T1/de not_active IP Right Cessation
- 2006-01-27 CN CN200680003732XA patent/CN101124851B/zh not_active Expired - Fee Related
- 2006-01-27 WO PCT/EP2006/000699 patent/WO2006081982A1/de not_active Ceased
- 2006-01-27 PL PL06701480T patent/PL1844629T3/pl unknown
- 2006-01-27 KR KR1020077019906A patent/KR101246012B1/ko not_active Expired - Fee Related
- 2006-01-27 ES ES06701480T patent/ES2330041T3/es not_active Expired - Lifetime
- 2006-01-27 EP EP06701480A patent/EP1844629B1/de not_active Expired - Lifetime
-
2007
- 2007-07-31 US US11/831,141 patent/US7417207B2/en not_active Expired - Fee Related
Non-Patent Citations (1)
| Title |
|---|
| See references of WO2006081982A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101124851A (zh) | 2008-02-13 |
| US20080000893A1 (en) | 2008-01-03 |
| DE102005005520A1 (de) | 2006-08-10 |
| EP1844629B1 (de) | 2009-07-22 |
| US7417207B2 (en) | 2008-08-26 |
| JP5021500B2 (ja) | 2012-09-05 |
| PL1844629T3 (pl) | 2009-12-31 |
| KR101246012B1 (ko) | 2013-03-20 |
| WO2006081982A1 (de) | 2006-08-10 |
| ES2330041T3 (es) | 2009-12-03 |
| KR20070114730A (ko) | 2007-12-04 |
| DE502006004300D1 (de) | 2009-09-03 |
| JP2008529225A (ja) | 2008-07-31 |
| ATE437552T1 (de) | 2009-08-15 |
| CN101124851B (zh) | 2011-03-09 |
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