EP1815554B8 - Lignes de couplage pour un filtre yig ou un oscillateur yig et procede pour produire ces lignes de couplage - Google Patents
Lignes de couplage pour un filtre yig ou un oscillateur yig et procede pour produire ces lignes de couplageInfo
- Publication number
- EP1815554B8 EP1815554B8 EP05813554A EP05813554A EP1815554B8 EP 1815554 B8 EP1815554 B8 EP 1815554B8 EP 05813554 A EP05813554 A EP 05813554A EP 05813554 A EP05813554 A EP 05813554A EP 1815554 B8 EP1815554 B8 EP 1815554B8
- Authority
- EP
- European Patent Office
- Prior art keywords
- yig
- coupling
- coupling line
- film
- lines
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000008878 coupling Effects 0.000 title claims abstract description 82
- 238000010168 coupling process Methods 0.000 title claims abstract description 82
- 238000005859 coupling reaction Methods 0.000 title claims abstract description 82
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000004020 conductor Substances 0.000 title abstract 6
- 230000003628 erosive effect Effects 0.000 claims abstract description 5
- 239000011888 foil Substances 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 20
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims description 4
- 239000004922 lacquer Substances 0.000 claims description 3
- 229910000952 Be alloy Inorganic materials 0.000 claims description 2
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 claims description 2
- 239000007921 spray Substances 0.000 claims description 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 claims 1
- 238000004140 cleaning Methods 0.000 claims 1
- 239000003973 paint Substances 0.000 claims 1
- 238000003698 laser cutting Methods 0.000 abstract description 2
- 238000010329 laser etching Methods 0.000 abstract 1
- 239000002223 garnet Substances 0.000 description 2
- MTRJKZUDDJZTLA-UHFFFAOYSA-N iron yttrium Chemical compound [Fe].[Y] MTRJKZUDDJZTLA-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000001404 mediated effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/215—Frequency-selective devices, e.g. filters using ferromagnetic material
- H01P1/218—Frequency-selective devices, e.g. filters using ferromagnetic material the ferromagnetic material acting as a frequency selective coupling element, e.g. YIG-filters
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49005—Acoustic transducer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
Definitions
- the invention relates to coupling lines for use in a YIG bandpass filter or a YIG oscillator according to the preamble of claim 1 and a method for producing such coupling lines, which are suitable for use in a YIG bandpass filter or a YIG oscillator, according to the preamble of claim 11.
- YIG bandpass filters or YIG oscillators have at least one resonator, which is preferably spherical and made of an yttrium iron garnet (Yttrium-Iron-Garnet YIG).
- the Resonator Brady is mediated by coupling lines, which must be designed and arranged so that the center of the resonator and the center of the bending radius of a coupling line match exactly.
- a YIG bandpass filter with correspondingly formed coupling lines is known, for example, from the publication US Pat. No. 4,480,238.
- the tunable YIG bandpass filter in this case has a base body, which slots for receiving isolated platelets having at one edge a conductive coating which serves as coupling lines comprises. Furthermore, filter chambers are provided for receiving the YIG elements. The platelets are placed over the YIG elements in the slots so that the YIG elements are arranged in indentations in the edges provided with the conductive coating. The YIG elements and the plates are fixed in fixed positions.
- a disadvantage of the YIG bandpass filter known from the cited document is, in particular, the complicated production of the platelets forming the coupling lines.
- the serving as a carrier insulator must first be appropriately shaped and then provided with the conductive coating. This is expensive and prone to jeopardy because the coating is sensitive to damage due to the small layer thickness.
- Object of the present invention is therefore to provide coupling lines that are easy to manufacture, insensitive to damage and easy to install, and to provide a method for producing such coupling lines.
- the object is achieved with respect to the coupling lines by the characterizing features of claim 1, with respect to the method by the characterizing features of claim 11 and with respect to a film carrier for the coupling lines by the characterizing features of claim 19.
- FIG. 1A is a schematic perspective view of a preferred embodiment of a main body of a YIG bandpass filter with
- Resonators and coupling lines, 1B is a schematic perspective view of the resonators and coupling lines without basic body
- FIG. 2A is a schematic representation of an exemplary coupling loop for two resonators according to the prior art
- FIG. 2B shows a schematic illustration of an exemplary embodiment of a coupling loop designed according to the invention for two resonators
- 3A-C are schematic representations of inventively designed coupling lines during the
- FIG. 1A shows a schematic, perspective view of an exemplary embodiment of a YIG bandpass filter 2, which has a base body 3 and, in the exemplary embodiment, four filter chambers 4 formed in the base body 3 with just as many YIG elements 6.
- the YIG elements 6 are formed spherically from an yttrium-iron garnet, mounted on holders 10, for example, by gluing with epoxy resin and electromagnetically coupled by coupling lines 1.
- the filter chambers 4 are interconnected by slots 5, in which the coupling lines 1 are inserted.
- two of the filter chambers 4 are identical in the embodiment.
- the filter chambers 4 denoted by 4b have only the YIG elements 6.
- the number of filter chambers 4b is not limited to two, but may be one or more so that the total number of filter chambers 4 may be either three or five or more.
- FIG. 1B shows the arrangement of the coupling lines 1 and the YIG elements 6 mounted on their holders 10 without the surrounding base body 3.
- the coupling lines 1 are executed in the embodiment in two different forms.
- the filter chambers 4b interconnecting coupling line 1 is designed as an input or output line Ia, while in the embodiment, three further coupling lines 1 are designed as connecting lines Ib.
- the coupling lines 1 have contact lugs 8, which on the one hand serve to connect the earth in the coupling lines 1 in the base body 3 and on the other hand to fix the coupling lines 1 in the slots 5.
- the contact lugs 8 are rectangular in shape, wherein an edge length of the contact lugs 8 corresponds approximately to the axial thickness of the base body 2.
- FIGS. 2A and 2B it is possible to see how the inventive coupling lines 1 according to FIG. 2B differ from conventional coupling lines 1 according to FIG. 2A.
- the two embodiments have in common that in each case at least one curved portion 17 is provided, which surrounds a respective YIG element 6 so at least partially, that a center of the YIG element 6 coincides with a center of the curved portion 17. Furthermore, at least one line section 18 is provided.
- the prior art coupling line 1 shown in Fig. 2A is bent from a wire.
- the YIG elements 6 are introduced into the main body 3, not shown in detail in FIGS. 2A and 2B, and then the only roughly pre-bent wire is inserted into the slots 5.
- a measurement of the degree of coupling results where the coupling line 1 still needs to be bent. This is done manually by means of a suitable tool. Thereafter must be checked again and readjusted. For this purpose, each time the YIG filter 2 or YIG oscillator must be opened and then reassembled to make the measurement. The method is thus extremely complicated and often even leads to the fact that the workpiece must be completely discarded after several iterations, because no satisfactory coupling is achieved.
- the inventively designed coupling lines 1 as shown in FIG. 2B made of a metallic foil 7 by suitable methods such as etching, eroding, cutting, especially laser cutting or water jet cutting and / or punching and assembled. Thereafter, the correct positioning of the YIG elements 6 takes place relative to the coupling lines. 1
- the film 7 is made of a copper-beryllium alloy to meet both the requirements of elasticity and strength.
- the thickness of the film 7 is preferably about 50 microns.
- the preparation of the coupling lines 1 from the film 7 takes place in several processing steps. First, the film 7 is cleaned and applied on both sides with a positive resist at an alignment accuracy of about 5 microns in a layer thickness of about 5 microns to create a mask. Thereafter, the preparation of the coupling lines 1, for example, by spray etching with iron chloride. (FeCl 3). Subsequently, the liberated in the form of a carrier 9 with a predetermined number of coupling lines 1 of lacquer residues and galvanically provided with a gold coating of about 5 microns. After that follows a curing process for example, one hour at 325 ° C. Then the coupling lines can be released from the film carrier 9 and installed.
- the coupling lines 1 have by the manufacturing method described a solid shape with a well-defined radius of curvature in the curved portions 17 at a uniform curvature.
- the YIG elements 6 are then aligned relative to the coupling lines 1. This is compared to the prior art simpler and associated with considerably less effort, because the manufacturing accuracy is considerably greater in the present invention designed coupling lines 1 as in manually curved coupling lines. 1
- FIG. 3A shows, in a schematic illustration, a carrier 9 which contains the coupling lines 1 required for a YIG bandpass filter 2 with four YIG elements 6.
- the coupling lines 1 are formed in the embodiment in the form of an input or output line Ia and three connecting lines Ib.
- the former is disposed at the bottom of Fig. 3A in the film carrier 9, the latter above.
- FIGS. 3B and 3C show the sections from the carrier 9 labeled HIB and IIIC in FIG. 3A.
- FIG. 3B one of the three connecting lines Ib is shown, while FIG. 3C shows the input and output lines Ia.
- the coupling lines 1 are held in the carrier 9 by webs 12 which are formed on the contact lugs 8 before being singulated.
- the coupling lines 1 are mounted in the base body 3 according to their shape and fixed in the base body 3 by soldering, welding or another method of maintaining the electrical conductivity.
- the invention is not limited to the illustrated embodiment and suitable for any configured YIG filter 2 or YIG oscillators.
- the individual features can be combined with each other as desired.
Landscapes
- Control Of Motors That Do Not Use Commutators (AREA)
- Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004056259A DE102004056259A1 (de) | 2004-11-22 | 2004-11-22 | Kopplungsleitungen für einen YIG-Filter oder YIG-Oszillator und Verfahren zur Herstellung der Kopplungsleitungen |
PCT/EP2005/011885 WO2006056314A1 (fr) | 2004-11-22 | 2005-11-07 | Lignes de couplage pour un filtre yig ou un oscillateur yig et procede pour produire ces lignes de couplage |
Publications (3)
Publication Number | Publication Date |
---|---|
EP1815554A1 EP1815554A1 (fr) | 2007-08-08 |
EP1815554B1 EP1815554B1 (fr) | 2010-10-27 |
EP1815554B8 true EP1815554B8 (fr) | 2011-01-19 |
Family
ID=35735322
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP05813554A Active EP1815554B8 (fr) | 2004-11-22 | 2005-11-07 | Lignes de couplage pour un filtre yig ou un oscillateur yig et procede pour produire ces lignes de couplage |
Country Status (5)
Country | Link |
---|---|
US (2) | US7573357B2 (fr) |
EP (1) | EP1815554B8 (fr) |
JP (1) | JP4589402B2 (fr) |
DE (2) | DE102004056259A1 (fr) |
WO (1) | WO2006056314A1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11923590B2 (en) * | 2018-10-29 | 2024-03-05 | Universitaet Hamburg | Magnetically tunable resonator |
TR201907601A2 (tr) * | 2019-05-20 | 2020-12-21 | Aselsan Elektronik Sanayi Ve Ticaret Anonim Sirketi | YIG Filtrelerinde Oluşan Merkez Frekans Kaymasını ve Doğrusallık Hatalarını Minimize Eden Yöntem |
CN110165344B (zh) * | 2019-05-28 | 2021-08-27 | 西南应用磁学研究所 | 旋磁滤波器谐振电路结构 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL158239B (nl) * | 1950-12-29 | Polensky & Zoellner | Voortschuifsteigerwerk. | |
US3821668A (en) * | 1973-03-12 | 1974-06-28 | Loral Corp | Electronically tunable microwave filter |
JPS5850701U (ja) * | 1981-09-18 | 1983-04-06 | 株式会社アドバンテスト | マイクロ波バンドパスフイルタ |
US4633205A (en) * | 1985-11-25 | 1986-12-30 | Tektronix, Inc. | Loop coupled YIG resonator |
FR2616972B1 (fr) * | 1987-06-22 | 1989-08-18 | Enertec | Filtre passe-bande a bille de grenat d'yttrium fer accordable en frequence et a large bande d'accord |
US4857871A (en) * | 1988-10-31 | 1989-08-15 | Harris David L | Magnetic field-tunable filter with plural section housing and method of making the same |
JPH0429204U (fr) * | 1990-07-02 | 1992-03-09 | ||
US5294899A (en) * | 1992-07-29 | 1994-03-15 | Hewlett-Packard Company | YIG-tuned circuit with rotatable magnetic polepiece |
WO1994024705A1 (fr) * | 1993-04-14 | 1994-10-27 | Hitachi Construction Machinery Co., Ltd. | Procede d'usinage d'une feuille metallique, procede d'usinage d'une grille de connexion, procede d'usinage d'une grille de connexion et d'un dispositif a semi-conducteur, et dispositif a semi-conducteur |
US5757125A (en) * | 1995-11-09 | 1998-05-26 | Astronics Corporation, Inc. | Electroluminescent lamp with lead attachment isolation structure, and rotary abrasion method of manufacture thereof |
US5959513A (en) * | 1997-05-13 | 1999-09-28 | Verticom, Inc. | Microwave ferrite resonator mounting structure having reduced mechanical vibration sensitivity |
JP3622639B2 (ja) * | 2000-05-30 | 2005-02-23 | 株式会社村田製作所 | 非可逆回路素子の製造方法 |
US6670208B2 (en) * | 2000-06-23 | 2003-12-30 | Nec Corporation | Optical circuit in which fabrication is easy |
GB2365007B (en) * | 2000-07-21 | 2002-06-26 | Murata Manufacturing Co | Insulative ceramic compact |
US6772515B2 (en) * | 2000-09-27 | 2004-08-10 | Hitachi, Ltd. | Method of producing multilayer printed wiring board |
US6727775B2 (en) * | 2001-11-29 | 2004-04-27 | Sirenza Microdevices, Inc. | Ferrite crystal resonator coupling structure |
DE10212018A1 (de) * | 2002-03-19 | 2003-10-02 | Bosch Gmbh Robert | Isolationsmaterial und Gassensor |
US7198764B2 (en) * | 2003-03-05 | 2007-04-03 | Delphi Technologies, Inc. | Gas treatment system and a method for using the same |
US20060035782A1 (en) * | 2004-08-12 | 2006-02-16 | Ford Global Technologies, Llc | PROCESSING METHODS AND FORMULATIONS TO ENHANCE STABILITY OF LEAN-NOx-TRAP CATALYSTS BASED ON ALKALI- AND ALKALINE-EARTH-METAL COMPOUNDS |
-
2004
- 2004-11-22 DE DE102004056259A patent/DE102004056259A1/de not_active Withdrawn
-
2005
- 2005-11-07 EP EP05813554A patent/EP1815554B8/fr active Active
- 2005-11-07 JP JP2007541743A patent/JP4589402B2/ja active Active
- 2005-11-07 WO PCT/EP2005/011885 patent/WO2006056314A1/fr active Application Filing
- 2005-11-07 DE DE502005010453T patent/DE502005010453D1/de active Active
- 2005-11-07 US US11/667,897 patent/US7573357B2/en active Active
-
2009
- 2009-02-11 US US12/369,498 patent/US8327520B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US7573357B2 (en) | 2009-08-11 |
US20080211605A1 (en) | 2008-09-04 |
DE102004056259A1 (de) | 2006-05-24 |
DE502005010453D1 (de) | 2010-12-09 |
EP1815554A1 (fr) | 2007-08-08 |
JP4589402B2 (ja) | 2010-12-01 |
EP1815554B1 (fr) | 2010-10-27 |
WO2006056314A1 (fr) | 2006-06-01 |
US20090144964A1 (en) | 2009-06-11 |
JP2008521299A (ja) | 2008-06-19 |
US8327520B2 (en) | 2012-12-11 |
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