EP1799446A4 - SEMICONDUCTOR PARTS SLIMMING SYSTEM - Google Patents

SEMICONDUCTOR PARTS SLIMMING SYSTEM

Info

Publication number
EP1799446A4
EP1799446A4 EP05789099A EP05789099A EP1799446A4 EP 1799446 A4 EP1799446 A4 EP 1799446A4 EP 05789099 A EP05789099 A EP 05789099A EP 05789099 A EP05789099 A EP 05789099A EP 1799446 A4 EP1799446 A4 EP 1799446A4
Authority
EP
European Patent Office
Prior art keywords
thinning
semiconductor workpiece
workpiece
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP05789099A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP1799446A2 (en
Inventor
Kert L Dolechek
Raymon F Thompson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Semitool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/922,762 external-priority patent/US20060040111A1/en
Priority claimed from US10/923,132 external-priority patent/US7354649B2/en
Priority claimed from US10/923,363 external-priority patent/US7288489B2/en
Priority claimed from US10/923,436 external-priority patent/US20060046499A1/en
Application filed by Semitool Inc filed Critical Semitool Inc
Publication of EP1799446A2 publication Critical patent/EP1799446A2/en
Publication of EP1799446A4 publication Critical patent/EP1799446A4/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02035—Shaping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Weting (AREA)
EP05789099A 2004-08-20 2005-08-18 SEMICONDUCTOR PARTS SLIMMING SYSTEM Ceased EP1799446A4 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US10/922,762 US20060040111A1 (en) 2004-08-20 2004-08-20 Process chamber and system for thinning a semiconductor workpiece
US10/923,132 US7354649B2 (en) 2004-08-20 2004-08-20 Semiconductor workpiece
US10/923,363 US7288489B2 (en) 2004-08-20 2004-08-20 Process for thinning a semiconductor workpiece
US10/923,436 US20060046499A1 (en) 2004-08-20 2004-08-20 Apparatus for use in thinning a semiconductor workpiece
PCT/US2005/029598 WO2006023753A2 (en) 2004-08-20 2005-08-18 System for thinning a semiconductor workpiece

Publications (2)

Publication Number Publication Date
EP1799446A2 EP1799446A2 (en) 2007-06-27
EP1799446A4 true EP1799446A4 (en) 2010-03-03

Family

ID=35968220

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05789099A Ceased EP1799446A4 (en) 2004-08-20 2005-08-18 SEMICONDUCTOR PARTS SLIMMING SYSTEM

Country Status (8)

Country Link
EP (1) EP1799446A4 (zh)
JP (1) JP2008511141A (zh)
KR (2) KR20070051337A (zh)
CN (1) CN102790000B (zh)
AT (1) AT10874U1 (zh)
DE (1) DE212005000047U1 (zh)
TW (2) TWI463527B (zh)
WO (1) WO2006023753A2 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG147330A1 (en) 2007-04-19 2008-11-28 Micron Technology Inc Semiconductor workpiece carriers and methods for processing semiconductor workpieces
US7989318B2 (en) * 2008-12-08 2011-08-02 Taiwan Semiconductor Manufacturing Company, Ltd. Method for stacking semiconductor dies
DE102009037281B4 (de) * 2009-08-12 2013-05-08 Siltronic Ag Verfahren zur Herstellung einer polierten Halbleiterscheibe
NL2014625B1 (en) * 2015-04-13 2017-01-06 Suss Microtec Lithography Gmbh Wafer treating device and sealing ring for a wafer treating device.
DE102019110402A1 (de) 2018-05-25 2019-11-28 Infineon Technologies Ag Ein Verfahren zum Bearbeiten eines Halbleiterwafers, eine Halbleiter-Verbundstruktur und eine Stützstruktur für einen Halbleiterwafer
JP7136679B2 (ja) * 2018-12-13 2022-09-13 株式会社荏原製作所 基板ホルダに使用するシール

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2024961A1 (zh) * 1968-11-29 1970-09-04 Philips Nv
US4266334A (en) * 1979-07-25 1981-05-12 Rca Corporation Manufacture of thinned substrate imagers
JPH0684731A (ja) * 1992-09-07 1994-03-25 Nec Kyushu Ltd 半導体ウェハー
EP1061584A2 (en) * 1999-06-17 2000-12-20 Intersil Corporation Self-supported ultra thin silicon wafer process
US20030119281A1 (en) * 2001-12-12 2003-06-26 Mikimasa Suzuki Method for manufacturing semiconductor power device
US20030215985A1 (en) * 2002-05-15 2003-11-20 Hitachi, Ltd. Semiconductor wafer and manufacturing method of semiconductor device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5011782A (en) * 1989-03-31 1991-04-30 Electric Power Research Institute Method of making passivated antireflective coating for photovoltaic cell
JP3161515B2 (ja) * 1997-10-08 2001-04-25 三菱マテリアル株式会社 半導体装置の製造方法
US6613681B1 (en) * 1998-08-28 2003-09-02 Micron Technology, Inc. Method of removing etch residues
US6248222B1 (en) * 1998-09-08 2001-06-19 Acm Research, Inc. Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
US6402843B1 (en) * 1999-12-07 2002-06-11 Trusi Technologies, Llc Non-contact workpiece holder
US6334453B1 (en) * 2000-02-14 2002-01-01 Semitool, Inc. Seal configuration for use with a motor drive assembly in a microelectronic workpiece processing system
WO2002047139A2 (en) * 2000-12-04 2002-06-13 Ebara Corporation Methode of forming a copper film on a substrate
JP3899871B2 (ja) * 2001-08-23 2007-03-28 株式会社デンソー エッチング方法及びエッチング装置並びに薄膜センサの製造方法
JP3620528B2 (ja) * 2001-12-12 2005-02-16 株式会社デンソー 半導体装置の製造方法
US20040074808A1 (en) * 2002-07-05 2004-04-22 Entegris, Inc. Fire retardant wafer carrier
DE10260233B4 (de) * 2002-12-20 2016-05-19 Infineon Technologies Ag Verfahren zum Befestigen eines Werkstücks mit einem Feststoff an einem Werkstückträger und Werkstückträger
US6940181B2 (en) * 2003-10-21 2005-09-06 Micron Technology, Inc. Thinned, strengthened semiconductor substrates and packages including same
US20050239295A1 (en) * 2004-04-27 2005-10-27 Wang Pei-L Chemical treatment of material surfaces

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2024961A1 (zh) * 1968-11-29 1970-09-04 Philips Nv
US4266334A (en) * 1979-07-25 1981-05-12 Rca Corporation Manufacture of thinned substrate imagers
JPH0684731A (ja) * 1992-09-07 1994-03-25 Nec Kyushu Ltd 半導体ウェハー
EP1061584A2 (en) * 1999-06-17 2000-12-20 Intersil Corporation Self-supported ultra thin silicon wafer process
US20030119281A1 (en) * 2001-12-12 2003-06-26 Mikimasa Suzuki Method for manufacturing semiconductor power device
US20030215985A1 (en) * 2002-05-15 2003-11-20 Hitachi, Ltd. Semiconductor wafer and manufacturing method of semiconductor device

Also Published As

Publication number Publication date
TWI463527B (zh) 2014-12-01
WO2006023753A3 (en) 2009-06-25
WO2006023753A2 (en) 2006-03-02
KR20070051337A (ko) 2007-05-17
TW200614329A (en) 2006-05-01
CN102790000B (zh) 2016-06-29
TWI502620B (zh) 2015-10-01
DE212005000047U1 (de) 2007-08-02
EP1799446A2 (en) 2007-06-27
TW201230144A (en) 2012-07-16
JP2008511141A (ja) 2008-04-10
AT10874U1 (de) 2009-11-15
CN102790000A (zh) 2012-11-21
KR20070048793A (ko) 2007-05-09

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