EP1799446A4 - System for thinning a semiconductor workpiece - Google Patents

System for thinning a semiconductor workpiece

Info

Publication number
EP1799446A4
EP1799446A4 EP20050789099 EP05789099A EP1799446A4 EP 1799446 A4 EP1799446 A4 EP 1799446A4 EP 20050789099 EP20050789099 EP 20050789099 EP 05789099 A EP05789099 A EP 05789099A EP 1799446 A4 EP1799446 A4 EP 1799446A4
Authority
EP
Grant status
Application
Patent type
Prior art keywords
system
thinning
semiconductor
workpiece
semiconductor workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP20050789099
Other languages
German (de)
French (fr)
Other versions
EP1799446A2 (en )
Inventor
Kert L Dolechek
Raymon F Thompson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Semitool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67126Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002Preparing wafers
    • H01L21/02005Preparing bulk and homogeneous wafers
    • H01L21/02035Shaping
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
EP20050789099 2004-08-20 2005-08-18 System for thinning a semiconductor workpiece Ceased EP1799446A4 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US10923363 US7288489B2 (en) 2004-08-20 2004-08-20 Process for thinning a semiconductor workpiece
US10922762 US20060040111A1 (en) 2004-08-20 2004-08-20 Process chamber and system for thinning a semiconductor workpiece
US10923436 US20060046499A1 (en) 2004-08-20 2004-08-20 Apparatus for use in thinning a semiconductor workpiece
US10923132 US7354649B2 (en) 2004-08-20 2004-08-20 Semiconductor workpiece
PCT/US2005/029598 WO2006023753A3 (en) 2004-08-20 2005-08-18 System for thinning a semiconductor workpiece

Publications (2)

Publication Number Publication Date
EP1799446A2 true EP1799446A2 (en) 2007-06-27
EP1799446A4 true true EP1799446A4 (en) 2010-03-03

Family

ID=35968220

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20050789099 Ceased EP1799446A4 (en) 2004-08-20 2005-08-18 System for thinning a semiconductor workpiece

Country Status (6)

Country Link
EP (1) EP1799446A4 (en)
JP (1) JP2008511141A (en)
KR (2) KR20070048793A (en)
CN (1) CN102790000B (en)
DE (1) DE212005000047U1 (en)
WO (1) WO2006023753A3 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8011513B2 (en) 2007-04-19 2011-09-06 Micron Technology, Inc. Semiconductor workpiece carriers and methods for processing semiconductor workpieces
DE102009037281B4 (en) * 2009-08-12 2013-05-08 Siltronic Ag A process for producing a polished wafer

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2024961A1 (en) * 1968-11-29 1970-09-04 Philips Nv
US4266334A (en) * 1979-07-25 1981-05-12 Rca Corporation Manufacture of thinned substrate imagers
JPH0684731A (en) * 1992-09-07 1994-03-25 Nec Kyushu Ltd Semiconductor wafer
EP1061584A2 (en) * 1999-06-17 2000-12-20 Intersil Corporation Self-supported ultra thin silicon wafer process
US20030119281A1 (en) * 2001-12-12 2003-06-26 Mikimasa Suzuki Method for manufacturing semiconductor power device
US20030215985A1 (en) * 2002-05-15 2003-11-20 Hitachi, Ltd. Semiconductor wafer and manufacturing method of semiconductor device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5011782A (en) * 1989-03-31 1991-04-30 Electric Power Research Institute Method of making passivated antireflective coating for photovoltaic cell
US6613681B1 (en) * 1998-08-28 2003-09-02 Micron Technology, Inc. Method of removing etch residues
US6248222B1 (en) * 1998-09-08 2001-06-19 Acm Research, Inc. Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
US6334453B1 (en) * 2000-02-14 2002-01-01 Semitool, Inc. Seal configuration for use with a motor drive assembly in a microelectronic workpiece processing system
EP1405336A2 (en) * 2000-12-04 2004-04-07 Ebara Corporation Substrate processing method
JP3899871B2 (en) * 2001-08-23 2007-03-28 株式会社デンソー Manufacturing method of an etching method and an etching apparatus, and a thin film sensor
JP3620528B2 (en) * 2001-12-12 2005-02-16 株式会社デンソー Manufacturing method of a semiconductor device
US20040074808A1 (en) * 2002-07-05 2004-04-22 Entegris, Inc. Fire retardant wafer carrier
US6940181B2 (en) * 2003-10-21 2005-09-06 Micron Technology, Inc. Thinned, strengthened semiconductor substrates and packages including same
US20050239295A1 (en) * 2004-04-27 2005-10-27 Wang Pei-L Chemical treatment of material surfaces

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2024961A1 (en) * 1968-11-29 1970-09-04 Philips Nv
US4266334A (en) * 1979-07-25 1981-05-12 Rca Corporation Manufacture of thinned substrate imagers
JPH0684731A (en) * 1992-09-07 1994-03-25 Nec Kyushu Ltd Semiconductor wafer
EP1061584A2 (en) * 1999-06-17 2000-12-20 Intersil Corporation Self-supported ultra thin silicon wafer process
US20030119281A1 (en) * 2001-12-12 2003-06-26 Mikimasa Suzuki Method for manufacturing semiconductor power device
US20030215985A1 (en) * 2002-05-15 2003-11-20 Hitachi, Ltd. Semiconductor wafer and manufacturing method of semiconductor device

Also Published As

Publication number Publication date Type
KR20070051337A (en) 2007-05-17 application
EP1799446A2 (en) 2007-06-27 application
CN102790000B (en) 2016-06-29 grant
KR20070048793A (en) 2007-05-09 application
DE212005000047U1 (en) 2007-08-02 grant
WO2006023753A3 (en) 2009-06-25 application
CN102790000A (en) 2012-11-21 application
WO2006023753A2 (en) 2006-03-02 application
JP2008511141A (en) 2008-04-10 application

Similar Documents

Publication Publication Date Title
GB2415656B (en) Hand tool machine
GB2420843B (en) Hand machine tool
GB2428609B (en) Chuck
GB2426805B (en) Machine tool
GB0506846D0 (en) Setting tool for hydraulically actuated devices
GB0517460D0 (en) Automatic tool release
GB0418069D0 (en) Method for reducing depolarization
GB0327610D0 (en) Device for returning workpieces
GB2448784B (en) Bolt-tightening tool
GB0513381D0 (en) Jig system
GB0319798D0 (en) A method for software distribution
GB2418282B (en) System for detecting a rollover
GB0422543D0 (en) "Gripping means"
GB0222317D0 (en) Turning device for a worktable connecting base
GB0411031D0 (en) A holder
GB0426825D0 (en) Package
GB0414984D0 (en) Package
GB0428018D0 (en) A laser machining apparatus
GB0525858D0 (en) A clamp arrangement
GB0511172D0 (en) Electric tool
GB0417759D0 (en) Bench
GB0403296D0 (en) A support for an iron
GB0417059D0 (en) Multiple chip semiconductor device
GB0415525D0 (en) System for providing secure access
GB0306765D0 (en) A tool for screeding

Legal Events

Date Code Title Description
17P Request for examination filed

Effective date: 20070316

AK Designated contracting states:

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent to

Countries concerned: ALBAHRMKYU

DAX Request for extension of the european patent (to any country) deleted
R17D Search report (correction)

Effective date: 20090625

RIC1 Classification (correction)

Ipc: B32B 13/04 20060101ALI20090702BHEP

Ipc: B32B 9/04 20060101ALI20090702BHEP

Ipc: H01L 21/461 20060101ALI20090702BHEP

Ipc: H01L 21/302 20060101ALI20090702BHEP

Ipc: H01L 21/36 20060101ALI20090702BHEP

Ipc: C23F 1/00 20060101AFI20090702BHEP

A4 Despatch of supplementary search report

Effective date: 20100122

RA4 Despatch of supplementary search report

Effective date: 20100129

RAP1 Transfer of rights of an ep published application

Owner name: APPLIED MATERIALS, INC.

REG Reference to a national code

Ref country code: DE

Ref legal event code: R003

18R Refused

Effective date: 20140227