Classifications

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  • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
  • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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  • H01L23/02—Containers; Seals
  • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
  • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
  • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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  • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
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  • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
  • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
  • H01L23/367—Cooling facilitated by shape of device
  • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
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  • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
  • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
  • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
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  • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
  • H01L23/49822—Multilayer substrates
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  • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
  • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
  • H01L25/165—Containers
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  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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  • H05K1/14—Structural association of two or more printed circuits
  • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
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  • H01L2224/02—Bonding areas; Manufacturing methods related thereto
  • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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  • H01L2224/10—Bump connectors; Manufacturing methods related thereto
  • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
  • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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  • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
  • H01L2224/732—Location after the connecting process
  • H01L2224/73251—Location after the connecting process on different surfaces
  • H01L2224/73253—Bump and layer connectors
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  • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
  • H01L23/64—Impedance arrangements
  • H01L23/66—High-frequency adaptations
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  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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  • H01L2924/097—Glass-ceramics, e.g. devitrified glass
  • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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  • H01L2924/11—Device type
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  • H01L2924/1423—Monolithic Microwave Integrated Circuit [MMIC]
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  • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
  • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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  • H01L2924/151—Die mounting substrate
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  • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
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  • H01L2924/161—Cap
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  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
  • H05K1/0203—Cooling of mounted components
  • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
  • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
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  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
  • H05K1/0298—Multilayer circuits
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  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/18—Printed circuits structurally associated with non-printed electric components
  • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
  • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
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  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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  • H05K2201/06—Thermal details
  • H05K2201/066—Heatsink mounted on the surface of the PCB
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  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
  • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
  • H05K3/341—Surface mounted components
  • H05K3/3431—Leadless components
  • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
  • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
  • H05K3/341—Surface mounted components
  • H05K3/3431—Leadless components
  • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers

Definitions

• the invention relates to an integrated circuit module having a carrier substrate with connections for electrically contacting the carrier substrate with a main circuit board and having at least one substrate electrically contacted with the carrier substrate and integrated in the carrier substrate, wherein the carrier substrate at least one of a Montage ⁇ surface for the main board adjacent cavity for receiving at least one semiconductor chip and in the cavity connecting contacts for associated terminals of the at least one semiconductor chip for electrical contacting of the semiconductor chip with the carrier substrate are vorgese ⁇ hen.
• the invention further relates to a multichip circuit module having a main circuit board, at least one carrier substrate mounted on the main circuit board and electrically contacted with the main circuit board and having at least one semiconductor chip on the carrier substrate for forming an integrated circuit module, wherein the semiconductor chip is electrically contacted with the carrier substrate in that the carrier substrate has at least one cavity for accommodating at least one semiconductor chip on a mounting surface for the motherboard, in the cavity are provided connection contacts for assigned connections of the at least one semiconductor chip for electrical contacting of the semiconductor chip to the carrier substrate and the mounting surface of the Carrier substrate is applied to a contact surface of the motherboard.
• Multichip circuit modules are sufficiently known for example from DE 100 1 1 005 A1 and DE 100 41 770 A1.
• high-frequency circuits in the frequency range up to 100 GHz are realized in the form of such multichip circuit modules.
• the multichip circuit modules consist here of a carrier substrate on which wire bonding or flip-chip technology individual semiconductor chips are mounted. Suitable semiconductor chips may be, for example, millimeter Wave Monolithic Integrated Circuits MMIC.
• the carrier substrate can furthermore have passive circuit components, for example on the surface or in deeper planes of the carrier substrate.
• the carrier substrate may be, for example, a multilayer ceramic, such. B. Low Temperature Cofired Ceramics LTCC.
• the carrier substrates with the passive and active circuit components in turn form submodules which are combined on a further substrate, the main board.
• the submodules are electrically connected to the motherboard and thus also to each other.
• the BaII-Gid-Array BGA connection technique from DE 199 31 004 A1 is known, for example.
• the multichip circuit module is then encapsulated with dielectric filling materials, as disclosed in DE 101 16 510 A1, or shielded with a metal housing, as described in DE 100 59 688 A1.
• EP 0 900 477 B1 describes an electronic component with surface wave filters, in which a carrier substrate is mounted in flip-chip technology on a motherboard. On the side of the carrier substrate facing away from the connection substrate between the carrier substrate and the motherboard, as far as the main circuit board, a metallic protective layer is applied directly, so that a tight seal is provided to the main circuit board.
• DE 196 40 192 A1 describes a method for bump-free flip-chip mounting of integrated circuits on a substrate using anisotropically conductive adhesives.
• JP 2003174141 A1 discloses a multichip circuit module in which a semiconductor chip is connected to bumps which are connected to connection contacts in cavities of the carrier substrate on a plane of a carrier substrate.
• the mounting surface of the carrier substrate is connected to the contact surface of a motherboard with intermediate filler material, so that the semiconductor chip is encapsulated.
• the object of the invention is therefore an improved integrated circuit module as well as an improved multichip circuit module with a to provide such integrated circuit module, which is hermetically gekap ⁇ Selt and still allows good heat dissipation.
• the object is achieved with the generic integrated circuit module as well as the generic multichip circuit module in that the carrier substrate is multilayer with interconnects extending transversely through several layers and the cavity in the multilayer spinach ⁇ substrate with a hermetic and thermally conductive cover ver ⁇ is closed ,
• the arrangement of the semiconductor chips in the cavity adjacent to the mounting surface for the motherboard ensures good immediate heat dissipation to the motherboard as well as hermetic encapsulation of the integrated circuit module by the hermetic and thermally conductive cover. It is thus essential that the cavity is immediately adjacent to the motherboard. It can be hermetically sealed by the cover in the production of the integrated circuit module after contacting the at least one semiconductor chip accommodated in the cavity, so that the integrated circuit module is protected and relatively robust.
• thermally conductive contact material is provided between the at least one semiconductor chip and the cover in the cavity.
• thermally conductive contact material is provided between the at least one semiconductor chip and the cover in the cavity.
• thermally conductive contact material zwi ⁇ tween the cover and the motherboard for direct thermal coupling of the cover is provided with the motherboard.
• thermal vias preferably adjacent to the cover and / or the heat-conductive contact material on the cover, can be provided for heat dissipation through the main circuit board to a heat sink of the main circuit board.
• the carrier substrate is preferably contacted directly with the motherboard, wherein the mounting surface of the carrier substrate is directly adjacent to the main circuit board.
• the carrier substrate can also be contacted with ball grid arrays with the motherboard.
• Ball-grid arrays are soldered connections with micro-solder balls, which are arranged in a field-like manner at contact points at contact points.
• the ball grid array soldering technique is well known from the micromachine technology.
• the carrier substrate can be embedded in a recess in the main circuit board and directly adjoin a heat sink of the main circuit board.
• the heat no longer has to, for example, by thermal vias through the electrically insulating
• Layer of the motherboard are passed to the heat sink, but can be removed directly.
• the electrical connection of the integrated circuit module to the motherboard can be done, for example, with a field coupling of the terminals of the carrier substrate to the motherboard.
• This field coupling can be realized with parallel or overlapping terminals of the carrier substrate and the motherboard.
• the carrier substrate can also have connections in the region of the contact surface of the main circuit board which are connected directly or with bonding connections to associated connections of the mainboard.
• Figure 1 cross-sectional view of a first embodiment of the inventive multi-chip circuit module
• Figure 2 cross-sectional view of a second embodiment of the multi-chip circuit module according to the invention with ball grid array contacts;
• FIG. 3 shows a cross-sectional view of a third embodiment of the multichip circuit module according to the invention with a carrier substrate and field coupling embedded in the main circuit board;
• FIG. 4 shows a cross-sectional view of a fourth embodiment of the multichip circuit module according to the invention with a carrier substrate embedded in the main circuit board and direct contacting.
• FIG. 1 shows a cross-sectional view of a first embodiment of a multi-chip circuit module 1 with an applied on a motherboard 2 integrated circuit module 3 recognize.
• the integrated circuit module 3 has a multilayer carrier substrate 4, in which passive components 5 can be integrated. Furthermore, hermetically encapsulated active or passive components 6, 7 can be mounted on the surface of the carrier substrate 4.
• At least one cavity 8 for receiving at least one semiconductor chip 9 on a mounting surface 10 of the carrier substrate 4 for the motherboard 2 is provided in the carrier substrate 4.
• the at least one building Element is electrically contacted with associated terminal contacts 1 1 a, 1 1 b of the carrier substrate 4 on the inside of the cavity 8.
• the cavity 8 is closed with a hermetic and thermally conductive cover 12.
• a hermetic and thermally conductive cover 12 In the manufacture of the integrated circuit module 3, it is already hermetically sealed with the cover 12, so that lower requirements for the mounting and mounting of the integrated circuit module 3 with the mainboard 2 must be made in the subsequent processing stages.
• the thermally conductive cover 12 also ensures good heat dissipation of the heat energy from the semiconductor chip 9 to the motherboard 2.
• the thermal coupling can with thermally conductive contact material 13a, 13b between the semiconductor chip 9 and the cover 12 and between the cover 12 and an electrically insulating Layer 14 of Haupt ⁇ board 2 can be improved. With the thermally conductive contact material 13a, 13b and height variations of the mounted semiconductor chip 9 can be compensated.
• the sealing between the cover 12 and the multilayer Suspray substrate 4 can be done with a hermetic seal 15, which is spielmik arranged on the peripheral edge of the cover 12.
• the motherboard 2 which is also poor thermal conductivity at the same time, to a heat sink 16 of the motherboard 2 can be improved with thermal vias 17, which is adjacent to the cover 12 through the electrically insulating layer 14 of the motherboard 2 extend to the heat sink 16.
• the integrated circuit module 3 is electrically connected by means of a direct contact 18 with the motherboard 2 and is substantially directly on the motherboard 2.
• FIG. 2 shows a second embodiment of the multichip circuit module 1, in which the integrated circuit module 3 does not rest directly on the substrate 2, but electrically by using a ball-grid array (BGA) 19 electrically with the main board 2 is contacted. This results in a distance between the integrated circuit module 3 and the main board 2, which is balanced with the heat-conductive contact material 13b.
• BGA ball-grid array
• FIG. 3 shows a third embodiment of the multi-chip circuit module 1, in which the hermetically sealed integrated circuit module 3 is embedded in a recess 20 of the main board 2, in particular in the electrically insulating layer 14.
• This has the advantage that the heat generated by the semiconductor chip 9 via the electrical contact material 13a, 13b and the cover 12 is guided directly into the heat sink 16 of the motherboard 2.
• the thermal impedance of the electrically insulating layer 14 of the motherboard and the thermal impedance of the thermal vias 17 in the path between the semiconductor chip 9 and heat sink 16 are thus eliminated.
• the integrated circuit module 3 can be connected via a parallel field coupling 21 a or a field coupling by overlapping 21 b to the motherboard 2.
• the parallel field coupling 21 a the zu ⁇ ordered electrical connections of the integrated circuit module 3 and the motherboard 2 are directly opposite with their ends, without touching and produce a direct electrical contact.
• the Field coupling by overlapping 21 b the terminals of the integrated circuit module and the motherboard 2 overlap, but without touching.
• FIG. 4 shows a fourth embodiment of the multichip
• Detect circuit module 1 wherein the integrated circuit module 3 is in turn recessed in a recess of the electrically insulating layer 14 of the motherboard 2.
• the electrical contacting of the integrated circuit module with the mainboard 2 takes place here by means of a bonding connection 22 or by means of direct contacting by overlapping connections 23 and optionally a direct contact 18.
• the illustrated with a thermally conductive cover 12 hermetically sealed multi-chip circuit modules 1 are due to the hermeti- see encapsulation of the embedded semiconductor chips 9 in the multi-layer Trä ⁇ gersubstrat 4 robust against environmental influences.
• the encapsulation already carried out prior to assembly of the integrated circuit module 3 on a carrier makes possible a simple storage, further processing and test possibility, for example burn-in. Due to the simultaneous good thermal dissipation use of power semiconductors in the integrated circuit module 3 is possible.
• the multi-chip circuit module 1 can also be produced inexpensively due to the compatibility with standard industrial processes. In addition, due to the freedom of design of the interface between the integrated circuit module 3 and the motherboard 2, application-adapted transitions are possible.

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• Power Engineering (AREA)
• Chemical & Material Sciences (AREA)
• Materials Engineering (AREA)
• Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
• Combinations Of Printed Boards (AREA)

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• 2004
  • 2004-09-23 US US11/573,015 patent/US20110169162A1/en not_active Abandoned
  • 2004-09-23 CN CNA2004800437836A patent/CN101002320A/zh active Pending
  • 2004-09-23 WO PCT/DE2004/002108 patent/WO2006032219A1/de active Application Filing
  • 2004-09-23 DE DE112004003016T patent/DE112004003016A5/de not_active Withdrawn
  • 2004-09-23 EP EP04786825A patent/EP1792344A1/de not_active Withdrawn

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