EP1695601A4 - Flachplatten-wärmetauscheinrichtung und herstellungsverfahren dafür - Google Patents

Flachplatten-wärmetauscheinrichtung und herstellungsverfahren dafür

Info

Publication number
EP1695601A4
EP1695601A4 EP04808415A EP04808415A EP1695601A4 EP 1695601 A4 EP1695601 A4 EP 1695601A4 EP 04808415 A EP04808415 A EP 04808415A EP 04808415 A EP04808415 A EP 04808415A EP 1695601 A4 EP1695601 A4 EP 1695601A4
Authority
EP
European Patent Office
Prior art keywords
manufacturing
same
heat transfer
flat plate
transfer device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04808415A
Other languages
English (en)
French (fr)
Other versions
EP1695601A1 (de
Inventor
Hyun-Tae Kim
Yong-Duck Lee
Min-Jung Oh
Sung-Wook Jang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LS Mtron Ltd
Original Assignee
LS Mtron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LS Mtron Ltd filed Critical LS Mtron Ltd
Publication of EP1695601A1 publication Critical patent/EP1695601A1/de
Publication of EP1695601A4 publication Critical patent/EP1695601A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
EP04808415A 2003-12-16 2004-12-14 Flachplatten-wärmetauscheinrichtung und herstellungsverfahren dafür Withdrawn EP1695601A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020030092088A KR100581115B1 (ko) 2003-12-16 2003-12-16 판형 열전달 장치 및 그 제조 방법
PCT/KR2004/003284 WO2005060325A1 (en) 2003-12-16 2004-12-14 Flat plate heat transfer device and method for manufacturing the same

Publications (2)

Publication Number Publication Date
EP1695601A1 EP1695601A1 (de) 2006-08-30
EP1695601A4 true EP1695601A4 (de) 2010-03-03

Family

ID=36693436

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04808415A Withdrawn EP1695601A4 (de) 2003-12-16 2004-12-14 Flachplatten-wärmetauscheinrichtung und herstellungsverfahren dafür

Country Status (7)

Country Link
US (1) US20070163755A1 (de)
EP (1) EP1695601A4 (de)
JP (1) JP2007519877A (de)
KR (1) KR100581115B1 (de)
CN (1) CN1895011A (de)
TW (1) TWI266851B (de)
WO (1) WO2005060325A1 (de)

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TWM299458U (en) 2006-04-21 2006-10-11 Taiwan Microloops Corp Heat spreader with composite micro-structure
KR100809587B1 (ko) * 2007-02-02 2008-03-04 이용덕 판형 열전달장치
CN101014235A (zh) * 2007-02-09 2007-08-08 广州恩诺吉电子科技有限公司 一种均温传热装置及其制造方法
TW200912237A (en) * 2007-09-13 2009-03-16 Univ Tamkang Thermal spreader with enhancement of support strength and capillarity
TWM347809U (en) * 2008-05-26 2008-12-21 Xu xiu cang Fast temperature-averaging heat conductive device
US8596341B2 (en) * 2008-06-05 2013-12-03 Battelle Memorial Institute Enhanced two phase flow in heat transfer systems
JP4737285B2 (ja) * 2008-12-24 2011-07-27 ソニー株式会社 熱輸送デバイス及び電子機器
JP4706754B2 (ja) * 2008-12-24 2011-06-22 ソニー株式会社 熱輸送デバイス及び電子機器
JP4811460B2 (ja) * 2008-12-24 2011-11-09 ソニー株式会社 熱輸送デバイス及び電子機器
US20100200197A1 (en) 2009-02-09 2010-08-12 International Business Machines Corporation Liquid cooled compliant heat sink and related method
US8579018B1 (en) 2009-03-23 2013-11-12 Hrl Laboratories, Llc Lightweight sandwich panel heat pipe
US8587944B2 (en) * 2009-04-01 2013-11-19 Harris Corporation Multi-layer mesh wicks for heat pipes
WO2010123210A2 (ko) * 2009-04-21 2010-10-28 주식회사 유나티앤이 냉각장치를 구비한 태양광 모듈 및 그 냉각장치 제조방법
US8573289B1 (en) 2009-07-20 2013-11-05 Hrl Laboratories, Llc Micro-architected materials for heat exchanger applications
US8453717B1 (en) 2009-07-20 2013-06-04 Hrl Laboratories, Llc Micro-architected materials for heat sink applications
JP2011085311A (ja) * 2009-10-15 2011-04-28 Sony Corp 熱輸送デバイス、熱輸送デバイスの製造方法及び電子機器
CN102042776A (zh) * 2009-10-16 2011-05-04 富准精密工业(深圳)有限公司 回路热管
US9546826B1 (en) 2010-01-21 2017-01-17 Hrl Laboratories, Llc Microtruss based thermal heat spreading structures
US8921702B1 (en) 2010-01-21 2014-12-30 Hrl Laboratories, Llc Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments
US8857182B1 (en) 2010-05-19 2014-10-14 Hrl Laboratories, Llc Power generation through artificial transpiration
US8771330B1 (en) 2010-05-19 2014-07-08 Hrl Laboratories, Llc Personal artificial transpiration cooling system
US20120031587A1 (en) * 2010-08-05 2012-02-09 Kunshan Jue-Choung Electronics Co., Ltd. Capillary structure of heat plate
CN102469744A (zh) * 2010-11-09 2012-05-23 富准精密工业(深圳)有限公司 平板式热管
KR101239172B1 (ko) * 2011-08-16 2013-03-05 주식회사 에이디티 다방향 방열판
TWI530654B (zh) * 2011-12-26 2016-04-21 鴻準精密工業股份有限公司 扁平熱管
US20130213609A1 (en) * 2012-02-22 2013-08-22 Chun-Ming Wu Heat pipe structure
TWI457528B (zh) * 2012-03-22 2014-10-21 Foxconn Tech Co Ltd 扁平熱管
CN103363829B (zh) * 2012-04-03 2016-12-28 富瑞精密组件（昆山）有限公司 热管
WO2013157535A1 (ja) * 2012-04-16 2013-10-24 古河電気工業株式会社 ヒートパイプ
US9405067B2 (en) 2013-03-13 2016-08-02 Hrl Laboratories, Llc Micro-truss materials having in-plane material property variations
US9435590B2 (en) * 2014-04-07 2016-09-06 Microsoft Technology Licensing, Llc Thin heat transfer device for thermal management
GB2525203A (en) * 2014-04-15 2015-10-21 Pa Knowledge Ltd Radiator
US10458716B2 (en) * 2014-11-04 2019-10-29 Roccor, Llc Conformal thermal ground planes
KR101661958B1 (ko) * 2014-12-22 2016-10-10 엘지전자 주식회사 인쇄회로기판 및 인쇄회로기판을 포함하는 모터구동장치
JP2018523088A (ja) * 2015-07-27 2018-08-16 金積徳 ベイパーチャンバー
JP6216838B1 (ja) * 2016-06-28 2017-10-18 株式会社フジクラ 放熱モジュール及びその製造方法
JP6291000B2 (ja) * 2016-09-01 2018-03-07 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
JP2021036175A (ja) 2017-09-29 2021-03-04 株式会社村田製作所 ベーパーチャンバー
JP6588599B1 (ja) * 2018-05-29 2019-10-09 古河電気工業株式会社 ベーパーチャンバ
TWI727194B (zh) * 2018-08-09 2021-05-11 奇鋐科技股份有限公司 散熱單元
US20200166293A1 (en) * 2018-11-27 2020-05-28 Hamilton Sundstrand Corporation Weaved cross-flow heat exchanger and method of forming a heat exchanger
CN110763061A (zh) * 2019-10-31 2020-02-07 东莞市合众导热科技有限公司 一种均热板及其加工方法
KR102488227B1 (ko) * 2019-11-11 2023-01-13 주식회사 아모그린텍 시트형 히트 파이프 및 그 제조방법
KR102447779B1 (ko) * 2019-11-11 2022-09-27 주식회사 아모그린텍 시트형 히트 파이프 및 그 제조방법
CN211656734U (zh) * 2020-01-13 2020-10-09 昇印光电（昆山）股份有限公司 一种散热组件及搭载其的电子设备
US20210247147A1 (en) * 2020-02-09 2021-08-12 Unimicron Technology Corp. Vapor chamber structure and manufacturing method thereof
US11060799B1 (en) * 2020-03-24 2021-07-13 Taiwan Microloops Corp. Vapor chamber structure
KR200496380Y1 (ko) * 2020-06-19 2023-01-13 셴젠 유라이크 스마트 일렉트로닉스 컴퍼니 리미티드 탈모기
WO2021253682A1 (zh) * 2020-06-19 2021-12-23 深圳由莱智能电子有限公司 脱毛仪
KR20220011550A (ko) * 2020-07-21 2022-01-28 삼성전자주식회사 방열 구조물 및 그 방열 구조물을 포함하는 전자 장치
KR102667435B1 (ko) * 2020-08-14 2024-05-21 주식회사 피엠모터스 배터리팩 방열 장치 및 그 제조 방법
TWI813936B (zh) * 2021-01-20 2023-09-01 奕昌有限公司 散熱件
US20220243994A1 (en) * 2021-02-04 2022-08-04 Northrop Grumman Systems Corporation Metal woodpile capillary wick
US20220404101A1 (en) * 2021-06-18 2022-12-22 Ming-Cheng Chen Heat dissipation net
CN114199057A (zh) * 2021-12-23 2022-03-18 特能(厦门)超导科技有限公司 一种均温板装置及其生产方法
CN114894015B (zh) * 2022-03-24 2023-09-26 山东大学 一种热管均温板及其换热系统
JP7362854B1 (ja) * 2022-07-28 2023-10-17 レノボ・シンガポール・プライベート・リミテッド 放熱構造および電子機器

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7515197A (nl) * 1975-04-10 1976-10-12 Siemens Ag Warmtebuis.
SU1673824A1 (ru) * 1989-02-07 1991-08-30 Уральский политехнический институт им.С.М.Кирова Плоска теплова труба
US20020056542A1 (en) * 1995-12-21 2002-05-16 Masaaki Yamamoto Flat type heat pipe
US20020124995A1 (en) * 2001-03-09 2002-09-12 Seok-Hwan Moon Heat pipe having woven-wire wick and straight-wire wick
US20020189793A1 (en) * 1999-09-07 2002-12-19 Hajime Noda Wick, plate type heat pipe and container

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US3576210A (en) * 1969-12-15 1971-04-27 Donald S Trent Heat pipe
US3681843A (en) * 1970-03-06 1972-08-08 Westinghouse Electric Corp Heat pipe wick fabrication
US3834457A (en) * 1971-01-18 1974-09-10 Bendix Corp Laminated heat pipe and method of manufacture
US3754594A (en) * 1972-01-24 1973-08-28 Sanders Associates Inc Unilateral heat transfer apparatus
US4557413A (en) * 1984-04-11 1985-12-10 Mcdonnell Douglas Heat pipe fabrication
US5076352A (en) * 1991-02-08 1991-12-31 Thermacore, Inc. High permeability heat pipe wick structure
US6097602A (en) * 1998-06-23 2000-08-01 Marian, Inc. Integrated circuit package heat sink attachment
JP2000161878A (ja) * 1998-11-30 2000-06-16 Furukawa Electric Co Ltd:The 平面型ヒートパイプ
JP2001183080A (ja) * 1999-12-24 2001-07-06 Furukawa Electric Co Ltd:The 圧縮メッシュウイックの製造方法、および、圧縮メッシュウイックを備えた平面型ヒートパイプ
US6446706B1 (en) * 2000-07-25 2002-09-10 Thermal Corp. Flexible heat pipe
US6631078B2 (en) * 2002-01-10 2003-10-07 International Business Machines Corporation Electronic package with thermally conductive standoff
US6778398B2 (en) * 2002-10-24 2004-08-17 Koninklijke Philips Electronics N.V. Thermal-conductive substrate package

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7515197A (nl) * 1975-04-10 1976-10-12 Siemens Ag Warmtebuis.
SU1673824A1 (ru) * 1989-02-07 1991-08-30 Уральский политехнический институт им.С.М.Кирова Плоска теплова труба
US20020056542A1 (en) * 1995-12-21 2002-05-16 Masaaki Yamamoto Flat type heat pipe
US20020189793A1 (en) * 1999-09-07 2002-12-19 Hajime Noda Wick, plate type heat pipe and container
US20020124995A1 (en) * 2001-03-09 2002-09-12 Seok-Hwan Moon Heat pipe having woven-wire wick and straight-wire wick

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
DOLGIREV YU E ET AL: "Flat heat pipe - has capillary-porous structure forming slot in central part of housing which houses mesh layer", WPI/THOMSON,, vol. 1992, no. 42, 30 August 1991 (1991-08-30), XP002506755 *
HAN JAE SEOP ET AL: "Heat Pipe with Braiding Wick Structure", EPODOC,, 15 December 1999 (1999-12-15), XP002506754 *

Also Published As

Publication number Publication date
EP1695601A1 (de) 2006-08-30
KR20050060461A (ko) 2005-06-22
WO2005060325A1 (en) 2005-06-30
TWI266851B (en) 2006-11-21
CN1895011A (zh) 2007-01-10
TW200523518A (en) 2005-07-16
US20070163755A1 (en) 2007-07-19
JP2007519877A (ja) 2007-07-19
KR100581115B1 (ko) 2006-05-16

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Effective date: 20060612

AK Designated contracting states

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Designated state(s): DE FR GB IT

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: LS MTRON, LTD.

A4 Supplementary search report drawn up and despatched

Effective date: 20100128

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 23/427 20060101ALI20100122BHEP

Ipc: H05K 7/20 20060101AFI20050712BHEP

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