TWI266851B - Flat plate heat transfer device and method for manufacturing the same - Google Patents

Flat plate heat transfer device and method for manufacturing the same

Info

Publication number
TWI266851B
TWI266851B TW093138754A TW93138754A TWI266851B TW I266851 B TWI266851 B TW I266851B TW 093138754 A TW093138754 A TW 093138754A TW 93138754 A TW93138754 A TW 93138754A TW I266851 B TWI266851 B TW I266851B
Authority
TW
Taiwan
Prior art keywords
heat
mesh
emitting unit
wires
heat transfer
Prior art date
Application number
TW093138754A
Other languages
English (en)
Chinese (zh)
Other versions
TW200523518A (en
Inventor
Yong-Duck Lee
Min-Jung Oh
Hyun-Tae Kim
Sung-Wook Jang
Original Assignee
Lg Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Cable Ltd filed Critical Lg Cable Ltd
Publication of TW200523518A publication Critical patent/TW200523518A/zh
Application granted granted Critical
Publication of TWI266851B publication Critical patent/TWI266851B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW093138754A 2003-12-16 2004-12-14 Flat plate heat transfer device and method for manufacturing the same TWI266851B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020030092088A KR100581115B1 (ko) 2003-12-16 2003-12-16 판형 열전달 장치 및 그 제조 방법

Publications (2)

Publication Number Publication Date
TW200523518A TW200523518A (en) 2005-07-16
TWI266851B true TWI266851B (en) 2006-11-21

Family

ID=36693436

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093138754A TWI266851B (en) 2003-12-16 2004-12-14 Flat plate heat transfer device and method for manufacturing the same

Country Status (7)

Country Link
US (1) US20070163755A1 (de)
EP (1) EP1695601A4 (de)
JP (1) JP2007519877A (de)
KR (1) KR100581115B1 (de)
CN (1) CN1895011A (de)
TW (1) TWI266851B (de)
WO (1) WO2005060325A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI727194B (zh) * 2018-08-09 2021-05-11 奇鋐科技股份有限公司 散熱單元

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KR101239172B1 (ko) * 2011-08-16 2013-03-05 주식회사 에이디티 다방향 방열판
TWI530654B (zh) * 2011-12-26 2016-04-21 鴻準精密工業股份有限公司 扁平熱管
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TWI457528B (zh) * 2012-03-22 2014-10-21 Foxconn Tech Co Ltd 扁平熱管
CN103363829B (zh) * 2012-04-03 2016-12-28 富瑞精密组件（昆山）有限公司 热管
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JP2018523088A (ja) * 2015-07-27 2018-08-16 金積徳 ベイパーチャンバー
JP6216838B1 (ja) * 2016-06-28 2017-10-18 株式会社フジクラ 放熱モジュール及びその製造方法
JP6291000B2 (ja) * 2016-09-01 2018-03-07 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
JP2021036175A (ja) 2017-09-29 2021-03-04 株式会社村田製作所 ベーパーチャンバー
JP6588599B1 (ja) * 2018-05-29 2019-10-09 古河電気工業株式会社 ベーパーチャンバ
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CN110763061A (zh) * 2019-10-31 2020-02-07 东莞市合众导热科技有限公司 一种均热板及其加工方法
KR102488227B1 (ko) * 2019-11-11 2023-01-13 주식회사 아모그린텍 시트형 히트 파이프 및 그 제조방법
KR102447779B1 (ko) * 2019-11-11 2022-09-27 주식회사 아모그린텍 시트형 히트 파이프 및 그 제조방법
CN211656734U (zh) * 2020-01-13 2020-10-09 昇印光电（昆山）股份有限公司 一种散热组件及搭载其的电子设备
US20210247147A1 (en) * 2020-02-09 2021-08-12 Unimicron Technology Corp. Vapor chamber structure and manufacturing method thereof
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KR200496380Y1 (ko) * 2020-06-19 2023-01-13 셴젠 유라이크 스마트 일렉트로닉스 컴퍼니 리미티드 탈모기
WO2021253682A1 (zh) * 2020-06-19 2021-12-23 深圳由莱智能电子有限公司 脱毛仪
KR20220011550A (ko) * 2020-07-21 2022-01-28 삼성전자주식회사 방열 구조물 및 그 방열 구조물을 포함하는 전자 장치
KR102667435B1 (ko) * 2020-08-14 2024-05-21 주식회사 피엠모터스 배터리팩 방열 장치 및 그 제조 방법
TWI813936B (zh) * 2021-01-20 2023-09-01 奕昌有限公司 散熱件
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Publication number Priority date Publication date Assignee Title
TWI727194B (zh) * 2018-08-09 2021-05-11 奇鋐科技股份有限公司 散熱單元

Also Published As

Publication number Publication date
EP1695601A1 (de) 2006-08-30
KR20050060461A (ko) 2005-06-22
WO2005060325A1 (en) 2005-06-30
CN1895011A (zh) 2007-01-10
TW200523518A (en) 2005-07-16
EP1695601A4 (de) 2010-03-03
US20070163755A1 (en) 2007-07-19
JP2007519877A (ja) 2007-07-19
KR100581115B1 (ko) 2006-05-16

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