HK1089513A1 - Heating plate and manufacturing method thereof - Google Patents
Heating plate and manufacturing method thereofInfo
- Publication number
- HK1089513A1 HK1089513A1 HK06111147.3A HK06111147A HK1089513A1 HK 1089513 A1 HK1089513 A1 HK 1089513A1 HK 06111147 A HK06111147 A HK 06111147A HK 1089513 A1 HK1089513 A1 HK 1089513A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- manufacturing
- heating plate
- heating
- plate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004295701A JP4838992B2 (en) | 2004-10-08 | 2004-10-08 | Heater plate and heater plate manufacturing method |
JP2004295702A JP4806179B2 (en) | 2004-10-08 | 2004-10-08 | Heater plate manufacturing method |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1089513A1 true HK1089513A1 (en) | 2006-12-01 |
Family
ID=37141314
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK06111147.3A HK1089513A1 (en) | 2004-10-08 | 2006-10-11 | Heating plate and manufacturing method thereof |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR101164186B1 (en) |
HK (1) | HK1089513A1 (en) |
TW (1) | TWI429314B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8263908B2 (en) | 2004-10-08 | 2012-09-11 | Furukawa-Sky Aluminum Corp. | Heater plate and a method for manufacturing the heater plate |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4942385B2 (en) * | 2006-04-25 | 2012-05-30 | 東芝三菱電機産業システム株式会社 | Soaking equipment |
KR100831241B1 (en) * | 2006-12-28 | 2008-05-22 | 주식회사 단성일렉트론 | Manufacturing method for susceptor and susceptor using this method |
KR100780749B1 (en) * | 2006-12-28 | 2007-11-30 | 주식회사 단성일렉트론 | Manufacturing method for susceptor and susceptor using this method |
JP6948832B2 (en) * | 2017-05-22 | 2021-10-13 | 株式会社Uacj鋳鍛 | Heat transfer plate for vacuum equipment and its manufacturing method |
KR102351319B1 (en) * | 2021-05-25 | 2022-01-17 | 주식회사 기가레인 | Heating assembly |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000068037A (en) * | 1998-08-18 | 2000-03-03 | Sakaguchi Dennetsu Kk | Plate heater |
JP2001176645A (en) * | 1999-12-21 | 2001-06-29 | Keihin Sokki Kk | Heater plate and its manufacturing method |
JP4385533B2 (en) * | 2001-03-02 | 2009-12-16 | 日本軽金属株式会社 | Manufacturing method of heat plate |
JP4805466B2 (en) * | 2001-03-14 | 2011-11-02 | 古河スカイ株式会社 | Method for manufacturing a heater plate provided with a sheath heater |
-
2004
- 2004-12-23 KR KR1020040110895A patent/KR101164186B1/en active IP Right Grant
-
2005
- 2005-02-25 TW TW094105906A patent/TWI429314B/en active
-
2006
- 2006-10-11 HK HK06111147.3A patent/HK1089513A1/en unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8263908B2 (en) | 2004-10-08 | 2012-09-11 | Furukawa-Sky Aluminum Corp. | Heater plate and a method for manufacturing the heater plate |
Also Published As
Publication number | Publication date |
---|---|
KR20060031581A (en) | 2006-04-12 |
TW200612769A (en) | 2006-04-16 |
TWI429314B (en) | 2014-03-01 |
KR101164186B1 (en) | 2012-07-10 |
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