EP1695601A4 - Flat plate heat transfer device and method for manufacturing the same - Google Patents

Flat plate heat transfer device and method for manufacturing the same

Info

Publication number
EP1695601A4
EP1695601A4 EP04808415A EP04808415A EP1695601A4 EP 1695601 A4 EP1695601 A4 EP 1695601A4 EP 04808415 A EP04808415 A EP 04808415A EP 04808415 A EP04808415 A EP 04808415A EP 1695601 A4 EP1695601 A4 EP 1695601A4
Authority
EP
European Patent Office
Prior art keywords
manufacturing
same
heat transfer
flat plate
transfer device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04808415A
Other languages
German (de)
French (fr)
Other versions
EP1695601A1 (en
Inventor
Hyun-Tae Kim
Yong-Duck Lee
Min-Jung Oh
Sung-Wook Jang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LS Mtron Ltd
Original Assignee
LS Mtron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LS Mtron Ltd filed Critical LS Mtron Ltd
Publication of EP1695601A1 publication Critical patent/EP1695601A1/en
Publication of EP1695601A4 publication Critical patent/EP1695601A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
EP04808415A 2003-12-16 2004-12-14 Flat plate heat transfer device and method for manufacturing the same Withdrawn EP1695601A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020030092088A KR100581115B1 (en) 2003-12-16 2003-12-16 Flat plate heat transferring apparatus and Method for manufacturing the same
PCT/KR2004/003284 WO2005060325A1 (en) 2003-12-16 2004-12-14 Flat plate heat transfer device and method for manufacturing the same

Publications (2)

Publication Number Publication Date
EP1695601A1 EP1695601A1 (en) 2006-08-30
EP1695601A4 true EP1695601A4 (en) 2010-03-03

Family

ID=36693436

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04808415A Withdrawn EP1695601A4 (en) 2003-12-16 2004-12-14 Flat plate heat transfer device and method for manufacturing the same

Country Status (7)

Country Link
US (1) US20070163755A1 (en)
EP (1) EP1695601A4 (en)
JP (1) JP2007519877A (en)
KR (1) KR100581115B1 (en)
CN (1) CN1895011A (en)
TW (1) TWI266851B (en)
WO (1) WO2005060325A1 (en)

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KR100775013B1 (en) * 2006-04-18 2007-11-09 (주)셀시아테크놀러지스한국 Flat type heat transfer device
TWM299458U (en) 2006-04-21 2006-10-11 Taiwan Microloops Corp Heat spreader with composite micro-structure
KR100809587B1 (en) * 2007-02-02 2008-03-04 이용덕 Plate heat transfer device
CN101014235A (en) * 2007-02-09 2007-08-08 广州恩诺吉电子科技有限公司 Apparatus of uniform heat transfer and method of manufacturing the same
TW200912237A (en) * 2007-09-13 2009-03-16 Univ Tamkang Thermal spreader with enhancement of support strength and capillarity
TWM347809U (en) * 2008-05-26 2008-12-21 Xu xiu cang Fast temperature-averaging heat conductive device
US8596341B2 (en) * 2008-06-05 2013-12-03 Battelle Memorial Institute Enhanced two phase flow in heat transfer systems
JP4811460B2 (en) * 2008-12-24 2011-11-09 ソニー株式会社 Heat transport device and electronic equipment
JP4737285B2 (en) * 2008-12-24 2011-07-27 ソニー株式会社 Heat transport device and electronic equipment
JP4706754B2 (en) * 2008-12-24 2011-06-22 ソニー株式会社 Heat transport device and electronic equipment
US20100200197A1 (en) 2009-02-09 2010-08-12 International Business Machines Corporation Liquid cooled compliant heat sink and related method
US8579018B1 (en) 2009-03-23 2013-11-12 Hrl Laboratories, Llc Lightweight sandwich panel heat pipe
US8587944B2 (en) 2009-04-01 2013-11-19 Harris Corporation Multi-layer mesh wicks for heat pipes
JP2012524998A (en) * 2009-04-21 2012-10-18 ユナ ティーアンドイー カンパニーリミテッド Solar module with cooling device and method of manufacturing the same
US8453717B1 (en) 2009-07-20 2013-06-04 Hrl Laboratories, Llc Micro-architected materials for heat sink applications
US8573289B1 (en) 2009-07-20 2013-11-05 Hrl Laboratories, Llc Micro-architected materials for heat exchanger applications
JP2011085311A (en) * 2009-10-15 2011-04-28 Sony Corp Heat transport device, method for manufacturing heat transport device and electronic device
CN102042776A (en) * 2009-10-16 2011-05-04 富准精密工业(深圳)有限公司 Loop heat pipe
US9546826B1 (en) 2010-01-21 2017-01-17 Hrl Laboratories, Llc Microtruss based thermal heat spreading structures
US8921702B1 (en) 2010-01-21 2014-12-30 Hrl Laboratories, Llc Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments
US8857182B1 (en) 2010-05-19 2014-10-14 Hrl Laboratories, Llc Power generation through artificial transpiration
US8771330B1 (en) 2010-05-19 2014-07-08 Hrl Laboratories, Llc Personal artificial transpiration cooling system
US20120031587A1 (en) * 2010-08-05 2012-02-09 Kunshan Jue-Choung Electronics Co., Ltd. Capillary structure of heat plate
CN102469744A (en) * 2010-11-09 2012-05-23 富准精密工业(深圳)有限公司 Flat plate type heat pipe
KR101239172B1 (en) * 2011-08-16 2013-03-05 주식회사 에이디티 Multi directional cooling panel
TWI530654B (en) * 2011-12-26 2016-04-21 鴻準精密工業股份有限公司 Plate type heat pipe
US20130213609A1 (en) * 2012-02-22 2013-08-22 Chun-Ming Wu Heat pipe structure
TWI457528B (en) * 2012-03-22 2014-10-21 Foxconn Tech Co Ltd Plate type heat pipe
CN103363829B (en) * 2012-04-03 2016-12-28 富瑞精密组件（昆山）有限公司 Heat pipe
KR101642625B1 (en) * 2012-04-16 2016-07-25 후루카와 덴키 고교 가부시키가이샤 Heat pipe
US9405067B2 (en) 2013-03-13 2016-08-02 Hrl Laboratories, Llc Micro-truss materials having in-plane material property variations
US9435590B2 (en) * 2014-04-07 2016-09-06 Microsoft Technology Licensing, Llc Thin heat transfer device for thermal management
GB2525203A (en) * 2014-04-15 2015-10-21 Pa Knowledge Ltd Radiator
US10458716B2 (en) * 2014-11-04 2019-10-29 Roccor, Llc Conformal thermal ground planes
KR101661958B1 (en) * 2014-12-22 2016-10-10 엘지전자 주식회사 Printed circuit board and motor drive apparatus including the printed circuit board
JP2018523088A (en) * 2015-07-27 2018-08-16 金積徳 Vapor chamber
JP6216838B1 (en) * 2016-06-28 2017-10-18 株式会社フジクラ Heat dissipation module and manufacturing method thereof
JP6291000B2 (en) * 2016-09-01 2018-03-07 新光電気工業株式会社 Loop heat pipe and manufacturing method thereof
JP2021036175A (en) 2017-09-29 2021-03-04 株式会社村田製作所 Vapor chamber
JP6588599B1 (en) * 2018-05-29 2019-10-09 古河電気工業株式会社 Vapor chamber
TWI727194B (en) * 2018-08-09 2021-05-11 奇鋐科技股份有限公司 Heat dissipation unit
US20200166293A1 (en) * 2018-11-27 2020-05-28 Hamilton Sundstrand Corporation Weaved cross-flow heat exchanger and method of forming a heat exchanger
CN110763061A (en) * 2019-10-31 2020-02-07 东莞市合众导热科技有限公司 Vapor chamber and processing method thereof
KR102488227B1 (en) * 2019-11-11 2023-01-13 주식회사 아모그린텍 Sheet type heat pipe and manufacturing method thereof
KR102447779B1 (en) * 2019-11-11 2022-09-27 주식회사 아모그린텍 Sheet type heat pipe and manufacturing method thereof
CN211656735U (en) * 2020-01-13 2020-10-09 昇印光电（昆山）股份有限公司 Heat dissipation assembly and electronic equipment carrying same
US20210247147A1 (en) * 2020-02-09 2021-08-12 Unimicron Technology Corp. Vapor chamber structure and manufacturing method thereof
US11060799B1 (en) * 2020-03-24 2021-07-13 Taiwan Microloops Corp. Vapor chamber structure
JP3242510U (en) * 2020-06-19 2023-06-22 深▲せん▼由莱智能電子有限公司 epilator
WO2021253682A1 (en) * 2020-06-19 2021-12-23 深圳由莱智能电子有限公司 Hair removal device
KR20220011550A (en) * 2020-07-21 2022-01-28 삼성전자주식회사 Heat dissipation structure and electronic device comprising thereof
TWI813936B (en) * 2021-01-20 2023-09-01 奕昌有限公司 Heat sink
US20220243994A1 (en) * 2021-02-04 2022-08-04 Northrop Grumman Systems Corporation Metal woodpile capillary wick
US20220404101A1 (en) * 2021-06-18 2022-12-22 Ming-Cheng Chen Heat dissipation net
CN114199057A (en) * 2021-12-23 2022-03-18 特能(厦门)超导科技有限公司 Temperature-uniforming plate device and production method thereof
CN114894015B (en) * 2022-03-24 2023-09-26 山东大学 Heat pipe temperature equalizing plate and heat exchange system thereof
JP7362854B1 (en) * 2022-07-28 2023-10-17 レノボ・シンガポール・プライベート・リミテッド Heat dissipation structure and electronic equipment

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7515197A (en) * 1975-04-10 1976-10-12 Siemens Ag HEAT TUBE.
SU1673824A1 (en) * 1989-02-07 1991-08-30 Уральский политехнический институт им.С.М.Кирова Flat thermal pipe
US20020056542A1 (en) * 1995-12-21 2002-05-16 Masaaki Yamamoto Flat type heat pipe
US20020124995A1 (en) * 2001-03-09 2002-09-12 Seok-Hwan Moon Heat pipe having woven-wire wick and straight-wire wick
US20020189793A1 (en) * 1999-09-07 2002-12-19 Hajime Noda Wick, plate type heat pipe and container

Family Cites Families (12)

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US3576210A (en) * 1969-12-15 1971-04-27 Donald S Trent Heat pipe
US3681843A (en) * 1970-03-06 1972-08-08 Westinghouse Electric Corp Heat pipe wick fabrication
US3834457A (en) * 1971-01-18 1974-09-10 Bendix Corp Laminated heat pipe and method of manufacture
US3754594A (en) * 1972-01-24 1973-08-28 Sanders Associates Inc Unilateral heat transfer apparatus
US4557413A (en) * 1984-04-11 1985-12-10 Mcdonnell Douglas Heat pipe fabrication
US5076352A (en) * 1991-02-08 1991-12-31 Thermacore, Inc. High permeability heat pipe wick structure
US6097602A (en) * 1998-06-23 2000-08-01 Marian, Inc. Integrated circuit package heat sink attachment
JP2000161878A (en) * 1998-11-30 2000-06-16 Furukawa Electric Co Ltd:The Planar heat pipe
JP2001183080A (en) * 1999-12-24 2001-07-06 Furukawa Electric Co Ltd:The Method for manufacturing compressed mesh wick and flat surface type heat pipe having compressed mesh wick
US6446706B1 (en) * 2000-07-25 2002-09-10 Thermal Corp. Flexible heat pipe
US6631078B2 (en) * 2002-01-10 2003-10-07 International Business Machines Corporation Electronic package with thermally conductive standoff
US6778398B2 (en) * 2002-10-24 2004-08-17 Koninklijke Philips Electronics N.V. Thermal-conductive substrate package

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7515197A (en) * 1975-04-10 1976-10-12 Siemens Ag HEAT TUBE.
SU1673824A1 (en) * 1989-02-07 1991-08-30 Уральский политехнический институт им.С.М.Кирова Flat thermal pipe
US20020056542A1 (en) * 1995-12-21 2002-05-16 Masaaki Yamamoto Flat type heat pipe
US20020189793A1 (en) * 1999-09-07 2002-12-19 Hajime Noda Wick, plate type heat pipe and container
US20020124995A1 (en) * 2001-03-09 2002-09-12 Seok-Hwan Moon Heat pipe having woven-wire wick and straight-wire wick

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
DOLGIREV YU E ET AL: "Flat heat pipe - has capillary-porous structure forming slot in central part of housing which houses mesh layer", WPI/THOMSON,, vol. 1992, no. 42, 30 August 1991 (1991-08-30), XP002506755 *
HAN JAE SEOP ET AL: "Heat Pipe with Braiding Wick Structure", EPODOC,, 15 December 1999 (1999-12-15), XP002506754 *

Also Published As

Publication number Publication date
KR20050060461A (en) 2005-06-22
JP2007519877A (en) 2007-07-19
TW200523518A (en) 2005-07-16
CN1895011A (en) 2007-01-10
US20070163755A1 (en) 2007-07-19
WO2005060325A1 (en) 2005-06-30
TWI266851B (en) 2006-11-21
KR100581115B1 (en) 2006-05-16
EP1695601A1 (en) 2006-08-30

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20060612

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): DE FR GB IT

DAX Request for extension of the european patent (deleted)
RBV Designated contracting states (corrected)

Designated state(s): DE FR GB IT

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: LS MTRON, LTD.

A4 Supplementary search report drawn up and despatched

Effective date: 20100128

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 23/427 20060101ALI20100122BHEP

Ipc: H05K 7/20 20060101AFI20050712BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20100427