TWI727194B - Heat dissipation unit - Google Patents
Heat dissipation unit Download PDFInfo
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- TWI727194B TWI727194B TW107127830A TW107127830A TWI727194B TW I727194 B TWI727194 B TW I727194B TW 107127830 A TW107127830 A TW 107127830A TW 107127830 A TW107127830 A TW 107127830A TW I727194 B TWI727194 B TW I727194B
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- lower plate
- heat dissipation
- capillary structure
- dissipation unit
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
一種散熱單元,尤指一種具有複數種類毛細結構作為提升回水效 率及含水量的散熱單元。 A type of heat dissipation unit, especially a capillary structure with plural kinds of capillary structure to improve the return water efficiency Cooling unit with high rate and moisture content.
現行均溫板或平板式熱管透過真空氣密腔室搭配毛細結構及工作液體透過汽液循環之方式進行熱傳導,毛細結構具有燒結粉末、網格體、溝槽、纖維體等等,並由該毛細結構提供工作液體回流或吸附工作液體使用,其中燒結粉末所製成之多孔性毛細結構最為常被使用且其毛細力最佳,但部分均溫板或平板式熱管因特殊結構或製程關係則無法使用燒結粉末或網格體及纖維體作為毛細結構,故於該均溫板或平板式熱管內部腔室的壁面開設溝槽作為毛細結構使用,雖溝槽設置較其他毛細結構簡易,但針對均溫板或平板式熱管並非水平放置時則內部之工作液體因重力關係影響無法藉由溝槽進行回流,故如何補強毛細結構選用的缺失則為現行該項業者首重之目標。 The current uniform temperature plate or flat-plate heat pipe conducts heat conduction through the vacuum chamber with capillary structure and the working fluid through vapor-liquid circulation. The capillary structure has sintered powder, mesh body, groove, fiber body, etc., and the capillary structure has sintered powder, mesh body, groove, fiber body, etc. The capillary structure provides the working fluid to recirculate or adsorb the working fluid. Among them, the porous capillary structure made of sintered powder is the most commonly used and its capillary force is the best. However, some uniform temperature plates or flat heat pipes are due to special structure or process. It is impossible to use sintered powder or mesh and fibrous body as the capillary structure. Therefore, grooves are provided on the wall surface of the internal chamber of the uniform temperature plate or flat heat pipe as the capillary structure. Although the groove setting is simpler than other capillary structures, it is suitable for When the uniform temperature plate or flat-plate heat pipe is not placed horizontally, the internal working fluid cannot flow back through the groove due to the influence of gravity. Therefore, how to strengthen the lack of selection of the capillary structure is the most important goal of the current industry.
爰此,為解決上述習知技術之缺點,本發明之主要目的,係提供一種可補強散熱單元中之毛細結構毛細力不足的散熱單元。 Therefore, in order to solve the shortcomings of the above-mentioned conventional technology, the main purpose of the present invention is to provide a heat dissipation unit that can reinforce the insufficient capillary force of the capillary structure in the heat dissipation unit.
為達上述目的本發明係提供一種散熱單元,係包含:一本體、一網格體;所述本體具有一上板及一下板,所述上、下板對應疊合並共同界定一氣密腔室並填充有一工作液體,所述下板相對該氣密腔室之一側具有一透過雷射加工所形成之一毛細結構;所述網格體係貼設於該下板具有該毛細結構之一側。 To achieve the above objective, the present invention provides a heat dissipation unit, which includes: a body and a mesh body; the body has an upper plate and a lower plate, and the upper and lower plates are correspondingly stacked and jointly define an airtight chamber and Filled with a working fluid, the lower plate has a capillary structure formed by laser processing on one side of the airtight chamber; the grid system is attached to the side of the lower plate with the capillary structure.
本發明係透過該網格體之設置進一步提供補強該下板原設置之毛細結構的毛細力加強回水力及提升含水性,進而提升本體內部之汽液循環之效率者。 The present invention further provides the capillary force that reinforces the capillary structure originally installed on the lower plate through the arrangement of the grid body, strengthens the water return force and improves the water content, thereby improving the efficiency of the vapor-liquid circulation inside the body.
1:散熱單元 1: Cooling unit
11:本體 11: body
111:上板 111: upper board
112:下板 112: lower board
113:氣密腔室 113: Airtight Chamber
1121:毛細結構 1121: Capillary structure
1121a:溝槽 1121a: groove
12:網格體 12: Mesh
2:工作液體 2: working fluid
21:汽化之工作液體 21: Vaporized working fluid
22:液態之工作液體 22: Liquid working fluid
第1圖係為本發明散熱單元第一實施例之立體分解圖;第2圖係為本發明散熱單元第一實施例之立體組合剖視圖;第3圖係為本發明散熱單元第二實施例之剖視圖。 Figure 1 is a perspective exploded view of the first embodiment of the heat dissipation unit of the present invention; Figure 2 is a three-dimensional combined cross-sectional view of the first embodiment of the heat dissipation unit of the present invention; Figure 3 is a perspective view of the second embodiment of the heat dissipation unit of the present invention Sectional view.
本發明之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。 The above-mentioned objects and structural and functional characteristics of the present invention will be described based on the preferred embodiments of the accompanying drawings.
請參閱第1、2圖,係為本發明散熱單元第一實施例之立體分解及組合剖視圖,如圖所示,本發明提供一種散熱單元1,係包含:一本體11、一網格體12;所述本體11具有一上板111及一下板112,所述上、下板111、112對應疊合並共同界定一氣密腔室113並填充有一工作液體2,所述下板112相對該氣密腔室113之一側具有一透過雷射加工所形成之一毛細結構1121,所述上、下板體111、112係為鈦或銅或鋁或鐵或纖維或塑膠或鈦合金或商業純鈦或陶瓷其中任一相異或相同材質,本實施例係以商業純鈦作為說明實施例但並不引以為限,所述毛細結構1121係由複數溝槽1121a所構成,該等溝槽1121a沿該下板112之水平橫向及縱向延伸,並選擇相互交錯或非交錯其中任一方式,本實施例係以相互交錯作為說明實施例但並不引以為限。
Please refer to Figures 1 and 2, which are the three-dimensional exploded and combined cross-sectional views of the first embodiment of the heat dissipation unit of the present invention. As shown in the figure, the present invention provides a
所述網格體12係貼設於該下板112具有該毛細結構1121之一側,所述網格體12係為鈦或銅或鋁或鐵或纖維或塑膠或鈦合金或商業純鈦或燒結粉末其中任一材
質,本實施例係以商業純鈦作為說明實施例但並不引以為限,所述網格體12透過焊接或擴散接合與該下板112結合。
The
請參閱第3圖,係為本發明散熱單元第二實施例之組合剖視圖,如圖所示,本實施例與前述第一實施例部分結構相同故在此將不再贅述,惟本實施例與前述第一實施例之不同處在於所述網格體12亦可為複數疊層設置並與該下板112結合固定,該等網格體12之材質可為相同或相異材質之搭配組合或不同編織密度之網格體12作為搭配組合。
Please refer to Figure 3, which is a combined cross-sectional view of the second embodiment of the heat dissipation unit of the present invention. As shown in the figure, this embodiment has the same partial structure as the aforementioned first embodiment, so it will not be repeated here, but this embodiment is different from The difference of the foregoing first embodiment is that the
本案主要透過複數層(毛細結構1121及網格體12)具有毛細力效果的結構相互搭配結合,係可提升毛細力並進而提升散熱單元內部蒸發區域的含水量及增加液態之工作流體的回流效率。
In this case, multiple layers (
1:散熱單元 1: Cooling unit
11:本體 11: body
111:上板 111: upper board
112:下板 112: lower board
113:氣密腔室 113: airtight chamber
1121:毛細結構 1121: Capillary structure
12:網格體 12: Mesh
2:工作液體 2: working fluid
Claims (4)
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TW107127830A TWI727194B (en) | 2018-08-09 | 2018-08-09 | Heat dissipation unit |
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TW107127830A TWI727194B (en) | 2018-08-09 | 2018-08-09 | Heat dissipation unit |
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TW202009438A TW202009438A (en) | 2020-03-01 |
TWI727194B true TWI727194B (en) | 2021-05-11 |
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TWI727194B (en) * | 2018-08-09 | 2021-05-11 | 奇鋐科技股份有限公司 | Heat dissipation unit |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI266851B (en) * | 2003-12-16 | 2006-11-21 | Lg Cable Ltd | Flat plate heat transfer device and method for manufacturing the same |
TWM561191U (en) * | 2017-12-22 | 2018-06-01 | Aisa Vital Components China Co Ltd | Heat dissipation apparatus |
TW202009438A (en) * | 2018-08-09 | 2020-03-01 | 奇鋐科技股份有限公司 | Heat dissipation unit |
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2018
- 2018-08-09 TW TW107127830A patent/TWI727194B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI266851B (en) * | 2003-12-16 | 2006-11-21 | Lg Cable Ltd | Flat plate heat transfer device and method for manufacturing the same |
TWM561191U (en) * | 2017-12-22 | 2018-06-01 | Aisa Vital Components China Co Ltd | Heat dissipation apparatus |
TW202009438A (en) * | 2018-08-09 | 2020-03-01 | 奇鋐科技股份有限公司 | Heat dissipation unit |
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