EP1652205B1 - Bistabiler mikromechanischer schalter, betätigungsverfahren und entsprechendes verfahren zu seiner realisierung - Google Patents

Bistabiler mikromechanischer schalter, betätigungsverfahren und entsprechendes verfahren zu seiner realisierung Download PDF

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Publication number
EP1652205B1
EP1652205B1 EP04767777A EP04767777A EP1652205B1 EP 1652205 B1 EP1652205 B1 EP 1652205B1 EP 04767777 A EP04767777 A EP 04767777A EP 04767777 A EP04767777 A EP 04767777A EP 1652205 B1 EP1652205 B1 EP 1652205B1
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EP
European Patent Office
Prior art keywords
peripheral
substrate
switch
medial
actuating means
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Not-in-force
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EP04767777A
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English (en)
French (fr)
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EP1652205A2 (de
Inventor
Pierre-Louis Charvet
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Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
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Commissariat a lEnergie Atomique CEA
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H01H2001/0042—Bistable switches, i.e. having two stable positions requiring only actuating energy for switching between them, e.g. with snap membrane or by permanent magnet

Definitions

  • the invention relates to a micromechanical switch, comprising a deformable suspension bridge, attached by means of support to a substrate, and actuating means intended, from a first stable position of the switch, to deform the suspension bridge deformable so as to establish an electrical contact between at least a first conductive element formed on the substrate, between the bridge and the substrate, and a second conductive element secured to a lower face of the bridge.
  • a micromechanical switch typically comprises a deformable suspended bridge 1 attached by support means 2 to a substrate 3.
  • Actuators make it possible to deform the suspension bridge, so as to establish an electrical contact between first 5 conductive elements formed on the substrate 3 and a second conductive element 6, secured to a lower face of the bridge 1.
  • the actuators are, for example, constituted by electrodes 4a and 4b respectively formed on the bridge 1 and on the substrate 3 and between which is applied a control voltage.
  • the first conductive elements are, for example, constituted by two sections of a radiofrequency line which are connected by the second conductive element 6.
  • a conventional household switch has two stable positions and the electrical contact remains respectively established or interrupted without permanent energy supply.
  • it is complicated to manufacture a similar switch, bistable, microscopic size.
  • a first conductive element is a drop of mercury, which is displaced by electrostatic forces to establish or interrupt electrical contact between two solid conductive elements.
  • mercury is very toxic and, on the other hand, the drop moves at the slightest movement of the switch which can cause unexpected switching.
  • the document US2002 / 191897 describes a switch comprising a switching beam connected at its ends by supports fixed on a substrate.
  • the switch has a first stable position corresponding to an open position of the switch.
  • the switching beams are actuated by switching electrodes, so as to deform the switching beam to switch the switch to a second position corresponding to the closed position of the switch. To maintain contact in this second position, it is necessary to keep the switching electrodes energized.
  • the switch also comprises reconfiguration beams arranged at the periphery of the switching beam, a only side of it or on both sides of it.
  • the reconfiguration beams are fixed to the substrate by means of rigid supports.
  • the switch also comprises actuating elements cooperating with the reconfiguration beams and intended to deform them independently of the switching beam.
  • the deformation of the reconfiguration beam causes an increase in the distance between the switching beam and the electrode.
  • the deformation of the reconfiguration beams causes the appearance of return forces, within the switching beam, representative of the spring constants of the switch.
  • the object of the invention is to remedy these disadvantages and, in particular, to produce a microscopic switch having two mechanically stable positions.
  • the support means consist of two feet arranged between the bridge and the substrate so as to subdivide the bridge transversely in a median segment disposed between the feet and two peripheral segments projecting outwards and having free ends
  • the actuating means comprising peripheral actuating means and medial actuating means for deforming, respectively, respectively the peripheral segments and the median segment perpendicularly to the substrate.
  • the switch being in the first stable position, in a first phase, the middle segment and the peripheral segments are simultaneously bent towards the substrate, by means of their respective actuating means, so as to establish the electrical contact, then the peripheral actuating means are interrupted in a second phase, so as to automatically cause the spacing of the peripheral segments relative to to the substrate, the medial actuating means being interrupted in a third phase, the middle segment thus being automatically maintained in the bent position, so as to define a second stable position of the switch, wherein the electrical contact remains established.
  • the micromechanical switch shown in FIG. 2 comprises a deformable suspended bridge 1 attached to a substrate 3 by two legs 7 arranged between the bridge 1 and the substrate 3 so as to subdivide the bridge 1 transversely into a median segment 8 arranged between the two feet 7, and two peripheral segments 9 projecting outwards.
  • Two median electrostatic actuators 10 and two peripheral electrostatic actuators 11 make it possible to deform, independently, respectively the median segment 8 and the peripheral segments 9 substantially perpendicular to the substrate.
  • the actuators 10 and 11 consist of electrodes respectively formed on the substrate 3 and on the median 8 or peripheral 9 segments.
  • the actuators 10 and 11 make it possible to deform the bridge 1 so as to establish an electrical contact between a first conductive element 5 formed on the substrate 3, between the bridge 1 and the substrate 3, and a second conductive element 6, secured to the underside of the bridge 1.
  • the peripheral actuators are also in the rest position and the switch is in a first stable position.
  • the median segment 8 and the peripheral segments 9 consist of a single layer
  • a first curved layer 13 forms respectively a foot 7 and the associated peripheral segment 9, so that the feet 7 are inclined relative to the substrate 3 and that the segments
  • the peripherals 9 have free ends 15 inclined away from the substrate 3.
  • the middle segment 8 is constituted by a second curved layer 14 and thus comprises a central portion 12 slightly elevated.
  • the actuators 10 and 11 are respectively integrated in the middle and peripheral segments.
  • the switch can switch from its first stable position, corresponding to the interruption of the electrical contact (FIGS. 2 and 3), to a second stable position corresponding to an established electrical contact.
  • Figures 4 to 7 schematically illustrate the transition from the first stable position to the second stable position.
  • the switch is represented in the first stable position, the actuators being at rest, the central portion 12 of the middle segment 8 being raised and the peripheral segments 9 being inclined away from the substrate 3.
  • Localized constraints ⁇ at the peripheral segments represented by horizontal arrows in the figures, exert a compressive force on the middle segment 8 in its longitudinal direction and thus prevent the middle segment from leaving its raised position.
  • a first phase represented in FIG. 5
  • the median segment 8 and the peripheral segments 9 are simultaneously bent toward the substrate 3, respectively via the median and peripheral actuators 10 and 11.
  • FIG. 8 illustrates the return of the second stable position to the first stable position of the switch.
  • the peripheral segments 9 are bent again in the direction of the substrate 3, via the peripheral actuators 11.
  • a mechanical stress ⁇ in tension is exerted on the median segment 8 in its longitudinal direction, spreading its central portion 12 of the substrate 3.
  • the peripheral actuators 11 are then interrupted in a fifth phase, shown in Figure 9, to return the switch in its first stable position, wherein the peripheral segments 9 are inclined away from the substrate 3.
  • peripheral segments 9 are substantially in the same position (away from the substrate) in the two stable positions of the switch (FIGS. 4, 7 and 9) and change positions only provisionally (FIGS. 5 and 8) during the actuation of the switch.
  • the switch having two stable positions, the first position in which the electrical contact is interrupted, and the second position in which the electrical contact is established, only the passage from one position to another consumes energy and the switch can, after actuation, remain in each of these positions without additional energy input.
  • FIG. 10 illustrates a method of producing a micromechanical switch according to the invention.
  • the manufacture of the deformable suspension bridge 1 on the substrate 3 then comprises at least the following steps.
  • a peripheral sacrificial layer 16 is deposited on each side of the first conductive element disposed on the substrate 3.
  • at least one insulating layer 17 peripheral for example silicon nitride, is deposited on each peripheral sacrificial layer 16.
  • the peripheral insulating layers cover the front faces and the lateral faces of the two peripheral sacrificial layers.
  • the lateral faces of the peripheral insulating layers 17 arranged with respect to the first conducting element 5 are intended to form the feet 7 and the front faces of the peripheral insulating layers 17 are intended to form the peripheral segments 9.
  • a medial sacrificial layer 18 is deposited between the peripheral insulating layers 17. It comes into contact with the adjacent side faces of the two peripheral insulating layers 17 and covers the first conductive element.
  • the fourth step consists in depositing on the medial sacrificial layer 18 a median insulating layer 19. This comes into contact with each of the front faces of the two peripheral insulating layers 17, which it can partially cover, to form the middle segment 8 (FIG. 13).
  • a fifth step (FIG.
  • etching the peripheral lateral faces of the two peripheral insulating layers 17 then makes it possible to delimit the peripheral segments, in order to keep only the peripheral segments 9 and the feet 7.
  • the sacrificial layers 16 and 18 are removed (FIG. 15).
  • the peripheral insulating layer 17 may be a layer able to create a compressive stress on the median segment 8 in the longitudinal direction of the median segment 8 by a mechanical torque effect at the peripheral segments 9.
  • the peripheral insulating layer 17 may be deposited using a method setting a stress state of the peripheral insulating layer 17.
  • a “dual-frequency plasma deposition" method for example, it is possible to obtain a single layer which has a gradient of constraints.
  • the desired stress level can be obtained by adapting the thickness of the deposited layer. It is also possible to deposit several peripheral insulation layers 17 on each peripheral sacrificial layer 16 in order to produce a stress gradient compressing the median segment 8 in its longitudinal direction.
  • a stack of two layers may, for example, be made by an unconstrained layer deposited on a layer in compression, by a tension layer deposited on a non-stressed layer or by a tension layer deposited on a layer in compression.
  • a stack of three layers may, for example, be constituted by two tension layers deposited on a layer in compression or by a tension layer deposited on a non-stress layer deposited, itself, on a layer in compression. This gives a spring-like effect.
  • the median insulating layer 19 covers the front faces of the insulating peripheral layers 17 over their entire length, which amplifies the stresses between the two layers 17 and 19.
  • the electrodes of the peripheral electrostatic actuators 11 are respectively disposed between each insulating layer 17 peripheral and the associated insulating layer 19 median.
  • peripheral insulating layers 17 each cover a portion 20 of the front face of the substrate 3 disposed respectively between the lateral face of a peripheral sacrificial layer 16 and the first conductive element 5.
  • the actuators 10 and 11 may be constituted by any type of actuator namely by piezoelectric actuators, thermal, magnetic.
  • the peripheral electrodes are preferably wider, for example by a factor of three, than the median electrodes, in a plane parallel to the substrate 3, which makes it possible to reduce the driving voltage of the electrodes.
  • peripheral actuators A switch according to the invention can be used in a matrix of switches or as a simple switch. Such a switch can typically be used in telecommunication applications, particularly for radio frequency, terrestrial and space devices, in biomedical applications, relays.

Claims (12)

  1. Mikromechanischer Schalter mit einer verformbaren Hängebrücke (1), die mittels Stützmitteln (2) mit einem Substrat (3) verbunden ist, und Betätigungsmitteln (4), die aus einer ersten stabilen Position des Schalters heraus die verformbare Hängebrücke (1) verformen sollen, um einen elektrischen Kontakt zwischen mindestens einem ersten leitenden, auf dem Substrat (3) zwischen der Brücke (1) und dem Substrat (3) gebildeten Element (5) und einem zweiten leitenden Element (6) herzustellen, das fest mit einer Unterseite der Brücke (1) verbunden ist, Schalter, der dadurch gekennzeichnet ist, dass die Stützmittel aus zwei Stützen (7) bestehen, die zwischen der Brücke (1) und dem Substrat (3) angeordnet sind und die Brücke (1) in Querrrichtung in ein Mittelsegment (8), das zwischen den Stützen (7) angeordnet ist, und zwei Randsegmente (9) unterteilen, die nach außen hervorstehen und freie Enden (15) umfassen, wobei die Betätigungsmittel periphere Betätigungsmittel (11) und mittlere Betätigungsmittel (10) umfassen, die unabhängig voneinander eine Verformung jeweils der Randsegmente (9) und des Mittelsegments (8) lotrecht zum Substrat (3) erlauben.
  2. Schalter nach Anspruch 1, dadurch gekennzeichnet, dass das mittlere Segment (8) einen Mittelbereich (12) umfasst, der in der ersten stabilen Position des Schalters erhöht ist.
  3. Schalter nach einem der Ansprüche 1 und 2, dadurch gekennzeichnet, dass die freien Enden (15) in Ruhestellung der peripheren Betätigungsmittel (11) vom Substrat (3) entfernt geneigt sind.
  4. Schalter nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass die Betätigungsmittel von Elektroden gebildet werden, die jeweils auf dem Substrat (3) und auf den Randsegmenten (9) und dem Mittelsegment (8) gebildet sind.
  5. Schalter nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass die Stützen (7) geneigt sind.
  6. Verfahren zur Betätigung eines elektrischen Kontakts eines mikromechanischen Schalters nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass, wenn der Schalter in der ersten stabilen Position ist, das Mittelelement (8) und die Randsegmente (9) in einer ersten Phase mittels ihrer jeweiligen Betätigungsmittel (10, 11) gleichzeitig zum Substrat (3) hin durchgebogen werden, um den elektrischen Kontakt herzustellen, dass anschließend die peripheren Betätigungsmittel (11) in einer zweiten Phase ausgeschaltet werden, um die Randsegmente (9) automatisch vom Substrat (3) zu entfernen, und die mittleren Betätigungsmittel (10) in einer dritten Phase ausgeschaltet werden und das mittlere Segment (8) so automatisch in durchgebogener Position gehalten wird, um eine zweite stabile Position des Schalters zu bilden, in der der elektrische Kontakt erhalten bleibt.
  7. Verfahren nach Anspruch 6, dadurch gekennzeichnet, dass, wenn sich der Schalter in der zweiten stabilen Position befindet, in einer vierten Phase die Randsegmente (9) mittels der peripheren Betätigungsmittel (11) zum Substrat (3) hin durchgebogen werden, um eine mechanische Spannung auf das Mittelsegment (8) auszuüben und seinen mittleren Bereich (12) vom Substrat (3) zu entfernen, wobei die peripheren Betätigungsmittel (11) in einer fünften Phase ausgeschaltet werden, um den Schalter in seine erste stabile Position zu bringen.
  8. Verfahren zur Herstellung eines mikromechanischen Schalters nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass die Herstellung der Hängebrücke (1) auf dem Substrat (3) umfasst:
    - Aufbringen einer peripheren Opferschicht (16) auf das Substrat (3), und zwar auf jeder Seite des ersten leitenden Elements (5),
    - Aufbringen mindestens einer peripheren Isolierschicht (17) auf jede periphere Opferschicht (16), sodass die Vorderseite und die Seitenflächen der beiden peripheren Opferschichten (16) bedeckt sind, um die Randsegmente (9) und Stützen (7) zu bilden,
    - Aufbringen einer mittleren Opferschicht (18) zwischen den peripheren Isolierschichten (17), die in Kontakt mit den an die beiden peripheren Isolierschichten (17) angrenzenden Seitenflächen kommt und das erste leitende Element (5) bedeckt,
    - Aufbringen einer mittleren Isolierschicht (19) auf die mittlere Opferschicht (18), welche Isolierschicht in Kontakt mit jeder der Vorderseiten der beiden peripheren Isolierschichten (17) kommt, um das mittlere Segment (8) zu bilden,
    - Zurückätzen der Seitenflächen der beiden peripheren Isolierschichten (17) zur Abgrenzung der Randsegmente (9),
    - Entfernen der Opferschichten (16, 18).
  9. Verfahren zur Herstellung eines mikromechanischen Schalters nach Anspruch 8, dadurch gekennzeichnet, dass die mittlere Isolierschicht (19) zumindest teilweise auf die Vorderseite der peripheren Isolierschichten (17) aufgebracht ist.
  10. Verfahren zur Herstellung eines mikromechanischen Schalters nach einem der Ansprüche 8 und 9, dadurch gekennzeichnet, dass die peripheren Isolierschichten (17) jeweils auf einen Teil (20) der Vorderseite des Substrats (3) aufgebracht werden, der jeweils zwischen der Seitenfläche einer der peripheren Opferschichten (16) und dem ersten leitenden Element (5) angeordnet ist.
  11. Verfahren zur Herstellung eines mikromechanischen Schalters nach einem der Ansprüche 8 bis 10, dadurch gekennzeichnet, dass das Aufbringen der peripheren Isolierschichten (17) so geschieht, dass ein Spannungsgradient in den peripheren Isolierschichten (17) erzeugt wird.
  12. Verfahren zur Herstellung eines mikromechanischen Schalters nach Anspruch 11, dadurch gekennzeichnet, dass das Aufbringen der peripheren Isolierschichten (17) so geschieht, dass nach dem Aufbringen des Mittelsegments (8) auf dieses in dessen Längsrichtung eine Druckspannung erzeugt wird.
EP04767777A 2003-08-01 2004-07-26 Bistabiler mikromechanischer schalter, betätigungsverfahren und entsprechendes verfahren zu seiner realisierung Not-in-force EP1652205B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0309534A FR2858459B1 (fr) 2003-08-01 2003-08-01 Commutateur micro-mecanique bistable, methode d'actionnement et procede de realisation correspondant
PCT/FR2004/001988 WO2005015594A2 (fr) 2003-08-01 2004-07-26 Commutateur micro-mecanique bistable, methode d’actionnement et procede de realisation correspondant

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EP1652205A2 EP1652205A2 (de) 2006-05-03
EP1652205B1 true EP1652205B1 (de) 2007-08-29

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US (1) US7342472B2 (de)
EP (1) EP1652205B1 (de)
JP (1) JP4481309B2 (de)
AT (1) ATE371948T1 (de)
DE (1) DE602004008648T2 (de)
FR (1) FR2858459B1 (de)
WO (1) WO2005015594A2 (de)

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WO2006077987A1 (ja) * 2005-01-21 2006-07-27 Matsushita Electric Industrial Co., Ltd. 電気機械スイッチ
DE602005003008T2 (de) * 2005-03-21 2008-08-14 Delfmems RF MEMS Schalter mit einer flexiblen und freien Schaltmembran
US7763818B2 (en) * 2005-07-29 2010-07-27 Brigham Young University Spherical bistable mechanism
KR101188438B1 (ko) * 2006-02-20 2012-10-08 삼성전자주식회사 하향형 멤스 스위치의 제조방법 및 하향형 멤스 스위치
EP1850360A1 (de) * 2006-04-26 2007-10-31 Seiko Epson Corporation Mikroschalter mit einem ersten betätigbaren Teil und mit einem zweiten Kontaktteil
WO2007145294A1 (ja) * 2006-06-15 2007-12-21 Panasonic Corporation 電気機械素子およびそれを用いた電気機器
US8063456B2 (en) * 2006-09-12 2011-11-22 Alcatel Lucent Mechanical switch with a curved bilayer
WO2008072163A2 (en) * 2006-12-12 2008-06-19 Nxp B.V. Mems device with controlled electrode off-state position
ES2388126T3 (es) * 2009-03-20 2012-10-09 Delfmems Estructura de tipo MEMS con una membrana flexible y medios de accionamiento eléctrico mejorados
GB2497379B (en) * 2011-12-07 2016-06-08 Ibm A nano-electromechanical switch
CN106132403B (zh) 2013-10-11 2020-04-28 普尔莫凯恩股份有限公司 喷雾干燥制剂
US9783977B2 (en) * 2015-11-20 2017-10-10 University Of South Florida Shape-morphing space frame apparatus using unit cell bistable elements
CN109950063A (zh) * 2019-04-16 2019-06-28 苏州希美微纳系统有限公司 基于杠杆原理的双稳态rf mems接触式开关

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SE0101182D0 (sv) * 2001-04-02 2001-04-02 Ericsson Telefon Ab L M Micro electromechanical switches
US7126446B2 (en) * 2001-06-15 2006-10-24 Brigham Young University Self-retracting fully compliant bistable micromechanism
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FR2865724A1 (fr) * 2004-02-04 2005-08-05 St Microelectronics Sa Microsysteme electromecanique pouvant basculer entre deux positions stables

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WO2005015594A2 (fr) 2005-02-17
EP1652205A2 (de) 2006-05-03
ATE371948T1 (de) 2007-09-15
JP4481309B2 (ja) 2010-06-16
US7342472B2 (en) 2008-03-11
FR2858459B1 (fr) 2006-03-10
JP2007501494A (ja) 2007-01-25
DE602004008648T2 (de) 2008-06-26
FR2858459A1 (fr) 2005-02-04
DE602004008648D1 (de) 2007-10-11
WO2005015594A3 (fr) 2005-06-09
US20060192641A1 (en) 2006-08-31

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