EP1639628A2 - Dispositif de transfert de chaleur et procede de fabrication - Google Patents

Dispositif de transfert de chaleur et procede de fabrication

Info

Publication number
EP1639628A2
EP1639628A2 EP04754527A EP04754527A EP1639628A2 EP 1639628 A2 EP1639628 A2 EP 1639628A2 EP 04754527 A EP04754527 A EP 04754527A EP 04754527 A EP04754527 A EP 04754527A EP 1639628 A2 EP1639628 A2 EP 1639628A2
Authority
EP
European Patent Office
Prior art keywords
particles
heat pipe
wick
brazing compound
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04754527A
Other languages
German (de)
English (en)
Other versions
EP1639628A4 (fr
Inventor
John H. Rosenfeld
Donald M. Ernst
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aavid Thermal Corp
Original Assignee
Thermal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/607,337 external-priority patent/US6994152B2/en
Application filed by Thermal Corp filed Critical Thermal Corp
Publication of EP1639628A2 publication Critical patent/EP1639628A2/fr
Publication of EP1639628A4 publication Critical patent/EP1639628A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/04—Fastening; Joining by brazing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

La présente invention concerne une structure capillaire destinée à un dispositif de transfert de chaleur tel qu'un caloduc, qui comprend une pluralité de particules unies entre elles par un composé de brasage tel que des filets du composé de brasage se forment entre les particules adjacentes de la pluralité de particules et qu'un ou plusieurs canaux d'évacuation de vapeur se forment dans la structure capillaire. De cette manière, un réseau de passages capillaires se forme entre les particules et les canaux d'évacuation de vapeur traversant la structure capillaire, qui facilitent le transfert d'un liquide de travail sous l'effet de l'action capillaire, tandis que la pluralité de filets améliorent les propriétés de transfert de chaleur entre la pluralité de particules et, par conséquent, améliorent significativement l'efficacité de transfert de chaleur du dispositif. L'invention se rapporte également à un procédé de fabrication de la structure capillaire précitée.
EP04754527A 2003-06-26 2004-06-04 Dispositif de transfert de chaleur et procede de fabrication Withdrawn EP1639628A4 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/607,337 US6994152B2 (en) 2003-06-26 2003-06-26 Brazed wick for a heat transfer device
US10/765,660 US7028759B2 (en) 2003-06-26 2004-01-27 Heat transfer device and method of making same
PCT/US2004/017937 WO2005006395A2 (fr) 2003-06-26 2004-06-04 Dispositif de transfert de chaleur et procede de fabrication

Publications (2)

Publication Number Publication Date
EP1639628A2 true EP1639628A2 (fr) 2006-03-29
EP1639628A4 EP1639628A4 (fr) 2007-12-26

Family

ID=34068495

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04754527A Withdrawn EP1639628A4 (fr) 2003-06-26 2004-06-04 Dispositif de transfert de chaleur et procede de fabrication

Country Status (3)

Country Link
US (1) US20060124281A1 (fr)
EP (1) EP1639628A4 (fr)
WO (1) WO2005006395A2 (fr)

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US11278978B2 (en) * 2019-06-21 2022-03-22 International Business Machines Corporation Pattern bonded finned cold plate
US11121058B2 (en) 2019-07-24 2021-09-14 Aptiv Technologies Limited Liquid cooled module with device heat spreader
CN111397410A (zh) * 2019-12-31 2020-07-10 东莞市万维热传导技术有限公司 一种无管密封的铝均温板及其制造工艺
JP7444704B2 (ja) 2020-06-04 2024-03-06 古河電気工業株式会社 伝熱部材および伝熱部材を有する冷却デバイス
US11382205B2 (en) 2020-09-16 2022-07-05 Aptiv Technologies Limited Heatsink shield with thermal-contact dimples for thermal-energy distribution in a radar assembly
CN113734417A (zh) * 2021-09-06 2021-12-03 上海航天精密机械研究所 半主动防热结构及其制造方法
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Title
No further relevant documents disclosed *
See also references of WO2005006395A2 *

Also Published As

Publication number Publication date
WO2005006395A2 (fr) 2005-01-20
WO2005006395A3 (fr) 2005-04-28
EP1639628A4 (fr) 2007-12-26
US20060124281A1 (en) 2006-06-15

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