WO2005006395A3 - Dispositif de transfert de chaleur et procede de fabrication - Google Patents

Dispositif de transfert de chaleur et procede de fabrication Download PDF

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Publication number
WO2005006395A3
WO2005006395A3 PCT/US2004/017937 US2004017937W WO2005006395A3 WO 2005006395 A3 WO2005006395 A3 WO 2005006395A3 US 2004017937 W US2004017937 W US 2004017937W WO 2005006395 A3 WO2005006395 A3 WO 2005006395A3
Authority
WO
WIPO (PCT)
Prior art keywords
particles
capillary
heat transfer
transfer device
making same
Prior art date
Application number
PCT/US2004/017937
Other languages
English (en)
Other versions
WO2005006395A2 (fr
Inventor
John H Rosenfeld
Donald M Ernst
Original Assignee
Thermal Corp
John H Rosenfeld
Donald M Ernst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/607,337 external-priority patent/US6994152B2/en
Application filed by Thermal Corp, John H Rosenfeld, Donald M Ernst filed Critical Thermal Corp
Priority to EP04754527A priority Critical patent/EP1639628A4/fr
Publication of WO2005006395A2 publication Critical patent/WO2005006395A2/fr
Publication of WO2005006395A3 publication Critical patent/WO2005006395A3/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/04—Fastening; Joining by brazing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention concerne une structure capillaire destinée à un dispositif de transfert de chaleur tel qu'un caloduc, qui comprend une pluralité de particules unies entre elles par un composé de brasage tel que des filets du composé de brasage se forment entre les particules adjacentes de la pluralité de particules et qu'un ou plusieurs canaux d'évacuation de vapeur se forment dans la structure capillaire. De cette manière, un réseau de passages capillaires se forme entre les particules et les canaux d'évacuation de vapeur traversant la structure capillaire, qui facilitent le transfert d'un liquide de travail sous l'effet de l'action capillaire, tandis que la pluralité de filets améliorent les propriétés de transfert de chaleur entre la pluralité de particules et, par conséquent, améliorent significativement l'efficacité de transfert de chaleur du dispositif. L'invention se rapporte également à un procédé de fabrication de la structure capillaire précitée.
PCT/US2004/017937 2003-06-26 2004-06-04 Dispositif de transfert de chaleur et procede de fabrication WO2005006395A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP04754527A EP1639628A4 (fr) 2003-06-26 2004-06-04 Dispositif de transfert de chaleur et procede de fabrication

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10/607,337 US6994152B2 (en) 2003-06-26 2003-06-26 Brazed wick for a heat transfer device
US10/607,337 2003-06-26
US10/765,660 US7028759B2 (en) 2003-06-26 2004-01-27 Heat transfer device and method of making same
US10/765,660 2004-01-27

Publications (2)

Publication Number Publication Date
WO2005006395A2 WO2005006395A2 (fr) 2005-01-20
WO2005006395A3 true WO2005006395A3 (fr) 2005-04-28

Family

ID=34068495

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/017937 WO2005006395A2 (fr) 2003-06-26 2004-06-04 Dispositif de transfert de chaleur et procede de fabrication

Country Status (3)

Country Link
US (1) US20060124281A1 (fr)
EP (1) EP1639628A4 (fr)
WO (1) WO2005006395A2 (fr)

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US20100006268A1 (en) * 2008-07-14 2010-01-14 Meyer Iv George Anthony Vapor chamber and supporting structure of the same
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US20100294467A1 (en) * 2009-05-22 2010-11-25 General Electric Company High performance heat transfer device, methods of manufacture thereof and articles comprising the same
US20100294475A1 (en) * 2009-05-22 2010-11-25 General Electric Company High performance heat transfer device, methods of manufacture thereof and articles comprising the same
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JP7444704B2 (ja) * 2020-06-04 2024-03-06 古河電気工業株式会社 伝熱部材および伝熱部材を有する冷却デバイス
US11382205B2 (en) 2020-09-16 2022-07-05 Aptiv Technologies Limited Heatsink shield with thermal-contact dimples for thermal-energy distribution in a radar assembly
CN113734417A (zh) * 2021-09-06 2021-12-03 上海航天精密机械研究所 半主动防热结构及其制造方法
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CN115338406B (zh) * 2022-07-11 2024-06-18 瑞泰精密科技(沭阳)有限公司 用于制备毛细结构的浆料及制备方法

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Also Published As

Publication number Publication date
EP1639628A4 (fr) 2007-12-26
US20060124281A1 (en) 2006-06-15
WO2005006395A2 (fr) 2005-01-20
EP1639628A2 (fr) 2006-03-29

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