EP1636809B1 - Composant miniature inductif concu pour un montage smd - Google Patents
Composant miniature inductif concu pour un montage smd Download PDFInfo
- Publication number
- EP1636809B1 EP1636809B1 EP04789996A EP04789996A EP1636809B1 EP 1636809 B1 EP1636809 B1 EP 1636809B1 EP 04789996 A EP04789996 A EP 04789996A EP 04789996 A EP04789996 A EP 04789996A EP 1636809 B1 EP1636809 B1 EP 1636809B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- ferrite core
- frame
- component according
- flanges
- miniature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000001939 inductive effect Effects 0.000 title claims abstract description 6
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 45
- 238000004804 winding Methods 0.000 claims abstract description 16
- 239000004033 plastic Substances 0.000 claims abstract description 5
- 229920003023 plastic Polymers 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F17/045—Fixed inductances of the signal type with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/027—Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/02—Coils wound on non-magnetic supports, e.g. formers
Definitions
- the invention relates to a miniature inductive component for SMD mounting with the features of the preamble of claim 1.
- flanges are attached to a ferrite core having a rectangular cross section, each having a frame provided with an insertion opening for the ferrite core adapted to the cross section of the ferrite core.
- the flanges are attached to the ferrite core and firmly connected to it.
- the core and flanges may be made of different materials and the flanges may be constructed of, for example, ceramic material. The purpose of this design is to make the device less sensitive to mechanical and thermal stresses.
- the invention has for its object to provide an inductive miniature device for SMD mounting with the features specified in the preamble of claim 1 protection in which different embodiments, in particular components of different lengths, can be kept at a much lower production cost.
- a basic idea of the present invention is to design the flanges as plastic parts to be staked on the ferrite core and then firmly connected to it.
- This design has the consequence that for components of different lengths, wherein the length is given by the length of the ferrite core, in each case only simple ferrite cores of different lengths are to be produced in different shapes, while the réellesteckenden flanges are the same in all embodiments of the device, so that only one injection mold has to be kept ready for these flanges. It has been shown that this production of manufacturing costs and the cost of storage can be significantly reduced.
- connection elements for the winding ends and for the connection of the entire component to the printed conductors of a printed circuit board are arranged on the flanges, which in this case also for all embodiments of components of different lengths can be the same.
- a small plate or an adhesive point with a flat surface to form a suction surface may be arranged so that the component can be detected by a placement machine.
- the antenna coil shown in FIGS. 1 to 3 has a rectangular cross-section ferrite core 1, on both ends of which flanges 3 and 4 are plugged and connected to the ferrite core 1 by gluing.
- the flanges 3 and 4 are configured in the same way.
- the flanges have an outer cross-section substantially rectangular frame 3.1 and 4.1, which is provided with a matched to the rectangular cross-section of the ferrite core 1 rectangular through opening 3.2 and 4.2, in which the ferrite core 1 is inserted in the axial direction.
- the component can be placed with its underside on a printed circuit board, not shown, in such a way that the connection elements can be soldered directly to the correspondingly formed elements of the printed circuit board.
- the upper ends of the metal rods 5.1, 5.2 and 6.1, 6.2, to which the winding ends 2.1, 2.2 and 2.3 are attached, can also be bent inwards or outwards.
- winding ends 2.1 to 2.3 are in the region of the upper ends of the side struts of the frame 3.1 or 4.1 formed on the outer narrow side of the frame projections respectively 3.41, 3.42 and 4.41, 4.42, each of one of the winding ends 2.1, 2.2, 2.3 of the coil winding 2 are included.
- a wafer or adhesive dot 7 is applied, which has a flat surface to form a suction for a placement machine.
- a coating 8 extending in the longitudinal direction over a partial section of the length of the ferrite core is arranged, which consists of a material whose melting point is below the temperature applied to the component during soldering of the electrical connection elements occurs with the tracks of a printed circuit board, such that the coating material is temporarily liquefied and after the flow and re-solidification of the ferrite core stabilizing connection between the component and circuit board is formed.
- FIGS. 4 to 6 show other embodiments of flanges which can be used in place of the flanges 3 and 4 shown in FIGS. 1 to 3.
- flanges differ from the flanges described above initially in that the frame 14.1 is not formed as a closed rectangular frame, but as open at the top U-shaped frame. In the frame opening 14.2 a rectangular cross-section ferrite core can be inserted from above.
- the connecting elements 15.1 and 15.2 illustrated in FIGS. 4 to 6 are not exemplary embodiments of the present invention according to claim 1.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Multi-Conductor Connections (AREA)
Claims (11)
- Composant miniature inductif pour montage SMD avec un noyau de ferrite (1) d'une seule pièce, dont la longueur est supérieure à sa largeur et avec au moins un enroulement de bobine (2) appliqué directement sur le noyau, avec des éléments de raccordement (5.1, 5.2 ; 6.1, 6.2) électriques et avec des brides (3, 4) disposées sur les deux extrémités du noyau de ferrite, chaque bride présentant un cadre (3.1, 4.1), qui est doté d'une ouverture d'enfichage ou de traverse (3.2, 4.2) adaptée à la section du noyau de ferrite pour le noyau de ferrite (1), et les brides (3, 4) étant emboîtées sur le noyau de ferrite et reliées de façon fixe avec lui, caractérisé en ce que chacune des deux branches (3, 4) est conçue comme une partie plastique et au moins une barre métallique (5.1, 5.2 ; 6.1, 6.2) ou une bande métallique guidée à travers le cadre en direction du côté supérieur vers le côté inférieur du composant et sortant sur les deux extrémités du cadre étant disposée dans le cadre (3.1, 4.1), l'extrémité reposant sur le côté supérieur étant reliée à une extrémité d'enroulement (2.1, 2.2, 2.3) d'un enroulement de bobine (2), alors que l'extrémité (5.11, 5.21 ; 6.11, 6.21) disposée sur le côté inférieur est pliée parallèlement au côté inférieur du composant est réalisée sous la forme d'un élément de raccordement.
- Composant miniature selon la revendication 1, caractérisé en ce que l'extrémité (5.11, 5.21 ; 6.11, 6.21), reposant sur le côté inférieur du cadre (3.1, 4.1), de la barre métallique (5.1, 5.2 ; 6.1, 6.2) ou de la bande est pliée vers l'extérieur dans le sens longitudinal du noyau de ferrite (1).
- Composant miniature selon la revendication 1 ou 2, caractérisé en ce que l'extrémité, disposée sur le dessus du cadre (3.1, 4.1), de la barre métallique (5.1, 5.2 ; 6.1, 6.2) ou de la bande est pliée vers l'intérieur dans le sens longitudinal du noyau de ferrite (1).
- Composant miniature selon l'une quelconque des revendications 1 à 3, caractérisé en ce que, dans la zone des extrémités supérieures des montants latéraux du cadre (3.1, 4.1), sur au moins l'un de ses côtés étroits extérieurs est formée une saillie (3.41, 3.42 ; 4.41, 4.42), qui est appropriée pour être enveloppée par une extrémité d'enroulement (2.1, 2.2, 2.3) d'un enroulement de bobine (2).
- Composant miniature selon l'une quelconque des revendications 1 à 4, caractérisé en ce que l'espacement des deux brides (3, 4) emboîtées sur le noyau de ferrite (1) peut être modifié avant la liaison fixe avec le noyau de ferrite à l'intérieur de limites prédéfinies.
- Composant miniature selon l'une quelconque des revendications 1 à 5, caractérisé en ce que le composant plastique est relié par collage au noyau de ferrite (1).
- Composant miniature selon l'une quelconque des revendications 1 à 6, caractérisé en ce que la bride (3, 4) présente un cadre (3.1, 4.1) fermé, qui est doté d'une ouverture de passage (3.2, 4.2) agencée dans le sens radial pour le noyau de ferrite (1).
- Composant miniature selon l'une quelconque des revendications 1 à 6, caractérisé en ce que la bride présente un cadre ouvert, qui est doté d'une ouverture d'enfichage latérale pour le noyau de ferrite.
- Composant miniature selon l'une quelconque des revendications 1 à 7, caractérisé en ce que la bride (3, 4) présente sur son côté extérieur des nervures de guidage (3.31 à 3.34, 4.31 à 4.34) s'étendant sur son côté extérieur vers l'extérieur dans le sens longitudinal du noyau de ferrite (1) et s'appliquant avec leurs côtés intérieurs, tournés vers le noyau de ferrite, sur la surface extérieure du noyau de ferrite (1) guidé à travers le cadre (3.1, 4.1).
- Composant miniature selon l'une quelconque des revendications 1 à 9, caractérisé en ce que sur le côté supérieur du composant est disposé une plaquette (7) ou un point de collage avec une surface plane pour la formation d'une surface d'aspiration.
- Composant miniature selon l'une quelconque des revendications 1 à 10, caractérisé en ce que sur le côté inférieur, affecté lors du montage à une carte imprimée, du composant est disposé un revêtement (8) s'étendant dans le sens longitudinal au moins sur une section partielle de la longueur du noyau de ferrite (1), qui est à base d'un matériau dont le point de fusion se situe au-dessous de la température qui apparaît sur le composant lors du brasage des éléments de raccordement électriques avec les pièces conductrices d'une carte imprimée, de sorte que le matériau de revêtement se liquéfie par moments et, après la liquéfaction et le redurcissement, il se forme une liaison stabilisant le noyau de ferrite (1) entre le composant et la carte imprimée.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE20318052U DE20318052U1 (de) | 2003-11-21 | 2003-11-21 | Induktives Miniatur-Bauelement für SMD-Montage |
PCT/DE2004/002294 WO2005052963A2 (fr) | 2003-11-21 | 2004-10-15 | Composant miniature inductif conçu pour un montage smd |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1636809A2 EP1636809A2 (fr) | 2006-03-22 |
EP1636809B1 true EP1636809B1 (fr) | 2006-12-20 |
Family
ID=31984732
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP04789996A Active EP1636809B1 (fr) | 2003-11-21 | 2004-10-15 | Composant miniature inductif concu pour un montage smd |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1636809B1 (fr) |
AT (1) | ATE349063T1 (fr) |
DE (3) | DE20318052U1 (fr) |
WO (1) | WO2005052963A2 (fr) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202005019497U1 (de) * | 2005-12-14 | 2007-04-26 | Neosid Pemetzrieder Gmbh & Co Kg | Induktives Miniatur-Bauelement für SMD-Montage |
DE202005019496U1 (de) * | 2005-12-14 | 2007-04-26 | Neosid Pemetzrieder Gmbh & Co Kg | Induktives Miniatur-Bauelement für SMD-Montage |
JP2008085684A (ja) * | 2006-09-28 | 2008-04-10 | Sumida Corporation | アンテナ装置 |
US7733283B2 (en) | 2007-10-16 | 2010-06-08 | Sumida Corporation | Antenna Device |
DE102010006010B4 (de) * | 2010-01-27 | 2014-08-14 | Atmel Corp. | IC-Gehäuse |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4326358C1 (de) * | 1993-08-05 | 1994-11-24 | Siemens Audiologische Technik | Induktionsspule zur Verwendung als elektromagnetischer Induktionswandler (Hörspule) in elektrischen Hörhilfegeräten |
DE19523521A1 (de) * | 1995-06-30 | 1997-01-02 | Licentia Gmbh | Transponder-Drahtspule |
DE19607092A1 (de) * | 1996-02-24 | 1997-08-28 | Kaschke Kg Gmbh & Co | Antennenspule für Fahrbereitschaftssysteme |
US6144280A (en) * | 1996-11-29 | 2000-11-07 | Taiyo Yuden Co., Ltd. | Wire wound electronic component and method of manufacturing the same |
DE29824118U1 (de) * | 1998-03-24 | 2000-06-08 | Pemetzrieder Neosid | Induktives Miniatur-Bauelement für SMD-Montage |
DE19911803A1 (de) * | 1999-03-17 | 2000-09-21 | Kaschke Kg Gmbh & Co | Antennenspule in Miniaturausführung, insbesondere für elektronische Fahrzeug-Schließsysteme |
DE10143708B4 (de) * | 2001-08-31 | 2005-04-07 | Kaschke Kg (Gmbh & Co.) | Miniatur-Induktivität mit einem prismatischen, auf einen Kunststoffkörper aufgesetzten Ferritkern |
US6690255B2 (en) * | 2002-02-21 | 2004-02-10 | Coilcraft, Incorporated | Electronic component |
DE20300713U1 (de) * | 2003-01-16 | 2003-03-27 | Pemetzrieder Neosid | Induktives Miniatur-Bauelement für SMD-Montage |
-
2003
- 2003-11-21 DE DE20318052U patent/DE20318052U1/de not_active Expired - Lifetime
-
2004
- 2004-10-15 EP EP04789996A patent/EP1636809B1/fr active Active
- 2004-10-15 DE DE502004002388T patent/DE502004002388D1/de active Active
- 2004-10-15 AT AT04789996T patent/ATE349063T1/de not_active IP Right Cessation
- 2004-10-15 DE DE112004002707T patent/DE112004002707D2/de not_active Expired - Fee Related
- 2004-10-15 WO PCT/DE2004/002294 patent/WO2005052963A2/fr active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
ATE349063T1 (de) | 2007-01-15 |
WO2005052963A2 (fr) | 2005-06-09 |
WO2005052963A3 (fr) | 2005-07-21 |
DE20318052U1 (de) | 2004-03-04 |
EP1636809A2 (fr) | 2006-03-22 |
DE112004002707D2 (de) | 2006-11-30 |
DE502004002388D1 (de) | 2007-02-01 |
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