EP1636809B1 - Inductive miniature component for smd assembly - Google Patents
Inductive miniature component for smd assembly Download PDFInfo
- Publication number
- EP1636809B1 EP1636809B1 EP04789996A EP04789996A EP1636809B1 EP 1636809 B1 EP1636809 B1 EP 1636809B1 EP 04789996 A EP04789996 A EP 04789996A EP 04789996 A EP04789996 A EP 04789996A EP 1636809 B1 EP1636809 B1 EP 1636809B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- ferrite core
- frame
- component according
- flanges
- miniature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000001939 inductive effect Effects 0.000 title claims abstract description 6
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 45
- 238000004804 winding Methods 0.000 claims abstract description 16
- 239000004033 plastic Substances 0.000 claims abstract description 5
- 229920003023 plastic Polymers 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F17/045—Fixed inductances of the signal type with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/027—Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/02—Coils wound on non-magnetic supports, e.g. formers
Definitions
- the invention relates to a miniature inductive component for SMD mounting with the features of the preamble of claim 1.
- flanges are attached to a ferrite core having a rectangular cross section, each having a frame provided with an insertion opening for the ferrite core adapted to the cross section of the ferrite core.
- the flanges are attached to the ferrite core and firmly connected to it.
- the core and flanges may be made of different materials and the flanges may be constructed of, for example, ceramic material. The purpose of this design is to make the device less sensitive to mechanical and thermal stresses.
- the invention has for its object to provide an inductive miniature device for SMD mounting with the features specified in the preamble of claim 1 protection in which different embodiments, in particular components of different lengths, can be kept at a much lower production cost.
- a basic idea of the present invention is to design the flanges as plastic parts to be staked on the ferrite core and then firmly connected to it.
- This design has the consequence that for components of different lengths, wherein the length is given by the length of the ferrite core, in each case only simple ferrite cores of different lengths are to be produced in different shapes, while the réellesteckenden flanges are the same in all embodiments of the device, so that only one injection mold has to be kept ready for these flanges. It has been shown that this production of manufacturing costs and the cost of storage can be significantly reduced.
- connection elements for the winding ends and for the connection of the entire component to the printed conductors of a printed circuit board are arranged on the flanges, which in this case also for all embodiments of components of different lengths can be the same.
- a small plate or an adhesive point with a flat surface to form a suction surface may be arranged so that the component can be detected by a placement machine.
- the antenna coil shown in FIGS. 1 to 3 has a rectangular cross-section ferrite core 1, on both ends of which flanges 3 and 4 are plugged and connected to the ferrite core 1 by gluing.
- the flanges 3 and 4 are configured in the same way.
- the flanges have an outer cross-section substantially rectangular frame 3.1 and 4.1, which is provided with a matched to the rectangular cross-section of the ferrite core 1 rectangular through opening 3.2 and 4.2, in which the ferrite core 1 is inserted in the axial direction.
- the component can be placed with its underside on a printed circuit board, not shown, in such a way that the connection elements can be soldered directly to the correspondingly formed elements of the printed circuit board.
- the upper ends of the metal rods 5.1, 5.2 and 6.1, 6.2, to which the winding ends 2.1, 2.2 and 2.3 are attached, can also be bent inwards or outwards.
- winding ends 2.1 to 2.3 are in the region of the upper ends of the side struts of the frame 3.1 or 4.1 formed on the outer narrow side of the frame projections respectively 3.41, 3.42 and 4.41, 4.42, each of one of the winding ends 2.1, 2.2, 2.3 of the coil winding 2 are included.
- a wafer or adhesive dot 7 is applied, which has a flat surface to form a suction for a placement machine.
- a coating 8 extending in the longitudinal direction over a partial section of the length of the ferrite core is arranged, which consists of a material whose melting point is below the temperature applied to the component during soldering of the electrical connection elements occurs with the tracks of a printed circuit board, such that the coating material is temporarily liquefied and after the flow and re-solidification of the ferrite core stabilizing connection between the component and circuit board is formed.
- FIGS. 4 to 6 show other embodiments of flanges which can be used in place of the flanges 3 and 4 shown in FIGS. 1 to 3.
- flanges differ from the flanges described above initially in that the frame 14.1 is not formed as a closed rectangular frame, but as open at the top U-shaped frame. In the frame opening 14.2 a rectangular cross-section ferrite core can be inserted from above.
- the connecting elements 15.1 and 15.2 illustrated in FIGS. 4 to 6 are not exemplary embodiments of the present invention according to claim 1.
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Multi-Conductor Connections (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
Die Erfindung betrifft ein induktives Miniatur-Bauelement für SMD-Montage mit den Merkmalen aus dem Oberbegriff von Patentanspruch 1.The invention relates to a miniature inductive component for SMD mounting with the features of the preamble of claim 1.
Ein derartiges Bauelement ist an sich bekannt und beispielsweise in US 2003/0156002 A1 beschrieben.Such a device is known per se and described for example in US 2003/0156002 A1.
Bei dem in dem oben genannten Dokument beschriebenen elektronischen Bauelement sind auf einen Ferritkern mit rechteckigem Querschnitt Flansche aufgesteckt, die jeweils einen Rahmen aufweisen, der mit einer an dem Querschnitt des Ferritkerns angepassten Einstecköffnung für den Ferritkern versehen ist. Die Flansche sind auf den Ferritkern aufgesteckt und mit ihm fest verbunden. Nach der Offenbarung in diesem Dokument können Kern und Flansche aus unterschiedlichem Material bestehen und die Flansche beispielsweise aus keramischen Material aufgebaut sein. Der Zweck dieser Ausbildung besteht darin, das Bauelement unempfindlicher gegen mechanische und thermische Belastungen zu machen.In the electronic component described in the above-mentioned document, flanges are attached to a ferrite core having a rectangular cross section, each having a frame provided with an insertion opening for the ferrite core adapted to the cross section of the ferrite core. The flanges are attached to the ferrite core and firmly connected to it. As disclosed in this document, the core and flanges may be made of different materials and the flanges may be constructed of, for example, ceramic material. The purpose of this design is to make the device less sensitive to mechanical and thermal stresses.
Der Erfindung liegt die Aufgabe zugrunde, ein induktives Miniatur-Bauelement für SMD-Montage mit den im Oberbegriff des Schutzanspruchs 1 angegebenen Merkmalen zu schaffen, bei dem mit wesentlich geringerem Herstellungaufwand unterschiedliche Ausführungsformen, insbesondere Bauelemente unterschiedlicher Längen, bereitgehalten werden können.The invention has for its object to provide an inductive miniature device for SMD mounting with the features specified in the preamble of claim 1 protection in which different embodiments, in particular components of different lengths, can be kept at a much lower production cost.
Die Lösung dieser Aufgabe geschieht erfindungsgemäß nach den Merkmalen aus dem kennzeichnenden Teil des Patentanspruchs 1.The solution of this object is achieved according to the invention according to the features of the characterizing part of patent claim. 1
Vorteilhafte Weiterbildungen den Erfindung smd weiter unten und in den abhängigen Patentansprüchen beschrieben.Advantageous developments of the invention smd described below and in the dependent claims.
Ein Grundgedanke der vorliegenden Erfindung besteht darin, die Flansche als auf den Ferritkern aufzusteckende und dann mit ihm fest zu verbindende Kunststoffteile auszubilden. Diese Ausbildung hat zur Folge, dass für Bauelemente unterschiedlicher Länge, wobei die Länge durch die Länge des Ferritkerns gegeben ist, jeweils nur einfache Ferritkerne unterschiedlicher Länge in unterschiedlichen Formen herzustellen sind, während die aufzusteckenden Flansche bei allen Ausführungsformen des Bauelements die gleichen sind, so dass für diese Flansche jeweils nur eine Spritzgussform bereitgehalten werden muss. Es hat sich gezeigt, dass durch diese Ausbildung der Herstellungsaufwand und der Aufwand bei der Lagerhaltung erheblich reduziert werden kann.A basic idea of the present invention is to design the flanges as plastic parts to be staked on the ferrite core and then firmly connected to it. This design has the consequence that for components of different lengths, wherein the length is given by the length of the ferrite core, in each case only simple ferrite cores of different lengths are to be produced in different shapes, while the aufzusteckenden flanges are the same in all embodiments of the device, so that only one injection mold has to be kept ready for these flanges. It has been shown that this production of manufacturing costs and the cost of storage can be significantly reduced.
Die erfindungsgemäße Ausbildung des Bauelements bringt noch den weiteren besonderen Vorteil mit sich, dass an den Flanschen die Anschlusselemente für die Wicklungsenden und für den Anschluss des gesamten Bauelements an die Leiterbahnen einer Leiterplatte angeordnet sind, die in diesem Fall ebenfalls für alle Ausführungsformen von Bauelementen unterschiedlicher Länge gleich ausgebildet sein können.The inventive construction of the device has the further particular advantage that the connection elements for the winding ends and for the connection of the entire component to the printed conductors of a printed circuit board are arranged on the flanges, which in this case also for all embodiments of components of different lengths can be the same.
Schließlich kann in an sich bekannter Weise an der Oberseite des Bauteils ein Plättchen oder ein Kleberpunkt mit planer Oberfläche zur Bildung einer Ansaugfläche angeordnet sein, damit das Bauelement von einem Bestückungsautomaten erfasst werden kann.Finally, in a conventional manner at the top of the component, a small plate or an adhesive point with a flat surface to form a suction surface may be arranged so that the component can be detected by a placement machine.
Bei der Verwendung von relativ langen und dünnen Ferritkernen für das Bauteil hat es sich weiterhin als vorteilhaft erwiesen, wenn das Bauelement so ausgestaltet ist, wie dies beispielsweise in DE-U-203 00 713.1 beschrieben ist. Ein derartiges, in der erfindungsgemäßen Weise ausgestaltetes Bauelement ist in Patentanspruch 11 beschrieben.When using relatively long and thin ferrite cores for the component, it has also proven to be advantageous if the device is configured as described for example in DE-U-203 00 713.1. Such a device configured in the manner according to the invention is described in patent claim 11.
Im folgenden wird anhand der beigefügten Zeichnungen ein Ausführungsbeispiel für ein induktives Miniatur-Bauelement für SMD-Montage nach der Erfindung näher erläutert.In the following an embodiment of an inductive miniature device for SMD mounting according to the invention will be explained in more detail with reference to the accompanying drawings.
In den Zeichnungen zeigen:
- Fig. 1
- ein als Antennenspule ausgebildetes Miniatur-Bauelement in einer Seitenansicht mit teilweise im Schnitt dargestellter Spulenwicklung;
- Fig. 2
- in einer Darstellung analog Fig. 1 das Bauelement nach Fig. 1 in Aufsicht;
- Fig. 3
- das Bauelement nach Fig. 1 und 2 in einer Ansicht auf die in den Fig. 1 und 2 linke Schmalseite.
- Fig. 4
- eine andere Ausführungsform eines Flansches für ein Miniatur-Bauelement nach den Fig. 1 bis 3 in Seitenansicht;
- Fig. 5
- den Flansch nach Fig. 4 in einer Ansicht von oben;
- Fig. 6
- den Flansch nach Fig. 4 und 5 in einer Ansicht auf die Außenseite.
- Fig. 1
- a designed as an antenna coil miniature device in a side view partially shown in section coil winding;
- Fig. 2
- in a representation analogous to Figure 1, the component of Figure 1 in a plan view.
- Fig. 3
- the component according to FIGS. 1 and 2 in a view of the left in Figs. 1 and 2 narrow side.
- Fig. 4
- another embodiment of a flange for a miniature device according to Figures 1 to 3 in side view.
- Fig. 5
- the flange of Figure 4 in a view from above.
- Fig. 6
- the flange of Fig. 4 and 5 in a view of the outside.
Die in den Fig. 1 bis 3 dargestellte Antennenspule besitzt einen im Querschnitt rechteckigen Ferritkern 1, auf dessen beide Enden Flansche 3 und 4 aufgesteckt und mit dem Ferritkern 1 durch Verklebung verbunden sind. Die Flansche 3 und 4 sind in der gleichen Weise ausgestaltet. Die Flansche weisen einen im Außenquerschnitt im wesentlichen rechteckigen Rahmen 3.1 bzw. 4.1 auf, der mit einer an den rechteckigen Querschnitt des Ferritkerns 1 angepassten rechteckigen Durchstecköffnung 3.2 bzw. 4.2 versehen ist, in welche der Ferritkern 1 in axialer Richtung eingesteckt ist. An den jeweils nach außen gekehrten Seiten der Flansche 3 und 4 besitzen diese sich in Längsrichtung des Ferritkerns 1 erstreckende, mit ihren dem Ferritkern 1 zugewandten Innenseiten an der Außenfläche des durch den Rahmen 3.1 bzw. 4.1 hindürchgeführten Ferritkerns 1 anliegende Führungsrippen 3.31 bis 3.34 bzw. 4.31 bis 4.34. Zwischen den beiden Flanschen 3 und 4 ist direkt auf den Ferritkern 1 die Spulenwicklung 2 aufgebracht. Durch die Rahmen 3.1 bzw. 4.1 der Flansche sind von der Oberseite zur Unterseite an beiden Enden aus dem Rahmen austretende Metallstäbe 5.1 und 5.2 bzw. 6.1 und 6.2 geführt. Die Begriffe "Oberseite" und "Unterseite" beziehen sich jeweils auf das in den Fig. 1 bis 3 dargestellte Gesamtbauelement und zwar ist die Unterseite jeweils die Seite des Bauelements, die bei der Montage auf die Leiterplatte aufgesetzt wird, während die Oberseite die Seite ist, die von der Leiterplatte abgewandt ist. Das an der Oberseite des Rahmens liegende Ende dieser Metallstäbe 5.1, 5.2 bzw. 6.1, 6.2 ist jeweils mit einem Wicklungsende 2.1, 2.2 und 2.3 der Spulenwicklung 2 verbunden, während das an der Unterseite des Rahmens liegende, parallel zur Unterseite des Bauelements nach außen umgebogene Ende 5.11, 5.21 bzw. 6.11, 6.21 der Metallstäbe jeweils als Anschlusselement ausgebildet ist. Wie aus der Darstellung in Fig. 1 bis 3 unmittelbar ersichtlich, kann das Bauteil mit seiner Unterseite derart auf eine nicht dargestellte Leiterplatte aufgesetzt werden, dass die Anschlusselemente direkt mit den entsprechend ausgebildeten Elementen der Leiterplatte verlötet werden können. Die oberen Enden der Metallstäbe 5.1, 5.2 bzw. 6.1, 6.2, an denen die Wicklungsenden 2.1, 2.2 und 2.3 befestigt sind, können ebenfalls nach innen oder außen umgebogen werden.The antenna coil shown in FIGS. 1 to 3 has a rectangular cross-section ferrite core 1, on both ends of which flanges 3 and 4 are plugged and connected to the ferrite core 1 by gluing. The flanges 3 and 4 are configured in the same way. The flanges have an outer cross-section substantially rectangular frame 3.1 and 4.1, which is provided with a matched to the rectangular cross-section of the ferrite core 1 rectangular through opening 3.2 and 4.2, in which the ferrite core 1 is inserted in the axial direction. At the respective outwardly turned sides of the flanges 3 and 4, these have in the longitudinal direction of the ferrite core 1 extending, with their ferrite core 1 facing inner sides of the outer surface of the guided through the frame 3.1 and 4.1 ferrite core 1 guide ribs 3.31 to 3.34 and 4.31 to 4.34. Between the two flanges 3 and 4, the coil winding 2 is applied directly to the ferrite core 1. By the frame 3.1 and 4.1 of the flanges are from the top to the bottom at both ends of the frame leaking metal rods 5.1 and 5.2 or 6.1 and 6.2 out. The terms "top" and "bottom" respectively refer to the overall component shown in FIGS. 1 to 3, and indeed the underside is in each case the side of the component which is placed on the printed circuit board during assembly, while the top side is the side which faces away from the circuit board. The lying at the top of the frame end of the metal rods 5.1, 5.2 and 6.1, 6.2 is respectively connected to a winding end 2.1, 2.2 and 2.3 of the coil winding 2, while lying on the underside of the frame, parallel to the underside of the device bent outward End 5.11, 5.21 and 6.11, 6.21 of the metal rods is formed in each case as a connection element. As can be seen directly from the representation in FIGS. 1 to 3, the component can be placed with its underside on a printed circuit board, not shown, in such a way that the connection elements can be soldered directly to the correspondingly formed elements of the printed circuit board. The upper ends of the metal rods 5.1, 5.2 and 6.1, 6.2, to which the winding ends 2.1, 2.2 and 2.3 are attached, can also be bent inwards or outwards.
Zur besseren Führung und Zugentlastung der Wicklungsenden 2.1 bis 2.3 sind im Bereich der oberen Enden der Seitenstreben der Rahmen 3.1 bzw. 4.1 an der äußeren Schmalseite der Rahmen jeweils Vorsprünge 3.41, 3.42 bzw. 4.41, 4.42 angeformt, die jeweils von einem der Wicklungsenden 2.1, 2.2, 2.3 der Spulenwicklung 2 umfasst werden.For better guidance and strain relief of the winding ends 2.1 to 2.3 are in the region of the upper ends of the side struts of the frame 3.1 or 4.1 formed on the outer narrow side of the frame projections respectively 3.41, 3.42 and 4.41, 4.42, each of one of the winding ends 2.1, 2.2, 2.3 of the
An der Oberseite des Bauteils ist direkt auf der Wicklung 2 ein Plättchen oder Klebepunkt 7 aufgebracht, der eine plane Oberfläche aufweist zur Bildung einer Ansaugfläche für einen Bestückungsautomaten.At the top of the component is directly on the winding 2, a wafer or
Weiterhin ist an der bei der Montage der Leiterplatte zugekehrten Unterseite des Bauteils eine sich in Längsrichtung über einen Teilabschnitt der Länge des Ferritkerns erstreckende Beschichtung 8 angeordnet, die aus einem Material besteht, dessen Schmelzpunkt unterhalb der Temperatur liegt, die am Bauelement beim Verlöten der elektrischen Anschlusselemente mit den Leiterbahnen einer Leiterplatte auftritt, derart, dass das Beschichtungsmaterial sich zeitweise verflüssigt und nach dem Verfließen und Wiederverfestigen eine den Ferritkern stabilisierende Verbindung zwischen Bauelement und Leiterplatte entsteht.Furthermore, on the underside of the component facing the assembly of the printed circuit board, a coating 8 extending in the longitudinal direction over a partial section of the length of the ferrite core is arranged, which consists of a material whose melting point is below the temperature applied to the component during soldering of the electrical connection elements occurs with the tracks of a printed circuit board, such that the coating material is temporarily liquefied and after the flow and re-solidification of the ferrite core stabilizing connection between the component and circuit board is formed.
In den Fig. 4 bis 6 sind andere Ausführungsformen von Flanschen dargestellt, die an Stelle der in den Fig. 1 bis 3 dargestellten Flansche 3 und 4 treten können.FIGS. 4 to 6 show other embodiments of flanges which can be used in place of the flanges 3 and 4 shown in FIGS. 1 to 3.
Diese Flansche unterscheiden sich von den oben beschriebenen Flanschen zunächst dadurch, dass der Rahmen 14.1 nicht als geschlossener Rechteckrahmen, sondern als an der Oberseite offener U-förmiger Rahmen ausgebildet ist. In die Rahmenöffnung 14.2 kann ein im Querschnitt rechteckiger Ferritkern von oben her eingeschoben werden.These flanges differ from the flanges described above initially in that the frame 14.1 is not formed as a closed rectangular frame, but as open at the top U-shaped frame. In the frame opening 14.2 a rectangular cross-section ferrite core can be inserted from above.
Die in den Fig. 4 bis 6 dargestellten Anschlusselemente 15.1 und 15.2 sind keine Ausführungsbeispiele des vorliegenden Erfindung gemäß Anspruch 1.The connecting elements 15.1 and 15.2 illustrated in FIGS. 4 to 6 are not exemplary embodiments of the present invention according to claim 1.
Abschließend wird bemerkt, dass bei allen Ausführungsformen des beschriebenen Miniatur-Bauelements der gegenseitige Abstand der beiden auf den Ferritkern aufgesteckten Flansche 3, 4; 14 vor der festen Verbindung mit dem Ferritkern innerhalb vorgegebener Grenzen veränderbar ist.Finally, it is noted that in all embodiments of the described miniature component of the mutual distance between the two flanged onto the ferrite core flanges 3, 4; 14 is variable within predetermined limits before the fixed connection with the ferrite core.
Claims (11)
- Inductive miniature component for SMD assembly with a monolithic ferrite core (1) of a length which is greater than its width and with at least one coil winding (2) which is applied directly to the core, with electrical connecting elements (5.1, 5.2, 6.1, 6.2) and with flanges (3, 4) located at both ends of the ferrite core, wherein each flange comprises a frame (3.1, 4.1) which is provided with an insertion or a push-through opening (3.2, 4.2), adapted to the cross section of the ferrite core, for the ferrite core (1), and the flanges (3, 4) are pushed onto the ferrite core and joined thereto in a fixed manner, characterised in that each of the two flanges (3, 4) is formed as a plastics part and at least one metal rod (5.1, 5.2, 6.1, 6.2) or strip is located in the frame (3.1, 4.1), this being passed through the frame in the direction from the top side to the underside of the component and emerging from the frame at both ends, wherein the end which lies at the top side is joined to a winding end (2.1, 2.2, 2,3) of a coil winding (2), while the end (5.11, 5.21; 6.11, 6.21) which lies at the underside and is bent parallel to the underside of the component is formed as a connecting element.
- Miniature component according to Claim 1, characterised in that the end (5.11, 5.21; 6.11, 6.21) of the metal rod (5.1, 5.2; 6.1, 6.2) or strip which lies at the underside of the frame (3.1, 4.1) is bent outwards in the longitudinal direction of the ferrite core (1).
- Miniature component according to Claim 1 or 2, characterised in that the end of the metal rod (5.1, 5.2; 6.1, 6.2) or strip which lies at the top side of the frame (3.1, 4.1) is bent inwards in the longitudinal direction of the ferrite core (1).
- Miniature component according to any one of Claims 1 to 3, characterised in that a projection (3.41, 3.42; 4.41, 4.42) is in each case formed in the region of the top ends of the side struts of the frame (3.1, 4.1) at least on one of its external narrow sides, which projection is adapted to be encompassed by a winding end (2.1, 2.2, 2.3) of a coil winding (2).
- Miniature component according to any one of Claims 1 to 4, characterised in that the distance between the two flanges (3, 4) which are pushed onto the ferrite core (1) can be varied within predetermined limits before these are joined to the ferrite core in a fixed manner.
- Miniature component according to any one of Claims 1 to 5, characterised in that the plastics part is joined to the ferrite core (1) by gluing.
- Miniature component according to any one of Claims 1 to 6, characterised in that the flange (3, 4) comprises a closed frame (3.1, 4.1) which is provided with a push-through opening (3.2, 4.2), which extends in the axial direction, for the ferrite core (1).
- Miniature component according to any one of Claims 1 to 6, characterised in that the flange comprises an open frame which is provided with a lateral insertion opening for the ferrite core.
- Miniature component according to any one of Claims 1 to 7, characterised in that the flange (3, 4) comprises at its outside guide ribs (3.31 to 3.34, 4.31 to 4.34) which extend outwards in the longitudinal direction of the ferrite core (1) and lie with their insides, which face the ferrite core, against the external surface of the ferrite core (1) passed through the frame (3.1, 4.1).
- Miniature component according to any one of Claims 1 to 9, characterised in that a lamina (7) or an adhesive point with a planar surface is located at the top side of the component in order to form a suction face.
- Miniature component according to any one of Claims 1 to 10, characterised in that a coating (8) extending in the longitudinal direction at least over a fraction of the length of the ferrite core (1) is located at the underside of the component, which faces a printed circuit board when assembly takes place, this coating consisting of a material whose melting point lies below the temperature occurring at the component upon soldering the electrical connecting elements to the conductor tracks of a printed circuit board such that the coating material liquefies temporarily and, after flowing and solidifying again, a joint which stabilises the ferrite core (1) is produced between the component and the printed circuit board.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE20318052U DE20318052U1 (en) | 2003-11-21 | 2003-11-21 | Miniature inductive component for SMD assembly |
PCT/DE2004/002294 WO2005052963A2 (en) | 2003-11-21 | 2004-10-15 | Inductive miniature component for smd assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1636809A2 EP1636809A2 (en) | 2006-03-22 |
EP1636809B1 true EP1636809B1 (en) | 2006-12-20 |
Family
ID=31984732
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP04789996A Expired - Lifetime EP1636809B1 (en) | 2003-11-21 | 2004-10-15 | Inductive miniature component for smd assembly |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1636809B1 (en) |
AT (1) | ATE349063T1 (en) |
DE (3) | DE20318052U1 (en) |
WO (1) | WO2005052963A2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202005019497U1 (en) * | 2005-12-14 | 2007-04-26 | Neosid Pemetzrieder Gmbh & Co Kg | Inductive miniature component for SMD assembly, has entrance opening in connection flange extending in direction from upper to lower face of component |
DE202005019496U1 (en) * | 2005-12-14 | 2007-04-26 | Neosid Pemetzrieder Gmbh & Co Kg | Inductive miniature component e.g., for SMD assemblies, has entrance aperture extending to transverse bars normal to the plane of frame |
JP2008085684A (en) * | 2006-09-28 | 2008-04-10 | Sumida Corporation | Antenna unit |
US7733283B2 (en) | 2007-10-16 | 2010-06-08 | Sumida Corporation | Antenna Device |
DE102010006010B4 (en) * | 2010-01-27 | 2014-08-14 | Atmel Corp. | IC package |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4326358C1 (en) * | 1993-08-05 | 1994-11-24 | Siemens Audiologische Technik | Induction coil for use as an electromagnetic induction transducer (hearing coil) in electrical hearing aids |
DE19523521A1 (en) * | 1995-06-30 | 1997-01-02 | Licentia Gmbh | Electrical transponder coil and circuit assembly |
DE19607092A1 (en) * | 1996-02-24 | 1997-08-28 | Kaschke Kg Gmbh & Co | Antenna coil for high reliability motor vehicle systems |
US6144280A (en) * | 1996-11-29 | 2000-11-07 | Taiyo Yuden Co., Ltd. | Wire wound electronic component and method of manufacturing the same |
DE29824118U1 (en) * | 1998-03-24 | 2000-06-08 | Neosid Pemetzrieder GmbH & Co KG, 58553 Halver | Miniature inductive component for SMD assembly |
DE19911803A1 (en) * | 1999-03-17 | 2000-09-21 | Kaschke Kg Gmbh & Co | Miniature antenna coil, especially for electronic vehicle locking systems |
DE10143708B4 (en) * | 2001-08-31 | 2005-04-07 | Kaschke Kg (Gmbh & Co.) | Miniature inductor with a prismatic ferrite core placed on a plastic body |
US6690255B2 (en) * | 2002-02-21 | 2004-02-10 | Coilcraft, Incorporated | Electronic component |
DE20300713U1 (en) * | 2003-01-16 | 2003-03-27 | Neosid Pemetzrieder GmbH & Co KG, 58553 Halver | Miniature inductive component for SMD assembly |
-
2003
- 2003-11-21 DE DE20318052U patent/DE20318052U1/en not_active Expired - Lifetime
-
2004
- 2004-10-15 DE DE112004002707T patent/DE112004002707D2/en not_active Expired - Fee Related
- 2004-10-15 WO PCT/DE2004/002294 patent/WO2005052963A2/en active IP Right Grant
- 2004-10-15 AT AT04789996T patent/ATE349063T1/en not_active IP Right Cessation
- 2004-10-15 EP EP04789996A patent/EP1636809B1/en not_active Expired - Lifetime
- 2004-10-15 DE DE502004002388T patent/DE502004002388D1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1636809A2 (en) | 2006-03-22 |
WO2005052963A2 (en) | 2005-06-09 |
ATE349063T1 (en) | 2007-01-15 |
DE112004002707D2 (en) | 2006-11-30 |
DE20318052U1 (en) | 2004-03-04 |
DE502004002388D1 (en) | 2007-02-01 |
WO2005052963A3 (en) | 2005-07-21 |
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