DE102010006010B4 - IC package - Google Patents
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- DE102010006010B4 DE102010006010B4 DE102010006010.0A DE102010006010A DE102010006010B4 DE 102010006010 B4 DE102010006010 B4 DE 102010006010B4 DE 102010006010 A DE102010006010 A DE 102010006010A DE 102010006010 B4 DE102010006010 B4 DE 102010006010B4
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- metal strip
- integrated circuit
- transponder antenna
- antenna
- housing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/645—Inductive arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/27—Adaptation for use in or on movable bodies
- H01Q1/32—Adaptation for use in or on road or rail vehicles
- H01Q1/3208—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used
- H01Q1/3233—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems
- H01Q1/3241—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems particular used in keyless entry systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
- H01Q7/06—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
- H01Q7/08—Ferrite rod or like elongated core
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/0651—Wire or wire-like electrical connections from device to substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Security & Cryptography (AREA)
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Abstract
IC-Gehäuse (10) aufweisend, eine integrierte Schaltung (20) in Form eines Dies, einen Metallstreifen (50), der zur Aufnahme der integrierten Schaltung (20) eingerichtet ist, wobei die integrierte Schaltung (20) mittels Bonddrähten (40) mit dem Metallstreifen (50) elektrisch verbunden ist, eine induktiv wirkende Transponderantenne (35), die als Ferritantenne für das Senden und Empfangen von elektromagnetischer Strahlung ausgebildet ist und einen ersten Kontakt und einen zweiten Kontakt aufweist, die jeweils mit dem Metallstreifen (50) elektrisch verbunden sind, und eine Vergussmasse (15), welche die Bauteile allseitig umschliesst, wobei der Metallstreifen (50) zur Aufnahme der Transponderantenne (35) eingerichtet ist, die Transponderantenne (35) in Form einer Brücke mit einem zylindrischen Mittelteil (38) für eine Aufnahme von Wicklungen eines Spulendrahts ausgebildet ist, an zwei bezüglich des Mittelteils gegenüberliegenden Stellen (36, 37) auf dem Metallstreifen (50) aufliegt, und zwischen dem ersten Auflagepunkt (36) und dem zweiten Auflagepunkt (37) eine Ausformung zur Aufnahme wenigstens eines Teils der integrierten Schaltung (20) aufweist, und die integrierte Schaltung (20) vollständig unterhalb der Brücke angeordnet ist, so dass die integrierte Schaltung (20) von unten durch den Metallstreifen (50) und von oben durch die Transponderantenne (35) gegen elektrische Felder abgeschirmt ist.IC housing (10) having an integrated circuit (20) in the form of a die, a metal strip (50) which is set up to accommodate the integrated circuit (20), the integrated circuit (20) by means of bonding wires (40) with the metal strip (50) is electrically connected, an inductively acting transponder antenna (35), which is designed as a ferrite antenna for sending and receiving electromagnetic radiation and has a first contact and a second contact, each electrically connected to the metal strip (50) and a potting compound (15) which encloses the components on all sides, the metal strip (50) being set up to accommodate the transponder antenna (35), the transponder antenna (35) in the form of a bridge with a cylindrical central part (38) for a receptacle is formed by windings of a coil wire, rests on the metal strip (50) at two opposite points (36, 37) with respect to the central part, and between between the first support point (36) and the second support point (37) has a shape for receiving at least part of the integrated circuit (20), and the integrated circuit (20) is arranged completely below the bridge, so that the integrated circuit (20 ) is shielded from below by the metal strip (50) and from above by the transponder antenna (35) against electrical fields.
Description
Die Erfindung betrifft ein IC-Gehäuse.The invention relates to an IC package.
IC-Gehäuse werden zum Schutz von integrierten Schaltkreisen verwendet. Hierbei werden die Schaltkreise in Form von Dies, das sind im Allgemeinen gesägte und geprobte Waferteile welche die Schaltkreise enthalten, auf Metallstreifen auch Kellen genannt, aufgelegt. Anschließend werden die Dies mittels eines Bondvorgangs mit den Metallstreifen elektrisch verbunden und mit einer Vergussmasse soweit umschlossen, dass ausschließlich die Kontaktfahnen bzw. die Anschlusskontakte der Kelle noch frei zugänglich sind.IC packages are used to protect integrated circuits. Here are the circuits in the form of Dies, which are generally sawn and tested wafer parts containing the circuits, called on metal strips and trowels, placed. Subsequently, the dies are electrically connected to the metal strips by means of a bonding process and encased with a potting compound so far that only the contact lugs or the terminal contacts of the trowel are still freely accessible.
Für eine Systemintegration werden die umschlossenen Bauteile im Allgemeinen auf eine Trägerplatine aufgebracht und mit weiteren Bauteilen verbunden. Insbesondere für eine Verwendung im Bereich der Transponder wird hierbei wenigstens eine Antenne und teilweise weitere zumeist SMD Bauteile mit auf die Platine aufgebracht und mit den entsprechenden Kontakten des Gehäuses verschaltet. Bei den Transponderantennen werden für eine Kommunikation im Bereich LF, beispielsweise bei 125 kHz, vorzugsweise Ferritantennen verwendet, welche mit Spulendraht umwickelt sind und induktiv an das elektromagnetische Feld ankoppeln. Für den HF Bereich, beispielsweise für 13,56 MHz werden im Allgemeinen einige Wicklungen Spulendraht ohne Eisenkern verwendet, um ebenfalls induktiv an das elektromagnetische Feld anzukoppeln. Für den Bereich der UHF, beispielsweise zwischen 700 und 1000 MHz werden dipolartige Antennen verwendet, die kapazitiv an das elektromagnetische Feld ankoppeln.For system integration, the enclosed components are generally applied to a carrier board and connected to other components. In particular, for use in the field of transponders in this case at least one antenna and partially further SMD components usually applied to the board and connected to the corresponding contacts of the housing. In the transponder antennas are preferably used for communication in the range LF, for example at 125 kHz, ferrite antennas, which are wrapped with coil wire and inductively coupled to the electromagnetic field. For the RF range, for example for 13.56 MHz, some windings without an iron core are generally used in order to also inductively couple to the electromagnetic field. For the range of UHF, for example between 700 and 1000 MHz, dipole-type antennas are used, which couple capacitively to the electromagnetic field.
Nachteilig ist, dass ein derartiger Aufbau aufwändig und fehleranfällig ist. Insbesondere im LF Bereich weisen die Antennen das größte Gewicht und Ausdehnung im Vergleich zu den weiteren Bauteilen auf, so dass die Trägerplatine eine hohe mechanische Stabilität aufweisen muss. Des Weiteren werden die integrierten Schaltungen insbesondere durch die bei dem Aufbau unterschiedliche geometrische Lage der Spulen unterschiedlich stark beeinflusst.The disadvantage is that such a structure is complex and error-prone. Particularly in the LF range, the antennas have the largest weight and expansion in comparison to the other components, so that the carrier board must have a high mechanical stability. Furthermore, the integrated circuits are influenced to different degrees, in particular by the different geometric position of the coils in the structure.
Aus der Druckschrift
Aus der Druckschrift
Vor diesem Hintergrund besteht die Aufgabe der Erfindung darin, ein IC-Gehäuse anzugeben, das die Nachteile des Standes der Technik verringert.Against this background, the object of the invention is to provide an IC package, which reduces the disadvantages of the prior art.
Die Aufgabe wird durch ein IC-Gehäuse mit den Merkmalen des Patentanspruchs 1 gelöst. Vorteilhafte Ausgestaltungen der Erfindung sind Gegenstand von Unteransprüchen und in der Beschreibung enthalten.The object is achieved by an IC package having the features of patent claim 1. Advantageous embodiments of the invention are the subject of dependent claims and included in the description.
Die Erfinder haben erkannt, dass auf zusätzliche Abschirmungsmaßnahmen verzichtet werden kann, wenn die integrierte Schaltung unmittelbar und vollständig unterhalb der als Ferritstabantenne ausgebildeten Transponderantenne angeordnet wird, da sowohl der oberhalb der integrierten Schaltung liegende Spulenkörper als auch der unterhalb der integrierten Schaltung liegende Metallstreifen eine wirksame Abschirmung gegen kapazitiv ankoppelnde elektrische Felder bilden. Durch diese Anordnung wird die integrierte Schaltung gegen die Einstreuung elektromagnetischer Strahlung und/oder gegen elektrische Felder besonders effektiv abgeschirmt.The inventors have recognized that additional shielding can be dispensed with if the integrated circuit is placed directly underneath the transponder antenna in the form of a ferrite rod antenna since both the bobbin above the integrated circuit and the metal strip below the integrated circuit provide effective shielding form against capacitive coupling electric fields. By this arrangement, the integrated circuit is shielded particularly effective against the interference of electromagnetic radiation and / or electric fields.
Ein Vorteil der erfindungsgemäßen Anordnung ist es, dass innerhalb eines IC-Gehäuses in dem bisher nur eine oder mehrere integrierte Schaltungen auf einem Metallstreifen angeordnet sind, unmittelbar wenigstens eine induktive wirkende Antenne, die vorzugsweise für einen Frequenzbereich unterhalb 1 MHz ausgelegt ist, zusammen mit der oder den integrierten Schaltungen in ein einziges IC-Gehäuse integriert wird. Hierdurch lässt sich insbesondere ein Transpondersende- und Empfangssystem mit einem einzelnen IC-Gehäuse in einer im Vergleich zu dem Stand der Technik wesentlich kleineren Bauform kostengünstig und mit reduzierter Fehleranfälligkeit zusammenfügen. Des Weiteren lassen sich die Kosten für ein Zusammenfügen unterschiedliche Einzelteile gegenüber einem Aufbau auf einer Platine wesentlich reduzieren. Es versteht sich, dass der Metallstreifen in seiner Form und Größe an die Größe der integrierten Schaltung und der aufzunehmenden Antenne und gegebenenfalls an weitere Bauteile angepasst ist. Hierbei wird die Form des Metallstreifens durch bekannte Stanz- und Biegeprozesse und oder Ätzprozesse bestimmt. Ferner werden die Einzelteile vor Umwelteinflüssen mittels des Vergusses geschützt und mittels der Stabilität nach der Aushärtung der Vergussmasse dauerhaft und mechanisch stabil zusammengefügt.An advantage of the arrangement according to the invention is that within an IC package in which so far only one or more integrated circuits are arranged on a metal strip, directly at least one inductive acting antenna, which is preferably designed for a frequency range below 1 MHz, together with the or the integrated circuits are integrated into a single IC package. This makes it possible in particular a Transpondersende- and receiving system with a single IC package in a much smaller compared to the prior art design cost and put together with reduced error rate. Furthermore, the costs for assembling different individual parts compared to a construction on a circuit board can be significantly reduced. It is understood that the shape and size of the metal strip are adapted to the size of the integrated circuit and the antenna to be accommodated and possibly to other components. Here, the shape of the metal strip is determined by known punching and bending processes and or etching processes. Furthermore, the items are protected from environmental influences by means of the potting and assembled by the stability after curing of the potting permanently and mechanically stable.
In einer Weiterbildung ist der Metallstreifen eingerichtet, mehrere integrierte Schaltkreise aufzunehmen.In one development, the metal strip is set up to accommodate a plurality of integrated circuits.
In einer anderen Ausführungsform sind die Metallstreifen eingerichtet wenigstens ein SMD Bauteil aufzunehmen. Hierdurch lassen sich innerhalb eines IC-Gehäuses ein vollständiges System für einen Tranpondersende- und Empfangssystem aufbauen, ohne dass weitere externe Bauteile benötigt werden, sofern die Spannungsversorgung mittels Absorption der Energie zur Versorgung der elektrischen Bauteile aus dem elektromagnetischen Feld aufgenommen werden kann. Die Anschlüsse der einzelnen in ein IC-Gehäuse integrierten Bauteile lassen sich mittels des Metallstreifens nach außen führen, soweit erforderlich.In another embodiment, the metal strips are configured to receive at least one SMD component. As a result, can be built within a IC package, a complete system for a Tranpondersende- and receiving system without further external components are needed, if the power supply can be absorbed by absorbing the energy to supply the electrical components from the electromagnetic field. The terminals of the individual components integrated into an IC housing can be led outwards by means of the metal strip, if necessary.
Untersuchungen der Anmelderin haben gezeigt, dass aufgrund der geringen Bauform des IC-Gehäuses eine Verwendung zum Aufbau eines Mikromoduls für einen elektronischen Schlüssel besonders vorteilhaft ist. Insbesondere lässt sich ein derartiges Modul als elektronischer Schlüssel für eine Zugangskontrolle für ein Kraftfahrzeug verwenden.Investigations by the applicant have shown that due to the small size of the IC package, a use for constructing a micromodule for an electronic key is particularly advantageous. In particular, such a module can be used as an electronic key for access control for a motor vehicle.
Die Erfindung wird nachfolgend unter Bezugnahme auf die Zeichnungen näher erläutert. Hierbei werden funktional gleiche Teile mit identischen Bezugszeichen beschriftet. Darin zeigen die:The invention will be explained in more detail with reference to the drawings. Here functionally identical parts are labeled with identical reference numerals. In it show:
In der Darstellung der
In der Darstellung der
In der Darstellung der
Ein Vorteil der erfindungsgemäßen Ausführung ist es, dass je nach Größe und Ausformung des Metallstreifens und der Vergussmasse unterschiedliche elektrische Bauteile innerhalb eines IC-Gehäuse unter Verwendung eines standardisierten Herstellungsprozesses kostengünstig produziert werden können. Insbesondere lassen sich auch mehrere Antennen unterschiedlicher Bauart für unterschiedliche Frequenzen in das IC-Gehäuse integrieren.An advantage of the embodiment according to the invention is that, depending on the size and shape of the metal strip and the potting compound, different electrical components within an IC package can be inexpensively produced using a standardized manufacturing process. In particular, several antennas of different designs can be integrated into the IC package for different frequencies.
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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DE102010006010.0A DE102010006010B4 (en) | 2010-01-27 | 2010-01-27 | IC package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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DE102010006010.0A DE102010006010B4 (en) | 2010-01-27 | 2010-01-27 | IC package |
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DE102010006010A1 DE102010006010A1 (en) | 2011-09-29 |
DE102010006010B4 true DE102010006010B4 (en) | 2014-08-14 |
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CN113206057B (en) * | 2021-04-30 | 2022-09-06 | 深圳数马电子技术有限公司 | Chip package frame, chip assembly and method for manufacturing chip assembly |
Citations (13)
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FR2641102A1 (en) * | 1988-12-27 | 1990-06-29 | Ebauchesfabrik Eta Ag | |
EP0677887A1 (en) * | 1994-04-13 | 1995-10-18 | Texas Instruments Incorporated | Built-in chip transponder with antenna circuit |
US6321994B1 (en) * | 1998-12-22 | 2001-11-27 | U.S. Philips Corporation | Contactless communication data carrier with fully enclosed holding means for holding a chip and a passive component |
US6373447B1 (en) * | 1998-12-28 | 2002-04-16 | Kawasaki Steel Corporation | On-chip antenna, and systems utilizing same |
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DE20318052U1 (en) * | 2003-11-21 | 2004-03-04 | Neosid Pemetzrieder Gmbh & Co Kg | Miniature inductive component for SMD assembly |
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