EP1287537B1 - Element de construction miniature inductif pour montage en surface smd, et procede de fabrication associe - Google Patents
Element de construction miniature inductif pour montage en surface smd, et procede de fabrication associe Download PDFInfo
- Publication number
- EP1287537B1 EP1287537B1 EP02735060A EP02735060A EP1287537B1 EP 1287537 B1 EP1287537 B1 EP 1287537B1 EP 02735060 A EP02735060 A EP 02735060A EP 02735060 A EP02735060 A EP 02735060A EP 1287537 B1 EP1287537 B1 EP 1287537B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- winding
- wire
- coil
- component according
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000001939 inductive effect Effects 0.000 title claims description 8
- 238000000034 method Methods 0.000 title claims description 8
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 238000004804 winding Methods 0.000 claims description 76
- 239000000463 material Substances 0.000 claims description 6
- 229910000859 α-Fe Inorganic materials 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 239000004922 lacquer Substances 0.000 claims 2
- 238000005516 engineering process Methods 0.000 description 4
- 210000003298 dental enamel Anatomy 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F17/045—Fixed inductances of the signal type with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2823—Wires
- H01F27/2828—Construction of conductive connections, of leads
Definitions
- the invention relates to an inductive miniature component for SMD assembly with a coil carrier made of plastic or ferrite material, in or on the at least one coil winding is arranged, being on an outside of the Coil carrier and in one piece with this connecting pin projecting outwards are arranged around which one end of the winding wire each Coil winding is wound around in several turns, as well as a method for the production of such a component.
- Such a miniature inductive component with a ferrite material existing coil former is, for example, in the German utility model No. 298 24 118.8.
- the invention has for its object an inductive miniature component for SMD assembly with the introduction and in the preamble of claim 1 the specified features so that even when using Winding wires with a very thin diameter risk of tearing the end of the winding wire considerably even when subjected to shock vibration is reduced.
- the basic idea of the invention is the respective end of the winding wire not to wind up directly on the connecting pin, but the To first connect the connecting pin with a wire in several turns
- the diameter of the wire of the metallizing wire winding should be so large be that its tensile strength is sufficient, the demands made on the component with regard to impact and shaking loads. It turned out that it is convenient if the wire of the metallizing wire winding has a diameter that is at least twice as large as the diameter of the winding wire.
- the wire of the metallizing wire winding can be a CuAg wire, it a tinned copper wire can also be used or a wire made of an alloy with higher tensile strength, such as bronze.
- connection technology according to the invention is both in coil formers Plastic material as well as coil carriers made of ferrite material and ceramic plates applicable.
- the arrangement of the connecting pins is arbitrary and can can be adapted to the respective needs.
- a transponder coil is shown with a hood trained coil carrier 1, in which a coil winding 2 is inserted.
- the Coil carrier 1 has an octagonal layout and is made of plastic material.
- connection pins on every second side surface of the coil carrier 1 1.1, 1.2, 1.3 and 1.4 arranged, which are integrally connected to the coil carrier are.
- the connecting pins 1.1 to 1.4 are in the transverse direction to the coil axis arranged.
- the ends 2.1 to 2.4 of the coil winding 2 are each wrapped around the connecting pins 1.1 to 1.4 in several turns.
- Fig. 4 shows details of this connection technology using the example of the connecting pin 1.1.
- a metallizing wire winding 3.1 which consists of a there is electrically conductive wire whose diameter is larger than that Diameter of the winding wire 2.1 and directly in several turns is wound on the connecting pin 1.1.
- FIGS. 5 to 7. It is here again around a bobbin 4 designed as a hood, which has a rectangular one Has floor plan and the connecting pins 4.1, 4.2, 4.3, 4.4, 4.5, 4.6 are each on two opposite side walls of the coil carrier 4 arranged.
- FIG. 8 Another example is the coil carrier 5 shown in FIG. 8, which is a ceramic Plate is designed for a double-hole core transformer and to the opposite side surfaces of connecting pins 5.1, 5.2, 5.3 or 5.4 and 5.5.
- the connection of the ends of the not shown Winding in the same way as described with reference to FIG. 4.
- Fig. 9 shows another way of forming the coil carrier.
- the Coil carrier 6 is designed here as a ferrite winding body with two connecting pins 6.1 and 6.2 on the opposite sides of the winding body.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Coils Of Transformers For General Uses (AREA)
Claims (10)
- Composant miniature inductif pour montage SMD, comprenant un porte-bobine (1, 4) en matière plastique ou en matériau à base de ferrite, dans lequel ou sur lequel est agencé au moins un enroulement de bobine (2), dans lequel sur une face extérieure du porte-bobine et d'un seul tenant avec celui-ci sont agencés des tenons de raccordement (1.1 à 1.4, 4.1 à 4.6) dépassant vers l'extérieur et autour desquels une extrémité respective (2.1 à 2.4) du fil d'un enroulement de bobine est enroulé en plusieurs spires, caractérisé en ce qu'entre le tenon de raccordement (1.1) et l'extrémité (2.1) du fil d'enroulement enroulé autour de celui-ci est agencé un enroulement de fil de métallisation (3.1) formé d'un fil électroconducteur dont le diamètre est supérieur au diamètre du fil d'enroulement et qui est enroulé directement sur le tenon de raccordement (1.1) en plusieurs spires.
- Composant selon la revendication 1, caractérisé en ce que le diamètre du fil de l'enroulement de fil de métallisation (3.1) est au moins deux fois plus grand que le diamètre du fil d'enroulement.
- Composant selon l'une ou l'autre des revendications 1 et 2, caractérisé en ce que le fil de l'enroulement de fil de métallisation (3.1) est un fil de CuAg.
- Composant selon l'une des revendications 1 à 3, caractérisé en ce que le porte-bobine est réalisé sous forme de capot (1, 4), dans lequel l'enroulement de bobine (2) est mis en place, et en ce que les tenons de raccordement (1.1 à 1.4, 4.1 à 4.6) sont agencés sur les parois latérales du capot en direction transversale à l'axe de bobine.
- Composant selon la revendication 4, caractérisé en ce que le capot (4) présente un contour de base essentiellement rectangulaire, et en ce que les tenons de raccordement (4.1 à 4.6) sont agencés respectivement sur deux parois latérales opposées l'une à l'autre.
- Composant selon la revendication 4, caractérisé en ce que le capot (1) présente un contour de base essentiellement octogonal, et en ce que les tenons de raccordement (1.1 à 1.4) sont agencés respectivement sur chaque face latérale paire.
- Composant selon la revendication 4, caractérisé en ce que le capot présente un contour de base circulaire.
- Composant selon l'une des revendications 1 à 3, caractérisé en ce que le porte-bobine (5) est réalisé sous forme d'une plaque en céramique.
- Procédé pour réaliser un composant selon l'une des revendications 1 à 8, caractérisé par les étapes de procédé suivantes :a) on prépare un porte-bobine avec des tenons de raccordement en saillie vers l'extérieur ;b) on enroule sur le tenon de raccordement un enroulement de fil de métallisation en plusieurs spires, le diamètre du fil étant supérieur au diamètre du fil d'enroulement ;c) on met en place un enroulement de bobine dans le porte-bobine ;d) on enlève l'isolation de laque aux extrémités du fil d'enroulement et on procède le cas échéant à un étamage des extrémités ;e) on enroule sur le tenon de raccordement doté de l'enroulement de fil de métallisation les extrémités du fil de l'enroulement de bobine en plusieurs spires ;f) on établit un contact des extrémités de bobine avec le tenon de raccordement par brasage au trempé.
- Procédé pour réaliser un composant selon l'une des revendications 1 à 8, caractérisé par les étapes de procédé suivantes :a) on prépare un porte-bobine avec des tenons de raccordement en saillie vers l'extérieur ;b) on enroule sur le tenon de raccordement un enroulement de fil de métallisation en plusieurs spires, le diamètre du fil étant supérieur au diamètre du fil d'enroulement ;c) on monte un enroulement de bobine sur le porte-bobine ;d) on enlève l'isolation de laque aux extrémités du fil d'enroulement et on procède le cas échéant à un étamage des extrémités ;e) on enroule sur le tenon de raccordement doté de l'enroulement de fil de métallisation les extrémités du fil de l'enroulement de bobine en plusieurs spires ;f) on établit un contact des extrémités de bobine avec le tenon de raccordement par brasage au trempé.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10124378 | 2001-05-18 | ||
DE10124378A DE10124378A1 (de) | 2001-05-18 | 2001-05-18 | Induktives Miniaturbauelement für SMD-Montage sowie Verfahren zu seiner Herstellung |
PCT/DE2002/001615 WO2002095776A1 (fr) | 2001-05-18 | 2002-05-03 | Element de construction miniature inductif pour montage en surface smd, et procede de fabrication associe |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1287537A1 EP1287537A1 (fr) | 2003-03-05 |
EP1287537B1 true EP1287537B1 (fr) | 2004-06-16 |
Family
ID=7685361
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP02735060A Expired - Lifetime EP1287537B1 (fr) | 2001-05-18 | 2002-05-03 | Element de construction miniature inductif pour montage en surface smd, et procede de fabrication associe |
Country Status (4)
Country | Link |
---|---|
US (1) | US6788179B2 (fr) |
EP (1) | EP1287537B1 (fr) |
DE (2) | DE10124378A1 (fr) |
WO (1) | WO2002095776A1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004050650A (ja) * | 2002-07-19 | 2004-02-19 | Nec Corp | 半導体装置、画像出力装置、および機能素子の駆動方法 |
CN101640118B (zh) * | 2009-07-13 | 2011-05-18 | 广州金升阳科技有限公司 | 一种棱形变压器 |
US8754734B2 (en) * | 2010-02-11 | 2014-06-17 | Pulse Electronics, Inc. | Simplified inductive devices and methods |
EP3975209A4 (fr) * | 2019-09-09 | 2022-09-14 | Suzhou Opple Lighting Co., Ltd. | Structure de cadre de bobine d'induction, dispositif de bobine d'induction et lampe |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE7509610U (de) | 1975-07-17 | Neosid Pemetzrieder Kg | Elektrische Spule | |
US4754370A (en) * | 1986-08-26 | 1988-06-28 | American Telephone And Telegraph Company, At&T Bell Laboratories | Electrical component with added connecting conducting paths |
US5212345A (en) * | 1992-01-24 | 1993-05-18 | Pulse Engineering, Inc. | Self leaded surface mounted coplanar header |
DE19812836A1 (de) * | 1998-03-24 | 1999-09-30 | Pemetzrieder Neosid | Induktives Miniatur-Bauelement für SMD-Montage |
-
2001
- 2001-05-18 DE DE10124378A patent/DE10124378A1/de not_active Withdrawn
-
2002
- 2002-05-03 WO PCT/DE2002/001615 patent/WO2002095776A1/fr active IP Right Grant
- 2002-05-03 US US10/312,920 patent/US6788179B2/en not_active Expired - Lifetime
- 2002-05-03 DE DE50200524T patent/DE50200524D1/de not_active Expired - Lifetime
- 2002-05-03 EP EP02735060A patent/EP1287537B1/fr not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE50200524D1 (de) | 2004-07-22 |
US6788179B2 (en) | 2004-09-07 |
US20030141955A1 (en) | 2003-07-31 |
EP1287537A1 (fr) | 2003-03-05 |
DE10124378A1 (de) | 2002-11-21 |
WO2002095776A1 (fr) | 2002-11-28 |
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