EP1287537A1 - Element de construction miniature inductif pour montage en surface smd, et procede de fabrication associe - Google Patents

Element de construction miniature inductif pour montage en surface smd, et procede de fabrication associe

Info

Publication number
EP1287537A1
EP1287537A1 EP02735060A EP02735060A EP1287537A1 EP 1287537 A1 EP1287537 A1 EP 1287537A1 EP 02735060 A EP02735060 A EP 02735060A EP 02735060 A EP02735060 A EP 02735060A EP 1287537 A1 EP1287537 A1 EP 1287537A1
Authority
EP
European Patent Office
Prior art keywords
wire
winding
coil
connecting pins
diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP02735060A
Other languages
German (de)
English (en)
Other versions
EP1287537B1 (fr
Inventor
Karl-Heinz HÖLLER
Eugeniusz Swoboda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Neosid Pemetzrieder GmbH and Co KG
Original Assignee
Neosid Pemetzrieder GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Neosid Pemetzrieder GmbH and Co KG filed Critical Neosid Pemetzrieder GmbH and Co KG
Publication of EP1287537A1 publication Critical patent/EP1287537A1/fr
Application granted granted Critical
Publication of EP1287537B1 publication Critical patent/EP1287537B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F17/045—Fixed inductances of the signal type  with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2823—Wires
    • H01F27/2828—Construction of conductive connections, of leads

Definitions

  • the invention has for its object to form an inductive miniature component for SMD assembly with the features specified at the beginning and in the preamble of claim 1 such that even when using winding wires with a very thin diameter, the risk of the end of the winding wire tearing off even in the event of shock - Vibration exposure is significantly reduced.
  • the diameter of the wire of the metallizing wire winding should be so large that its tensile strength is sufficient to meet the demands placed on the component with regard to impact and shaking stress. It has turned out that it is favorable if the wire of the metallizing wire winding has a diameter which is at least twice as large as the diameter of the winding wire.
  • FIG. 8 Another example is the coil carrier 5 shown in FIG. 8, which is designed as a ceramic plate for a double-hole core transformer and has connecting pins 5.1, 5.2, 5.3 or 5.4 and 5.5 on the opposite side faces.
  • the coil carrier 6 is designed here as a ferrite winding body with two connecting pins 6.1 and 6.2 on the opposite sides of the winding body.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Coils Of Transformers For General Uses (AREA)

Abstract

L'invention concerne un élément de construction miniature inductif, destiné au montage en surface SMD, comportant un porte-bobine (1) en plastique ou en ferrite disposé dans ou sur l'enroulement, qui est au moins au nombre de un. Sur une face extérieure du porte-bobine, avec lequel ils forment un bloc, se trouvent des pivots de raccordement (1.1) en saillie vers l'extérieur, autour desquels une extrémité (2.1) du fil d'un enroulement est enroulé en plusieurs spires. Entre le pivot de raccordement (1.1) et l'extrémité (2.1) du fil qui l'entoure, un enroulement de fil (3.1) de métallisation comporte un fil électriquement conducteur, dont le diamètre est supérieur à celui du fil d'enroulement, ce fil conducteur étant directement enroulé en plusieurs spires sur le pivot de raccordement (1.1).
EP02735060A 2001-05-18 2002-05-03 Element de construction miniature inductif pour montage en surface smd, et procede de fabrication associe Expired - Lifetime EP1287537B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10124378A DE10124378A1 (de) 2001-05-18 2001-05-18 Induktives Miniaturbauelement für SMD-Montage sowie Verfahren zu seiner Herstellung
DE10124378 2001-05-18
PCT/DE2002/001615 WO2002095776A1 (fr) 2001-05-18 2002-05-03 Element de construction miniature inductif pour montage en surface smd, et procede de fabrication associe

Publications (2)

Publication Number Publication Date
EP1287537A1 true EP1287537A1 (fr) 2003-03-05
EP1287537B1 EP1287537B1 (fr) 2004-06-16

Family

ID=7685361

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02735060A Expired - Lifetime EP1287537B1 (fr) 2001-05-18 2002-05-03 Element de construction miniature inductif pour montage en surface smd, et procede de fabrication associe

Country Status (4)

Country Link
US (1) US6788179B2 (fr)
EP (1) EP1287537B1 (fr)
DE (2) DE10124378A1 (fr)
WO (1) WO2002095776A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3975209A4 (fr) * 2019-09-09 2022-09-14 Suzhou Opple Lighting Co., Ltd. Structure de cadre de bobine d'induction, dispositif de bobine d'induction et lampe

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004050650A (ja) * 2002-07-19 2004-02-19 Nec Corp 半導体装置、画像出力装置、および機能素子の駆動方法
CN101640118B (zh) * 2009-07-13 2011-05-18 广州金升阳科技有限公司 一种棱形变压器
US8754734B2 (en) * 2010-02-11 2014-06-17 Pulse Electronics, Inc. Simplified inductive devices and methods

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE7509610U (de) * 1975-07-17 Neosid Pemetzrieder Kg Elektrische Spule
US4754370A (en) * 1986-08-26 1988-06-28 American Telephone And Telegraph Company, At&T Bell Laboratories Electrical component with added connecting conducting paths
US5212345A (en) * 1992-01-24 1993-05-18 Pulse Engineering, Inc. Self leaded surface mounted coplanar header
DE19812836A1 (de) * 1998-03-24 1999-09-30 Pemetzrieder Neosid Induktives Miniatur-Bauelement für SMD-Montage

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO02095776A1 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3975209A4 (fr) * 2019-09-09 2022-09-14 Suzhou Opple Lighting Co., Ltd. Structure de cadre de bobine d'induction, dispositif de bobine d'induction et lampe

Also Published As

Publication number Publication date
US20030141955A1 (en) 2003-07-31
DE10124378A1 (de) 2002-11-21
US6788179B2 (en) 2004-09-07
WO2002095776A1 (fr) 2002-11-28
EP1287537B1 (fr) 2004-06-16
DE50200524D1 (de) 2004-07-22

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