EP0177759A1 - Composant électronique, en particulier pour une micro-inductance - Google Patents
Composant électronique, en particulier pour une micro-inductance Download PDFInfo
- Publication number
- EP0177759A1 EP0177759A1 EP85111179A EP85111179A EP0177759A1 EP 0177759 A1 EP0177759 A1 EP 0177759A1 EP 85111179 A EP85111179 A EP 85111179A EP 85111179 A EP85111179 A EP 85111179A EP 0177759 A1 EP0177759 A1 EP 0177759A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- contact elements
- recesses
- electronic component
- component according
- winding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004804 winding Methods 0.000 claims abstract description 20
- 239000007787 solid Substances 0.000 claims abstract description 5
- 239000012811 non-conductive material Substances 0.000 claims abstract description 4
- 230000005294 ferromagnetic effect Effects 0.000 claims abstract description 3
- 229910000859 α-Fe Inorganic materials 0.000 claims description 10
- 239000011810 insulating material Substances 0.000 claims description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 238000012216 screening Methods 0.000 claims 1
- IHQKEDIOMGYHEB-UHFFFAOYSA-M sodium dimethylarsinate Chemical class [Na+].C[As](C)([O-])=O IHQKEDIOMGYHEB-UHFFFAOYSA-M 0.000 claims 1
- 239000010410 layer Substances 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000005291 magnetic effect Effects 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000000696 magnetic material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/10—Connecting leads to windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F17/045—Fixed inductances of the signal type with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
- H01F2027/295—Surface mounted devices with flexible terminals
Definitions
- the invention relates to an electronic component, in particular for a chip inductance, in particular air coil and RF choke, with a solid core part with a vertical prismatic spatial shape, in particular cuboids, cubes or cylinders, consisting of ferromagnetic or electrically non-conductive material, in particular ferrite, ceramic or Plastic, with a winding space that can be wound in one or more layers and is set apart from parallel ends of the core part and with recesses arranged in the area of these ends for receiving electrical contact elements.
- Chip inductors are smaller in comparison to conventional wired inductors, can be manufactured with less effort and are more suitable for use in the automatic assembly machines for printed circuit boards.
- the known chip inductors are partly produced using layer technology and partly designed as rectangular or cylindrical, wire-wound magnetic cores, in particular ferrite cores
- a carrier is coated with a layer of magnetic material and a conductor track shaped into a coil is applied to this layer, the partial inductance thus produced being combined with further partial inductances to form a stack, depending on the desired inductance.
- Numerous methods are not known for through-contacting the ends of the individual coils or partial inductors
- chip inductors are characterized by their space-saving design, can be killed directly on printed circuit boards and do not require any additional wires as connection elements.
- the disadvantage is their complex production, which is due to the layering technique. Variations in the layer thickness of the magnetic layer that are unavoidable in production cause undesirable fluctuations in the L and Q values of the inductors. Silver or a silver-palladium alloy, for example, must be used as the material for the coil conductor tracks and a high ohmic resistance of the conductor tracks must be accepted. Since the conductor tracks are embedded in the magnetic layer, magnetic saturation occurs due to the closed magnetic circuit even at low values; the DC bias properties of the chip inductance are consequently deteriorated. In addition, the number of coil turns cannot be selected to any desired height and therefore no inductance of any desired value can be set.
- a likewise known chip inductor has a rectangular ferrite core with a rectangular or cylindrical central part as a winding support and flanges integrally formed on this support, which also have a rectangular cross section.
- the winding ends are contacted by means of electrically conductive layers on the flanges on the end face, to which the winding ends are soldered.
- the finished wrap is embedded in synthetic resin, which forms a cuboid together with the flanges
- connection elements have to be fastened to the coil core in two processing steps. First, a metal plate is glued to the coil body and only then is the actual connection strip soldered on.
- US Pat. No. 3,585,553 discloses a chip inductor with a solid ferrite part with a cuboid shape, which has a winding space which is wound in one layer and is set down against the parallel ends of the core part and has recesses arranged in the region of these ends for leading out the winding ends.
- the recesses are guided in the longitudinal direction of the chip inductor and the surfaces of the stimulators arranged on both sides are covered with electrically conductive layers, via which the winding ends are contacted.
- the structure of this chip inductor is relatively simple; however, the electrically conductive contact layers have to be manufactured in a complicated manner.
- the present invention has for its object to provide an electronic component of the type mentioned, which can be produced with little effort, is suitable for manufacturing chip inductors and meets the requirements of certain electronic devices in terms of high resonance frequencies insofar as it e.g. single layer and can be wound with high numbers of turns despite small dimensions.
- the connection elements of this electronic component should also be such that they meet both the high mechanical requirements such. B. during assembly and also the mechanical loads caused by any bending of the printed circuit boards.
- the invention provides for an electronic component according to the preamble of the patent claim that the end faces of parallel ends of the core part of this electronic component have mutually parallel cutouts which run over the entire narrow or broad side of these end faces and which accommodate platelet-shaped contact elements are suitable.
- the contact elements which are glued, clamped or resiliently held in the recesses, protrude with their one ends in each case beyond the ends and are in these parts intended for winding the winding ends, e.g. bent in a U-shape or permitted as connector pins
- the production of these electronic components and their chip inductors is considerably simplified if - as is known per se - the contact elements are first formed as detachable parts of a system carrier, the wound core parts are placed on these contact elements, their winding ends are wound onto the contact elements and - if necessary required - the chip inductance manufactured in this way is encased with insulating material, which can be mixed with carbonyl iron or ferrite for certain shielding requirements.
- the system carriers equipped with these chip inductors can be separated before or, if necessary, only after they have been coated with insulating material.
- Fig. 1 is a solid core part in cuboid shape, which z. B. in the manufacture of an RF choke made of magnetic material, in particular ferrite, or, if z. B. an air coil is to be made of electrical non-conductive material, in particular ceramic or plastic.
- the core part 1 is formed with a winding space opposite its one parallel ends 2, which in the exemplary embodiment shown carries a single-layer winding 4.
- the end faces of the ends 2, 2 have parallel cut-outs 3, 3, which run over the entire narrow or broad side of the end faces and have a dovetail-shaped cross section.
- Platelet-shaped contact elements 5 are inserted into these recesses and are chamfered at one corner edge 7 to facilitate their insertion.
- the contact elements 5 each have a part 8 projecting over the front ends 2, 2 and bent in a U-shape and intended for winding the winding ends 6.
- the contact elements 5 can be glued into the recesses 3 or can be resiliently held in the recesses by appropriate design of their parts guided in the recess.
- the chip inductance is surrounded by an insulating material covering 11, which can be offset with carbonyl iron or ferrite for shielding.
- the contacting of the winding ends 7 with the contact elements 5, the z. B. can be carried out by means of welding or soldering, takes place here directly in the part of the contact elements 5 guided in the recesses 3.
- the parts 12 of the contact elements 5 led out of the insulating material sheath 11 can, for. B. be designed as connector pins for drilled circuit boards.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3433692 | 1984-09-13 | ||
DE3433692 | 1984-09-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0177759A1 true EP0177759A1 (fr) | 1986-04-16 |
EP0177759B1 EP0177759B1 (fr) | 1990-05-16 |
Family
ID=6245346
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP85111179A Expired - Lifetime EP0177759B1 (fr) | 1984-09-13 | 1985-09-04 | Composant électronique, en particulier pour une micro-inductance |
Country Status (4)
Country | Link |
---|---|
US (1) | US4704592A (fr) |
EP (1) | EP0177759B1 (fr) |
JP (1) | JPS6171609A (fr) |
DE (1) | DE3577771D1 (fr) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4332638A1 (de) * | 1993-09-24 | 1995-03-30 | Siemens Matsushita Components | Chip-Induktivität |
EP0675513A1 (fr) * | 1994-03-30 | 1995-10-04 | Matsushita Electric Industrial Co., Ltd. | Micro inductance |
EP1250828A1 (fr) * | 2000-01-13 | 2002-10-23 | Sonion Microtronic Nederland B.V. | Conditionnement et blindage r.f. pour phonocapteurs t l phoniques |
DE19547091B4 (de) * | 1995-12-16 | 2005-04-07 | Kaschke Kg (Gmbh & Co.) | Antennenspule mit oberflächenmontierbarem Gehäuse und Verfahren zu deren Herstellung |
DE10031599B4 (de) * | 1999-06-29 | 2005-06-23 | Matsushita Electric Industrial Co., Ltd., Kadoma | Spulenelement |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2606544B1 (fr) * | 1986-11-07 | 1990-05-18 | Thomson Csf | Inductance |
JPS63187312U (fr) * | 1987-05-26 | 1988-11-30 | ||
JPH06325938A (ja) * | 1993-05-11 | 1994-11-25 | Murata Mfg Co Ltd | 巻線型コイル |
DE4432740A1 (de) | 1994-09-14 | 1996-03-21 | Siemens Matsushita Components | Chip-Induktivität |
US6144280A (en) | 1996-11-29 | 2000-11-07 | Taiyo Yuden Co., Ltd. | Wire wound electronic component and method of manufacturing the same |
US5959587A (en) * | 1997-09-12 | 1999-09-28 | Ppg Industries Ohio, Inc. | On the glass antenna system |
FI105294B (fi) | 1997-12-16 | 2000-07-14 | Nokia Networks Oy | Järjestely magneettipiirin toteuttamiseksi piirilevylle |
US6137390A (en) * | 1999-05-03 | 2000-10-24 | Industrial Technology Research Institute | Inductors with minimized EMI effect and the method of manufacturing the same |
US7088211B2 (en) * | 2003-07-15 | 2006-08-08 | Astec International Limited | Space saving surface-mounted inductors |
US20050145408A1 (en) * | 2003-12-03 | 2005-07-07 | Scott Hess | Electronic component |
CN101501791A (zh) * | 2006-07-14 | 2009-08-05 | 美商·帕斯脉冲工程有限公司 | 自引线表面安装电感器和方法 |
US20150137919A1 (en) * | 2011-10-25 | 2015-05-21 | Correlated Magnetics Research, Llc | System and Method for Producing Magnetic Structures |
US20120249107A1 (en) * | 2011-04-01 | 2012-10-04 | Cowley Nicholas P | Coupled inductor to facilitate integrated power delivery |
EP2530686B1 (fr) * | 2011-06-01 | 2014-08-06 | ABB Research Ltd. | Pression des enroulements de transformateur durant le séchage de la partie active |
CN104335342A (zh) | 2012-03-13 | 2015-02-04 | 英特尔公司 | 反向微电子封装上的微电子器件附着 |
US10136516B2 (en) | 2012-03-13 | 2018-11-20 | Intel Corporation | Microelectronic device attachment on a reverse microelectronic package |
US9526175B2 (en) * | 2012-04-24 | 2016-12-20 | Intel Corporation | Suspended inductor microelectronic structures |
US9177714B2 (en) * | 2012-12-28 | 2015-11-03 | Power Integrations, Inc. | Transverse shield wire for energy transfer element |
JP2021002577A (ja) * | 2019-06-21 | 2021-01-07 | 株式会社村田製作所 | 巻線型インダクタ部品 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3533054A (en) * | 1968-01-11 | 1970-10-06 | United Carr Inc | Electrical terminal structure |
US3735214A (en) * | 1972-01-27 | 1973-05-22 | Coilcraft Inc | A header for mounting circuit elements for incorporation in an electric circuit |
DE2454175A1 (de) * | 1974-11-15 | 1976-05-26 | Lothar Sachsse | Einstueckiger spulenwickelkoerper ohne bohrung |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3117294A (en) * | 1964-01-07 | Bobbin with insulated lead-in means | ||
US1997198A (en) * | 1931-01-31 | 1935-04-09 | Bell Telephone Labor Inc | Terminal mounting for resistances |
GB397536A (en) * | 1932-02-19 | 1933-08-21 | Pye Radio Ltd | Improvements in or relating to electrical transformers, particularly for use as intervalve transformers in radio apparatus |
US2339067A (en) * | 1941-04-05 | 1944-01-11 | Western Electric Co | Coil unit |
GB1278257A (en) * | 1968-08-16 | 1972-06-21 | Bsr Ltd | Improvements relating to bobbin assemblies |
US3585553A (en) * | 1970-04-16 | 1971-06-15 | Us Army | Microminiature leadless inductance element |
US3663914A (en) * | 1971-06-14 | 1972-05-16 | Western Electric Co | Bobbin wound coil assembly and electrical terminals therefor |
DE2148534A1 (de) * | 1971-09-29 | 1973-04-05 | Plathner Ernst Transformatoren | Anschlussfahne fuer transformatoren, drosseln od. dgl |
DE2236241A1 (de) * | 1972-07-24 | 1974-02-07 | Siemens Ag | Spulenkoerper |
US3800172A (en) * | 1972-11-10 | 1974-03-26 | Oster J Mfg Co | Hair clipper having blade illumination and field wire strain relief |
JPS585317B2 (ja) * | 1974-12-12 | 1983-01-29 | 日本化薬株式会社 | セルロ−ズケイセンイノ センシヨクホウ |
US4166265A (en) * | 1978-02-03 | 1979-08-28 | Amp Incorporated | Coil bobbins and termination of coil windings |
JPS5926577Y2 (ja) * | 1979-09-17 | 1984-08-02 | ティーディーケイ株式会社 | 小型インダクタンス素子 |
JPS59746Y2 (ja) * | 1980-06-06 | 1984-01-10 | 四国変圧器株式会社 | 放電灯用安定器の端子部 |
US4361773A (en) * | 1980-12-15 | 1982-11-30 | Whirlpool Corporation | Coil retainer and terminal assembly |
JPS57149709A (en) * | 1981-03-11 | 1982-09-16 | Idec Izumi Corp | Coil drawing-out method of coil bobbin |
JPS585317U (ja) * | 1981-07-01 | 1983-01-13 | 東光株式会社 | チツプ形インダクタ |
NL188772C (nl) * | 1981-07-09 | 1992-09-16 | Tdk Corp | Inductantie. |
-
1985
- 1985-08-01 US US06/761,288 patent/US4704592A/en not_active Expired - Fee Related
- 1985-09-04 DE DE8585111179T patent/DE3577771D1/de not_active Expired - Lifetime
- 1985-09-04 EP EP85111179A patent/EP0177759B1/fr not_active Expired - Lifetime
- 1985-09-09 JP JP60199299A patent/JPS6171609A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3533054A (en) * | 1968-01-11 | 1970-10-06 | United Carr Inc | Electrical terminal structure |
US3735214A (en) * | 1972-01-27 | 1973-05-22 | Coilcraft Inc | A header for mounting circuit elements for incorporation in an electric circuit |
DE2454175A1 (de) * | 1974-11-15 | 1976-05-26 | Lothar Sachsse | Einstueckiger spulenwickelkoerper ohne bohrung |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4332638A1 (de) * | 1993-09-24 | 1995-03-30 | Siemens Matsushita Components | Chip-Induktivität |
EP0675513A1 (fr) * | 1994-03-30 | 1995-10-04 | Matsushita Electric Industrial Co., Ltd. | Micro inductance |
DE19547091B4 (de) * | 1995-12-16 | 2005-04-07 | Kaschke Kg (Gmbh & Co.) | Antennenspule mit oberflächenmontierbarem Gehäuse und Verfahren zu deren Herstellung |
DE10031599B4 (de) * | 1999-06-29 | 2005-06-23 | Matsushita Electric Industrial Co., Ltd., Kadoma | Spulenelement |
EP1250828A1 (fr) * | 2000-01-13 | 2002-10-23 | Sonion Microtronic Nederland B.V. | Conditionnement et blindage r.f. pour phonocapteurs t l phoniques |
EP1250828A4 (fr) * | 2000-01-13 | 2006-08-02 | Sonion Microtronic Nederland B | Conditionnement et blindage r.f. pour phonocapteurs t l phoniques |
Also Published As
Publication number | Publication date |
---|---|
JPS6171609A (ja) | 1986-04-12 |
EP0177759B1 (fr) | 1990-05-16 |
JPH0564845B2 (fr) | 1993-09-16 |
DE3577771D1 (de) | 1990-06-21 |
US4704592A (en) | 1987-11-03 |
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