Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K9/00—Screening of apparatus or components against electric or magnetic fields
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0213—Electrical arrangements not otherwise provided for
  • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
  • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K9/00—Screening of apparatus or components against electric or magnetic fields
  • H05K9/0007—Casings
  • H05K9/002—Casings with localised screening
  • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K9/00—Screening of apparatus or components against electric or magnetic fields
  • H05K9/0007—Casings
  • H05K9/002—Casings with localised screening
  • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
  • H05K1/0298—Multilayer circuits

Definitions

• the invention relates to an enhanced shielding arrangement.
• Sensitive electronic components and integrated circuits formed of those are fragile to electromagnetic interference, EMI.
• the presence of electromagnetic signals interferes the operation and performance of sensitive electronic components.
• electromagnetic interference there also exists a source of EMI, a receptive component as a victim of EMI and a coupling path through which a source emission conducts to a receptive component.
• Certain electronic components emit electro- magnetic signals during their operation. Such electromagnetically emitting components may affect to a performance and operability of other components for example on the same circuit board.
• the EMI also degrades the reliability of components and circuits.
• Certain components can act both as EMI sources and as receptive components. Between a source and a receptive component there exists a so-called coupling path.
• An EMI source emission can be a conducted voltage or current coupling via conducted paths through which current can flow, or an electric or magnetic field coupling through space or materials through electromagnetic wave propagation. So, the transmission of EMI can occur across a circuit or through the air due to electric field and/or magnetic field propagations. Also the electromagnetic waves can propagate through circuit boards or substrate materials. EMI signals may occur due to some electromagnetic radiator, electric- or magnetic fields or failures during the design, such as sharing of conductors with EMI sources.
• an EMI shielding is employed for protecting electronic components from both interfering sources on the same assembly and ones apart from the arrangement.
• Shielding cans may be applied to prevent interfering signals from being emitted by an emitting source, or to inhibit interfering signals from propagating to a receptive component.
• An EMI shielding Can prevent electromagnetic waves, which propagate through space, by absorbing or reflecting waves incidencing on walls of a shielding can. Material of a shielding can is advantageously valid so that most of interfering EMI signals or waves are reflected from shielding walls.
• Shielding walls then advantageously adsorbs a transmitted part of interfering waves, so a part not reflected off. Only some residual noise or energy is able to pass through shielding walls. This residual noise or energy forms the resulting EMI. So the essential characteristics are the reflectance and absorbance properties of a shielding can. These characteristics depend on shielding material and an interface of a shielding with a base substrate and circuit ground. The interfaces inside the shielding and the grounding are essential parts of the shielding concept. Typically there has to be some openings in the shielding walls to form an input and output for certain wanted signals of the system. So the shielding arrangement is never perfect (closed), but it must include openings as input and output paths for signals. The problem is, that also the unwanted signals tend to use these paths, since signal lines of printed circuit boards typically act like antennas. Through these signal lines external noise gets inside the shielded environment and the signals of the system drop out.
• grounding Another problem in shielding sensitive electrical components is grounding.
• Grounding and generally a grounding concept is one issue, which typically reduces shield- ing efficiency and disturbs the system. It is typical that printed circuit boards are stacked in order to make the arrangement as compact as possible. Usually printed . circuit boards are contacted both mechanically and electrically to a base or a frame supporting the arrangement. Electrical circuits of the printed circuit board and a frame typically have one common ground potential. There are few attempts in prior art to avoid EMI effects by using separate ground potentials. If these different grounds of electrical circuits and the frame get into contact with each other, there may occur a ground loop between printed circuit boards. The ground loop affects the operation of the printed circuit boards by exposing those to annoying noise, which in turn distorts the circuit ground to a value over zero. This affects the proper operation of circuits.
• the aim is achieved by simple and enhanced grounding concept.
• the final objective is to achieve a Faraday cage, e.g. absence of electric fields, around the circuits and components to be protected or shielded.
• a Faraday cage e.g. absence of electric fields
• the shielding structure to be solid and integral, or at least almost closed.
• the Faraday cage could be well-formed and implemented by coping with the limitation of not to over limit the predetermined size of openings and by applying a solid ground layer underneath a shielding arrangement.
• the shielding can is an important part of the Faraday cage, but only a part of it.
• the other part of the Faraday cage, forming the counter part of the shielding can is a printed circuit board.
• a shielding can ground is isolated from a circuit ground on upper signal layers of a multilayered printed circuit board.
• the ground layer of the shielding can provides a part of a Faraday cage, which protects the electrical circuits on the printed circuit boards from electromagnetic interference.
• An advantageous grounding concept also provides small loops, which in turn enhances the operability and security of the shielding arrangement.
• signals of sensitive sources as well as signals of emitting sources are placed in a safe shielding.
• the components have an isolated area encircling them and signals propagate through shielded paths to the shielded area.
• a coaxial tunnel for shielding the signals emerging within coverage of the shielding can is advantageously formed between ground potential layers.
• the coaxial tunnel is maintained from an emitting source to a corresponding receptive component.
• Fig. 1 illustrates a side view of an advantageous embodiment of the present invention
• Fig. 2 illustrates a top view of an advantageous embodiment of the present invention.
• Figure 1 illustrates the basic idea of the invention according to one advantageous embodiment of the invention.
• Figure 1 illustrates as a side view a multilayered printed circuit board having 8 different layers including first layer 101, which is preferably connected to ground potential to create shielding to the direction opposite to the components.
• Second layer 102 and third layer 103 are also signal layers unused in this exemplary embodiment.
• Fourth layer 104 and sixth layer 106 are signal layers in ground potential, or so-called ground layers.
• Fifth layer 105, seventh layer 107 and eighth layer 108 are signal layers.
• On the eighth signal layer 108 there are electrical components 109a, 109b, 109c, 109d 109e and 109f.
• Arrows 20 illustrate the paths of signals emerging to the signal layer 108.
• the fifth layer 105 is the one between the ground potential layers 104 and 106, on which only exterior sensitive or otherwise critical signals emerging to the signal layer 108, especially heading to components 109a, 109b, 109e, can go through.
• Dashed lines in fig. 1 present paths of signals.
• On the printed circuit board there are connections and interconnections between components.
• the arrow 11 on the components 109a and 109f describes the direction of the current.
• the component 109a is grounded straight to the ground layer 104 as illustrated by arrow 12. The grounding is performed through a via straight down to a ground layer 104, keeping the path as short as possible.
• the short paths are safer and not so easily impacted by interferences as long ones. With the short paths the arrangement can be better managed and controlled.
• the component 109b is connected to the component 109c, and the direction of the current is illustrated by an arrow 13.
• the component 109e is connected to the component 109d and an arrow 14 here illustrates the direction of the current.
• the components 109c and 109d are grounded advantageously straight to ground layers 106 and/or 104 as illustrated by arrows 15.
• number 10 refers grounding vias perpendicular to layers of the printed circuit board.
• a shielding can 111 consists of a frame and a lid.
• a shielding can 111 is configured on the uppermost layer, above the components 109a, 109b, 109c, 109d, 109e, 109f to secure and protect components, printed circuit board and interconnections from interfering effects.
• the shielding can 111 is grounded along edge vias of the ar- rangement shown in fig. 1. So also the shielding can 111 is grounded straight to ground potential layer through the shortest possible path. According to prior solutions the components have been grounded through these same edge vias as the shielding can.
• the grounding paths of components according to prior solutions proceeds on the surface of the uppermost printed circuit board to a certain grounding via, which typically has been the same for a shielding can and components.
• the shielding can ground is isolated from signal ground in the upper signal layers. This is advantageous, because this way there are no large ground areas in signal layers 107 or 108, but the grounding is implemented straight downwards to a ground potential layer. This kind of ground- ing concept provides small loops and minimizes a probability of interferences. If any interference or noise gets to layer 108, it may cause leaking problems. So it is important to shield the layer 108, and especially the electrical area of it containing electrical components, signals and interconnections. Mainly there are components and inter-connections to be shielded in the electrical area. By an advantageous grounding concept there is formed isolated areas 110 between shielding can 111 frame and the electrical area including electrical components in layers 107 and 108.
• the isolated areas 110 there is no copper or other conductive substrate, nor paths or components. These isolated areas 110 ensure the safety and security of a shielding arrangement. Further the isolation 110 between a shielding can frame and an electrical area, supports the idea of small loops and makes the shielding of electrical area more effective against outside interferences. No exterior connection line or signal line can pass through the isolated area. So this isolated area 110 also prevents the exterior signals from intruding to shielded electrical area.
• all components inside the shielded area are grounded to common grounds.
• the common grounds are formed by layers 104 and 106.
• all signals needed to be shielded are arranged to go through a shielded signal layer, layer 105 in fig. 1.
• the most essential signals to be shielded are the signals of sensitive electrical components and the signals of radiation sources. The selection of the most essential signals to be shielded is important part of the designing and implementation process.
• the selection of the shielded signals thus depends the type and occurrence of sensitive or radiating components in a certain arrangement, and their relations and associations to the arrangement as a whole.
• an internal interference occurs, there exists an emitting source of radiation, a respective victim component, which suffers from the interfer- ence, and a coupling path between those two.
• paths of the signals to be shielded are placed in so called coaxial tunnel formed between the ground lines, formed by ground potential layers 104 and 106 in this exemplary embodiment. It can be seen from fig. 1 signal vias 20 to the components 109f, 109b and 109e and coaxial ground vias 10 perpendicular to the layers 101 - 108.
• the coaxial structure of a shielding path is advantageously maintained from an emitting source component to a respective component, all the way through the coupling path.
• the structure is tubular. It is important that the signal propagates through the tubular, coaxial, shielded signal tunnel to the signal layer and heads back to the tunnel so, that the signal is in shielded space all the way.
• the ground potential layers 104 and 106 in fig. 1 are only one example for imple- menting an advantageous embodiment of the invention.
• the invention is not bound to any material of a substrate of a printed circuit board.
• a printed circuit board typically includes different type of via structures, for example mi- crovias.
• the shielding can according to an advantageous embodiment of the present invention can be implemented without restrictions in all radio frequency (RF) and base band (BB) areas as well as with voltage-controlled oscillators (NCO).
• RF radio frequency
• BB base band
• NCO voltage-controlled oscillators
• the il- lustrated arrangement built-up on a printed circuit board prevents uncertain return current paths to any high or low frequency signals. The more effective RF-sources are, the better shielding those require for both input and output signals.
• Fig. 2 illustrates a ,top view of a shielding arrangement according to an advantageous embodiment.
• a shielding can frame I l ia and two components 109b and 109c.
• the isolated area 110 corresponding to fig. 1 is illustrated in fig. 2 by a dashed line encircling between the edges of a shielding frame and component area to be shielded.
• the fig. 2 illustrates a signal 20 heading to the shielded area.
• any signals inputted to or outputted from the shielded area propagate through a shielded coaxial tunnel formed between ground potential layers.
• No exterior signals can propagate to the uppermost signal layer straightforward along the uppermost signal layer.
• the signal a dashed line illustrates line 20 situating between ground potential layers inside the area within the coverage of the shielding can.

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• Electromagnetism (AREA)
• Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
• Structure Of Printed Boards (AREA)

Applications Claiming Priority (3)

Publications (2)

Family

ID=32824307

Family Applications (1)

Country Status (5)

Families Citing this family (20)

Family Cites Families (16)

• 2003
  • 2003-02-07 US US10/361,804 patent/US6965072B2/en not_active Expired - Lifetime
• 2004
  • 2004-01-23 WO PCT/FI2004/050004 patent/WO2004071145A1/en not_active Ceased
  • 2004-01-23 EP EP04704626.3A patent/EP1590997B1/de not_active Expired - Lifetime
  • 2004-02-05 KR KR1020040007519A patent/KR101059912B1/ko not_active Expired - Fee Related
  • 2004-02-06 CN CNB2004100038128A patent/CN100556265C/zh not_active Expired - Fee Related
  • 2004-02-06 CN CN200910170699A patent/CN101646334A/zh active Pending

Non-Patent Citations (1)

Also Published As

Similar Documents

Legal Events