EP1574327A2 - Procedé de fabrication d' un produit composite semi-fini en alliage de cuivre et utilisation du produit semi-fini - Google Patents

Procedé de fabrication d' un produit composite semi-fini en alliage de cuivre et utilisation du produit semi-fini Download PDF

Info

Publication number
EP1574327A2
EP1574327A2 EP05005073A EP05005073A EP1574327A2 EP 1574327 A2 EP1574327 A2 EP 1574327A2 EP 05005073 A EP05005073 A EP 05005073A EP 05005073 A EP05005073 A EP 05005073A EP 1574327 A2 EP1574327 A2 EP 1574327A2
Authority
EP
European Patent Office
Prior art keywords
composite
semi
alloy
core
oxidized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05005073A
Other languages
German (de)
English (en)
Other versions
EP1574327A3 (fr
Inventor
Uwe Dr. Hofmann
Michael Scharf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wieland Werke AG
Original Assignee
Wieland Werke AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wieland Werke AG filed Critical Wieland Werke AG
Publication of EP1574327A2 publication Critical patent/EP1574327A2/fr
Publication of EP1574327A3 publication Critical patent/EP1574327A3/fr
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/10—Alloys containing non-metals
    • C22C1/1078—Alloys containing non-metals by internal oxidation of material in solid state
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/001—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
    • C22C32/0015—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides with only single oxides as main non-metallic constituents
    • C22C32/0021—Matrix based on noble metals, Cu or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
    • C23C8/08—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases only one element being applied
    • C23C8/10—Oxidising
    • C23C8/16—Oxidising using oxygen-containing compounds, e.g. water, carbon dioxide
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C8/80—After-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/025—Composite material having copper as the basic material

Definitions

  • the invention relates to a method for producing a semi-finished composite from a precipitable copper alloy consisting of at least one core and a cladding area surrounding the core and the use of the Semi-finished product.
  • Some composite semi-finished products made of copper materials are increasing in strength or hardness and the electrical conductivity is a middle position between pure Copper and completely by combined strength-enhancing measures hardened copper alloys.
  • the desire for balanced property combinations in the foreground are often aimed at the metal surface Made changes in which in a metallic matrix non-metals, such as For example, oxygen, nitrogen or carbon are diffused in order to for example, on the basis of solution processes and chemical Solid state reactions, the strength or hardness of the material on the surface to increase a so-called dispersion hardening.
  • sheets and wires are considered.
  • the precious metal alloys are alloyed with small amounts of copper.
  • the invention has the object based on a manufacturing process and a semi-finished product with regard to electrical properties and hardness to that end, that both properties for the respective use optimally to the technical requirements.
  • the invention is related to the manufacturing process by the features of Claim 1 and with respect to the semifinished product by the features of claim 8 and the use according to claim 12 reproduced.
  • the others back claims give advantageous training and further education Invention again.
  • the invention is based on the consideration of the consideration that in the first process step the semifinished product at high temperature in oxidizing Atmosphere is annealed. To shorten the process times are as possible high temperatures sought for internal oxidation. Preferably, the annealing depending on the alloy composition in the range of 800 ° C - 1050 ° C take place.
  • the reaction gases are purer Oxygen, air or other mixtures of oxygen, nitrogen and optionally Hydrogen or noble gases.
  • the concentration of dissolved alloying elements which have a high vapor pressure, such as Cd, Zn or Mg.
  • the Reaction layer is made by oxidized and precipitable alloys usually coined by coarsened precipitates. In it, the Copper matrix on a relatively small concentration of dissolved foreign atoms. The hardness and the resistivity are reduced from the rest of the alloy.
  • the scale layer formed by the annealing process can be used as outer cover layer are removed by pickling.
  • the further processing can, depending on the requirement by known per se Forming process done.
  • the production of wire with a well-conductive than Vein formed inner or outer area is done by retracing the treated starting material.
  • the inner diameter d i can be reduced to zero or values close to zero by rolling and / or hoisting. This succeeds in particular if one strives for the outer diameter after deformation d u ⁇ d i , whereby, however, the respective change in wall thickness is still to be considered.
  • the annealing can advantageously be carried out at a homologous temperature T / T m of more than 0.9, preferably between 0.92 and 0.96. Due to a homologous temperature of more than 0.9, the process times are correspondingly minimized during internal oxidation.
  • the homologous temperature results from the quotient of the absolute process temperature and the absolute melting temperature in Kelvin.
  • the oxygen solubility and the diffusion rate of oxygen in the alloy are thereby increased accordingly.
  • the layer thickness of the respective oxidized regions grows parabolically and, to a first approximation, linearly with the annealing time.
  • the growth rate of the oxide front increases with increasing temperature and depending on the degree of scaling with increasing oxygen partial pressure.
  • the outer, mainly consisting of Cu oxide scale layer as a topcoat is by pickling, for example in dilute sulfuric acid, or burning, For example, in pickling solutions, with oxidizing agents removed.
  • the semifinished product after annealing at high temperatures in oxidized quickly quenched to room temperature and a subsequent follow-up with formation of a discharge phase subjected. If the annealing temperature above the solubility of a Alloy component is, this can be a subsequent curing respectively.
  • a thermal aftertreatment can be carried out after annealing, after removing the Covering layer or after the forming step, for example by thermal aging. This will be the material after forming to the respective requirements regarding conductivity and hardness customized.
  • the semifinished product may be tubular and the oxidizing atmosphere can flow through the interior of the tube.
  • an inner core can with high electrical conductivity, starting from a pipe or a Hollow rod to be generated.
  • the oxidizing reaction gas is passed through during the annealing passed the hollow body, while the outer surface by an inert gas in front Oxidation is protected.
  • the semifinished product can be tubular be formed and the oxidizing atmosphere on the outside and through the Flow inside the pipe.
  • the electrical conductivity elevated can be elevated.
  • the semi-finished composite of hardenable copper materials increases in hardness and electrical conductivity a middle position between pure copper and fully cured by combined strength-enhancing measures Alloys.
  • the semi-finished composite finds its use for connectors, Lifting contacts or wires.
  • Wires with a good conductive surface layer are suitable for high-frequency technology, where at high AC frequencies only the Outer skin of the conductor carries electricity.
  • Wires with a good conductive central core can be used for moving contacts, such as printing, lifting or Breaker contacts, sliding contacts or fixed contacts, such as Winding connections, press connections or plug and clamp connections be used. Due to the relatively hard outer shell is a favorable burn-off and wear behavior to be expected.
  • the method produced by the method Composite semi-finished product of a copper alloy of at least one core and one the core-enclosing cladding region, wherein at least one of the regions an oxide formed by internal oxidation of the alloy or a Alloy component exists and at least one other area is not oxidized is.
  • the invention is based on the consideration that the Composite semi-finished product comprising at least one core and the core enclosing Sheath area exists. However, it can also have several core or cladding areas be formed, each of which is oxidized or not oxidized. there The individual areas can enclose like a shell.
  • the respective Assignment to the core or cladding region is not strictly defined, it results However, largely from the geometric conditions of the composite material.
  • the encircling of the core through the cladding region essentially occurs the entire surface.
  • the term enclosing the entire surface should also include semi-finished products, in which, for example, by a cutting process, the core or cladding areas lie open.
  • Copper-based materials often have heterogeneous microstructures with different phase constituents, some of which may be present as precipitates immediately adjacent to the matrix. Thus, in the individual areas, by means of internal oxidation, either the entire alloy or even individual constituents can be subjected to oxidation. Internal oxidation of the copper alloy makes it possible to produce a composite semi-finished product which has relatively soft and electrically highly conductive volume regions.
  • curable copper-iron alloys with further properties determining elements are suitable to set a balance between electrical conductivity and hardness in order to optimally adapt both properties for the respective use to the technical needs.
  • the alloy component may have an alloying element or a plurality of alloying elements and an intermediate or intermetallic or ordered phase or a plurality of such phases.
  • the Material properties particularly favorably influenced.
  • At least one component A is in the form of precipitates in the microstructure.
  • the solubility of A in the Cu matrix decreases with decreasing temperature. This allows curing.
  • Of the Melting point of A is greater than that of Cu at 1083 ° C, causing the Activation energy for a diffusion and thus for the dissolution of A large is.
  • shell or core areas for example wires, form an oxidized soft layer with high electrical conductivity.
  • the advantages achieved by the invention are in particular the possibility a targeted influence on the properties by appropriate choice of Material composition of the starting alloy in conjunction with suitable Annealing and forming steps.
  • the strength values and to match the electrical conductivity So, for example inexpensive wires or composite cables with high mechanical strength and high be provided electrical conductivity.
  • Multi-component alloys often have a complex structure of structure.
  • the copper alloy may include at least one component thermodynamically forming a more stable oxide than Cu 2 O. As a result, the internal oxidation is targeted to certain selected structural constituents.
  • a precipitable copper alloy is present, in which the alloying component in the form of already existing or itself during the first process step forming precipitates in a Matrix is present.
  • the Ausscheidungshärtung or hardening can hereby because of the decrease in the solubility of the alloying component in the Alloy matrix in the course of cooling from the oxidation temperature or by a targeted thermal aftertreatment at medium temperatures of the sun increase in hot storage mentioned. Is the melting point of the alloy component above that of pure copper, then the precipitates dissolve high temperatures only slowly and remain as a reaction partner for Obtained oxygen in the structure.
  • the copper alloy at least one or more of Elements Mg, Al, Si, V, Mn, Zn, P, Co, As, Ni, Ag, Fe, Cr, Zr, Pb, Sb, Cd or Ti contain.
  • alloys formed from these elements include all low alloyed copper alloys, such as base alloys CuZn, CuNiCrSi, CuCrZr, CuFeP, CuCr, CuSiMn or CuMg.
  • Excretion systems with the mentioned elements can be strength properties and advantageously influence the electrical conductivity of the alloys.
  • Many precipitation-hardening systems contain finely divided intermetallic precipitates, which has a high electrical conductivity and advantageous mechanical Create properties.
  • the layer thicknesses of the cladding region 3 are each After treatment usually 2 to 20% of the total wire cross-section.
  • the inner core region 2 consists of the original alloy, the optionally undergoes structural transformation by the thermal treatment.
  • a transition between the oxidized cladding region 3 and the inside Core area 2 is associated with lower, especially at high annealing temperature Process time designed accordingly sharp.
  • tubes 4 or hollow rods used as starting material tubes 4 or hollow rods.
  • starting material may also be oval or rectangular bars and tubes.
  • Fig. 2 shows a view a tube 4 before the final deformation, with an oxidized layer 2 inside the scaling has already been eroded. The outer surface of the pipe was protected by an inert gas and is not oxidized.
  • the cold forming step is from the pretreated tube 4, as shown in Fig. 3, by reducing the cross section a wire material with a compact oxidized core region 2 drawn.
  • the tube 4 can also be made of profiles or wires with not circular cross-section to be reshaped.
  • Fig. 4 shows a semi-finished composite after the final forming of a on the inside and Outer surface oxidized tube 4. At the inner oxidation becomes this both through the interior of the tube 4 and on the tube surface oxygen-containing gas passed through or along. After the forming process This results in a multilayer wire material with an oxidized inner core region 21, an unoxidized outer core region 22 and an oxidized one Sheath area 3.
  • the production of the wire includes an optimized thermal aging, whereby already existing precipitates in the structure.
  • the wire was annealed at 1000 ° C for 10 minutes in air.
  • the samples were metallographically characterized with conductivity and hardness measurements.
  • the reaction layers in some samples were removed by etching in nitric acid.
  • the specific electrical conductivity of the layer could be determined under known geometrical conditions.
  • Tab. 1 shows the measurement results of the specific electrical conductivity in the core and edge area for samples that were rapidly cooled in water or in air.
  • Sample treatment for cooling Layer thickness of the edge area [mm] spec. elec.
  • Conductivity core [MS / m] water 0,075 44.0 13.4 air 0,075 42.0 23.8
  • oxidized edge region is a significant increase in electrical conductivity observed with respect to the non-oxidized core region.
  • the wire diameter decreases linearly with time from.
  • the layer thickness growth also follows in the first approximation of a linear Leave Act. With increasing layer thickness (solution annealing time), the specific increases electrical conductivity of the wire too. The specific electrical conductivity is after 9 h annealing time 39 MS / m.
  • the conductivity of the surface layer can be determined. It is 0.07 mm wide, their specific conductivity is 54 ms / m, while the wire core a specific conductivity of only 37 MS / m.
  • the hardness of the surface layer is significantly lower than that in the wire core, the experiencing an increase in hardness due to the aging. Lie in the outer layer coarsened iron, iron phosphide or iron-copper mixed oxides.
  • Hot curing eg at 500 ° C
  • the measurement results confirm that one heat treatment to another Increase in hardness and electrical conductivity.
  • a solution annealed condition after quenching and Thermal aging leads to precipitation hardening.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Composite Materials (AREA)
  • Conductive Materials (AREA)
  • Sampling And Sample Adjustment (AREA)
EP05005073A 2004-03-13 2005-03-09 Procedé de fabrication d' un produit composite semi-fini en alliage de cuivre et utilisation du produit semi-fini Withdrawn EP1574327A3 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200410012386 DE102004012386A1 (de) 2004-03-13 2004-03-13 Verbundhalbzeug aus einer Kupferlegierung, Herstellungsverfahren und Verwendung
DE102004012386 2004-03-13

Publications (2)

Publication Number Publication Date
EP1574327A2 true EP1574327A2 (fr) 2005-09-14
EP1574327A3 EP1574327A3 (fr) 2006-01-11

Family

ID=34813690

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05005073A Withdrawn EP1574327A3 (fr) 2004-03-13 2005-03-09 Procedé de fabrication d' un produit composite semi-fini en alliage de cuivre et utilisation du produit semi-fini

Country Status (2)

Country Link
EP (1) EP1574327A3 (fr)
DE (1) DE102004012386A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111778421A (zh) * 2019-10-28 2020-10-16 河南科技大学 铜基复合材料及其制备方法
CN114347586A (zh) * 2022-01-25 2022-04-15 宁波博威合金材料股份有限公司 一种铜-铜复合带材、制备方法以及应用

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101440445B (zh) 2008-12-23 2010-07-07 路达(厦门)工业有限公司 无铅易切削铝黄铜合金及其制造方法
DE102014010711B4 (de) 2014-07-19 2019-08-29 Wieland-Werke Ag Verfahren zur Glühbehandlung von zinkhaltigen Kupferlegierungsbändern

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2215692A1 (de) 1971-06-07 1972-12-21 Mansfeld Kombinat W Pieck Veb Verfahren zur Herstellung einer aus hartbaren Kupfer Eisen Titan Legierung

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3545074A (en) * 1968-07-29 1970-12-08 Dow Chemical Co Method of making copper alloy products
DE2002886A1 (de) * 1970-01-23 1971-07-29 Degussa Verfahren zur Herstellung eines durch innere Oxydation dispersionsgehaerteten Werkstoffes
DE2262132A1 (de) * 1972-12-19 1974-06-20 Metallgesellschaft Ag Verfahren zur herstellung von mit oxiden dispersionsgehaerteten metallischen werkstoffen
DE2418686C2 (de) * 1974-04-18 1982-06-09 Kabel- und Metallwerke Gutehoffnungshütte AG, 3000 Hannover Verfahren zur Herstellung von Halbzeug aus dispersionsgehärteten Kupferlegierungen
EP0097306B1 (fr) * 1982-06-18 1990-05-23 Scm Corporation Procédé de préparation d'articles métalliques renforcés par une dispersion et articles ainsi obtenus
US4434016A (en) * 1983-02-18 1984-02-28 Olin Corporation Precipitation hardenable copper alloy and process
JPH04268055A (ja) * 1991-02-22 1992-09-24 Yamaha Corp リードフレーム用銅合金の製造方法
DE19756815C2 (de) * 1997-12-19 2003-01-09 Wieland Werke Ag Kupfer-Knetlegierung, Verfahren zur Herstellung eines Halbzeuges daraus und deren Verwendung
JP3465108B2 (ja) * 2000-05-25 2003-11-10 株式会社神戸製鋼所 電気・電子部品用銅合金

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2215692A1 (de) 1971-06-07 1972-12-21 Mansfeld Kombinat W Pieck Veb Verfahren zur Herstellung einer aus hartbaren Kupfer Eisen Titan Legierung

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111778421A (zh) * 2019-10-28 2020-10-16 河南科技大学 铜基复合材料及其制备方法
CN114347586A (zh) * 2022-01-25 2022-04-15 宁波博威合金材料股份有限公司 一种铜-铜复合带材、制备方法以及应用
CN114347586B (zh) * 2022-01-25 2024-05-03 宁波博威合金材料股份有限公司 一种铜-铜复合带材、制备方法以及应用

Also Published As

Publication number Publication date
DE102004012386A1 (de) 2005-10-06
EP1574327A3 (fr) 2006-01-11

Similar Documents

Publication Publication Date Title
DE68915678T2 (de) Dispersionsgehärtete Kupferlegierungen und Verfahren zur Herstellung dieser Legierungen.
DE2007516C2 (de) Legierung auf Kupferbasis
EP2600996B1 (fr) Procédé de fabrication selon la technique de la métallurgie des poudres d'un matériau cu-cr
DE3520407C2 (de) Verfahren zur thermomechanischen Behandlung von kobalthaltigen Kupfer-Beryllium-Legierungen
DE2754335A1 (de) Elektrischer kontaktwerkstoff und verfahren zu dessen herstellung
DE3731266C2 (fr)
DE2350389A1 (de) Verfahren zur behandlung einer kupfernickel-zinn-legierung sowie dabei erzeugte zusammensetzungen und produkte
DE10125586A1 (de) Kupferlegierung zur Verwendung in elektrischen und elektronischen Teilen
DE102013018216A1 (de) Kupferlegierungsmaterial für Elektro- und Elekronikkomponenten und Verfahren zur Herstellung derselben (COPPER ALLOY MATERIAL FOR ELECTRONIC COMPONENTS AND METHOD FOR PREPARING THE SAME)
EP3960890A1 (fr) Alliage palladium-cuivre-argent-ruthénium
DE2412573B2 (de) Verfahren zur herstellung eines unterteilten supraleitenden drahtes
EP1574327A2 (fr) Procedé de fabrication d' un produit composite semi-fini en alliage de cuivre et utilisation du produit semi-fini
CH669211A5 (de) Kupfer-chrom-titan-silizium-legierung und ihre verwendung.
DE3522118A1 (de) Verfahren zur herstellung von kupfer-beryllium-legierungsmaterial sowie danach hergestellte teile
AT393697B (de) Verbesserte metallegierung auf kupferbasis, insbesondere fuer den bau elektronischer bauteile
DE2515904C2 (de) Verfahren zur Herstellung eines stabilisierten Supraleiters
DE69307236T2 (de) Verfahren zur Herstellung von einem leitenden Werkstoff auf Basis von Kupferlegierung
DE3124978A1 (de) Verfahren zur herstellung von supraleitenden draehten des verbindungstyps
EP0064181B1 (fr) Matériau de contact d'un alliage de cuivre et méthode pour sa fabrication
DE2541689B2 (de) Verfahren zum Herstellen eines V3Ga-Supraleiters
DE2050086A1 (de) Nickel Zink Legierung
DE2835974B2 (de) Verfahren zur Herstellung eines zusammengesetzten vieladrigen Supraleiters
DE102019130522A1 (de) Verfahren zur Herstellung von Verbunddrähten
WO1989009838A1 (fr) Procede pour fabriquer des alliages resistants au ternissement, a l'oxydation et au calaminage
DE2825424C2 (de) Siliciumhaltiges Tantalpulver, Verfahren zu seiner Herstellung und seine Verwendung

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR LV MK YU

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR LV MK YU

RIC1 Information provided on ipc code assigned before grant

Ipc: H01B 1/02 20060101ALI20051121BHEP

Ipc: C22C 1/10 20060101ALI20051121BHEP

Ipc: C22F 1/08 20060101ALI20051121BHEP

Ipc: B32B 15/02 20060101AFI20050623BHEP

17P Request for examination filed

Effective date: 20060120

AKX Designation fees paid

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

17Q First examination report despatched

Effective date: 20100329

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20130301