DE68915678T2 - Dispersionsgehärtete Kupferlegierungen und Verfahren zur Herstellung dieser Legierungen. - Google Patents

Dispersionsgehärtete Kupferlegierungen und Verfahren zur Herstellung dieser Legierungen.

Info

Publication number
DE68915678T2
DE68915678T2 DE68915678T DE68915678T DE68915678T2 DE 68915678 T2 DE68915678 T2 DE 68915678T2 DE 68915678 T DE68915678 T DE 68915678T DE 68915678 T DE68915678 T DE 68915678T DE 68915678 T2 DE68915678 T2 DE 68915678T2
Authority
DE
Germany
Prior art keywords
alloys
making
hardened copper
dispersion hardened
copper alloys
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68915678T
Other languages
English (en)
Other versions
DE68915678D1 (de
Inventor
Keizo Intellectual P Shimamura
Kagetaka Intellectual Pr Amano
Tatsuyoshi Intellectual Aisaka
Satoshi Intellectual Pro Hanai
Kohsoku Intellectual Pr Nagata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE68915678D1 publication Critical patent/DE68915678D1/de
Publication of DE68915678T2 publication Critical patent/DE68915678T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/20—Permanent superconducting devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/222—Non-consumable electrodes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/10—Alloys containing non-metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/001—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
    • C22C32/0015—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides with only single oxides as main non-metallic constituents
    • C22C32/0021—Matrix based on noble metals, Cu or alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F6/00—Superconducting magnets; Superconducting coils
    • H01F6/06—Coils, e.g. winding, insulating, terminating or casing arrangements therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12049—Nonmetal component
    • Y10T428/12056—Entirely inorganic

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
DE68915678T 1988-10-13 1989-10-13 Dispersionsgehärtete Kupferlegierungen und Verfahren zur Herstellung dieser Legierungen. Expired - Fee Related DE68915678T2 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP25768588 1988-10-13
JP26932888 1988-10-27
JP26933088 1988-10-27
JP26933388 1988-10-27
JP26933188 1988-10-27
JP26932988 1988-10-27

Publications (2)

Publication Number Publication Date
DE68915678D1 DE68915678D1 (de) 1994-07-07
DE68915678T2 true DE68915678T2 (de) 1995-01-12

Family

ID=27554263

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68915678T Expired - Fee Related DE68915678T2 (de) 1988-10-13 1989-10-13 Dispersionsgehärtete Kupferlegierungen und Verfahren zur Herstellung dieser Legierungen.

Country Status (3)

Country Link
US (1) US5004498A (de)
EP (1) EP0364295B1 (de)
DE (1) DE68915678T2 (de)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2272910B (en) * 1990-02-13 1994-08-17 Honda Motor Co Ltd Molded articles
US5443615A (en) * 1991-02-08 1995-08-22 Honda Giken Kogyo Kabushiki Kaisha Molded ceramic articles
GB2243160B (en) * 1990-02-13 1994-08-10 Honda Motor Co Ltd A method of producing a moulded article
US5145504A (en) * 1991-07-08 1992-09-08 The Dow Chemical Company Boron carbide-copper cermets and method for making same
JP3339652B2 (ja) * 1992-10-21 2002-10-28 株式会社豊田中央研究所 複合材料およびその製造方法
US5292477A (en) * 1992-10-22 1994-03-08 International Business Machines Corporation Supersaturation method for producing metal powder with a uniform distribution of dispersants method of uses thereof and structures fabricated therewith
US5551970A (en) * 1993-08-17 1996-09-03 Otd Products L.L.C. Dispersion strengthened copper
JP3125851B2 (ja) * 1995-08-24 2001-01-22 矢崎総業株式会社 アルミナ分散強化銅の製造法
US5686676A (en) * 1996-05-07 1997-11-11 Brush Wellman Inc. Process for making improved copper/tungsten composites
AU5089998A (en) * 1996-10-22 1998-05-15 Evgueni P. Danielia Dispersion strengthened copper
DE19847987C2 (de) * 1998-10-17 2001-06-13 Xcellsis Gmbh Verfahren zur Herstellung einer Vorrichtung zur Wasserstofferzeugung und Vorrichtung zur Wasserstofferzeugung
JP2002368168A (ja) * 2001-06-13 2002-12-20 Hitachi Ltd 半導体装置用複合部材、それを用いた絶縁型半導体装置、又は非絶縁型半導体装置
GB2419603B (en) * 2002-07-18 2006-11-22 Honda Motor Co Ltd Composite copper material
US6837915B2 (en) * 2002-09-20 2005-01-04 Scm Metal Products, Inc. High density, metal-based materials having low coefficients of friction and wear rates
US20040105775A1 (en) * 2002-11-14 2004-06-03 Bryan Prucher Method of manufacturing dispersion strengthened copper and/or hyper-nucleated metal matrix composite resistance welding electrodes
KR100576141B1 (ko) * 2003-03-03 2006-05-03 삼보신도고교 가부기키가이샤 내열성 동합금재 및 그 제조방법
FR2859401B1 (fr) * 2003-09-10 2006-03-17 Le Bronze Ind Sa Electrode de soudage par resistance et son procede de fabrication
US7131768B2 (en) * 2003-12-16 2006-11-07 Harco Laboratories, Inc. Extended temperature range EMF device
WO2007089894A2 (en) * 2006-01-31 2007-08-09 Indiana University Research & Technology Corporation Materials and methods for manufacturing amorphous tricalcium phosphate and metal oxide alloys of amorphous tricalcium phosphate and methods of using the same
US7699905B1 (en) * 2006-05-08 2010-04-20 Iowa State University Research Foundation, Inc. Dispersoid reinforced alloy powder and method of making
DE102007005536A1 (de) * 2007-02-03 2008-08-07 Volkswagen Ag Verfahren zur Herstellung einer Elektrode, insbesondere einer Elektrodenkappe zum Widerstandspunktschweißen
WO2009081664A1 (ja) * 2007-12-21 2009-07-02 Mitsubishi Shindoh Co., Ltd. 高強度・高熱伝導銅合金管及びその製造方法
PT2246448T (pt) 2008-02-26 2016-11-17 Mitsubishi Materials Corp Fio laminado de cobre de alta resistência e alta condutividade
US9163300B2 (en) * 2008-03-28 2015-10-20 Mitsubishi Shindoh Co., Ltd. High strength and high conductivity copper alloy pipe, rod, or wire
US8017451B2 (en) 2008-04-04 2011-09-13 The Charles Stark Draper Laboratory, Inc. Electronic modules and methods for forming the same
US8273603B2 (en) * 2008-04-04 2012-09-25 The Charles Stark Draper Laboratory, Inc. Interposers, electronic modules, and methods for forming the same
CN102165080B (zh) 2009-01-09 2013-08-21 三菱伸铜株式会社 高强度高导电铜合金轧制板及其制造方法
CN102149835B (zh) 2009-01-09 2014-05-28 三菱伸铜株式会社 高强度高导电铜合金轧制板及其制造方法
JP5505392B2 (ja) * 2011-10-04 2014-05-28 株式会社デンソー 複合材料、及びこれを用いた電気接点電極、電気接点皮膜、導電性フィラー、電気接点構造、並びに複合材料の製造方法
KR101693814B1 (ko) * 2014-12-26 2017-01-09 한국기계연구원 티타늄이 포함된 산화물 분산 강화 분산동 합금 및 그의 제조방법
CN109897982B (zh) * 2019-01-29 2020-09-29 中南大学 高气密低自由氧含量纳米弥散铜合金及短流程制备工艺
CN113199028B (zh) * 2021-04-29 2022-03-15 合肥工业大学 一种电阻焊电极用铜基复合材料的制备方法
CN114752838A (zh) * 2022-05-17 2022-07-15 合肥工业大学 铜基氧化物弥散强化的Cu-Y2O3复合材料制备方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3024110A (en) * 1958-07-21 1962-03-06 Du Pont Processes for producing dispersions of refractory metal oxides in matrix metals
US3069759A (en) * 1960-04-27 1962-12-25 Grant Production of dispersion strengthened metals
US3180727A (en) * 1962-02-20 1965-04-27 Du Pont Composition containing a dispersionhardening phase and a precipitation-hardening phase and process for producing the same
US3158473A (en) * 1962-08-27 1964-11-24 Gen Electric Method for producing composite bodies
US3143789A (en) * 1962-08-31 1964-08-11 Du Pont Dispersion strengthened metal composition
GB1172813A (en) * 1966-07-19 1969-12-03 British Insulated Callenders Process for the Production of Copper Bodies of High Mechanical Strength and High Electrical Conductivity.
US3492113A (en) * 1967-01-19 1970-01-27 Scm Corp High green strength-low density copper powder and process for preparing same
US3574609A (en) * 1967-06-09 1971-04-13 Copper Range Co Process for dispersoid strengthening of copper by fusion metallurgy and products thereof
US3922180A (en) * 1970-04-01 1975-11-25 Bell Telephone Labor Inc Method for oxidation-hardening metal alloy compositions, and compositions and structures therefrom
US3779714A (en) * 1972-01-13 1973-12-18 Scm Corp Dispersion strengthening of metals by internal oxidation
US4462845A (en) * 1982-02-17 1984-07-31 Scm Corporation Oxygen-free dispersion-strengthened copper and process for making same
US4752334A (en) * 1983-12-13 1988-06-21 Scm Metal Products Inc. Dispersion strengthened metal composites
JPS6293321A (ja) * 1985-10-17 1987-04-28 Komatsu Ltd 粒子分散型合金素材の製造方法
JP2531701B2 (ja) * 1987-09-24 1996-09-04 株式会社東芝 分散強化型銅合金の製造方法
JPH06293321A (ja) * 1993-04-06 1994-10-21 Toppan Printing Co Ltd ディスク検出装置

Also Published As

Publication number Publication date
EP0364295A2 (de) 1990-04-18
DE68915678D1 (de) 1994-07-07
EP0364295B1 (de) 1994-06-01
EP0364295A3 (en) 1990-07-25
US5004498A (en) 1991-04-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee