DE3880067D1 - Leiterplatten fuer hohe stroeme und verfahren zur herstellung. - Google Patents

Leiterplatten fuer hohe stroeme und verfahren zur herstellung.

Info

Publication number
DE3880067D1
DE3880067D1 DE8888402418T DE3880067T DE3880067D1 DE 3880067 D1 DE3880067 D1 DE 3880067D1 DE 8888402418 T DE8888402418 T DE 8888402418T DE 3880067 T DE3880067 T DE 3880067T DE 3880067 D1 DE3880067 D1 DE 3880067D1
Authority
DE
Germany
Prior art keywords
producing
same
circuit boards
high current
current circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8888402418T
Other languages
English (en)
Other versions
DE3880067T2 (de
Inventor
Bertrand Torcheux
Jean-Paul Viennois
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dav SA
Original Assignee
Dav SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dav SA filed Critical Dav SA
Publication of DE3880067D1 publication Critical patent/DE3880067D1/de
Application granted granted Critical
Publication of DE3880067T2 publication Critical patent/DE3880067T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2072—Anchoring, i.e. one structure gripping into another
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Connection Or Junction Boxes (AREA)
  • Structure Of Printed Boards (AREA)
DE19883880067 1987-10-12 1988-09-26 Leiterplatten für hohe Ströme und Verfahren zur Herstellung. Expired - Fee Related DE3880067T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8714039A FR2621774B1 (fr) 1987-10-12 1987-10-12 Plaque circuit pour courants eleves et procede de preparation

Publications (2)

Publication Number Publication Date
DE3880067D1 true DE3880067D1 (de) 1993-05-13
DE3880067T2 DE3880067T2 (de) 1993-10-07

Family

ID=9355721

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19883880067 Expired - Fee Related DE3880067T2 (de) 1987-10-12 1988-09-26 Leiterplatten für hohe Ströme und Verfahren zur Herstellung.

Country Status (4)

Country Link
EP (1) EP0312415B1 (de)
DE (1) DE3880067T2 (de)
ES (1) ES2039670T3 (de)
FR (1) FR2621774B1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4430798A1 (de) * 1994-08-30 1996-03-07 Siemens Ag Stanzgitter zur Verbindung von elektrischen Bauelementen
KR0165544B1 (ko) * 1990-03-05 1999-03-20 야마다 로꾸이찌 전자발음장치
FR2697715B1 (fr) * 1992-10-30 1994-12-30 Dav Circuit imprimé double face et ensemble de conduction électrique comprenant un tel circuit imprimé.
DE4323827C1 (de) * 1993-07-15 1994-12-08 Siemens Ag Steckbare Baugruppe
US5587890A (en) 1994-08-08 1996-12-24 Cooper Industries, Inc. Vehicle electric power distribution system
DE4432191C1 (de) * 1994-09-09 1996-01-18 Siemens Ag Verfahren zum Anschweißen von Bauteilanschlüssen an die Kontakte einer Leiterplatte und unter Anwendung dieses Verfahrens hergestellte Baugruppe
JP3387726B2 (ja) * 1996-04-10 2003-03-17 松下電器産業株式会社 部品実装用基板とその製造方法およびモジュールの製造方法
FR2752913B1 (fr) * 1996-09-03 1998-10-30 Axo Scintex Cie Equip Automobi Procede de fabrication d'un porte-lampes de feux de signalisation et porte-lampes realise suivant ledit procede
JPH1141754A (ja) * 1997-07-10 1999-02-12 Molex Inc 三次元立体回路体
GB9828490D0 (en) * 1998-12-23 1999-02-17 Lucas Ind Plc Printed circuit device
FR2822339B3 (fr) * 2001-03-19 2003-02-07 Dav Procede de liaison entre deux etages de circuit electrique, et circuits ainsi relies
DE102006006846B3 (de) 2006-02-15 2007-08-30 Tyco Electronics Amp Gmbh Elektrischer Leistungsverteiler und elektrisches Stanzgitter dafür
DE102006062493A1 (de) * 2006-12-28 2008-07-03 Robert Bosch Gmbh Elektrische Vorrichtung
KR102099934B1 (ko) * 2012-11-30 2020-04-10 엘지이노텍 주식회사 인쇄회로기판, 상기 인쇄회로기판을 포함하는 조명장치 및 백라이트 유닛

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1237191B (de) * 1965-04-08 1967-03-23 Normalzeit G M B H Verfahren zur Herstellung einer elektrischen Geraeteschaltung
CH711574A4 (de) * 1974-05-24 1975-11-28
DE2536029A1 (de) * 1975-08-13 1977-02-24 Westfaelische Metall Industrie Verfahren zur herstellung von leiterplatten
FR2344151A1 (fr) * 1976-03-08 1977-10-07 Amp Inc Connecteur electrique et son procede de production
DE2612257C3 (de) * 1976-03-23 1979-06-07 Westfaelische Metall Industrie Kg, Hueck & Co, 4780 Lippstadt Verfahren und Vorrichtung zur Herstellung von Leiterplatten
FR2531597B1 (fr) * 1982-08-09 1985-07-05 Dav Ind Circuit imprime pour courants eleves

Also Published As

Publication number Publication date
ES2039670T3 (es) 1993-10-01
EP0312415B1 (de) 1993-04-07
FR2621774A1 (fr) 1989-04-14
FR2621774B1 (fr) 1990-02-16
EP0312415A1 (de) 1989-04-19
DE3880067T2 (de) 1993-10-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee