DE3686634D1 - Verfahren zur herstellung von leiterplatten fuer das zusammenschalten mit koaxialkabeln und dadurch hergestellte leiterplatten. - Google Patents

Verfahren zur herstellung von leiterplatten fuer das zusammenschalten mit koaxialkabeln und dadurch hergestellte leiterplatten.

Info

Publication number
DE3686634D1
DE3686634D1 DE8686114327T DE3686634T DE3686634D1 DE 3686634 D1 DE3686634 D1 DE 3686634D1 DE 8686114327 T DE8686114327 T DE 8686114327T DE 3686634 T DE3686634 T DE 3686634T DE 3686634 D1 DE3686634 D1 DE 3686634D1
Authority
DE
Germany
Prior art keywords
circuit boards
interconnecting
coaxial cables
produced
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686114327T
Other languages
English (en)
Inventor
Philip J Plonski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Interconnection Technology Inc
Original Assignee
Advanced Interconnection Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Interconnection Technology Inc filed Critical Advanced Interconnection Technology Inc
Application granted granted Critical
Publication of DE3686634D1 publication Critical patent/DE3686634D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/03—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections
    • H01R9/05—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections for coaxial cables
    • H01R9/0515—Connection to a rigid planar substrate, e.g. printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10356—Cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Multi-Conductor Connections (AREA)
DE8686114327T 1985-10-18 1986-10-16 Verfahren zur herstellung von leiterplatten fuer das zusammenschalten mit koaxialkabeln und dadurch hergestellte leiterplatten. Expired - Lifetime DE3686634D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/788,962 US4679321A (en) 1985-10-18 1985-10-18 Method for making coaxial interconnection boards

Publications (1)

Publication Number Publication Date
DE3686634D1 true DE3686634D1 (de) 1992-10-08

Family

ID=25146136

Family Applications (2)

Application Number Title Priority Date Filing Date
DE8686114327T Expired - Lifetime DE3686634D1 (de) 1985-10-18 1986-10-16 Verfahren zur herstellung von leiterplatten fuer das zusammenschalten mit koaxialkabeln und dadurch hergestellte leiterplatten.
DE19863635800 Granted DE3635800A1 (de) 1985-10-18 1986-10-17 Leiterplatten mit koaxialen leiterzuegen

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE19863635800 Granted DE3635800A1 (de) 1985-10-18 1986-10-17 Leiterplatten mit koaxialen leiterzuegen

Country Status (4)

Country Link
US (1) US4679321A (de)
EP (1) EP0223071B1 (de)
DE (2) DE3686634D1 (de)
GB (1) GB2182211B (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4859807A (en) * 1985-07-19 1989-08-22 Kollmorgen Technologies Corporation Wire scribed circuit boards and method of manufacture
US4956749A (en) * 1987-11-20 1990-09-11 Hewlett-Packard Company Interconnect structure for integrated circuits
US4859806A (en) * 1988-05-17 1989-08-22 Microelectronics And Computer Technology Corporation Discretionary interconnect
US4972050A (en) * 1989-06-30 1990-11-20 Kollmorgen Corporation Wire scribed circuit boards and methods of their manufacture
EP0468767B1 (de) * 1990-07-25 1996-10-09 Hitachi Chemical Co., Ltd. Leiterplatte mit Verbindung von Koaxialleitern untereinander
US5250759A (en) * 1992-02-28 1993-10-05 Watson Troy M Surface mount component pads
DE4238747C2 (de) * 1992-11-17 1997-04-24 Gore Enterprise Holdings Inc Anordnung zur Verbindung von Koaxialleitungen für koaxiale Hochfrequenzsteckverbindungen
US5402088A (en) * 1992-12-03 1995-03-28 Ail Systems, Inc. Apparatus for the interconnection of radio frequency (RF) monolithic microwave integrated circuits
US5378857A (en) * 1993-01-15 1995-01-03 Advanced Interconnection Technology, Inc. Directly bondable termination for a fixed discrete wire
JP2748890B2 (ja) * 1995-06-14 1998-05-13 日本電気株式会社 有機樹脂多層配線基板およびその製造方法
JP3400634B2 (ja) * 1996-02-28 2003-04-28 富士通株式会社 プリント基板の配線パターン改造方法およびプリント基板の配線パターンの切断方法
US6323549B1 (en) * 1996-08-29 2001-11-27 L. Pierre deRochemont Ceramic composite wiring structures for semiconductor devices and method of manufacture
US5755596A (en) * 1996-11-19 1998-05-26 Watson; Troy M. High-density compression connector
US6010342A (en) * 1996-11-19 2000-01-04 Watson; Troy M. Sleeveless high-density compression connector
US7108546B2 (en) * 2001-06-20 2006-09-19 Formfactor, Inc. High density planar electrical interface
US8338713B2 (en) * 2002-11-16 2012-12-25 Samsung Electronics Co., Ltd. Cabled signaling system and components thereof
US20040094328A1 (en) * 2002-11-16 2004-05-20 Fjelstad Joseph C. Cabled signaling system and components thereof
US7061096B2 (en) * 2003-09-24 2006-06-13 Silicon Pipe, Inc. Multi-surface IC packaging structures and methods for their manufacture
US9011177B2 (en) 2009-01-30 2015-04-21 Molex Incorporated High speed bypass cable assembly
US9142921B2 (en) 2013-02-27 2015-09-22 Molex Incorporated High speed bypass cable for use with backplanes
EP3042420A4 (de) 2013-09-04 2017-04-05 Molex, LLC Steckverbindersystem mit kabelbypass
US9521751B2 (en) * 2013-11-20 2016-12-13 Intel Corporation Weaved electrical components in a substrate package core
DE102014105530A1 (de) 2014-04-17 2015-10-22 Endress+Hauser Flowtec Ag Leiterplatte und Anordnung aus einer Leiterplatte und einem Koaxialkabel
TWI637568B (zh) 2015-01-11 2018-10-01 莫仕有限公司 Circuit board bypass assembly and its components
US10367280B2 (en) 2015-01-11 2019-07-30 Molex, Llc Wire to board connectors suitable for use in bypass routing assemblies
WO2016179263A1 (en) 2015-05-04 2016-11-10 Molex, Llc Computing device using bypass assembly
US10424878B2 (en) 2016-01-11 2019-09-24 Molex, Llc Cable connector assembly
US10424856B2 (en) 2016-01-11 2019-09-24 Molex, Llc Routing assembly and system using same
CN110839182B (zh) 2016-01-19 2021-11-05 莫列斯有限公司 集成路由组件以及采用集成路由组件的系统
EP4094549A1 (de) * 2020-01-21 2022-11-30 Telefonaktiebolaget LM Ericsson (publ) Low-pim-koax-zu-leiterplatten-schnittstelle
CN114916133A (zh) * 2022-05-20 2022-08-16 维沃移动通信有限公司 柔性电路板和电子设备

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3674914A (en) * 1968-02-09 1972-07-04 Photocircuits Corp Wire scribed circuit boards and method of manufacture
US3659340A (en) * 1969-12-16 1972-05-02 Ibm Method of fabricating coaxial wires in back panels
US3969816A (en) * 1972-12-11 1976-07-20 Amp Incorporated Bonded wire interconnection system
US3996416A (en) * 1975-03-18 1976-12-07 Amp Incorporated Interconnection system and method of assembly
US4500389A (en) * 1981-04-14 1985-02-19 Kollmorgen Technologies Corporation Process for the manufacture of substrates to interconnect electronic components

Also Published As

Publication number Publication date
US4679321A (en) 1987-07-14
EP0223071A3 (en) 1989-10-18
DE3635800A1 (de) 1987-04-23
GB2182211B (en) 1989-10-25
EP0223071A2 (de) 1987-05-27
DE3635800C2 (de) 1988-10-13
GB8624780D0 (en) 1986-11-19
GB2182211A (en) 1987-05-07
EP0223071B1 (de) 1992-09-02

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Legal Events

Date Code Title Description
8372 Publication of ep patent withdrawn