EP1574327A3 - Procedé de fabrication d' un produit composite semi-fini en alliage de cuivre et utilisation du produit semi-fini - Google Patents
Procedé de fabrication d' un produit composite semi-fini en alliage de cuivre et utilisation du produit semi-fini Download PDFInfo
- Publication number
- EP1574327A3 EP1574327A3 EP05005073A EP05005073A EP1574327A3 EP 1574327 A3 EP1574327 A3 EP 1574327A3 EP 05005073 A EP05005073 A EP 05005073A EP 05005073 A EP05005073 A EP 05005073A EP 1574327 A3 EP1574327 A3 EP 1574327A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- semi
- alloy
- finished
- copper alloy
- oxidized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/10—Alloys containing non-metals
- C22C1/1078—Alloys containing non-metals by internal oxidation of material in solid state
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/001—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
- C22C32/0015—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides with only single oxides as main non-metallic constituents
- C22C32/0021—Matrix based on noble metals, Cu or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
- C23C8/08—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases only one element being applied
- C23C8/10—Oxidising
- C23C8/16—Oxidising using oxygen-containing compounds, e.g. water, carbon dioxide
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/80—After-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/025—Composite material having copper as the basic material
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Composite Materials (AREA)
- Conductive Materials (AREA)
- Sampling And Sample Adjustment (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004012386 | 2004-03-13 | ||
DE200410012386 DE102004012386A1 (de) | 2004-03-13 | 2004-03-13 | Verbundhalbzeug aus einer Kupferlegierung, Herstellungsverfahren und Verwendung |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1574327A2 EP1574327A2 (fr) | 2005-09-14 |
EP1574327A3 true EP1574327A3 (fr) | 2006-01-11 |
Family
ID=34813690
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP05005073A Withdrawn EP1574327A3 (fr) | 2004-03-13 | 2005-03-09 | Procedé de fabrication d' un produit composite semi-fini en alliage de cuivre et utilisation du produit semi-fini |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP1574327A3 (fr) |
DE (1) | DE102004012386A1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101440445B (zh) | 2008-12-23 | 2010-07-07 | 路达(厦门)工业有限公司 | 无铅易切削铝黄铜合金及其制造方法 |
DE102014010711B4 (de) | 2014-07-19 | 2019-08-29 | Wieland-Werke Ag | Verfahren zur Glühbehandlung von zinkhaltigen Kupferlegierungsbändern |
CN111778421B (zh) * | 2019-10-28 | 2023-04-07 | 河南科技大学 | 铜基复合材料及其制备方法 |
CN114347586B (zh) * | 2022-01-25 | 2024-05-03 | 宁波博威合金材料股份有限公司 | 一种铜-铜复合带材、制备方法以及应用 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3545074A (en) * | 1968-07-29 | 1970-12-08 | Dow Chemical Co | Method of making copper alloy products |
DE2215692A1 (de) * | 1971-06-07 | 1972-12-21 | Mansfeld Kombinat W Pieck Veb | Verfahren zur Herstellung einer aus hartbaren Kupfer Eisen Titan Legierung |
DE2418686A1 (de) * | 1974-04-18 | 1975-10-30 | Kabel Metallwerke Ghh | Verfahren zur herstellung von halbzeug aus dispersionsgehaerteten kupferlegierungen |
US4434016A (en) * | 1983-02-18 | 1984-02-28 | Olin Corporation | Precipitation hardenable copper alloy and process |
JPH04268055A (ja) * | 1991-02-22 | 1992-09-24 | Yamaha Corp | リードフレーム用銅合金の製造方法 |
US6136103A (en) * | 1997-12-19 | 2000-10-24 | Wieland-Werke Ag | Copper-tin-titanium alloy |
US20020012603A1 (en) * | 2000-05-25 | 2002-01-31 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Copper alloy for use in electric and electronic parts |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2002886A1 (de) * | 1970-01-23 | 1971-07-29 | Degussa | Verfahren zur Herstellung eines durch innere Oxydation dispersionsgehaerteten Werkstoffes |
DE2262132A1 (de) * | 1972-12-19 | 1974-06-20 | Metallgesellschaft Ag | Verfahren zur herstellung von mit oxiden dispersionsgehaerteten metallischen werkstoffen |
EP0097306B1 (fr) * | 1982-06-18 | 1990-05-23 | Scm Corporation | Procédé de préparation d'articles métalliques renforcés par une dispersion et articles ainsi obtenus |
-
2004
- 2004-03-13 DE DE200410012386 patent/DE102004012386A1/de not_active Withdrawn
-
2005
- 2005-03-09 EP EP05005073A patent/EP1574327A3/fr not_active Withdrawn
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3545074A (en) * | 1968-07-29 | 1970-12-08 | Dow Chemical Co | Method of making copper alloy products |
DE2215692A1 (de) * | 1971-06-07 | 1972-12-21 | Mansfeld Kombinat W Pieck Veb | Verfahren zur Herstellung einer aus hartbaren Kupfer Eisen Titan Legierung |
DE2418686A1 (de) * | 1974-04-18 | 1975-10-30 | Kabel Metallwerke Ghh | Verfahren zur herstellung von halbzeug aus dispersionsgehaerteten kupferlegierungen |
US4434016A (en) * | 1983-02-18 | 1984-02-28 | Olin Corporation | Precipitation hardenable copper alloy and process |
JPH04268055A (ja) * | 1991-02-22 | 1992-09-24 | Yamaha Corp | リードフレーム用銅合金の製造方法 |
US6136103A (en) * | 1997-12-19 | 2000-10-24 | Wieland-Werke Ag | Copper-tin-titanium alloy |
US20020012603A1 (en) * | 2000-05-25 | 2002-01-31 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Copper alloy for use in electric and electronic parts |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 017, no. 055 (C - 1023) 3 February 1993 (1993-02-03) * |
Also Published As
Publication number | Publication date |
---|---|
EP1574327A2 (fr) | 2005-09-14 |
DE102004012386A1 (de) | 2005-10-06 |
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RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01B 1/02 20060101ALI20051121BHEP Ipc: C22C 1/10 20060101ALI20051121BHEP Ipc: C22F 1/08 20060101ALI20051121BHEP Ipc: B32B 15/02 20060101AFI20050623BHEP |
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