EP1560011A1 - Jauge de contrainte avec protection contre l'humidité en moyen d'une couche inorganique inhomogène sur une couche polymer d'égalisation et un arrangement de fentes - Google Patents
Jauge de contrainte avec protection contre l'humidité en moyen d'une couche inorganique inhomogène sur une couche polymer d'égalisation et un arrangement de fentes Download PDFInfo
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- EP1560011A1 EP1560011A1 EP04075199A EP04075199A EP1560011A1 EP 1560011 A1 EP1560011 A1 EP 1560011A1 EP 04075199 A EP04075199 A EP 04075199A EP 04075199 A EP04075199 A EP 04075199A EP 1560011 A1 EP1560011 A1 EP 1560011A1
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- EP
- European Patent Office
- Prior art keywords
- layer
- strain gauge
- protective layer
- inorganic
- strain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01G—WEIGHING
- G01G3/00—Weighing apparatus characterised by the use of elastically-deformable members, e.g. spring balances
- G01G3/12—Weighing apparatus characterised by the use of elastically-deformable members, e.g. spring balances wherein the weighing element is in the form of a solid body stressed by pressure or tension during weighing
- G01G3/14—Weighing apparatus characterised by the use of elastically-deformable members, e.g. spring balances wherein the weighing element is in the form of a solid body stressed by pressure or tension during weighing measuring variations of electrical resistance
- G01G3/1402—Special supports with preselected places to mount the resistance strain gauges; Mounting of supports
Definitions
- the invention relates to a strain gauge, which is a strain sensitive a carrier applied electrical resistance path and terminal electrodes for Contacting the resistance path, wherein the strain gauge with a is provided from inorganic materials existing protective layer, and a Row or surface arrangement of strain gauges provided with a strain-sensitive applied on a support electrical Resistor track, with one the resistance track and at least a part of the Carrier-covering protective layer consisting of inorganic materials. Furthermore, the invention relates to a load cell with a deformation body and with at least one strain gauges applied to the deformation body and a method for producing a protective layer on a strain gauge, or a series or surface arrangement of strain gauges, or on a strain gauge provided with a strain gauge.
- a strain gauge has a metal applied to a carrier Resistance path, which preferably in the form of a meander structure by means known etching process is produced. Further, on the carrier Connection electrodes for contacting the resistance path exist, these often arise in one operation with the resistor track and thus usually off consist of the same material.
- a carrier material for strain gauges used electrical insulators; depending on the application you can find glass, Ceramics, often also polymers, glass fiber reinforced polymers or Composite materials. Strain gauges are measuring elements in which a mechanical deformation causes a change in electrical resistance, and which are therefore used to measure the deformation causing force.
- strain gauges are transformed a deformation caused by a force on a deformation body in a used electrical signal.
- a load cell creates a Deflection of the vertically movable load carrier relative to the spatial fixed part of the deformation body by the force of a load on the Load transducer, for example in the weighing technology on the with the Load receptor connected weighing pan.
- such deformation bodies have four shaped by thin material areas, elastic bending points, which in each case at the four corners of a Parallelogramms are arranged, wherein the load receptor as a vertically movable Parallelogrammschenkel against a preferably on a housing attached, also vertical parallelogram legs is arranged.
- the size the deformation caused in the thin bends is at least one on one of the bending points, usually by means of an electrically insulating Adhesive layer applied strain gauges as a change of its electrical Resistance measured.
- polymeric carrier materials in particular polyimides, but also epoxides, Phenol resins, melamines and ketones used for strain gauges.
- polymers Carriers have the advantage that they due to their lower rigidity the Better adapt the deformation body. In particular, this is the mechanical Reduced load on the adhesive layer. Hysteresis effects or destruction of one rigid carrier with a deformation body connecting adhesive layer occur here much less.
- polymeric support materials allow for Strain gauges with a meandering resistance path As is known, a load drift compensation by a corresponding training the reversal points of the resistance path. Incidentally, strain gauges are with polymeric carriers better manageable and cheaper to produce.
- polymers have the disadvantage that they have a relatively high absorption capacity for water, but also for solvents, so that the moisture content the air surrounding a load cell, but in particular the change, a has a lasting influence on the measurement result.
- the Sensitivity, the stability of the zero point and the creep behavior, the so-called Load drift influenced by the humidity - concerning water and solvents Parameter of a load cell acted upon by strain gauges as a transducer.
- the backing material takes an unprotected Strain gauge the moisture on and swells by, so that the Distance of the resistance track to the bending point enlarged and thereby the of the deforming bending point in the resistance path induced deformation is slightly changed.
- absorbed moisture changes the elastic properties of the carrier material and thus the deformation parameters the resistance track.
- JP 7 113 697 A a thin inorganic film, for example SiO 2 with a thickness of about 100 nanometers (nm), so to speak to prevent the ingress of moisture is applied as a moisture barrier layer on the surface of the Dehnmessstsammlungs.
- an inorganic insulating film for example, polyimide having a thickness of about 10 microns (microns) is applied, whereby microscopic holes or cracks in the inorganic film, so-called pinholes, which could continue to penetrate moisture clogged.
- the protective effect provided by this two-ply layer is not always satisfactory, especially with the high-sensitivity load cells designed for relatively low loads.
- DE 40 15 666 C2 discloses a loaded with strain gauges Force transducer, wherein a strain gauge and the adjoining part of the Support with a vapor-deposited diffusion-tight electrically insulating Coating of silicon oxide or silicon carbide is provided, the layer thickness preferably two to four microns.
- the coating may also consist of a lower silicon oxide layer and one over it located metal layer, preferably a nickel layer consist.
- the Strain gauges covering protective layers or films as a whole, in particular the inorganic layers or films having a high barrier effect that they are applied directly to the measuring transducer Strain gauge, or that this on a large-scale arrangement of a variety be applied by strain gauges subsequent to their preparation, because of their comparatively large mass and high rigidity also with change the measurement result determined for the strain gauge.
- These measurement errors arise by a so-called force shunt, caused by the covering of the DehmessstMails with a relatively thick layer or foil in the order of a few micrometers as disclosed in the prior art.
- Insulator materials already wear because of their comparatively high rigidity a thickness of a few microns (microns) to a measurable force shunt at.
- a force shunt arises for example in that thick Inorganic protective layers due to their high rigidity significantly
- Overall rigidity of the above-mentioned bending points of the deformation body contribute.
- this is special problematic, because here the bends to achieve high sensitivity only have a small thickness. That means unwanted changes of the elastic Properties of the protective layer, such as anelastic after-effect, high Inelasticity, in particular strain hysteresis, do not lead to one reproducible and thus also not technologically compensable software Measurement error.
- a strain gauge with a strain-sensitive on a support applied electrical resistance track and terminal electrodes for Contacting of the resistance path is with at least one part of the carrier and / or the resistance path and / or the terminal electrodes covering inorganic materials existing protective layer provided.
- the protective layer is inhomogeneous in their construction over their thickness and between the strain gauge and the protective layer is a Ausbnende polymer layer arranged, which the Smooth surface of the area to be coated in terms of roughness.
- the Layer thickness of the ausbnenden layer corresponds at least to the thickness of the Protective layer.
- the invention utilizes the excellent barrier properties which the inorganic materials, and greatly reduced by use thin protective layers, the very high stiffness of the prior art known thick inorganic layers.
- the thickness of the protective layer predominantly in Submicrometer range to choose as the inorganic materials known have values for the Young's modulus which are larger by a factor of 10 to 100 than that of polymer materials, such as those for the carrier be used.
- the rigidity of the protective layer in which As is known, the modulus of elasticity of a material and the thickness of a layer from this material, be reduced.
- the thickness is not the same for the protective layer backed ausbnende layer, which consists of an electrically non-conductive polymer, in particular an acrylate polymer or an inorganic-organic Hybrid polymer is required. (The latter materials are described in DE 38 28 098 A1 and DE 43 03 570 A1 described). Their function is the development of Roughnesses of the surface of the carrier and the resistance track and in the rounding off the edges of the resistor track or the reduce of their Slope. Since the elastically soft polymer layers less to a Contribute force bypass than that for an inorganic protective layer of the same Thickness would be the case, this layer can be chosen thicker than the thinner Protective layer.
- the thickness of the ausbnenden layer is also dependent on the on it applied protective layer, in particular for strain gauges, in high-sensitivity load cells for a low load range use find should be in the submicron range.
- the ausbnende polymer layer in particular the inorganic-organic hybrid polymer layer in experiments as adhesion-promoting with regard to subsequent layers, so that no Delamination of the protective layer occurs.
- the ausbnende layer for example, a layer of an inorganic-organic hybrid polymer, is easy to apply, for example by brushing, rolling, spraying or by means Pad printing method, which also applies to an acrylate polymer layer.
- the ausbnende polymer layer is homogeneous as a function of their thickness in terms of their composition.
- a special property of the protective layer in particular individual layers the same is that when applied, in particular by means of PECVD, conformally grows up their underlay. This means that they are essentially a covering Constant thickness, regardless of the angle that their pad locally to Orientation of the coating surface as a whole (coating level) occupies. This also means overhanging areas or to the coating level in the Substantially orthogonal areas of a substrate to be coated, For example, the side edges of the resistance path are from the protective layer covered. In combination with the protective layer underlaid ausbnenden Polymer layer results in an optimized protective effect against penetrating Humidity.
- Edges at which in an inorganic protective layer mentioned above Micropores or microcracks, or hairline cracks due to local stresses, in particular thermal stresses, preferably arise and the other also act as trapping sites for these micropores and hairline cracks, are by the Protective layer underlaid polymer layer rounded and rough surfaces balanced.
- the presence of micropores or microcracks in the Protective layer reduced from the outset, however, by the conformity of the Protective layer the edges despite a still existing steepness of a covering not excluded by the protective layer.
- the area of the strain gauge is thus completely and evenly covered by the protective layer without Weaknesses for penetrating moisture would be present.
- An increase in the thickness of an inorganic protective layer does not result inevitably in an increase in the barrier effect against penetrating Moisture, which in the context of the invention generally as an effect against the penetration of water, but also solvents and / or gases to be understood.
- the protective layer inhomogeneous By suitable choice of inhomogeneous materials to be combined in the layer and, above all, by suitably changing the coating parameters, these can open channels in the form of micropores or microcracks are closed.
- the protective layer is a multi-layer, which in has alternating sequence different inorganic materials, and / or in alternating sequence different stoichiometric compositions of one has at least two components of existing inorganic material, and / or the varying in varying sequence structural parameters of a inorganic material.
- the protective layer can be a sequence of silica and Having silicon nitride layers.
- Such protective layers are disclosed in WO03 / 050894 for the covering of electronic devices, in particular of Display devices, such as light emitting devices or Liquid crystal displays.
- the protective layer has a continuous change of one or more parameters, in particular the chemical composition over its thickness.
- This continuous change can on the one hand for multilayer coatings in the art and done so that the transitions between the individual layers is soft, the means that the shift parameters do not change abruptly, but their profile is periodic, that is more like a sinusoidal function.
- This variant is particularly preferred for the Generation of very thin protective layers, which on strain gauges for high sensitive low-load force measuring devices find application.
- An advantage of an inhomogeneous protective layer with continuous change of a or more parameters is another reduction from inner tensions, as they are by very different parameters arise between abruptly successive layers in a multilayer which, in some cases, delamination of individual layers of a Multi-layer coating would not be excluded in any case.
- the advantage of a protective layer with continuous variation of a Parameters in a reduction of the danger of delamination lies in that by the layer parameters of a first layer, for example a Barrier location, different parameters of an immediately following second location, for Example of an intermediate layer, the micropores and microcracks in the first layer almost completely covered and thus an improved barrier effect is achieved.
- a first layer for example a Barrier location
- different parameters of an immediately following second location for Example of an intermediate layer
- the inorganic protective layers at relatively low temperatures, for example between 80 and 130 ° C., preferably by means of chemical vapor deposition, for example PECVD (plasma enhanced chemical vapour deposition) are applied, since the carrier material of the strain gauge and the ausbnende layer should be affected as little as possible.
- PECVD plasma enhanced chemical vapour deposition
- the structure of these protective layers often deviates from a strict one Crystallinity and it grows especially in the case of inorganic Insulator materials predominantly amorphous on.
- a strain gauge When using a strain gauge according to the invention has a Load cell with a deformation body at least one on the Deformation applied strain gauges, on which a strain sensitive on a support applied electrical resistance path is available.
- the protective layer is inhomogeneous in its construction about her thickness.
- the ausbnende polymer layer consists in particular of a Acrylate polymer or an inorganic-organic hybrid polymer.
- the Layer thickness of this ausbnenden layer corresponds at least to the thickness of the inhomogeneous inorganic protective layer.
- a cover layer of polymer material or from Silicone applied to the inorganic protective layer. Silicone is unproblematic in the In view of the force shunt discussed above, since it is particularly soft.
- a protective layer on a individual strain gauges or a series or surface arrangement of Strain gauge is a Ausbnende polymer layer on at least one part the carrier and / or the resistance path and / or the connection electrodes applied and on the ausbnenden polymer layer a thin inorganic Protective layer deposited, the coating parameters varies so become that inhomogeneous over their thickness inorganic protective layer formed.
- a preferred method for applying the ausbnenden polymer layer is the Tampon printing process.
- the preparation of the protective layer is in an advantageous Way the method of chemical vapor deposition (CVD), especially the plasma enhanced chemical vapor deposition (PECVD).
- CVD chemical vapor deposition
- PECVD plasma enhanced chemical vapor deposition
- the surface of the Strain gauge and / or the ausbnenden polymer layer before coating by means of chemical or physical cleaning methods, in particular by means of Plasma cleaning process, pretreated.
- a Ausbnende polymer layer on at least part of the Carrier and / or the resistance track and the deformation body applied and a thin inorganic protective layer is deposited on the polymer layer, wherein the coating parameters are varied such that one over their Thickness forms inhomogeneous inorganic protective layer.
- Such a coating of a strain gauge may be preferred to the already on the load cell applied strain gauges by means of the above mentioned Methods are done.
- FIG. 1 shows, in a three-dimensional representation, a single strain gauge 1, that with a protective layer against the ingress of moisture, in particular in terms of water and solvent vapors, but also gases, such as oxygen, in Form of a multi-layer 2 is provided.
- the strain gauge 1 has a strain-dependent resistance track 4, preferably meandering on a Carrier 5 is arranged and connected to terminal electrodes 8, on.
- the Strain gauge 1 for example, from a surface arrangement after his Cut out the coating.
- the multi-layer 2 the consists of a regular sequence of plies 6, 7, transparent and broken drawn.
- the layers 6, 7 of the multilayer protective layer 2 have different inorganic materials, or have a different stoichiometric Composition of one consisting of at least two components inorganic material, or have varying structural variations in an alternating sequence Parameter of an inorganic material.
- the thickness of the individual layers 6, 7 is typically 5 to 200 nm, depending on the coating method, in Isolated cases, especially in the case of application of the strain gauge 1 for higher load cells or when using a low material Young's modulus can also be up to 500 nm.
- the multi-layer is a Ausbnende layer 3 of a polymer, for example, an acrylate or methacrylate polymer layer, underlaid.
- Such Layer 3 smoothes the surface of the strain gauge 1, in particular in the area the edges, for example, those of the resistance path 4, whereby the Slope is reduced.
- irregularities of the Surface or even missing parts or dirt particles be it on the Resistance track 4 or the carrier 5 covered in a compensatory manner.
- the ausbnende polymer layer 3 the probability of Emergence or attachment of micropores or hairline cracks in one applied inorganic protective layer 2 is reduced. In this way, the Forming a good sealing applied to the ausbnende layer 3 or applied multi-layer inorganic protective layer 2 favors.
- inorganic-organic hybrid polymers for example with the trade name "ORMOCER®”. These materials, which in DE 38 28 098 A1 and DE 43 03 570 A1 have a good elasticity and even a certain amount Barrier effect against penetrating moisture. However, that is The barrier effect is not high enough to qualify for use Protective layer for strain gauges, in particular for those intended for a Use in a force measuring device are provided would be suitable.
- One particular advantage of these inorganic-organic hybrid polymers is that these Materials can be deposited in air, for example by means of spraying, Spin or pad printing process.
- the ausbnende Apply polymer layer 3 in a layer thickness of about one to three microns, the thickness of the layer being ultimately determined by the compensatory effect of material used and therefore in individual cases also in the Submicrometer range can be.
- the thickness of the ausbnenden polymer layer 3 is However, to achieve a sufficiently high balancing effect of at least the Total thickness of the protective layer 2 correspond.
- the ausbnende Polymer layer 3 as a function of their thickness homogeneous in terms of their Composition.
- inorganic Isolators for example, a sequence of thin layers of silicon nitride and Silicon oxide, wherein the sequence of 100 to 200 nm silicon nitride (first layer 6) - 100th nm silicon oxide (second layer 7) - 100 nm silicon nitride (again first layer 6) - 100 nm, optionally silicon oxide (again second layer 7) - optionally 100 nm Silicon nitride (again first layer 6) represents a preferred arrangement, especially since the silicon nitride as a barrier layer against high humidity Has effectiveness.
- a multi-layer 2 consists of at least three layers inorganic materials, but preferably from five layers.
- the layers 6, 7 of the multilayer protective layer 2 can also be made from one at least two components of existing inorganic material be composed, wherein the stoichiometric composition of Able to change location.
- materials that are suitable for the production of multilayer protective layers 2 with an alternating sequence of layers 6, 7 are of different stoichiometric composition are silicon oxynitrides called, wherein the oxide or the nitride content of layer to layer varied.
- the structure and the preferred sequence of the individual layers in the multilayer 2 is expressed in the figure 2, which is a section through a Strain gauge 1 with a total of five thin individual layers 6, 7 having applied multilayer 2 shows.
- the drawing is strong schematized and it is the respective thickness of the carrier 5, the resistance path 4, the ausbnenden polymer layer 3, which between the multilayer protective layer 2 and the strain gauge 1 is arranged, and the individual layers 6, 7 of the Protective layer not drawn to scale here.
- a multi-layer 2 may consist of a regular sequence of individual layers 6, 7, which are the same in thickness, for example, or in one irregular sequence of such layers exist. In the latter case there is one Higher variety in terms of usable materials, the layer thickness, the Stoichiometry and / or the structure of the individual layers. However, one is preferred regular sequence of layers, in particular, as mentioned above, from those with Silicon nitride alternating with silicon oxide, wherein the thickness of the individual layers about 100 nm and the total thickness of the multilayer coating is usually one Micrometer does not exceed.
- FIG. 3 shows a three-dimensional representation of a single strain gauge 1, on which first a ausbnende polymer layer 3, as shown by the Figures 1 and 2 described was applied.
- This follows an inorganic one Protective layer 12 in the form of a gradient layer which extends through a Inhomogeneity in the form of a steady increase or decrease of at least one Parameters, for example, in terms of their material composition or their Structure as a function of the layer thickness.
- Gradient protective layer 12 As an example of the inhomogeneity of the material composition of such Gradient protective layer 12 is one applied by PECVD Silicon oxynitride layer, wherein near the ausbnenden layer a high Nitride or even an area with pure silicon nitride is present. With increasing layer thickness increases the oxide content of the layer at the expense of Nitride portion close to the interface with the environment, a range of pure silicon oxide or at least one high oxide content silicon oxynitride layer is present. The Preparation of such a silicon oxynitride layer will be exemplified below described.
- a protective layer 12 may also be continuously changing Structural parameters are produced, since often a structural adjustment with accompanied by a changing composition.
- Structural parameters such as the graininess of polycrystalline layers, unless they grow amorphous, vary as a function of layer thickness consists in a change of coating parameters, be it the temperature of the Source, the substrate or the coating chamber as a whole or is this Coating rate.
- FIG. 4 shows the strain gauge 1 from FIG. 3 with the one shown there Protective layer 12 can be seen in a sectional drawing, the inhomogeneity or the gradient of a parameter indicated by the gray scale should be.
- the protective layers 2, 12 are a variety of known, in various coating methods applicable inorganic insulators usable. Examples are oxides, nitrides, fluorides, carbides, borides or Combinations thereof, in particular oxynitrides, or also called mixed ceramics. For example, silica, titania, chromia, alumina, Silicon nitride and titanium nitride proven as a material. Also the so-called “diamond-like Carbon "layers can be used as possible protective layers 2, 12.
- Mit Silicon nitride layers with their excellent properties can be particularly advantageous Barrier effect alternating with oxide layers, in particular silicon oxide, titanium oxide, Tantalum oxide, zirconium oxide, hafnium oxide, alumina, or fluoride layers, for example Titanium fluoride or mixtures of the respective materials for the inorganic Use protective layers.
- oxide layers in particular silicon oxide, titanium oxide, Tantalum oxide, zirconium oxide, hafnium oxide, alumina, or fluoride layers, for example Titanium fluoride or mixtures of the respective materials for the inorganic Use protective layers.
- the protective layers 2, 12 are in particular also Metals, for example, silver, aluminum, gold, chromium, copper, nickel, titanium, as well as Alloys, such as nickel-cobalt alloys, or intermetallic Compounds, for example of aluminum and copper, of tungsten and copper or made of titanium and aluminum in question.
- Metals for example, silver, aluminum, gold, chromium, copper, nickel, titanium, as well as Alloys, such as nickel-cobalt alloys, or intermetallic Compounds, for example of aluminum and copper, of tungsten and copper or made of titanium and aluminum in question.
- metal layers are protective layers less preferred because of the more expensive coating processes. Especially here the danger of a possible short circuit to the resistance path can not be completely excluded.
- strain gauges 1 with a inorganic protective layer, for example in the form of a multi-layer 2 or a gradient layer 12 in which a parameter changes continuously can follow after the production of the strain gauges 1, as long as they still in a series or area arrangement.
- a separation of the Strain gauges 1 usually remain the side surfaces, in particular the Carrier film, open and penetrating moisture accessible. Due to the Area ratios of top and side surfaces of a DehnmessstMails 1 is However, the protective effect of the inorganic protective layer 2, 12 still right high.
- a single strain gauge 1 if necessary all around, to coat, whereby the side surfaces of the carrier 5, at least at careful handling would be covered.
- FIG. 5 shows a series arrangement 30 of FIG Strain gauges 1.
- the carrier 31 of the array 30 through narrow slits 32 oriented transversely to the longitudinal extent of the row arrangement 30 pierced, wherein the slots 32 not over the entire width of the carrier 31 of Row arrangement 30 range.
- the slots 32 may after applying the Resistance track 4 and the terminal electrodes 8 by various methods, such as Water cutting, laser cutting or preferably by punching in Carrier 31 are generated.
- FIG. 6 shows a surface arrangement 35 of strain gauges 1 in which the areas between the individual with their respective terminal electrodes.
- 8 connected resistor tracks 4 slots 32 and arranged perpendicular thereto Slots 34 break through the carrier 36 of the surface assembly 35, so that this only at four connection points 37 around each strain gauge. 1 connected is.
- the slots 32, 34 are generated at those locations of a carrier 5, to which at a later separation of the strain gauges 1 this from the Surface arrangement 35 are separated out.
- Such a slot arrangement can However, be varied in many ways, for example, such that the slots forming a right angle around the with their respective terminal electrodes.
- the strain gauges 1 with each other also more than four connection points linked together.
- connection points 33, 37 It is important to link the carrier 31, 36 at the connection points 33, 37 to minimize, that is, the area of the connection points 33, 37 so low hold, on the one hand, the side surfaces of a strain gauge 1 in one as large a range of the protective layer 2, 12 can be covered, on the other hand, however, for the handling of the array 30 or the Surface arrangement 35 of strain gauges 1 still a sufficiently high Cohesion of the carrier 31, 36 is present. It has been shown that on this Way the penetration of moisture to strain gauges from a Series or surface arrangement of the prior art greatly reduced and the Sensitivity of a loaded with such strain gauges 1 load cell could be sustainably improved.
- the width of a slot 32, 34 is to be chosen so that on the one hand not too much Carrier material between the strain gauges 1 is lost and On the other hand, the applied coating materials a sufficient Ensure coverage of the side edges of a strain gauge 1.
- a width of about 0.5 mm is mentioned here as an orientation value.
- the carrier 5 or the resistance track 4 of a strain gauge 1, especially as long as it is in a row or surface arrangement, is preferred before the coating process, that is the application of the ausbnenden layer 3 a cleaning process in which the surface by means of chemical or physical cleaning method, in particular by means of a Plasma cleaning process is pretreated subjected.
- a cleaning process in which the surface by means of chemical or physical cleaning method, in particular by means of a Plasma cleaning process is pretreated subjected.
- FIG. 7 shows the deformation body 21 of a force measuring cell with four at the Corner points of a parallelogram arranged elastic bends 22. This be by arcuate extended edge portions 23 of a recess 24 in Center of the integral deformation body 21 is formed.
- the left in the figure illustrated load receptor 25 of the deformation body 21 is in the vertical direction movable. Is for example when using the load cell in the Weighing technology on a weighing pan not visible here - which, moreover, uses a plurality of screws in the threads 26 on the load receiver 25 can be fastened - a Load on, the load receptor 25 deflects vertically under deformation of the bending points 22 down to a fixed part 27 shown on the right in the figure of the deformation body 21.
- strain gauges. 1 with a strain-dependent resistance track 4, preferably meandering is arranged on a support 5, glued. Preference is given not only to the Top 28 of the deformation body 21 facing bending points 22nd Strain gauges 1 arranged, but also to those at the bottom of the Deformation body 21, which are not visible in the drawing.
- the Strain gauges 1 are provided with a protective layer 2, 12 for protection against penetrating moisture, ie water, solvents or gases, provided, their structure, production and operation above with reference to Figures 1 to 4 was explained.
- the Protective layer 2, 12 and its underlying ausbnende polymer layer 3 here drawn transparently. However, there is no need for the Layers 2, 12, 3 in their real version are transparent to light.
- the protective layer 2, 12 has been produced, for example, by direct application to the strain gauge 1 already connected to the deformation body 21.
- the strain gauge 1 As a result, it is possible to cover the strain gauge 1 as a whole, that is to say its carrier 5 and the resistance track 4 and even beyond that still a part of the deformation body 21 and thus to completely seal it against the ingress of moisture.
- the epoxy resin which is frequently used as adhesive material and which has been used here for adhering the strain gauge 1 to the deformation body 21, and which also extends beyond the surface edge of the strain gauge 1, is covered (see FIG. 8). This means that moisture-related influences of the adhesive material on the weighing result are also prevented.
- FIG. 8 shows the area of the circle A enclosed by the circle A of FIG Deformation body 21 shown enlarged. It is like in the figure 7 on the Bending point 22 applied strain gauges 1 with this and a part of Top 28 of the deformation body 21, in particular also the above-mentioned Adhesive layer 16 covering multilayer inorganic protective layer 2 together with the to see ausbnenden polymer layer 3. To clarify here is the inorganic protective layer 2 again transparent and on their in the figure after drawn to the right-hand side broken. In addition, the Connection electrodes 8 of the meandering resistance path 4 can be seen. These Of course, even after the application of a protective layer 2 for the Connection of the detecting bridge circuit (not shown here) accessible and appropriate measures must be taken.
- a vaporization in air for Application comes.
- a combustion chemical vapor Deposition (CCVD) known coating method is the vapor of a preferably in solution in a gas-fed flame heated where it reacts chemically before settling on a near the flame precipitates substrate.
- a coating method be the plasma enhanced chemical vapor deposition (PECVD) or the plasma induced chemical vapor deposition (PICVD).
- the coating parameters in particular the excitation frequency or their variation as a function of time can be low-stress protective layers 22nd or layers 26, 27 in a multilayer layer 25, resulting in decreased Danger of delamination, in particular of the individual layers 26, 27 in one Multi-layer 25 contributes.
- a protective layer 12 made of silicon oxynitride will be described in more detail by way of example.
- the ausbnenden layer 3 of an inorganic-organic hybrid polymer by pad printing method of strain gauges is introduced into a system for coating by means of PECVD.
- the ausbnenden layer 3 of an inorganic-organic hybrid polymer by pad printing method of strain gauges is introduced into a system for coating by means of PECVD.
- the nitride formation is favored.
- successively increasing supply of N 2 O takes place a formation of silicon nitride, after which the supply of NH 3 is throttled with further increase of the N 2 O supply.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Measurement Of Force In General (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE502004010904T DE502004010904D1 (de) | 2004-01-27 | 2004-01-27 | Dehnmessstreifen mit Feuchtigkeitsschutz durch inhomogene anorganische Schicht auf glättender Polymerschicht (ORMOCER) und Schlitzanordnung |
AT04075199T ATE461437T1 (de) | 2004-01-27 | 2004-01-27 | Dehnmessstreifen mit feuchtigkeitsschutz durch inhomogene anorganische schicht auf glättender polymerschicht (ormocer) und schlitzanordnung |
EP04075199A EP1560011B1 (fr) | 2004-01-27 | 2004-01-27 | Jauge de contrainte avec protection contre l'humidité au moyen d'une couche inorganique inhomogène sur une couche polymère d'égalisation (ORMOCER) et un arrangement de fentes |
DK04075199.2T DK1560011T3 (da) | 2004-01-27 | 2004-01-27 | Strain-gauge med fugtighedsbeskyttelse ved hjælp af et uensartet, uorganisk lag på et udglattende polymerlag (ORMOCER) samt slidsindretning |
JP2005012552A JP4673630B2 (ja) | 2004-01-27 | 2005-01-20 | 電気機械変換器のための防湿技術 |
CN200510006886.1A CN1648626B (zh) | 2004-01-27 | 2005-01-27 | 用于机电传感器的防潮保护 |
US11/051,628 US7215870B2 (en) | 2004-01-27 | 2005-01-27 | Moisture protection for an electromechanical transducer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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EP04075199A EP1560011B1 (fr) | 2004-01-27 | 2004-01-27 | Jauge de contrainte avec protection contre l'humidité au moyen d'une couche inorganique inhomogène sur une couche polymère d'égalisation (ORMOCER) et un arrangement de fentes |
Publications (2)
Publication Number | Publication Date |
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EP1560011A1 true EP1560011A1 (fr) | 2005-08-03 |
EP1560011B1 EP1560011B1 (fr) | 2010-03-17 |
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ID=34639446
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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EP04075199A Expired - Lifetime EP1560011B1 (fr) | 2004-01-27 | 2004-01-27 | Jauge de contrainte avec protection contre l'humidité au moyen d'une couche inorganique inhomogène sur une couche polymère d'égalisation (ORMOCER) et un arrangement de fentes |
Country Status (7)
Country | Link |
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US (1) | US7215870B2 (fr) |
EP (1) | EP1560011B1 (fr) |
JP (1) | JP4673630B2 (fr) |
CN (1) | CN1648626B (fr) |
AT (1) | ATE461437T1 (fr) |
DE (1) | DE502004010904D1 (fr) |
DK (1) | DK1560011T3 (fr) |
Cited By (4)
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Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7150199B2 (en) * | 2003-02-19 | 2006-12-19 | Vishay Intertechnology, Inc. | Foil strain gage for automated handling and packaging |
JP4710779B2 (ja) * | 2006-09-28 | 2011-06-29 | 株式会社日立製作所 | 力学量計測装置 |
DE102007036473A1 (de) * | 2007-08-01 | 2009-02-05 | Testo Ag | Vorrichtung zum Messen des Zustands eines Messguts, insbesondere von Ölen oder Fetten |
EP2116637A3 (fr) * | 2008-05-07 | 2012-03-21 | Covalent Materials Corporation | Creuset pour la fusion de silicium |
JP2010169616A (ja) * | 2009-01-26 | 2010-08-05 | A & D Co Ltd | 歪ゲージとロードセル。 |
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DE102012208492A1 (de) * | 2012-05-22 | 2013-11-28 | Continental Teves Ag & Co. Ohg | Dehnmessstreifenanordnung |
JP2015096868A (ja) * | 2015-01-20 | 2015-05-21 | 大和製衡株式会社 | ロードセル |
US10753789B2 (en) | 2015-02-05 | 2020-08-25 | R. Douglas Fredrickson | Weight sensing vehicle hitch |
US11554621B2 (en) | 2015-02-05 | 2023-01-17 | R. Douglas Fredrickson | Trailer side and vehicle side weight sensors |
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EP3088931A1 (fr) * | 2015-04-30 | 2016-11-02 | LG Innotek Co., Ltd. | Appareil de déplacement de lentille, module de caméra et dispositif optique comprenant celui-ci |
JP6161657B2 (ja) * | 2015-05-29 | 2017-07-12 | 株式会社タムラ製作所 | ひずみセンサ材料およびそれを用いたひずみセンサ |
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WO2017057459A1 (fr) * | 2015-09-29 | 2017-04-06 | ミネベア株式会社 | Jauge de déformation, capteur de charge, et procédé de fabrication de jauge de déformation |
JP2017067764A (ja) * | 2015-09-29 | 2017-04-06 | ミネベアミツミ株式会社 | ひずみゲージ、荷重センサ、及びひずみゲージの製造方法 |
US20170131136A1 (en) * | 2015-11-11 | 2017-05-11 | Dalman (Import & Export) Ltd | Water-proof electronic scale device |
KR102602238B1 (ko) * | 2016-08-29 | 2023-11-15 | 삼성디스플레이 주식회사 | 편광 소자, 이의 제조 방법 및 이를 포함하는 표시 장치 |
US11119545B2 (en) * | 2016-10-17 | 2021-09-14 | Hewlett-Packard Development Company, L.P. | Filter mesh with incorporated strain gauge |
JP2019078726A (ja) * | 2017-10-27 | 2019-05-23 | ミネベアミツミ株式会社 | ひずみゲージ、センサモジュール |
JP2019174387A (ja) | 2018-03-29 | 2019-10-10 | ミネベアミツミ株式会社 | ひずみゲージ |
JP2019184284A (ja) * | 2018-04-03 | 2019-10-24 | ミネベアミツミ株式会社 | ひずみゲージ |
CN110873616A (zh) * | 2018-08-31 | 2020-03-10 | 梅特勒-托利多(常州)精密仪器有限公司 | 防潮应变片及其制备方法 |
JP7189240B2 (ja) * | 2021-01-18 | 2022-12-13 | ミネベアミツミ株式会社 | ひずみゲージ |
CN113607043A (zh) * | 2021-07-30 | 2021-11-05 | 中航电测仪器股份有限公司 | 一种用于芯片应力测试用应变计 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60227140A (ja) * | 1984-04-25 | 1985-11-12 | Yamato Scale Co Ltd | ロ−ドセル |
JPH01212327A (ja) * | 1988-02-19 | 1989-08-25 | Ishida Scales Mfg Co Ltd | ロードセルおよびその製造方法 |
EP1384980A1 (fr) * | 2002-07-25 | 2004-01-28 | Mettler-Toledo GmbH | Protection contre l'humidité pour un transducteur électromécanique |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2363181A (en) * | 1943-07-12 | 1944-11-21 | Lockheed Aircraft Corp | Strain gauge |
US3639875A (en) * | 1970-08-24 | 1972-02-01 | Brewer Engineering Lab Inc | Strain gage assembly and method of attachment |
US3863192A (en) * | 1973-01-24 | 1975-01-28 | Irving R Grey | Waterproof mechanically protected sensor package and method of installation |
US4104605A (en) * | 1976-09-15 | 1978-08-01 | General Electric Company | Thin film strain gauge and method of fabrication |
DE3176209D1 (en) * | 1980-11-29 | 1987-06-25 | Tokyo Electric Co Ltd | Load cell and method of manufacturing the same |
JPS59231430A (ja) * | 1983-06-14 | 1984-12-26 | Tokyo Electric Co Ltd | ロ−ドセル等のパタ−ン形成部品 |
JPS60227129A (ja) * | 1984-04-25 | 1985-11-12 | Yamato Scale Co Ltd | ストレインゲ−ジ |
JPS62269393A (ja) * | 1986-05-19 | 1987-11-21 | 富士通株式会社 | 回路基板モジユ−ルのパタ−ン印刷方法 |
JP2535991B2 (ja) * | 1987-12-14 | 1996-09-18 | トヨタ自動車株式会社 | 回路基板のコ―ティング方法 |
JPH02150537U (fr) * | 1989-05-24 | 1990-12-26 | ||
DK0544934T3 (fr) * | 1991-11-30 | 1997-03-17 | Endress Hauser Gmbh Co | |
JP2573336Y2 (ja) * | 1992-01-31 | 1998-05-28 | 日本電気株式会社 | 歪センサ |
JPH0528947U (ja) * | 1992-09-22 | 1993-04-16 | 大和製衡株式会社 | ロードセル |
DE4236985C1 (de) * | 1992-11-04 | 1994-02-24 | Hottinger Messtechnik Baldwin | Dehnungsmeßstreifen |
JPH06186096A (ja) * | 1992-12-15 | 1994-07-08 | Ishida Co Ltd | 歪みゲージ及びその製造方法 |
EP0627495B1 (fr) * | 1993-05-10 | 1998-08-12 | Optical Coating Laboratory, Inc. | Revêtement auto-cicatrisant formant une barrière anti UV sur un substrat flexible en polymère |
DE4404716A1 (de) * | 1994-02-15 | 1995-08-17 | Hottinger Messtechnik Baldwin | Dehnungsmeßstreifen und Verfahren zur Herstellung eines Dehnungsmeßstreifens sowie Meßgrößenaufnehmer |
JPH08193899A (ja) * | 1995-01-17 | 1996-07-30 | Fuji Electric Co Ltd | 半導体圧力センサ |
US6283130B1 (en) * | 1995-05-30 | 2001-09-04 | Anelva Corporation | Plasma cleaning method and placement area protector used in the method |
JP3511420B2 (ja) * | 1995-06-26 | 2004-03-29 | 日本碍子株式会社 | 出力補正機能付きセンサ |
JP3520652B2 (ja) * | 1996-02-08 | 2004-04-19 | 株式会社デンソー | 半導体力センサ |
DE19614458C2 (de) * | 1996-04-12 | 1998-10-29 | Grundfos As | Druck- oder Differenzdrucksensor und Verfahren zu seiner Herstellung |
JPH09304006A (ja) * | 1996-05-09 | 1997-11-28 | Kyowa Electron Instr Co Ltd | ひずみゲージ式センサーおよびその製造方法 |
JPH109982A (ja) * | 1996-06-26 | 1998-01-16 | Matsushita Electric Works Ltd | 圧力センサの製造方法 |
JPH1051084A (ja) * | 1996-08-06 | 1998-02-20 | Cmk Corp | 分割型プリント配線板及びその製造方法 |
US6004484A (en) * | 1997-09-09 | 1999-12-21 | Plaskolite Inc. | Acrylate polymer abrasion and static resistant coating |
IT1295848B1 (it) * | 1997-11-06 | 1999-05-28 | Powerco S R L | Striscia estensimetrica a resistenza e sue applicazioni |
JP3934247B2 (ja) * | 1998-04-13 | 2007-06-20 | ミネベア株式会社 | ひずみゲージ |
US6191952B1 (en) * | 1998-04-28 | 2001-02-20 | International Business Machines Corporation | Compliant surface layer for flip-chip electronic packages and method for forming same |
JP3573064B2 (ja) * | 2000-05-31 | 2004-10-06 | 株式会社寺岡精工 | ロードセル |
JP2002365146A (ja) * | 2001-06-12 | 2002-12-18 | Ishida Co Ltd | ロードセル |
US6830817B2 (en) * | 2001-12-21 | 2004-12-14 | Guardian Industries Corp. | Low-e coating with high visible transmission |
JP3836727B2 (ja) * | 2002-01-11 | 2006-10-25 | 株式会社イシダ | ロードセル |
CN1203289C (zh) * | 2003-06-04 | 2005-05-25 | 中国科学院力学研究所 | 应变片深海绝缘方法及装置 |
-
2004
- 2004-01-27 DE DE502004010904T patent/DE502004010904D1/de not_active Expired - Lifetime
- 2004-01-27 EP EP04075199A patent/EP1560011B1/fr not_active Expired - Lifetime
- 2004-01-27 AT AT04075199T patent/ATE461437T1/de not_active IP Right Cessation
- 2004-01-27 DK DK04075199.2T patent/DK1560011T3/da active
-
2005
- 2005-01-20 JP JP2005012552A patent/JP4673630B2/ja active Active
- 2005-01-27 CN CN200510006886.1A patent/CN1648626B/zh active Active
- 2005-01-27 US US11/051,628 patent/US7215870B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60227140A (ja) * | 1984-04-25 | 1985-11-12 | Yamato Scale Co Ltd | ロ−ドセル |
JPH01212327A (ja) * | 1988-02-19 | 1989-08-25 | Ishida Scales Mfg Co Ltd | ロードセルおよびその製造方法 |
EP1384980A1 (fr) * | 2002-07-25 | 2004-01-28 | Mettler-Toledo GmbH | Protection contre l'humidité pour un transducteur électromécanique |
WO2004011892A1 (fr) * | 2002-07-25 | 2004-02-05 | Mettler-Toledo Gmbh | Systeme de protection contre l'humidite pour un transducteur electromecanique |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011110158A3 (fr) * | 2010-03-12 | 2011-11-10 | Otto Bock Healthcare Gmbh | Dispositif de mesure pour détecter les modifications de formes |
WO2014124617A1 (fr) * | 2013-02-14 | 2014-08-21 | Schaeffler Technologies AG & Co. KG | Dispositif de mesure de couple |
CN108469316A (zh) * | 2017-02-23 | 2018-08-31 | 中国科学院苏州纳米技术与纳米仿生研究所 | 表面接枝导电聚合物和共面型电极压力传感器及其制法 |
EP3617683A1 (fr) | 2018-08-31 | 2020-03-04 | Mettler Toledo (Changzhou) Precision Instrument Ltd. | Procédé d'isolation d'un détecteur de contrainte contre la pénétration d'humidité |
WO2020043892A2 (fr) | 2018-08-31 | 2020-03-05 | Mettler-Toledo (Changzhou) Precision Instrument Co. Ltd.. | Jauge de contrainte isolée contre l'humidité et procédé d'isolation d'une jauge de contrainte contre la pénétration d'humidité |
Also Published As
Publication number | Publication date |
---|---|
US20050163461A1 (en) | 2005-07-28 |
CN1648626A (zh) | 2005-08-03 |
ATE461437T1 (de) | 2010-04-15 |
DK1560011T3 (da) | 2010-05-31 |
JP4673630B2 (ja) | 2011-04-20 |
EP1560011B1 (fr) | 2010-03-17 |
JP2005214970A (ja) | 2005-08-11 |
CN1648626B (zh) | 2011-01-26 |
US7215870B2 (en) | 2007-05-08 |
DE502004010904D1 (de) | 2010-04-29 |
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