EP1531267A2 - Pumpvorrichtung mit Mikropumpen, die einen thermischen Transpirationseffekt nutzen - Google Patents

Pumpvorrichtung mit Mikropumpen, die einen thermischen Transpirationseffekt nutzen Download PDF

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Publication number
EP1531267A2
EP1531267A2 EP04292591A EP04292591A EP1531267A2 EP 1531267 A2 EP1531267 A2 EP 1531267A2 EP 04292591 A EP04292591 A EP 04292591A EP 04292591 A EP04292591 A EP 04292591A EP 1531267 A2 EP1531267 A2 EP 1531267A2
Authority
EP
European Patent Office
Prior art keywords
micropumps
pumping device
heating element
cavities
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP04292591A
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English (en)
French (fr)
Other versions
EP1531267A3 (de
EP1531267B1 (de
Inventor
Roland Bernard
Hisanori Kambara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent SAS
Original Assignee
Alcatel CIT SA
Alcatel SA
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Publication date
Application filed by Alcatel CIT SA, Alcatel SA filed Critical Alcatel CIT SA
Publication of EP1531267A2 publication Critical patent/EP1531267A2/de
Publication of EP1531267A3 publication Critical patent/EP1531267A3/de
Application granted granted Critical
Publication of EP1531267B1 publication Critical patent/EP1531267B1/de
Not-in-force legal-status Critical Current
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B19/00—Machines or pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B1/00 - F04B17/00
    • F04B19/20—Other positive-displacement pumps
    • F04B19/24—Pumping by heat expansion of pumped fluid
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B19/00—Machines or pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B1/00 - F04B17/00
    • F04B19/006—Micropumps

Definitions

  • the present invention relates to pumping devices thermal transpiration micropumps to generate and maintain low gas pressures in low volume speakers.
  • micropumps must be very small, and they must have an appropriate vacuum generation capacity, or at least vacuum conservation. That is, they must be able to produce a sufficient compression ratio, and sufficient gas flow.
  • micropumps require the production of channels whose dimensions are small enough to be comparable with the free path medium of gaseous molecules to be compressed.
  • the average free path of molecules is of the order of a few microns. It then becomes possible to achieve channels of satisfactory size thanks to systems technology microelectronic mechanical devices (MEMS).
  • MEMS microelectronic mechanical devices
  • Channels and cavities can be made by deep etching on the surface of a semiconductor wafer. The cavities are then closed by a glass plate applied with sealingly on the surface of the semiconductor wafer.
  • the pressure in a chamber or in a mini-environment enclosure is controlled by providing a valve of mechanical regulation at the inlet of the pump, to adapt the conductance of the pipe according to the pumping conditions that we want to obtain.
  • This structure has the disadvantage of adding an element to the system, and the parts mechanical movements that make up the valve can generate harmful contaminations due to friction between mechanical parts.
  • a device for pumping by micropumps with thermal transpiration allows to avoid these disadvantages, provided you can order pumping capabilities of the device.
  • a first problem is then to feed and control in a simple way and effective the elementary cells of micropumps with thermal transpiration, in a way that allows to control the pumping capacities without adding a control valve.
  • the multiplication of the number of connected elementary micropumps in the device requires particular control means, allowing the easy management of all the elementary micropumps.
  • the object of the invention is to achieve a particular control simple and efficient device consisting of a large number of micropumps, so to control the general pumping function of elementary micropumps without addition of a regulating valve.
  • a second problem is related to the realization of the hot spring at one ends of each channel connecting two successive cavities.
  • the compression ratio is directly related to the efficiency of this source hot, which determines the ratio of temperatures at both ends of the channel.
  • the hot source of a micropump with thermal transpiration is achieved by integrating, into the glass plate superior, a heating element in the form of a parallelepiped bar resistive material, constituting an electrical resistance that can be supplied by an external source of energy.
  • the heating element in the form of a bar must achieve a temperature clearly in the central zone of the bar because the temperature decreases when approaching the end of the bar that is adjacent to the entrance to the canal.
  • Another aspect of the invention is thus to increase the efficiency of the micropumps while reducing the risk of degradation due to excessive temperature in the central zone of the hot springs of the micropump.
  • the invention aims to achieve a optimal efficiency of the micropump while reducing energy consumption.
  • a third problem is that the necessary multiplication of the number elementary micropumps leads to proportionally increase the volume total occupied by the pumping device.
  • the invention therefore aims at reducing the overall volume of the pumping device, for a given number of elementary micropumps to thermal transpiration.
  • line control drivers are accessible for the electrical connection along a first edge of the substrate, and Column control drivers are accessible for connection electric according to a second edge of the substrate.
  • control means which control selectively the line control drivers and the drivers of column control, so as to control each micropump individually individual micropumps network.
  • Various interface circuits may be used between the drivers of line control and column control drivers to power from distinctly a heating element of the micropump placed at the intersection of the line and column.
  • each heating element is of type electrical resistance
  • the heating element can be connected to the terminals of a power supply in series with a transistor itself controlled by an AND gate whose inputs are respectively connected to a control conductor corresponding line and to a column control driver corresponding.
  • the simultaneous power supply of the line control driver and of the column control driver ensures the unblocking of the transistor for feed the heating element.
  • each element heating is controlled by a flip-flop itself arranged for switch to simultaneous reception of control pulse signals from of a corresponding line control driver and a driver of corresponding column command.
  • one or more lines of micropumps are connected serially in series to form a subset series, and several serial subsets can be connected aeraulically in parallel.
  • a pumping device can use individual micropumps with thermal transpiration in which the element heating is arranged to prevent overheating of certain areas of the channel to be heated, performing a temperature distribution substantially regular depending on the length of the channel section to be heated.
  • micropumps have a heating element arranged to equitably distribute the heating depending on the length of the channel section to be heated, so as to achieve a substantially regular temperature distribution according to the length of the channel to be heated.
  • the heating element is of the type electrical resistance and comprises at least two current conducting areas placed in two successive zones longitudinally spaced one of the other in the channel section to be heated.
  • the heating element of the type electrical resistance is a resistive range having a central hole.
  • the heating element is of the type electrical resistance in the form of heating cord wound in double flat spiral.
  • the heating element may advantageously be the heating zone of an element Peltier effect.
  • the invention proposes to increase the integration of the cavities.
  • a first idea is then to give the cavities a shape more easily integrable, and to place the cavities relative to one another way that reduces their total footprint.
  • Integration can first be horizontal, by several lines of micropumps side by side.
  • Integration may, in alternative or in addition, be vertical, by several layers of elemental micropumps.
  • the invention proposes to provide, in the pumping device, that at least some of the micropumps have a cavity whose section goes into reducing from the entrance to the exit, and providing that cavities of shapes similar are nested head to tail to reduce their common footprint in cross section.
  • the cross section of the cavity at its entrance, is large enough for the gaseous molecules lose their molecular displacement regime to the high temperature provided by the adjacent heating element, and then adopt a displacement regime in viscous medium, and it is necessary to ensure simultaneously that the molecules still preserve their regime of displacement in medium viscous at the other end of the cavity whose section is smaller but whose the temperature is lower.
  • the invention thus takes advantage of the progressive reduction the average free path of the molecules when the temperature decreases of the entry towards the exit of the cavity, and consequently reduces the cross section of the cavity, ensuring that the cross section of the cavity remains at all points considered along its length, large enough for the molecules aerated gases have a displacement regime in a viscous medium.
  • the cavities have a thickness constant and a width that decreases from their entry to their exit, and the cavities are nested side by side head to tail to reduce their overall size in the transverse direction.
  • the thickness of the cavities can go into decreasing from their entrance to their exit.
  • Multilayer integration can be achieved by providing that a substrate slice is treated on both sides to make two layers of cavities.
  • the two layers of cavities have thicknesses that are decreasing from entry to exit, and that Cavities are nested head-to-tail in the thickness of the substrate.
  • the means to increase the efficiency of micropumps by reducing the risk of thermal degradation constitute a second invention which can be used either in combination or independently of other means described in this patent application.
  • the means to reduce the total volume of pumping constitute a third invention which can be used either in combination, either independently of the other means described in this patent application.
  • Figure 1 illustrates four elementary micropumps, designated by the respective reference numerals 1, 1a, 1b and 1c, which each consist of as the micropump 1, a cavity 2, a channel 3, and a heating element 4 disposed in contact with the channel 3 in the vicinity of its connection to the cavity 2.
  • Channel 3 constitutes the input channel of the elementary micropump 1, and is connected to the inlet 2a of the cavity 2.
  • the cavity 2 has an output 2b which is connected to an output channel 3a which itself constitutes the input channel of the second elementary micropump 1a.
  • the inlet channel 3 has a cross section sufficiently small so that the gaseous molecules that run through it move according to a molecular diet.
  • the cavity 2 has a cross section large enough for the molecules it contains to move according to a viscous medium regime.
  • the channel must have a section of the order of a few microns.
  • the cavity 2 may have a cross section of some tens of microns.
  • Such shapes can be made in a substrate in semiconductor by etching, then closing by means of a glass plate applied to the etched substrate.
  • the heating element 4 may be made for example by a deposit of silicon nitrate with thermooxidation, made on the glass plate.
  • Figure 2 illustrates a larger micropump network, realized in a common semiconductor substrate 5, by etching the satisfactory number of cavities and associated channels, with corresponding heating elements placed at appropriate places, ie adjacent to the entrances of the cavities such as cavity 2.
  • micropump 1 consisting of the cavity 2, the channel 3 and the heating element 4.
  • the micropumps network is arranged according to a multiplicity of lines A, B, C ... D each consisting of a series of several elementary micropumps such as micropumps 1, 6, 7, 8 and 9 of line A, thus constituting columns a, b ... c and d.
  • Each line A, B, C ... D is associated with a control conductor respective line 10A, 10B, 10C ... 10D.
  • Each column a, b ... c, d is associated to a respective column driver 11a, 11b ... 11c, 11d.
  • Each heating element such as the heating element 4 of the micropump 1 at the intersection of line A and column a is controlled by simultaneous solicitation of the line control conductor 10A and the corresponding column driver 11a.
  • the line control conductors 10A, 10B, 10C, ... 10D are accessible for a connection along a first edge of the substrate 5.
  • the column control drivers 11a, 11b ... 11c and 11d are accessible for a connection along a second edge of the substrate 5.
  • a control device can selectively supplying the line control conductors 10A, 10B, 10C, ... 10D and the column drivers 11a, 11b ... 11c and 11d, for control at will the heating elements located at the intersections of each line and each column. This allows you to individually order each elementary micropump, so as to give the micropump network desired properties of compression ratio and flow rate or pumping rate.
  • each heating element such as the element 4
  • a flip-flop electronic circuit whose tilting is controlled by simultaneous impulse supply from the command line line 10A and the column control line 11a.
  • the flip-flop then controls the power supply of the heating element 4 from a external source of electrical energy.
  • FIG. 3 A simplified control mode is illustrated in Figure 3.
  • the heating element 4 is connected in series, between the positive terminals 12 and negative 13 of a power supply, in series with a transistor 14 whose base 15 is connected to the output of an AND gate 16 whose two inputs are connected respectively to the line control conductor 10A and to the driver of column control 11a.
  • Transistor 14 turns on, to power the heating element 4, when one and the other of the line control drivers 10A and 11a column are at an appropriate potential to produce failover of the AND gate 16 which unblocks the transistor 14.
  • FIGS. 4 to 7, illustrate the means for to improve the efficiency of elementary micropumps.
  • Figure 4 illustrates the temperature distribution in a source hot heat pump micropump consisting of a resistive bar 4 cuboid.
  • the dashed line shows the variation in temperature, ordered, according to the longitudinal position considered along the canal, in abscissa.
  • the temperature varies according to the zone considered bar of resistive material along channel 3 ( Figure 1): the temperature is not uniform but has a sinusoidal distribution, with a slow increase in the vicinity of the upstream end 4a of the bar 4, then a rapid increase up to a maximum M at the center 4c of the bar 4, followed by a rapid decrease itself followed by a more gradual decrease in the vicinity of the downstream end 4b of the bar 4.
  • This sinusoidal temperature distribution results in particular from a generally unequal distribution of electrical current that propagates in the bar 4 in a direction generally perpendicular to the longitudinal axis of the channel.
  • the electric current chooses the shortest way to go from a terminal to the other, and this shortest way passes essentially through the center 4c of the bar 4, which maximizes the central temperature at the summit M.
  • this traditional parallelepipedal bar structure with rectangular section produces a relatively reduced temperature in the vicinity of the downstream end 4b of the bar 4, which end is closest to the cavity 2 following.
  • the determining element to obtain a maximum compression ratio of a thermal transpiration pump lies in the ratio of temperatures to the downstream end of the channel 3, or inlet orifice in the cavity 2, and the temperature in the cavity 2. It is therefore understood that the resistive bar with rectangular section of the heating element 4 illustrated in Figure 4 does not provide a report optimal temperature, or requires then to increase excessively the temperature of the summit M at the center 4c of the bar 4.
  • the idea according to the invention is then to modify the temperature distribution along the heating element, so that the temperature in the vicinity of the downstream end 4b of the heating element is not much lower than the temperature in central part and in the other parts of the heating element.
  • This is expected that the heating element can produce a higher temperature at neighborhood of the downstream end of channel 3, without this requiring to increase for as much the temperature in the other parts of the heating element.
  • the power consumption can be minimized, and risk of degradation of the elements by excessive temperature in the center of the heating element.
  • FIG. 1 A first embodiment is illustrated in FIG. the heating element is formed by three successive heating elements 41, 42, 43, placed across the channel 3 and offset longitudinally along the channel.
  • the Figure 5 shows the temperature distribution in the presence of the three elements heating elements 41, 42 and 43. There is a better regularity of the temperature in function of the longitudinal zone considered of the canal.
  • a variant may consist to provide only two heating elements, realizing a heating section more short in channel 3.
  • FIG. 6 illustrates another embodiment of heating element 4, having a central cavity 4e devoid of resistive element, and thus promoting the passage of electric current in the vicinity of the upstream ends 4a and 4b downstream of the heating element 4. This reduces the temperature reached in the center of the the heating element 4.
  • FIG. 7 shows another embodiment of the heating element 4, consisting of a strip of resistive material wound in double flat spiral. We avoids favoring the passage of electric current in the center of the element heating 4, which reduces the overheating effect in the center of the heating element 4.
  • the heating element 4 must produce heating over a sufficient length of the channel 3 to ensure contact satisfactory with the gas molecules that pass through the channel. It is indeed necessary that the heating element 4 can sufficiently heat the molecules to that they are agitated and present the appropriate high temperature before entering in cavity 2 which follows. This is why the heating element 4 can not not have a reduced length, concentrated in the immediate vicinity of the inlet of the cavity 2, but that it must instead extend upstream in the channel 3 in a sufficient length.
  • the heating element 4 has been described like an electrical resistance.
  • the heating element 4 is the part of a Peltier effect torque, while the cooling element of the couple to Peltier effect can be placed next to the cavity 2 of the micropump, or view of the upstream part of canal 3.
  • FIG. 8 illustrates a first embodiment in which the cavities have a constant thickness but a width that is decreasing since their entrance to their exit.
  • the figure thus shows four micropumps elementary 1, 1a, 1b and 1c, in which we find, as in the embodiment of FIG. 1, a cavity 2, an inlet channel 3, a heating element 4, and an output channel 3a, the cavity being connected to the respective channels by its entrance 2a and by its exit 2b.
  • FIG. 9 illustrates the assembly of FIG. 8, shown seen from the side in cut according to plan I-I.
  • the two cavities 2 and 2c are on both figures beside.
  • cavities 2 and 2c are made by etching in a substrate 5, and the cavities are then closed by a plate of glass 17 reported on the etched substrate 5.
  • cavities 2 and 2c have a constant thickness.
  • the cavities such as the cavity 2 have a width that decreases since their entry 2a to their output 2b.
  • the progressive reduction of width can be regular, for to form a generally triangular cavity 2 as illustrated in FIG.
  • the adoption of such a cavity shape 2 is made possible by the fact that the gas temperature decreases gradually from the inlet 2a of the cavity 2 to the outlet 2b of the same cavity 2, the average free path of the molecules descending simultaneously with the temperature, so that the width of the cavity 2 remains, in all longitudinal positions considered, significantly greater than free path of molecules, which ensures that the molecules are move in the cavity 2 in a displacement regime in a viscous medium.
  • FIG. 10 illustrates, in cross-section, an improvement of the previous embodiment.
  • the substrate 5 is etched on its two opposite sides, to constitute, on a first face, the cavities 2 and 2c previous, and to constitute, on the opposite face, two cavities 21 and 21c. Both faces are closed by respective glass plates 17 and 171. it doubles the number of elementary micropumps per unit area of substrate 5.
  • This embodiment however leads to an increase of the thickness of the device.
  • FIG. 11 illustrated in longitudinal section, does not change the width of the cavity, but its depth to achieve a cavity 2 of variable cross section.
  • FIG. 12 an embodiment is illustrated which combines with both the idea of depth variation according to Figure 11 with micropumps elements 1 and 1a in series, the idea of the superposition of two layers according to the 10 with a substrate 5 etched on both sides and engaged between two glass plates 17 and 171, and the idea of nesting the cavities according to FIG. 8.
  • the cavities 2 and 21 are nested head to tail, which reduces the thickness overall of the assembly compared with the embodiment of FIG. 10.
  • the density that is to say the number of elementary micropumps in a given surface of the substrate 5, and also in a given volume of substrate 5.
  • the number of micropumps can to be increased by a factor close to 4, which leads to proportionally the pumping speed.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Micromachines (AREA)
  • Reciprocating Pumps (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
  • Thermotherapy And Cooling Therapy Devices (AREA)
  • Disinfection, Sterilisation Or Deodorisation Of Air (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)
EP04292591A 2003-11-04 2004-11-02 Pumpvorrichtung mit Mikropumpen, die einen thermischen Transpirationseffekt nutzen Not-in-force EP1531267B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0312894 2003-11-04
FR0312894A FR2861814B1 (fr) 2003-11-04 2003-11-04 Dispositif de pompage par micropompes a transpiration thermique

Publications (3)

Publication Number Publication Date
EP1531267A2 true EP1531267A2 (de) 2005-05-18
EP1531267A3 EP1531267A3 (de) 2006-05-17
EP1531267B1 EP1531267B1 (de) 2008-12-03

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EP04292591A Not-in-force EP1531267B1 (de) 2003-11-04 2004-11-02 Pumpvorrichtung mit Mikropumpen, die einen thermischen Transpirationseffekt nutzen

Country Status (6)

Country Link
US (1) US7572110B2 (de)
EP (1) EP1531267B1 (de)
JP (1) JP2005163784A (de)
AT (1) ATE416311T1 (de)
DE (1) DE602004018089D1 (de)
FR (1) FR2861814B1 (de)

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TWI278426B (en) * 2004-12-30 2007-04-11 Prec Instr Dev Ct Nat Composite plate device for thermal transpiration micropump
WO2006121534A1 (en) * 2005-05-09 2006-11-16 University Of Oregon Thermally-powered nonmechanical fluid pumps using ratcheted channels
US7913928B2 (en) * 2005-11-04 2011-03-29 Alliant Techsystems Inc. Adaptive structures, systems incorporating same and related methods
WO2007056267A2 (en) * 2005-11-04 2007-05-18 The Trustees Of Columbia University In The City Of New York Thermally actuated valves, photovoltaic cells and arrays comprising same, and methods for producing same
WO2008038611A1 (fr) * 2006-09-28 2008-04-03 National Institute Of Advanced Industrial Science And Technology Pompe d'acheminement de gaz, procédé de formation d'un dispositif de chauffage et capteur
US7980828B1 (en) 2007-04-25 2011-07-19 Sandia Corporation Microelectromechanical pump utilizing porous silicon
US9728699B2 (en) * 2009-09-03 2017-08-08 Game Changers, Llc Thermal transpiration device and method of making same
US9243624B2 (en) 2009-10-23 2016-01-26 University Of Louisville Research Foundation, Inc. Thermally driven Knudsen pump
US8480622B2 (en) * 2009-12-18 2013-07-09 Sims Infusion pump
RU2462615C1 (ru) 2011-04-19 2012-09-27 Федеральное Государственное Автономное Образовательное Учреждение Высшего Профессионального Образования "Московский Физико-Технический Институт (Государственный Университет)" Газовый микронасос
JP4934750B1 (ja) * 2011-05-31 2012-05-16 株式会社メトラン ポンプユニット、呼吸補助装置
JP5211336B2 (ja) * 2012-02-16 2013-06-12 株式会社メトラン ポンプユニット、呼吸補助装置
US9702351B2 (en) * 2014-11-12 2017-07-11 Leif Alexi Steinhour Convection pump and method of operation
US10208739B2 (en) * 2016-01-05 2019-02-19 Funai Electric Co., Ltd. Microfluidic pump with thermal control
JP7310911B2 (ja) 2019-10-21 2023-07-19 株式会社村田製作所 流体制御装置
CA3231106A1 (en) * 2021-09-09 2023-03-16 Torramics Inc. Apparatus and method of operating a gas pump

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US20020076140A1 (en) * 2000-12-14 2002-06-20 Onix Microsystems, Inc. MEMS optical switch with pneumatic actuation
US6422823B2 (en) * 1999-12-09 2002-07-23 Alcatel Mini-environment control system and method
US6533554B1 (en) * 1999-11-01 2003-03-18 University Of Southern California Thermal transpiration pump

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US6533554B1 (en) * 1999-11-01 2003-03-18 University Of Southern California Thermal transpiration pump
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Also Published As

Publication number Publication date
EP1531267A3 (de) 2006-05-17
US7572110B2 (en) 2009-08-11
FR2861814B1 (fr) 2006-02-03
ATE416311T1 (de) 2008-12-15
FR2861814A1 (fr) 2005-05-06
JP2005163784A (ja) 2005-06-23
EP1531267B1 (de) 2008-12-03
DE602004018089D1 (de) 2009-01-15
US20050095143A1 (en) 2005-05-05

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