EP1531267B1 - Pumpvorrichtung mit Mikropumpen, die einen thermischen Transpirationseffekt nutzen - Google Patents

Pumpvorrichtung mit Mikropumpen, die einen thermischen Transpirationseffekt nutzen Download PDF

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Publication number
EP1531267B1
EP1531267B1 EP04292591A EP04292591A EP1531267B1 EP 1531267 B1 EP1531267 B1 EP 1531267B1 EP 04292591 A EP04292591 A EP 04292591A EP 04292591 A EP04292591 A EP 04292591A EP 1531267 B1 EP1531267 B1 EP 1531267B1
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EP
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Prior art keywords
pumping device
micropumps
heating element
cavities
cavity
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EP04292591A
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English (en)
French (fr)
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EP1531267A3 (de
EP1531267A2 (de
Inventor
Roland Bernard
Hisanori Kambara
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Alcatel Lucent SAS
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Alcatel Lucent SAS
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Publication of EP1531267A3 publication Critical patent/EP1531267A3/de
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B19/00—Machines or pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B1/00 - F04B17/00
    • F04B19/20—Other positive-displacement pumps
    • F04B19/24—Pumping by heat expansion of pumped fluid
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B19/00—Machines or pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B1/00 - F04B17/00
    • F04B19/006—Micropumps

Definitions

  • the present invention relates to pumping devices by thermal transpiration micropumps for generating and maintaining low gas pressures in low volume speakers.
  • micropumps must be very small, and they must have an appropriate capacity for vacuum generation, or at least vacuum conservation. That is, they must be able to produce a sufficient compression ratio, and a sufficient gas flow.
  • micropumps require the production of channels whose dimensions are small enough to be comparable with the average free path of the gaseous molecules to be compressed.
  • the average free path of the molecules increasing when the pressure decreases, it is understood that the channels may be even larger than the pressure inside the pump is low.
  • the average free path of the molecules is of the order of a few microns. It then becomes possible to create channels of satisfactory size thanks to the technology of microelectronic mechanical systems (MEMS).
  • MEMS microelectronic mechanical systems
  • the channels and cavities can be made by deep etching on the surface of a semiconductor wafer. The cavities are then closed by a glass plate sealingly applied to the surface of the semiconductor wafer.
  • the pressure in a chamber or in a mini-environment chamber is controlled by providing a mechanical control valve at the inlet of the pump, to adapt the conductance of the pipe according to the conditions of the pumping that we want to get.
  • This structure has the disadvantage of adding an element to the system, and the moving mechanical parts that make up the valve can generate harmful contaminations because of the friction between the mechanical parts.
  • a pumping device with thermal transpiration micropumps then makes it possible to avoid these disadvantages, provided that the pumping capacities of the device can be controlled.
  • a first problem is then to supply and control in a simple and efficient manner the elementary cells of thermal transpiration micropumps, in a manner that allows to control the pumping capacity without adding a control valve.
  • the multiplication of the number of elementary micropumps connected in the device requires particular control means, allowing the easy management of all the elementary micropumps.
  • the object of the invention is to achieve a particularly simple and effective control of a device composed of a large number of micropumps, in order to control the general pumping function of the elementary micropumps without the addition of a control valve.
  • a second problem is related to the realization of the hot source at one end of each channel connecting two successive cavities. It is understood that the compression ratio is directly related to the efficiency of this hot source, which determines the ratio of temperatures at both ends of the channel.
  • the hot source of a thermal transpiration micropump is made by integrating, in the upper glass plate, a parallelepipedal bar-shaped heating element of resistive material, constituting an electrical resistance that can be supplied by an external source of energy.
  • the bar-shaped heating element must achieve a significantly higher temperature in the central zone of the bar, because the temperature decreases when approaching the end of the bar which is adjacent to the entrance of the channel.
  • the temperature of the hot source at the boundary between the channel and the adjacent cavity of the micropump is insufficient, and the efficiency of the pump is decreased.
  • Another aspect of the invention is thus to increase the efficiency of the micropumps while reducing the risk of degradation due to excess temperature in the central zone of the hot springs of the micropump.
  • the invention aims to achieve optimal efficiency of the micropump while reducing energy consumption.
  • a third problem is that the necessary multiplication of the number of elementary micropumps leads to proportionally increase the total volume occupied by the pumping device.
  • the invention therefore aims at reducing the overall volume of the pumping device, for a given number of elemental micropumps with thermal transpiration.
  • the line control conductors are accessible for the electrical connection along a first edge of the substrate, and the column control conductors are accessible for the electrical connection along a second edge of the substrate.
  • control means which selectively drive the line control conductors and the column control conductors, so as to individually control each individual micropump of the micropumps network.
  • Various interface circuits may be used between the line drivers and the column drivers to separately power a micropump heater positioned at the intersection of the line and the column.
  • each heating element is of the electrical resistance type
  • the heating element can be connected to the terminals of a series power supply with a transistor itself controlled by an AND gate whose inputs are respectively connected to a corresponding line driver and a corresponding column driver.
  • the simultaneous supply of the line control conductor and the column control conductor ensures the release of the transistor to supply the heating element.
  • each heating element is controlled by a flip-flop itself arranged to switch to simultaneous reception of control pulse signals from a corresponding line control conductor and a column control conductor. corresponding.
  • all the elementary micropumps can be connected in series one behind the other.
  • one or more lines of micropumps are connected aeraulically in series to form a serial subset, and several serial subsets can be connected aeraulically in parallel.
  • a pumping device can use individual thermal transpiration micropumps in which the The heating element is arranged to prevent overheating of certain areas of the channel section to be heated by providing a substantially regular temperature distribution along the length of the channel section to be heated.
  • the micropumps have a heating element arranged to evenly distribute the heating along the length of the channel section to be heated, so as to achieve a substantially regular temperature distribution according to the length of the heating element. channel section to be heated.
  • the heating element is of the electrical resistance type and comprises at least two conductive areas of the electric current placed in two successive zones longitudinally spaced from each other in the channel section to be heated.
  • the electric resistance heating element is a resistive range comprising a central hole.
  • the heating element is of the heating wire-shaped electrical resistance type wound in a double flat spiral.
  • the heating element may advantageously be the heating zone of a Peltier effect element.
  • the invention proposes to increase the integration of the cavities.
  • a first idea is then to give the cavities a more easily integrable shape, and to place the cavities relative to each other in a way that reduces their total footprint.
  • the integration can first be horizontal, by several lines of micropumps side by side.
  • the integration may, as an alternative or in addition, be vertical, by several layers of elementary micropumps.
  • the invention proposes to provide, in the pumping device, at least some of the micropumps have a cavity whose section is decreasing from the inlet to the outlet, and providing that cavities of similar shapes are nested head spade to reduce their common dimensions in cross section.
  • the invention thus takes advantage of the progressive reduction of the average free path of the molecules when the temperature decreases from the inlet to the outlet of the cavity, and consequently reduces the cross section of the cavity, while ensuring that the cross section the cavity remains at all points along its length, large enough for the gaseous molecules to have a displacement regime in a viscous medium.
  • the cavities have a constant thickness and a width that decreases from their entry to their exit, and the cavities are nested side by side head to tail to reduce their overall bulk in the transverse direction.
  • the thickness of the cavities may be decreasing from their entry to their exit.
  • Multilayer integration can be achieved by providing that a substrate wafer is treated on both sides to make two layers of cavities.
  • the two cavity layers have decreasing thicknesses from their entry to their outlet, and that the cavities are nested head to tail in the thickness of the substrate.
  • the means for increasing the efficiency of micropumps by reducing the risk of thermal degradation is a second invention that can be used either in combination or independently of other means described in this patent application.
  • the means for decreasing the total volume of the pumping device constitutes a third invention which may be used either in combination or independently of the other means described in this patent application.
  • the figure 1 illustrates four elementary micropumps, denoted by the respective reference numerals 1, 1a, 1b and 1c, which each consist, like the micropump 1, of a cavity 2, a channel 3, and a heating element 4 disposed at contact of the channel 3 in the vicinity of its connection to the cavity 2.
  • the channel 3 constitutes the input channel of the elementary micropump 1, and is connected to the inlet 2a of the cavity 2.
  • the cavity 2 has an output 2b which is connected to an output channel 3a which itself constitutes the input channel of the second elementary micropump 1a.
  • the inlet channel 3 has a cross section small enough for the gaseous molecules flowing through it to move in a molecular regime.
  • the cavity 2 has a cross section large enough for the molecules it contains to move according to a regime of viscous medium.
  • the channel must have a section of the order of a few microns.
  • the cavity 2 may have a cross section of a few tens of microns.
  • Such shapes can be made in a semiconductor substrate by etching, and then closed by means of a glass plate applied to the etched substrate.
  • the heating element 4 can be made for example by a deposition of silicon nitrate with thermooxidation, carried out on the glass plate.
  • the figure 2 illustrates a larger micropump array, made in a common semiconductor substrate, by etching the satisfactory number of cavities and associated channels, with corresponding heating elements placed at appropriate locations, i.e. adjacent cavities entrances such as the cavity 2.
  • micropump 1 consisting of the cavity 2, the channel 3 and the heating element 4.
  • the micropumps network is arranged in a plurality of lines A, B, C, D each consisting of a series of several elementary micropumps such as the micropumps 1, 6, 7, 8 and 9 of the micropumps.
  • line A thus constituting columns a, b ... c and d.
  • Each line A, B, C ... D is associated with a respective line control conductor 10A, 10B, 10C ... 10D.
  • Each column a, b ... c, d is associated with a respective column driver 11a, 11b ... 11c, 11d.
  • Each heating element such as the heating element 4 of the micropump 1 situated at the intersection of the line A and the column a is controlled by the simultaneous loading of the corresponding line control conductor 10A and the corresponding column driver 11a. .
  • the line control conductors 10A, 10B, 10C, ... 10D are accessible for connection along a first edge of the substrate 5.
  • the column control conductors 11a, 11b ... 11c and 11d are accessible for a connection along a second edge of the substrate 5.
  • a control device can selectively supply the line control conductors 10A, 10B, 10C, ... 10D and the column control conductors 11a, 11b ... 11c and 11d, to drive at the same time.
  • the heating elements that are at the intersections of each line and each column. This makes it possible to individually control each elementary micropump, so as to give the micropump network the desired properties of compression ratio and flow rate or pumping speed.
  • Multiplexed control of the heating elements can be envisaged, for example, providing, associated with each heating element such as the heating element 4, a bistable flip-flop electronic circuit whose switching is controlled by the simultaneous pulse supply of the control line. line 10A and the column control line 11a.
  • the flip-flop then controls the power supply of the heating element 4 from an external source of electrical energy.
  • a simplified control mode is shown on the figure 3 .
  • the heating element 4 is connected in series, between the positive terminals 12 and negative 13 of a power supply, in series with a transistor 14 whose base 15 is connected to the output of an AND gate 16 whose two inputs are respectively connected to the line control conductor 10A and to the column control conductor 11a.
  • the transistor 14 turns on, to power the heating element 4, when both of the line control drivers 10A and 11a are at a suitable potential to produce the tilting of the AND gate 16 which unlocks the transistor 14.
  • the figure 4 illustrates the temperature distribution in a heat source of thermal transpiration micropump consists of a parallelepiped resistive bar 4.
  • the dotted curve illustrates the variation of the temperature, in ordinates, as a function of the longitudinal position considered along the channel, in abscissas.
  • the temperature varies according to the zone considered of the bar of resistive material along the channel 3 ( figure 1 ): the temperature is not uniform but has a sinusoidal distribution, with a slow increase in the vicinity of the upstream end 4a of the bar 4, then a rapid increase to a maximum M at the center 4c of the bar 4, followed by a rapid decrease itself followed by a more gradual decrease in the vicinity of the downstream end 4b of the bar 4.
  • This sinusoidal temperature distribution results in particular from a generally unequal distribution of the electric current which propagates in the bar 4 in a direction generally perpendicular to the longitudinal axis of the channel.
  • the electric current selects the shortest path to go from one terminal to the other, and this shortest path essentially passes through the center 4c of the bar 4, which maximizes the central temperature at the peak M.
  • this traditional parallelepipedal bar structure with a rectangular section produces a relatively reduced temperature in the vicinity of the downstream end 4b of the bar 4, which end is closest to the cavity 2 which follows.
  • the determining element for obtaining a maximum compression ratio of a thermal transpiration pump lies in the ratio of the temperatures at the downstream end of the channel 3, or inlet orifice in the cavity 2, and the temperature in the cavity 2. It is therefore understandable that the resistive bar with rectangular section of the heating element 4 illustrated on the figure 4 does not allow to obtain an optimum temperature ratio, or requires then to increase excessively the temperature of the top M at the center 4c of the bar 4.
  • the idea according to the invention is then to modify the temperature distribution along the heating element, so that the temperature in the vicinity of the downstream end 4b of the heating element is not much lower than the temperature in the central part. and in the other parts of the heating element. It is thus expected that the heating element can produce a higher temperature in the vicinity of the downstream end of the channel 3, without this necessitating increasing the temperature in the other parts of the heating element. The consumption of electrical power can thus be minimized, and the risk of degradation of the elements by excessive temperature in the center of the heating element is avoided.
  • a first embodiment is illustrated on the figure 5 wherein the heating element is formed by three successive heating elements 41, 42, 43, placed across the channel 3 and longitudinally offset along the channel.
  • the figure 5 shows the temperature distribution in the presence of the three heating elements 41, 42 and 43. There is a better regularity of the temperature depending on the longitudinal zone considered channel.
  • An alternative may consist in providing only two heating elements, realizing a shorter heating section in the channel 3.
  • the figure 6 illustrates another embodiment of the heating element 4, comprising a central cavity 4e devoid of resistive element, and thus promoting the passage of electric current in the vicinity of the upstream ends 4a and 4b downstream of the heating element 4. Thus reduces the temperature reached in the center of the heating element 4.
  • the figure 7 shows another embodiment of the heating element 4, consisting of a strip of resistive material wound in double flat spiral. This avoids favoring the passage of electric current in the center of the heating element 4, which reduces the effect of overheating in the center of the heating element 4.
  • the heating element 4 must produce heating over a sufficient length of the channel 3, in order to ensure satisfactory contact with the gas molecules that pass through the channel. It is indeed necessary that the heating element 4 can sufficiently heat the molecules so that they move and have the appropriate high temperature before entering the cavity 2 which follows. This is why the heating element 4 can not itself have a reduced length, concentrated in the immediate vicinity of the inlet port of the cavity 2, but it must instead extend upstream in the channel 3 in a sufficient length.
  • the heating element 4 has been described as an electrical resistance.
  • the heating element 4 is the hot part of a Peltier effect torque
  • the cooling element of the Peltier effect torque can be placed facing the cavity 2 of the micropump, or view of the upstream part of canal 3.
  • the figure 8 illustrates a first embodiment in which the cavities have a constant thickness but a width which decreases from their entry to their exit.
  • the figure thus shows four elementary micropumps 1, 1a, 1b and 1c, in which we find, as in the embodiment of the figure 1 , a cavity 2, an inlet channel 3, a heating element 4, and an outlet channel 3a, the cavity being connected to the respective channels by its inlet 2a and its outlet 2b.
  • the figure 9 illustrates the whole of the figure 8 , shown seen from the side in section along the plane II.
  • the two figures show the two cavities 2 and 2c side by side.
  • the cavities 2 and 2c are made by etching in a substrate 5, and the cavities are then closed by a glass plate 17 attached to the etched substrate 5.
  • the cavities 2 and 2c have a constant thickness.
  • the cavities such as the cavity 2 have a width which decreases from their entry 2a to their outlet 2b.
  • the progressive reduction of width can be regular, to form a generally triangular cavity 2 as shown in FIG. figure 8 .
  • the adoption of such a cavity shape 2 is made possible by the fact that the temperature of the gases decreases progressively from the inlet 2a of the cavity 2 to the outlet 2b of the same cavity 2, the mean free path of the molecules decreasing simultaneously with the temperature, so that the width of the cavity 2 remains, in all longitudinal positions considered, significantly greater than the average free path of the molecules, which ensures that the molecules move in the cavity 2 in a displacement regime in the middle viscous.
  • the figure 10 illustrates, in cross-section, an improvement of the previous embodiment.
  • the substrate 5 is etched on its two opposite faces to form, on a first face, the cavities 2 and 2c above, and to constitute, on the opposite face, two cavities 21 and 21c. Both faces are closed by respective glass plates 17 and 171. This doubles the number of elementary micropumps per unit area of the substrate 5.
  • This embodiment leads to an increase in the thickness of the device.
  • the embodiment of the figure 11 illustrated in longitudinal section, is to modify not the width of the cavity, but its depth to produce a cavity 2 of variable cross section.
  • FIG 12 there is illustrated an embodiment that combines both the idea of the depth variation according to the figure 11 with elementary micropumps 1 and 1a in series, the idea of the superposition of two layers according to the figure 10 with a substrate 5 etched on its two faces and engaged between two glass plates 17 and 171, and the idea of nesting cavities according to the figure 8 .
  • the cavities 2 and 21 are nested head to tail, which reduces the overall thickness of the assembly compared to the embodiment of the invention. figure 10 .
  • the density is increased, that is to say the number of elementary micropumps in a given surface of the substrate 5, and also in a given volume of substrate 5.
  • the number of micropumps may be increased by a factor close to 4, which leads to proportionally increase the pumping speed.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Micromachines (AREA)
  • Reciprocating Pumps (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
  • Thermotherapy And Cooling Therapy Devices (AREA)
  • Disinfection, Sterilisation Or Deodorisation Of Air (AREA)

Claims (17)

  1. - Pumpvorrichtung in Form von Mikropumpen mit thermischer Transpiration, wobei die Mikropumpen mit thermischer Transpiration (1) jeweils mindestens einen Hohlraum (2) mit einem Eingang (2a), welcher an einen Eingangskanal (3) mit kleinem Querschnitt angeschlossen ist, und einem Ausgang (2b), welcher an einen Ausgangskanal (3a) abgeschlossen ist, sowie ein Heizelement (4) zum Erhitzen des an den Hohlraum (2) angrenzenden Abschnitts des Eingangskanals (3) umfassen, wobei eine Vielzahl solcher Mikropumpen (1, 1a. 1b, 1c) lufttechnisch in Reihenschaltung verbunden sind, dadurch gekennzeichnet, dass:
    - die Mikropumpen (1, 1a, 1b,1c) auf einem Substrat (5) in einer Vielzahl von Reihen (A, B, C ... D), von denen eine jede aus einer Vielzahl von Mikropumpen (1, 6 ... 7, 8, 9) besteht und somit eine Vielzahl von Kolonnen (a, b, ... c, d) bilden, verteilt sind,
    - die entsprechenden Heizelemente (4) der Mikropumpen) jeweils von einer entsprechenden Steuerung einer Reihen-Steuerader (10A, 10B, 10C, 10D) und einer Kolonnen-Steuerader (11a, 11b ... 11c und 11d) gesteuert werden.
  2. - Pumpvorrichtung nach Anspruch 1, dadurch gekennzeichnet, dass die Reihen-Steueradern (10A, 10B, 10C, ... 10D) für den elektrischen Anschluss entsprechend einem ersten Rand des Substrats (5) zugänglich sind, und dass die Kolonnen-Steueradern (11a, 11b ... 11c und 11d) für den elektrischen Anschluss entsprechend einem zweiten Rand des Substrats (5) zugänglich sind.
  3. - Pumpvorrichtung nach einem der Ansprüche 1 oder 2, dadurch gekennzeichnet, dass die Steuermittel die Reihen-Steueradern (10A, 10B, 10C, ... 10D) und die Kolonnen-Steueradern (11a, 11b ... 11c und 11d) selektiv steuern, so dassjede einzelne Mikropumpe des Mikropumpennetzes individuell gesteuert wird.
  4. - Pumpvorrichtung nach einem beliebigen der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass jedes Heizelement (4) vom Typ eines elektrischen Widerstands ist, welcher an die Pole einer Stromversorgung (12, 13) in Reihenschaltung mit einem Transistor (14), der seinerseits von einem Port ET (16) gesteuert wird, dessen Eingänge jeweils an eine entsprechende Reihen-Steuerader (10A) und an eine entsprechende Kolonnen-Steuerader (11a) angeschlossen sind, angeschlossen ist.
  5. - Pumpvorrichtung nach einem beliebigen der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass jedes Heizelement (4) von einem bistabilen Kippglied gesteuert wird, welches seinerseits so angeordnet ist, dass es bei einem simultanen Empfang von von einer entsprechenden Reihen-Steuerader (10A) und von einer entsprechenden Kolonnen-Steuerader (11a) gesendeten Steuerungsimpulssignalen umschaltet.
  6. - Pumpvorrichtung nach einem beliebigen der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass eine oder mehrere Reihen von Mikropumpen lufttechnisch in Reihenschaltung verbunden sind, um einen in Reihe geschalteten Baustein zu bilden, wobei mehrere in Reihe geschaltete Bausteine lufttechnisch parallel verbunden sind.
  7. - Pumpvorrichtung nach einem beliebigen der Ansprüche 1 bis 6, dadurch gekennzeichnet, dass mindestens einige der Mikropumpen mit einem Heizelement (4) ausgestattet sind, welches so angeordnet ist, dass die Erhitzung auf gerechte Weise entsprechend der Länge des zu heizenden Kanalabschnitts (3) verteilt wird, so dass eine recht gleichmäßige Temperaturverteilung entsprechend der Länge des zu heizenden Kanalabschnitts (3) erzielt wird.
  8. - Pumpvorrichtung nach Anspruch 7, dadurch gekennzeichnet, dass das Heizelement (4) vom Typ eines elektrischen Widerstands ist und mindestens zwei stromleitende Zonen (41, 42, 43) umfasst, welche in zwei aufeinanderfolgende Zonen in Längsrichtung in Abstand voneinander in dem zu heizenden Kanalabschnitt (3) angeordnet sind.
  9. - Pumpvorrichtung nach Anspruch 7, dadurch gekennzeichnet, dass das Heizelement (4) vom Typ eines elektrischen Widerstands ein ohmscher Bereich mit einem mittleren Loch (4e) ist.
  10. - Pumpvorrichtung nach Anspruch 7, dadurch gekennzeichnet, dass das Heizelement (4) vom Typ eines elektrischen Widerstands in Form eines als flache Doppelspirale gewickelten Heizkabels ist.
  11. - Pumpvorrichtung nach Anspruch 7, dadurch gekennzeichnet, dass das Heizelement die Heizzone eines Peltier-Elements ist.
  12. - Pumpvorrichtung nach einem beliebigen der Ansprüche 1 bis 11, dadurch gekennzeichnet, dass mindestens einige der Mikropumpen einen Hohlraum (2) aufweisen, dessen Querschnitt sich vom Eingang (2a) bis zum Ausgang (2b) verkleinert, und dadurch, dass die gleichförmigen Hohlräume (2, 2c) zueinander kopfstehend verschachtelt sind, um deren gemeinsamen Raumbedarf im Querschnitt zu reduzieren.
  13. - Pumpvorrichtuhg nach Anspruch 12, dadurch gekennzeichnet, dass der Querschnitt des Hohlraums (2) an jeder Stelle entlang seiner Länge groß genug bleibt, so dass sich die gasförmigen Moleküle in einem viskosen Medium bewegen können.
  14. - Pumpverrichtung nach einem beliebigen der Ansprüche 12 oder 13, dadurch gekennzeichnet, das die Hohlräume (2) eine konstante Dicke haben und sich deren Breite vom Eingang (2a) bis hin zum Ausgang (2b) verringert, und dadurch, dass die Hohlräume (2, 2c) nebeneinander kopfstehend verschachtelt sind, um deren Gesamtraumbedarf in Querrichtung zu reduzieren.
  15. - Pumpvorrichtung nach einem beliebigen der Ansprüche 12 bis 14, dadurch gekennzeichnet, dass sich die Dicke der Hohlräume (2) vom Eingang (2a) bis hin zum Ausgang (2b) verringert.
  16. - Pumpvorrichtung nach einem beliebigen der Ansprüche 12 bis 15, dadurch gekennzeichnet, dass das Substrat (5) auf beiden Seiten vergütet ist, um zwei Hohlraumschichten (2, 2c; 21, 21c) herzustellen.
  17. - Pumpvorrichtung nach Anspruch 15 und Anspruch 16, dadurch gekennzeichnet, dass die Hohlräume (2, 21) in der Dicke des Substrats (5) verschachtelt sind.
EP04292591A 2003-11-04 2004-11-02 Pumpvorrichtung mit Mikropumpen, die einen thermischen Transpirationseffekt nutzen Not-in-force EP1531267B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0312894 2003-11-04
FR0312894A FR2861814B1 (fr) 2003-11-04 2003-11-04 Dispositif de pompage par micropompes a transpiration thermique

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EP1531267A2 EP1531267A2 (de) 2005-05-18
EP1531267A3 EP1531267A3 (de) 2006-05-17
EP1531267B1 true EP1531267B1 (de) 2008-12-03

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US (1) US7572110B2 (de)
EP (1) EP1531267B1 (de)
JP (1) JP2005163784A (de)
AT (1) ATE416311T1 (de)
DE (1) DE602004018089D1 (de)
FR (1) FR2861814B1 (de)

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TWI278426B (en) * 2004-12-30 2007-04-11 Prec Instr Dev Ct Nat Composite plate device for thermal transpiration micropump
WO2006121534A1 (en) * 2005-05-09 2006-11-16 University Of Oregon Thermally-powered nonmechanical fluid pumps using ratcheted channels
US7913928B2 (en) * 2005-11-04 2011-03-29 Alliant Techsystems Inc. Adaptive structures, systems incorporating same and related methods
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Also Published As

Publication number Publication date
EP1531267A3 (de) 2006-05-17
US7572110B2 (en) 2009-08-11
FR2861814B1 (fr) 2006-02-03
EP1531267A2 (de) 2005-05-18
ATE416311T1 (de) 2008-12-15
FR2861814A1 (fr) 2005-05-06
JP2005163784A (ja) 2005-06-23
DE602004018089D1 (de) 2009-01-15
US20050095143A1 (en) 2005-05-05

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