Classifications

• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
  • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
  • F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
  • F21V23/0442—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
  • F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
  • F21V23/0442—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
  • F21V23/0457—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors the sensor sensing the operating status of the lighting device, e.g. to detect failure of a light source or to provide feedback to the device
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
  • F21V29/50—Cooling arrangements
  • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
  • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
  • F21V29/745—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades the fins or blades being planar and inclined with respect to the joining surface from which the fins or blades extend
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
  • F21V29/50—Cooling arrangements
  • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
  • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
  • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
  • F21V29/50—Cooling arrangements
  • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
  • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
  • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
  • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
  • F21V29/50—Cooling arrangements
  • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
  • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
  • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
  • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
  • H05K1/0203—Cooling of mounted components
  • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
  • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
  • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
  • F21Y2115/00—Light-generating elements of semiconductor light sources
  • F21Y2115/10—Light-emitting diodes [LED]
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
  • H05K1/0203—Cooling of mounted components
  • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
  • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09209—Shape and layout details of conductors
  • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
  • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10007—Types of components
  • H05K2201/10106—Light emitting diode [LED]
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10007—Types of components
  • H05K2201/10151—Sensor

Definitions

• a lighting device comprises a plate 10 of LED 12 fixed on a support 14 and surmounted by a transparent cover 16, subsequently called optical, which processes the LEDs. 12 projected towards the area to be illuminated.
• the plate 10 is in the form of a plate 18 made of an electrically and thermally insulating material with an upper surface at which a layer 20 made of a conductive material, generally made of copper, forming an electrical circuit and with a surface is provided. lower directly in contact with the support 14 ensuring the heat dissipation.
• Each LED comprises a first terminal 22 and a second terminal 24 connected by welds 22 'and 24' respectively to the anode and to the cathode of the electrical circuit formed by the layer 20.
• the service life of the electrical components and in particular the LEDs is strongly related to the operating temperature.
• the invention aims to provide an LED lighting device whose design promotes the evacuation of the heat produced by the LEDs to significantly increase the life of said lighting device.
• the subject of the invention is a lighting device comprising firstly a plane plate on which a plurality of LEDs are arranged, said plate comprising a plate made of an electrically insulating material with at its upper surface a so-called upper layer of a material conductor, forming an electrical circuit with for each two-terminal LED, characterized in that the plate comprises at its lower surface a so-called lower layer of a thermally conductive material, and a plurality of holes between the terminals clogged by a weld in one thermally conductive material for connecting said layers of conductive material each forming a thermal bridge between the two layers, in contact with the lower surface of the LEDs and in that it comprises a temperature sensor disposed at the upper surface, control means for regulating LED supply means as a function of the temperature measured by the sensor.
• Providing a temperature sensor at the LED stage provides a more accurate measurement of the actual operating temperature of the LEDs.
• the thermal bridges between the lower and upper layers make it possible to obtain a more homogeneous temperature at the level of the plate and thus a more faithful measurement to reality.
• FIG. 1A is a section of a lighting device according to the prior art
• FIG. 1B is a top view of an LED on a support of a lighting device according to the prior art
• FIG. 2 is a section of a lighting device according to the invention
• FIG. 3A is a top view of a plate according to the invention before the implantation of an LED
• FIG. 3B is a bottom view of a plate according to the invention
• FIG. 4 is a perspective view of a first variant of a lighting device according to the invention.
• FIG. 5 is a section of the lighting device of FIG. 4
• FIG. 6 is a perspective view of an extruded element according to the variant of the invention illustrated in FIG. 4 used as heat sink,
• FIG. 7 is a view illustrating an assembly of several lighting devices according to the invention.
• FIG. 8 is a section of another variant of a lighting device according to the invention.
• FIG. 9A is a view from above of another variant of a lighting device according to the invention.
• FIG. 9B is a sectional view of the lighting device illustrated in FIG. 9A,
• FIG. 10 is a diagram illustrating a light source according to another variant of the invention.
• FIGS HA and HB are front views illustrating the two parts forming the male part of the lighting device of Figure 10,
• FIG. 12 is a side view illustrating the male part of the lighting device of FIG. 10,
• FIGS. 13A and 13B are front views illustrating the two parts forming the female part of the lighting device of FIG. 10;
• FIG. 14 is a side view illustrating the female part of the lighting device of FIG. figure 10,
• FIG. 15 is a front view illustrating the connection means of the lighting device of FIG. 10,
• FIG. 16 is a section schematically illustrating a variant of the device
• FIG. 17 is a diagram illustrating the variant of the temperature
• FIG. 18 is a curve illustrating a power coefficient as a function of a voltage corresponding to the measured temperature.
• FIG. 2 there is shown at 30 an LED lighting device.
• the lighting device 30 comprises a flat plate 32 on which a plurality of LEDs 34 are arranged.
• the plate 32 comprises LEDs reported along lines, for example thirty LEDs, six lines of five LEDs.
• the invention is not limited to this arrangement of LEDs.
• the plate 32 comprises a plate 36 of electrically insulating material with at its upper surface a layer 38 of a conductive material, generally copper, forming an electrical circuit and at its lower surface a layer 40 at least one thermally conductive material, preferably copper.
• Each LED 34 comprises in the lower part a substantially square plate 42 with at two opposite edges of the substantially rectangular terminals 44 extending over the entire edge.
• the upper layer 38 comprises for each LED two rectangular terminals 46 capable of cooperating with the terminals 44 of the LED.
• the plate 32 comprises between the terminals 46, below the LED, a plurality of through holes 48 capable of connecting the two layers 38 and 40 of conductive material.
• these holes 48 have a reduced diameter less than or equal to 0.5 mm.
• these holes 48 are arranged along two lines parallel to the greatest length of the terminals 46.
• the plate comprises holes 48 at each end of the terminals 46.
• the holes 48 are arranged in forms of C (or inverted C).
• the terminals 44 of the LEDs are soldered to the terminals 46 of the plate 32, the holes 48 are clogged with the solder in an electrically and thermally conductive material.
• each welded hole 48 forms a thermal bridge between the two layers 38, 40 which conduct the plate in contact with the lower surface of the LEDs and close to said surface.
• the holes 48 should be small enough in diameter to be clogged when soldering the LEDs. However, they must have a diameter sufficient to be clogged by the weld.
• the plate 32 comprises, in the vicinity of the LEDs, orifices 50 passing through with metallized lateral walls to ensure thermal transfer between the two conductive layers 38 and 40 of the plate 32.
• the orifices 50 are arranged in at least one line provided at each end of the terminals 46, as shown in Figure 3A.
• the orifices have a diameter greater than 0.5 mm to ensure heat transfer between the area above the plate 32 and the area below.
• the lower layer 40 which covers almost the entire surface of the plate may comprise for each LED at least one heat barrier 52 between the holes 48 and the orifices 50 to limit the propagation of heat during the welding LEDs.
• the lower layer 40 may comprise a thermal barrier 52 or several thermal barriers placed end to end surrounding the LED.
• the lower layer 40 comprises cutouts and areas without conductive material forming thermal barriers. This configuration makes it possible to limit the risks of closing the orifices 50 during the welding of the LEDs so as not to alter their functions.
• the lighting device 30 comprises, for the treatment of the light beams emitted by the LEDs, a substantially transparent cover 54 called optical which covers the LEDs.
• This optic 54 comprises a front wall disposed between the LEDs 34 and the area to be illuminated with an outer surface oriented towards the area to be illuminated and an inner surface facing the LEDs 34 and a peripheral wall providing the connection between the optic 54 and the plate 32 so as to confine the LEDs in a substantially sealed enclosure.
• the peripheral wall comprises a flange capable of providing a bearing surface capable of being pressed against the plate 32 and at the level of which may be formed a peripheral groove adapted to receive a peripheral seal to ensure a better seal.
• the optic 54 and the plate 32 form a cavity 55 which is preferably filled with a heat-transfer liquid promoting heat exchange between the LEDs 34 and the upper face of the plate 32.
• the cavity is filled with silicone oil. This solution promotes heat exchange between the LEDs and the upper face of the plate 32, preserves the welds and improves the optical properties.
• the lighting device may comprise a reservoir for the coolant connected to the cavity 55 by a valve to compensate for variations in the volume of the coolant in said cavity 55.
• the cavity 55 may comprise a filling tip.
• the lighting device 30 comprises a volume of balls 56 made of ceramic, preferably glass, in direct contact or via at least one conductive plate with the Lower layer of the plate 32.
• the balls 56 have a diameter of the order of 5 mm. In all cases, these beads have a diameter greater than 1 mm and preferably greater than or equal to 3 mm.
• the ceramic beads 56 absorb some of the calories evacuated by the plate 32 and promote heat exchange between said platen and the external environment.
• the device lighting comprises a support 58 pressed against the lower surface of the plate 32 to ensure heat dissipation.
• the presence of the lower layer 40 of a heat-conducting material which extends over almost the entire surface of the plate 32 ensures optimized heat transfer between the plate 32 and the support 58 ensuring the heat dissipation.
• a thin copper corrugated sheet may be interposed between the plate 32 and the dissipator 58 and more particularly between a sole secured to the lower layer 40 of the plate and the dissipator 58.
• This arrangement makes it possible to compensate for any surface defects of the two elements put in contact and favors heat exchanges.
• the support 58 is in the form of a plate as illustrated in FIGS. 9A, 9B and 10.
• the support 58 comprises an extruded element 60.
• the extruded element 60 has parallel sections to the constant plate 32 comprising a hollow body 62 and elongated with a frame-shaped section defining a recess 64 and with a plurality of fins 66 on the outside.
• the body 62 comprises an upper bearing surface 68.
• the support 58 also comprises a first plate 70 made of a thermal transfer promoting material placed under the plate 32, the dimensions of which are such that said first plate 70 comes into contact with the upper bearing surface 68 and a second plate 72 made of a material promoting heat transfer plated under the first plate 70 whose dimensions are such that said second plate 72 is housed in the recess 64.
• the plates 70 and 72 each have a thickness of about 3 mm to obtain a thermal inertia satisfactory for limiting the thermal concentration at the central portion of the plate 32.
• the plates 70 and 72 promote the thermal transfer of the LED support plate 32 towards the extruded element 60.
• the plate 32 comprises at least one printed circuit for supplying the LEDs and the thermal bridges under each LED 34 to heat transfer the LEDs 34 to the plates 70 and 72.
• the extruded element 60 comprises means for securing the optic and the first plate 70.
• the optic 54 comprises at its rim a plurality of through holes which coincide with passage holes provided at the level of the first plate 70, screws being screwed into housings 74 formed at the level of the extruded element 60 thus ensuring the maintenance of the optics 54 and the first plate 70.
• the extruded member 60 includes fins 66 at the four sides of the hollow, elongated body 62.
• the extruded member 60 comprises two types of fins 66. Some fins 66.1 have only one heat dissipation function while other fins 66.2 have an additional function ensuring the assembly of several lighting devices 30 as illustrated in FIG. 7.
• the fins 66.1 have a section which gradually tapers towards their end and are corrugated in order to increase the surface of the fins and therefore the heat exchange surface.
• the fins 66.2 have a profile substantially identical to the fins 66.1 with at the end an extra thickness 76 reducing the spacing with the adjacent fin.
• the fins 66 are distributed in the following manner on each side of the extruded element 60 in the clockwise direction.
• the first fin is a fin-type fin 66.2 with an extra thickness 76 oriented towards the second fin, also of the fin type 66.2, with an excess thickness 76 oriented towards the first fin.
• the last fin is also a wing fin type 66.2 with a thickening 76 oriented in the same way as the first fin.
• all the other fins are blades of the fin type 66.1.
• the third fin is of the fin type 66.2 with an excess thickness 76 oriented in the same way as the first fin, the other fins being blades of the fin type 66.1.
• the first fin on each side comprises three star-shaped secondary fins 78 whose lengths are adapted to favor the assembly of the lighting devices.
• the last fin of the first lighting device is disposed between the two first fins of the second lighting device, the last fin of the second lighting device being disposed between the first two fins of the first lighting device.
• the lighting device comprises a power supply secured to the free face of the second plate 72 and housed in the recess 64. This power supply is used to power the LEDs.
• the duct formed by the extruded element 60 is closed at a first end by the plate 32 of the LEDs or one of the plates 70 and at the other end by of the resin 80, the recess 64 being filled with balls 56 which increase the thermal inertia and promote the heat transfer of the support of the LEDs towards the extruded element 60.
• a plate with a peripheral seal can be pressed against the bearing surface 82 of the extruded member.
• the amount of balls 56 is sufficient to flood the components of the power supply and that the resin 80 does not touch the components.
• the extruded element 60 has sections perpendicular to the constant plate 32 comprising an elongated hollow body 86 with a tube-shaped section delimiting a recess 88 and with a plurality of outside elements. of fins 90.
• the plate 32 is secured and pressed to a plane surface provided between the fins 90.
• a plate 92 is inserted into the recess 88 and supports the power supply of the LEDs.
• the recess 88 is filled with ceramic balls 56 and the tube 86 is closed at each end by plates.
• This embodiment provides an elongated lighting device.
• the support 58 is in the form of a plate with, at a first surface, a plate 32 of LED covered with an optic 54, a volume containing ball 56 being provided at the opposite surface.
• the support 58 also comprises a recess adjacent to the optic 54 at which the power supply of the LED trapped in a chamber filled with 56 beads secured to the support 58. This configuration provides a thin lighting device.
• a support 58 in two dismountable parts, the first part supporting a plate 32 and an optic 54 and the second part comprising means for dissipating heat comprising a volume of glass balls 56, the two parts being connected together. using a connection system.
• the second part also comprises a frame or casing 94 supporting means 96 for dissipating heat as well as means 98 for supplying the LEDs.
• the housing 94 comprises means for securing it to a support.
• the housing 94 comprises a housing 100 in which are placed the means 98 for feeding the LEDs embedded in glass balls.
• the means 96 for dissipating the heat are in the form of fins arranged around the housing 94.
• connection system 102 of removable type having an electrical connection and a thermal connection.
• the electrical connection comprises a first portion 104 connected to the support of
• the first portion 104 corresponds to the plug of a connection capable of fitting into the second portion 106 which corresponds to the socket.
• the invention is not limited to this arrangement, the plug being connectable to the housing and the socket to the LED support.
• the housing 94 comprises a surface 108 facing a surface 110 of the LED support.
• the housing 94 comprises a plate 112 connected to said housing 94, one of the surfaces of which corresponds to the surface 108.
• this plate 112 is made of a thermally conductive material, for example metal.
• the means 96 for dissipating heat are connected to this plate 112.
• the rest of the housing 94 is preferably made of a thermally insulating material.
• the LED support comprises a plate 114 fixed at the rear face of the printed circuit supporting the LEDs. Means are provided for transferring the heat emitted by the LEDs to this plate 114.
• the thermal connection comprises a first so-called male portion 116 connected to the LED support illustrated in Figures HA, HB, 12 and 15 and a said second female portion 118 connected to the housing 94 illustrated in Figures 13A, 13B, 14 and 15, the parts 116 and 118 being made of a thermal conductive material.
• the male part 116 comprises at least one surface capable of being in contact with at least one surface of the female part 118 to ensure the heat transfer and in addition to the locking / unlocking means to maintain pressing the two surfaces against each other. 'other.
• the male part 116 comprises two stacked plates, a disc 120 (Figure HA) interposed between the plate 114 and another disc 122 ( Figure HB ) having at the periphery at least one notch 124 projecting.
• the disc 122 comprises three protruding notches 124 disposed at 120 °, as illustrated in FIG.
• the plate 114, the disk 120 and the disk 122 are interconnected by any appropriate means, for example by three screws, to ensure the heat transfer between the LED support, the plate 114, the disks 120, 122.
• the disc 122 has a diameter d1 equal to or slightly greater than the diameter of the disc 120 between the notches 124 and a diameter Dl greater than d1 at the notches 124.
• the female part 118 comprises two plates, a ring 126 (FIG. 13B) interposed between the plate 112 and another ring 128 (FIG. 13A) comprising at least one recessed notch 130.
• the ring 128 comprises three notched recesses 130 to 120 °, as shown in Figure 13 A.
• the provision of recessed and protruding notches 124 and 130 is not limited to that described.
• the thermal connection can be made with one or more notches arranged with different angles. These notches can be arranged according to the geometry selected according to the needs according to the applications.
• the ring 126 has an inside diameter D2 slightly greater than D1.
• the ring 128 has a diameter equal to or slightly less than D2 at the recessed notches 130 and a diameter d2 greater than d1 and less than D1 between the recessed notches 130.
• the recessed notches 130 have shapes adapted to allow the protruding notches 124.
• the disk 122 corresponds to the recess of the ring 128.
• the disk 122 and the ring 128 are simultaneously obtained.
• This configuration makes it possible to optimize the material and makes it possible to be sure that the disk 122 will pass through the ring 128.
• the plate 112, the rings 126 and 128 are connected by any appropriate means, for example by three screws, to ensure the heat transfer between the housing 94, the plate 112 and the rings 126, 128.
• the rings 126, 128 and the disks 120 and 122 have substantially the same thicknesses.
• the disk 122 is inserted into the recess of the ring 128 by arranging the projecting notches 124 to the recessed notches 130.
• disc 122 is in the plane of the ring 126, a slight rotation is made along an axis 132, as illustrated in Figure 15.
• the projecting notches 124 of the disc 122 is immobilized by the portions of the ring 128 provided between the recessed notches 130 to obtain a locking of the thermal connection.
• the free surface A of the disc 122 is in contact with the free surface A ' of the plate 112 and the free surface B of the ring 128 is in contact with the free surface B 'of the plate 94 to ensure efficient heat transfer between the LED holder and the means 96 for dissipating heat.
• the expansion phenomena reinforce the contact between said surfaces which reinforces the heat transfer.
• the plug 104 of the electrical connection comprises a cylinder whose axis coincides with the axis of rotation 132 of the thermal connection.
• the socket 106 of the electrical connection comprises a bore whose axis coincides with the axis of rotation 132 which receives the plug 104.
• the cylinder and the bore comprise two zones which cooperate to ensure electrical continuity.
• the first part of the electrical connection comprises at least one stud 136 (shown in dashed lines in FIG. 10), the end of which is flush with the surface A, arranged on a circle of radius R and center 132. Generally, one can provide several pads 136.
• the second portion of the electrical connection comprises at least one pad 138 (shown dotted in Figure 10) whose end is flush with the surface A ', disposed on a circle of radius R and center of the axis of rotation 132, the pads 138 and 136 being arranged to face each other and provide electrical continuity when the connection device is in the locked state.
• the invention reduces maintenance costs, because when the quality of lighting is affected by the number of LEDs no longer working, it is sufficient to change only the LED support, the LEDs and the male parts of the thermal connections. and the electric. Unlike the systems of the prior art, the supply means and the means for dissipating heat are retained which reduces maintenance costs.
• the thermal and electrical connections do not affect the operation of the light source because they ensure on the one hand the electrical continuity, and on the other hand, an effective heat transfer between the LEDs and the means for dissipating heat.
• the device comprises a temperature sensor 140 disposed on the face of the plate 32 at which the LEDs 34 are located.
• the device comprises control means 142 for regulating supply means 144 as a function of the temperature measured by the sensor 140.
• control means 142 may be in the form of a microprocessor.
• the power supply means 144 comprise a set of electronic components for converting an input electrical signal into an output electrical signal adapted to the LEDs 34.
• the control means 142 can regulate the supply means as a function of at least one signal received by a receiver 146; for example of the infrared type and / or a signal carried by the LED supply current upstream or downstream of the power supply means 144.
• the operating temperature of the LEDs must be at least order of 75 ° C.
• the presence of the thermal bridges 48, 50 makes it possible to homogenize the temperature of the plate 32, which combined with the measurement of the temperature of the LEDs at the implantation surface of the LEDs contributes to obtaining a better efficiency of the LEDs.
• the light power emitted by an LED is a function of the electrical power supplied to this LED asec optimal performance at an optimum operating temperature. Beyond this optimum operating temperature, the amount of heat to be dissipated increases significantly so that if the system can not evacuate it; this generates an increase in the operating temperature of the LEDs and therefore a degradation of their yields.
• thermo bridges 48, 50 make it possible to obtain a more homogeneous temperature at the level of the plate and thus a more faithful measurement to reality.
• the regulation by the temperature is carried out by threshold, as illustrated in FIG. 18. According to one operating mode, the reduction of the electrical power is carried out according to four thresholds S1, S2, S3 and S4.
• the power increase may be performed according to four threshold Sl 1, S2 ', S3 and S4 1 1.
• the electrical power transmitted to the LEDs is reduced with a reducing power factor of 0.9 (ie 90%).
• this reduction in electrical power causes a reduction in the amount of heat to be dissipated and therefore in the temperature measured by the sensor. If there is no reduction in temperature or if this reduction is momentary and at the end of a period of time the temperature increases and exceeds a threshold S2, the electrical power transmitted to the LEDs is again reduced with a reduction coefficient of 0.8 (ie 80%).
• the electrical power transmitted to the LEDs is reduced again with a reduction coefficient of 0.6 (ie 60%). If there is no temperature reduction or if this temperature reduction is momentary and at the end of a period of time the temperature increases and exceeds a threshold S4, the electrical power transmitted to the LEDs is reduced again with a reduction coefficient of 0.4 (or 40%).
• the transmitted electric power can be increased and a reduction coefficient of 0.6 is applied to it (ie 60%).
• the transmitted electric power can be increased and a reduction coefficient of 0.8 (80%) applied to it.
• the transmitted electric power falls below the threshold S3 'then it is possible to increase the transmitted electric power and apply a reduction coefficient of 0.9 (ie 90%).
• the threshold Sl, S2, S3 and S4 may be respectively equal to the threshold SA ', 1 S3, S2 and Sl 1 1.
• the thresholds are expressed in volts (inversely proportional to the thresholds in degrees)
• the thresholds S1, S2, S3 and S4 are respectively greater than the thresholds S4 ', S3', S2 'and S1'.
• the reduction or increase of the electric power is generated with a ramp of one second between the current power and the power to be achieved.

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• Engineering & Computer Science (AREA)
• General Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• Optics & Photonics (AREA)
• Thermal Sciences (AREA)
• Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
• Non-Portable Lighting Devices Or Systems Thereof (AREA)

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• 2009
  • 2009-04-27 FR FR0952735A patent/FR2944853B1/fr not_active Expired - Fee Related
  • 2009-11-24 FR FR0958320A patent/FR2944855A1/fr active Pending
• 2010
  • 2010-04-27 WO PCT/FR2010/050793 patent/WO2010125294A1/fr active Application Filing
  • 2010-04-27 EP EP10727041A patent/EP2425180A1/de not_active Withdrawn

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