EP1508064A1 - Procede de fabrication collective de composants de filtrage optique - Google Patents
Procede de fabrication collective de composants de filtrage optiqueInfo
- Publication number
- EP1508064A1 EP1508064A1 EP03752834A EP03752834A EP1508064A1 EP 1508064 A1 EP1508064 A1 EP 1508064A1 EP 03752834 A EP03752834 A EP 03752834A EP 03752834 A EP03752834 A EP 03752834A EP 1508064 A1 EP1508064 A1 EP 1508064A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- cover
- component
- components
- optical
- plate according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/28—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
- G02B6/293—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
- G02B6/29346—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means operating by wave or beam interference
- G02B6/29358—Multiple beam interferometer external to a light guide, e.g. Fabry-Pérot, etalon, VIPA plate, OTDL plate, continuous interferometer, parallel plate resonator
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/28—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
- G02B6/293—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
- G02B6/29379—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means characterised by the function or use of the complete device
- G02B6/29395—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means characterised by the function or use of the complete device configurable, e.g. tunable or reconfigurable
Definitions
- the invention relates to optical filters that are selective in wavelength and tunable, allowing light to pass through a narrow optical spectral band, centered around an adjustable wavelength, and stopping the wavelengths. located outside this band.
- the central wavelength of the narrow spectral band is adjusted by electrical means.
- the word light is understood in the broad sense and includes in particular spectral bands in the infrared as will be seen below, a main application of the invention being the filtering of light in the various telecommunications bands by optical fibers between 1 , 3 and 1, 61 micrometers.
- a cable of several optical fibers can be used to make several different transmission channels; it is also possible to carry out a temporal multiplexing of the information in order to achieve the same goal; but the current trend, for a greater increase in the information flow capacity of the network, is to transmit simultaneously on the same optical fiber several light wavelengths modulated independently of each other and each defining an information channel .
- the ITU (International Telecommunications Union) 692 standard proposes to define adjacent channels of 100 GHz optical spectral bandwidth, centered on N adjacent normalized optical frequencies whose values are 200 terahertz, 199.9 terahertz, 199.8 terahertz, etc.
- a transmission node of the network assigned to the transmission and reception of information of channel i, it is necessary to be able to collect the light at a central frequency Fi (wavelength ⁇ j) without interfering with the transmission of the light modulating the central frequencies F * ⁇ to F N , while these optical frequencies are very close to one another.
- optical filtering components that are very selective in terms of light wavelength, capable of letting through the central optical frequency Fj and the frequencies located in a narrow band less than 50 GHz on either side of this frequency, and stop the other bands.
- Fj central optical frequency
- Fj central optical frequency
- An interferometer in practice comprises two mirrors with superimposed dielectric layers (Bragg mirrors), with a high reflection coefficient, separated by a transparent plate of optical thickness k. ⁇ j / 2 (real thickness k. ⁇ 2 if the plate is a plate air) where k is an integer defining the order of the interferometric filter.
- Indium phosphide (InP) is well suited to these embodiments due in particular to its transparency for the wavelengths considered, its very high refractive index, and the possibility of depositing epitaxial layers of well controlled thickness. .
- Perot filter for optical communications "in Electronics Letters, N ° 34 (5), pages 453-454, 1998.
- Other realizations have been proposed, in micromachined silicon, and in alloys based on gallium arsenide.
- filters are generally produced in wafers. More specifically, the filters are produced collectively on a transparent substrate such as, for example, indium phosphide. The concept of transparency is, of course, applied to the wavelengths of the band considered. Several hundred filters can be produced on the same substrate wafer.
- the filters formed by two Bragg mirrors separating an air space are extremely fragile. Their thickness does not exceed a few micrometers. Their handling is, therefore, very delicate.
- the object of the invention is to overcome this problem by proposing a method for the collective manufacture of optical filtering components, a method allowing easier handling.
- the subject of the invention is a process for the collective manufacture of an optical filtering component, consisting in producing a plurality of optical filtering components on a transparent substrate, characterized in that it also consists in covering the plurality of component by a transparent collective cover, optically testing each component individually and separating the different components from each other.
- the subject of the invention is also a plate of components comprising a transparent substrate on which a plurality of optical filtering components is produced, a transparent cover collectively covering the components, means for individual testing of each component.
- optical focusing or collimation means making it possible to optically connect optical fibers directly to the filter. It is thus possible to carry out an optical test of each filter before separating the components produced on the same wafer. It is thus possible to keep only the components which have successfully undergone the test and to eliminate the others.
- the separation of the components can be done by cutting, for example by sawing. This operation produces many particles that can damage the components.
- the presence of the cover before separation of the components makes it possible to protect the active part of the component, formed by the Bragg mirrors.
- FIG. 1 shows, in top view, the component shown in Figure 1;
- FIG. 3 shows in section the component according to a second embodiment
- FIG. 4 shows in section the component according to a third embodiment.
- Figures 1 and 2 show an optical filter component 1 made in a wafer. It is produced on a substrate 2 of which only the part carrying the component 1 is shown. In practice, a large number of components, for example identical components, are placed on the same substrate, placed side by side on the substrate 2.
- An active part of component 1 comprises two Bragg mirrors 3 and 4 separated by a blade of air 5.
- the mirrors 3 and 4 are connected to a solid part 6 secured to the substrate 2 by arms 7 which are, for example, 4 in number, as shown in FIG. 2.
- the arms 7 ensure a certain flexibility of the mirrors 3 and 4 in order to adjust the thickness of the air gap 5 and, consequently, the central wavelength filtered by the component 1.
- the active part of the component 1 is surmounted by a transparent cover 8.
- Shims 9 keep the cover 8 of the mirror at a distance.
- the fixing of the cover 8 to the solid part 6 is ensured by a bead 10 of resin surrounding the active part of the component 1.
- the bead 10 of resin can be replaced by a bead 10 of soft metal, such as for example indium, which is crushed, or by a bead 10 made of a soft solder alloy melted by moderate heating of the component 1 as a whole.
- the path of light radiation passing through the filter is symbolized by the arrow 11. This path is perpendicular to the plane of the mirrors 3 and 4.
- optical processing means 12 allowing for example the focusing or collimation of a radiation entering the filter through the outer face 13 of the cover 8.
- the agreement of the component 1 is obtained by varying the thickness of the air space 5 separating the two mirrors 3 and 4.
- the mirrors 3 and 4 can be produced by semiconductor layers.
- the air gap 5, defining the resonant Fabry-Perot cavity, is delimited by two facing semiconductor layers, the spacing of which is very precisely defined during manufacture; by making an electrical contact on each of them (the layers being assumed to be sufficiently conductive or coated with a conductive material), a continuous voltage can be applied creating between the layers facing each other electrostatic forces tending to modify this spacing in a controlled manner.
- the adjustment of the voltage makes it possible to modify these electrostatic forces and, consequently, to adjust the tuning of the component 1.
- the arms 7 provide sufficient stiffness to oppose the electrostatic forces and maintain the two layers in a stable position. Electrical contacts 14 and 15 make it possible to provide the electrical connection between the mirrors 3 and 4 and an external voltage source, not shown.
- component 1 During the manufacturing process of component 1, several components 1 are first produced on the substrate 2. All of the components 1 are then covered by the transparent collective cover 8. An optical test of each component is then carried out before separate them.
- a test of its tuning means More specifically, it is possible to apply an electrical voltage between the two studs 14 and 15 and to vary this voltage within a useful range in order to verify whether the component is tuned under acceptable conditions.
- the component 1 can be precut by eliminating a part 16 of the cover 8, part 16 external to the dotted lines 17.
- the studs 14 and 15 become accessible by the outside and the tension can be applied by example by means of needles, the points of which rest on the studs 14 and 15.
- FIG. 3 represents a second embodiment in which we find all of the elements previously described.
- the cover 8 is not cut, but the substrate 2 to apply the studs 14 and 15 to the voltage necessary to achieve the agreement of the component 1.
- the pads 14 and 15 are respectively connected to pads 18 and 19, for example produced by photogravure means on the internal face 20 of the cover 8.
- the pad 14 is electrically connected to the pad 18 by means of a column 21 made of conductive material. It is the same for the pad 15 which is connected to the pad 18 by means of a column 22.
- FIG. 3 also shows anti-reflection treatments 23, 24 and 30 which are advantageously carried out on the path of the radiation passing through the component 1.
- the anti-reflection treatment 23 is applied to the optical treatment means 12
- the anti-reflection treatment 24 is applied to the internal face of the cover 8
- the treatment 30 is applied to a face 31 of the substrate 2.
- the face 31 is opposite to that carrying the mirrors 3 and 4.
- FIG. 4 represents a third embodiment in which the elements described in the first embodiment are again found. This time, to apply the tension to the studs 14 and 15, no cutting is necessary.
- vias 25 and 26 are produced in the cover 8 making it possible to apply the voltage necessary for the tuning of the component 1 by the external face 13 of the cover 8.
- the vias 25 and 26 can be produced by piercing the cover 8 in line with ranges 18 and 19.
- the holes thus produced are then filled with a conductive material such as for example an epoxy conductive resin or a metal alloy compatible with the material of the cover 8.
- the optical filtering component 1 is tuned so that the central wavelength it lets through is centered on one of the wavelengths defined in standard ITU 692.
- the rejection of neighboring channels by the component 1 filter alone may be insufficient.
- the cover 8 can itself participate in the optical processing means to improve this rejection. More specifically, the DWDM frequency multiplexing technique imposes bit rates of 40 Gbits per second in channels distant from 100 GHz. It is therefore necessary to obtain a good rejection beyond 50 GHz on either side of the central wavelength of a channel in order to avoid mixing of the signals.
- the form of the response of a filter operating on the principle of Fabry-Pérot interferometers, known as the Fabry-Pérot filter, is a function of Airy, that is to say that the ratio between the width at mid height and width at 1% of the maximum transmission is independent of the width. We are therefore led either to make a filter that is too narrow if we favor rejection, or to insufficient rejection if we favor bandwidth.
- the transmission of an interference filter such as the Fabry-Pérot filter can be improved by coupling other resonant cavities to the filter.
- the transmission curve is no longer a function of Airy and then approaches the perfect passband, that is to say a passband with high transmission around the central wavelength associated with a strong extinction in outside the area of interest.
- ne c / 2 ⁇ v
- c the speed of light
- ⁇ v the difference between two neighboring frequencies in the ITU 692 standard.
- This thickness in the air would be of the order of 1.5 mm and can be achieved by means of a sapphire cover with a thickness of 862 ⁇ m or made of indium phosphide InP 475 ⁇ m thick. Other materials are, of course, possible.
- the shims 9 can be produced by means of balls or calibrated fibers. It is possible, for example, to use glass beads of extremely precise size which are also used in the production of liquid crystal screens.
- the shims 9 can also be produced by means of a layer of material etched in the cover 8 or in the substrate 2. It is possible, for example, to produce this layer by means of an epitaxial layer of In Ga As produced on a substrate 2 or a cover 8 in InP. This additional layer will be selectively etched to make the shims 9 at appropriate locations. This additional layer can also be produced, for example, in Si 0 2 in aluminum or in gold, which also allows it to fulfill the function provided by the studs 14 and 15.
- the component plate includes means for adjusting the optical thickness of the cover 8.
- the optical thickness ne of cover 8 should be controlled with an accuracy of the order of a hundredth of a micron, which seems unrealistic. It is possible to make an adjustment of the optical thickness of the cover 8 with means for adjusting its temperature T. More precisely, most of the materials see their dimensions, in particular their thickness e, change as a function of the temperature T. more, transparent materials also see their optical index n evolve as a function of temperature T. For example, for sapphire we have: dn
- This digital example shows that it is possible to tune the optical cavity produced by means of the cover 8 to the expected frequency by stabilizing the temperature of the cover 8 with an accuracy of a few tenths of degrees.
- This precision is easily achieved for example with a Peltier effect module associated with a temperature sensor making it possible to control the operation of the module.
- the Peltier effect module can be replaced by a heating resistor which can be deposited on the cover itself, if the desired temperature is always higher than the ambient temperature.
- the resin bead 10 surrounds the columns 21 and 22 as well as the active part of the component 1. It is thus possible to protect the columns 21 and 22 as well as the active part of the component 1 against screws of external aggressions by enclosing them in a tight envelope which can be filled with a neutral gas such as nitrogen for example.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Optical Filters (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0206113A FR2839812B1 (fr) | 2002-05-17 | 2002-05-17 | Procede de fabrication collective de composants de filtrage optique et plaquette de composants |
FR0206113 | 2002-05-17 | ||
PCT/FR2003/001503 WO2003098299A1 (fr) | 2002-05-17 | 2003-05-16 | Procede de fabrication collective de composants de filtrage optique |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1508064A1 true EP1508064A1 (fr) | 2005-02-23 |
Family
ID=29286586
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP03752834A Withdrawn EP1508064A1 (fr) | 2002-05-17 | 2003-05-16 | Procede de fabrication collective de composants de filtrage optique |
Country Status (7)
Country | Link |
---|---|
US (1) | US7626239B2 (fr) |
EP (1) | EP1508064A1 (fr) |
JP (1) | JP4582776B2 (fr) |
CN (1) | CN1303445C (fr) |
AU (1) | AU2003255582A1 (fr) |
FR (1) | FR2839812B1 (fr) |
WO (1) | WO2003098299A1 (fr) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7365530B2 (en) | 2004-04-08 | 2008-04-29 | Allegro Microsystems, Inc. | Method and apparatus for vibration detection |
US8124434B2 (en) | 2004-09-27 | 2012-02-28 | Qualcomm Mems Technologies, Inc. | Method and system for packaging a display |
US7668415B2 (en) | 2004-09-27 | 2010-02-23 | Qualcomm Mems Technologies, Inc. | Method and device for providing electronic circuitry on a backplate |
US7424198B2 (en) | 2004-09-27 | 2008-09-09 | Idc, Llc | Method and device for packaging a substrate |
US7573547B2 (en) * | 2004-09-27 | 2009-08-11 | Idc, Llc | System and method for protecting micro-structure of display array using spacers in gap within display device |
US8379392B2 (en) | 2009-10-23 | 2013-02-19 | Qualcomm Mems Technologies, Inc. | Light-based sealing and device packaging |
JP5720200B2 (ja) | 2010-11-25 | 2015-05-20 | セイコーエプソン株式会社 | 光モジュール、および光測定装置 |
JP2015068885A (ja) * | 2013-09-27 | 2015-04-13 | セイコーエプソン株式会社 | 干渉フィルター、光学フィルターデバイス、光学モジュール、及び電子機器 |
CN109814281B (zh) | 2017-11-20 | 2023-10-27 | 菲尼萨公司 | 可调光滤波器及其制造方法以及可调光滤波器组件 |
Family Cites Families (22)
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FR2581251B1 (fr) | 1985-04-30 | 1987-09-11 | Thomson Csf | Dispositif d'aboutement optique de detecteurs photosensibles |
JPH01134956A (ja) * | 1987-11-20 | 1989-05-26 | Hitachi Ltd | 半導体装置の組立方法 |
FR2693005B1 (fr) * | 1992-06-26 | 1995-03-31 | Thomson Lcd | Disposition d'encapsulation et de passivation de circuit pour écrans plats. |
US5798557A (en) * | 1996-08-29 | 1998-08-25 | Harris Corporation | Lid wafer bond packaging and micromachining |
FR2758039B1 (fr) | 1996-12-27 | 1999-03-26 | Thomson Tubes Electroniques | Detecteur d'image a contraste ameliore |
FR2763700B1 (fr) | 1997-05-23 | 1999-07-30 | Thomson Tubes Electroniques | Dispositif de mesure d'exposition d'un detecteur d'image a l'etat solide soumis a un rayonnement ionisant et detecteur d'image equipe d'un tel dispositif de mesure |
US6222206B1 (en) * | 1998-06-25 | 2001-04-24 | Lucent Technologies Inc | Wafer having top and bottom emitting vertical-cavity lasers |
FR2782388B1 (fr) | 1998-08-11 | 2000-11-03 | Trixell Sas | Detecteur de rayonnement a l'etat solide a duree de vie accrue |
US6534340B1 (en) * | 1998-11-18 | 2003-03-18 | Analog Devices, Inc. | Cover cap for semiconductor wafer devices |
US6275513B1 (en) * | 1999-06-04 | 2001-08-14 | Bandwidth 9 | Hermetically sealed semiconductor laser device |
US6295130B1 (en) * | 1999-12-22 | 2001-09-25 | Xerox Corporation | Structure and method for a microelectromechanically tunable fabry-perot cavity spectrophotometer |
FR2812089B1 (fr) | 2000-07-21 | 2007-11-30 | Trixell Sas | Detecteur de rayonnement a duree de vie accrue |
US6509560B1 (en) * | 2000-11-13 | 2003-01-21 | Amkor Technology, Inc. | Chip size image sensor in wirebond package with step-up ring for electrical contact |
US6686588B1 (en) * | 2001-01-16 | 2004-02-03 | Amkor Technology, Inc. | Optical module with lens integral holder |
US6455927B1 (en) * | 2001-03-12 | 2002-09-24 | Amkor Technology, Inc. | Micromirror device package |
US6910812B2 (en) * | 2001-05-15 | 2005-06-28 | Peregrine Semiconductor Corporation | Small-scale optoelectronic package |
US6842217B1 (en) * | 2001-08-23 | 2005-01-11 | Cambridge Research And Instrumentation, Inc. | Fabry-perot etalons and tunable filters made using liquid crystal devices as tuning material |
FR2832512B1 (fr) * | 2001-11-16 | 2004-01-02 | Atmel Grenoble Sa | Composant de filtrage optique accordable |
JP2003163342A (ja) * | 2001-11-29 | 2003-06-06 | Olympus Optical Co Ltd | 固体撮像装置及びその製造方法 |
JP4095300B2 (ja) * | 2001-12-27 | 2008-06-04 | セイコーエプソン株式会社 | 光デバイス及びその製造方法、光モジュール、回路基板並びに電子機器 |
KR100476558B1 (ko) * | 2002-05-27 | 2005-03-17 | 삼성전기주식회사 | 이미지 센서 모듈 및 그 제작 공정 |
US7045868B2 (en) * | 2003-07-31 | 2006-05-16 | Motorola, Inc. | Wafer-level sealed microdevice having trench isolation and methods for making the same |
-
2002
- 2002-05-17 FR FR0206113A patent/FR2839812B1/fr not_active Expired - Fee Related
-
2003
- 2003-05-16 AU AU2003255582A patent/AU2003255582A1/en not_active Abandoned
- 2003-05-16 CN CNB038112957A patent/CN1303445C/zh not_active Expired - Fee Related
- 2003-05-16 EP EP03752834A patent/EP1508064A1/fr not_active Withdrawn
- 2003-05-16 WO PCT/FR2003/001503 patent/WO2003098299A1/fr active Application Filing
- 2003-05-16 JP JP2004505765A patent/JP4582776B2/ja not_active Expired - Fee Related
- 2003-05-16 US US10/514,111 patent/US7626239B2/en not_active Expired - Fee Related
Non-Patent Citations (1)
Title |
---|
See references of WO03098299A1 * |
Also Published As
Publication number | Publication date |
---|---|
CN1653367A (zh) | 2005-08-10 |
CN1303445C (zh) | 2007-03-07 |
JP4582776B2 (ja) | 2010-11-17 |
FR2839812B1 (fr) | 2005-07-01 |
FR2839812A1 (fr) | 2003-11-21 |
US20050200835A1 (en) | 2005-09-15 |
JP2006511828A (ja) | 2006-04-06 |
AU2003255582A1 (en) | 2003-12-02 |
US7626239B2 (en) | 2009-12-01 |
WO2003098299A1 (fr) | 2003-11-27 |
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