Classifications

• • H—ELECTRICITY
  • H04—ELECTRIC COMMUNICATION TECHNIQUE
  • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
  • H04N3/00—Scanning details of television systems; Combination thereof with generation of supply voltages
  • H04N3/02—Scanning details of television systems; Combination thereof with generation of supply voltages by optical-mechanical means only
  • H04N3/08—Scanning details of television systems; Combination thereof with generation of supply voltages by optical-mechanical means only having a moving reflector

Definitions

• the invention relates to a so-called scanning camera.
• the opto-electrical image sensors used today in electronic cameras or digital cameras, ca corder and video telephones are based on semiconductor chips with an array of light-sensitive elements, so-called pixels.
• a lens optic is provided for imaging an object on this sensor, which in the simplest case consists of a single lens.
• Such optics are subject to distortions, require focusing or are bound to a fixed distance range, and their resolution is limited.
• the manufacturers of the devices mentioned at the outset strive to reduce weight, body volume and costs.
• the focal length of the lens and the distance of the lens from the image sensor are fixed by the sensor diagonal and the angle of the camera.
• a further miniaturization by reducing the sensor diagonal and thus the pixel size requires a significantly higher quality and thus more expensive optics.
• the invention has for its object to provide a smaller, yet inexpensive camera.
• a lens is no longer required and all optical properties can be significantly improved.
• the construction volume in the scanning camera according to the invention is drastically reduced compared to the conventional cameras with optics and sensor array.
• FIG. 1 shows a basic illustration of the scanning camera according to the invention
• Figure 4 shows an implementation of the scanning camera according to the invention on a chip.
• the scanning camera (SC) uses a novel image recording system.
• a biaxially tiltable or swiveling micromirror scans the surroundings or an object in a grid pattern and directs the light beam onto, for example, a single light detector element or opto-electrical sensor.
• the scanning camera SC has a point-shaped image pickup sensor SE.
• the sensor SE consists of an element or a pixel. In particular in the case of a color camera, several pixels can be provided which are sensitive to the different colors.
• the image pickup sensor SE can be implemented, for example, by a photo transistor, a CCD chip or by a CMOS module.
• the scanning camera SC has a deflection unit which is implemented by a micromirror SP.
• the micromirror SP scans an object OB two-dimensionally.
• the micromirror SP is designed to be tiltable in two axes. det. These two tilting axes are preferably perpendicular to one another. This tilting movement is symbolically represented in FIG. 1 by the two double arrows (not designated in more detail).
• the scanned solid angle is directed or reflected on the sensor SE. As a result, all elements of an image to be recorded are scanned using the time-division multiplex method and converted into image data by the sensor SE.
• the deflection unit or the micromirror SP can be implemented, for example, by so-called micromechanical elements (MEMS arrangements).
• MEMS arrangements micromechanical elements
• An overview of such components can be found, for example, on the Internet at the URL http: // ems .colorado.edu / cl. res .ppt / ppt / oe.review.
• the light-sensitive sensor SE is reduced to only a single pixel, all elements of an image to be recorded or an object OB being recorded in time-division multiplex.
• collimation optics can be dispensed with, which means that focusing on the image distance is also eliminated.
• FIG. 2 shows a possible form of implementation for the micromirror SP using a micromechanical element.
• the micromechanical element preferably consists of silicon, from which a movable tongue Z is etched out.
• the tongue Z can be deflected perpendicular to the plane of the drawing, for example with a frequency of approximately 30 to 40 kHz. This direction of movement is symbolically represented by a double arrow P1.
• the micromirror SP shown in FIG. 2 can be rotated further in the plane of the drawing, for example at a frequency of 50 Hz. This direction of movement is symbolically represented by a double arrow P2.
• FIG. 1 A further implementation possibility for the micromirror SP is shown in FIG.
• a mirror element SPM is the Art movably connected on two sides with a base body made of silicon, so that this element SPM can be deflected two-dimensionally.
• the oscillation frequencies are, for example, the same as in FIG. 2.
• FIG. 4 shows a particularly preferred embodiment of the scanning camera SC according to the invention.
• the micromirror SP and the image recording sensor SE are arranged in one plane.
• Micromirror SP and image recording sensor SE can be produced side by side, for example, as micromechanical elements on an integrated module, a chip CP.
• a deflection mirror US is provided for deflecting a light beam LS reflected by the micromirror SP onto the sensor SE.
• the chip CP can be arranged in a recess in a housing GH, and the opening can be covered by a glass plate GP.
• the light beam LS falling through the glass plate GP onto the mirror SP is then directed onto the sensor SE via the deflecting mirror US.
• the deflecting mirror is preferably implemented by partially reflecting the glass plate GP.

Landscapes

• Engineering & Computer Science (AREA)
• Multimedia (AREA)
• Signal Processing (AREA)
• Mechanical Light Control Or Optical Switches (AREA)
• Studio Devices (AREA)
• Transforming Light Signals Into Electric Signals (AREA)

Applications Claiming Priority (3)

Publications (1)

Family

ID=7696739

Family Applications (1)

Country Status (5)

Cited By (1)

Families Citing this family (17)

Family Cites Families (16)

• 2002
  • 2002-07-23 WO PCT/DE2002/002703 patent/WO2003028363A1/de active Application Filing
  • 2002-07-23 US US10/487,859 patent/US20040207744A1/en not_active Abandoned
  • 2002-07-23 CN CNB02816945XA patent/CN1287585C/zh not_active Expired - Fee Related
  • 2002-07-23 JP JP2003531730A patent/JP4018631B2/ja not_active Expired - Fee Related
  • 2002-07-23 EP EP02754414A patent/EP1421779A1/de not_active Withdrawn

Non-Patent Citations (1)

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