EP1418451A1 - Method of fabricating an optical fiber block using silicon-glass anodic bonding technique - Google Patents

Method of fabricating an optical fiber block using silicon-glass anodic bonding technique Download PDF

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Publication number
EP1418451A1
EP1418451A1 EP03025413A EP03025413A EP1418451A1 EP 1418451 A1 EP1418451 A1 EP 1418451A1 EP 03025413 A EP03025413 A EP 03025413A EP 03025413 A EP03025413 A EP 03025413A EP 1418451 A1 EP1418451 A1 EP 1418451A1
Authority
EP
European Patent Office
Prior art keywords
cover
substrate
optical fiber
fabricating
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03025413A
Other languages
German (de)
English (en)
French (fr)
Inventor
Hyun-Ki Kim
Dong-Su Kim
In-Jae Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of EP1418451A1 publication Critical patent/EP1418451A1/en
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
    • G02B6/3636—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3616—Holders, macro size fixtures for mechanically holding or positioning fibres, e.g. on an optical bench
    • G02B6/362—Vacuum holders for optical elements

Definitions

  • the present invention relates to an optical component and in particular to an optical fiber block used as an optical connector.
  • An optical fiber block is connected to an input or output terminal of a planar lightwave circuit device (PLC) and typically used to arrange an optical fiber or an optical fiber array. It is also used as an input or output terminal for an micro-optic device.
  • PLC planar lightwave circuit device
  • the cover 120 is seated onto the substrate 110 and the optical fibers coated with the polymer adhesive 140, thereby fixing and protecting the optical fibers 130 from the exterior environment.
  • the above conventional optical fiber block has a problem in that the adhesive material becomes deteriorated due to the characteristics of the polymer adhesive used to bond the glass cover and the thermal expansion coefficient of the adhesive is higher than those of objects to be adhered, causing some bonding strength phenomena.
  • the present invention relates to a method for fabricating an optical fiber block, which can improve the bonding strength and the reliability of a bonded article without using a polymer adhesive.
  • One embodiment of the present invention relates to a method for fabricating an optical fiber block using silicon-glass anodic bonding technique, in which a cover formed from glass is bonded onto a substrate, the top of which is provided with one or more grooves.
  • the method comprising the steps of: heating the cover to a predetermined temperature; and, during the state in which the heated cover is seated on the top of the substrate, applying an electric field so that an electrostatic attraction is generated in the interface of the cover and the substrate, thereby bonding the cover and the substrate.
  • the method for fabricating an optical fiber block comprises an arranging step 210, a heating step 220, and a bonding step 230.
  • the arranging step 210 includes the steps of: providing a substrate 310 formed from silicon and provided with one or more grooves 315 on the top thereof; seating an optical fiber 330 into each of the grooves 315; covering the top of the substrate with a cover 320 formed from glass; and applying a heater 340 in the form of a flat plate into close contact with the top of the cover 320.
  • the gap between the cover 320 and the substrate 310 does not exceed 1 ⁇ m, and the position, shape, construction, etc. of the heater 340 can be implemented selectively as desired.
  • the cover 320 is heated to a predetermined temperature by means of the heater 340, so that impurities contained in the glass cover 320 are caused to be readily mobile when an electric field is applied.
  • impurities contained in the glass cover 320 are caused to be readily mobile when an electric field is applied.
  • the cover 320 is formed from Pyrex glass (Corning Glass 7740)
  • a certain amount of impurities such as sodium (Na), potassium (K), etc. are included in the cover 320, and when such a cover 320 is heated to a temperature of 200 °C or more, those impurities are electrically charged and become readily mobile when an electric field is applied.
  • the resulting electrostatic attraction brings the cover 320 and substrate 310 into intimate contact. Further, current flow of oxygen anions(O - ) from the cover 320 to the substrate 310 results in an anodic reaction at the interface and the result is that the cover 320 becomes bonded to the substrate 310 with a permanent chemical bond.
  • the bonding strength obtained in such a silicon-glass anodic bonding technique is very strong, and the bonding requires a time from several seconds to several minutes depending on the dimensions of objects to be bonded.
  • the bonding step 230 is performed in a vacuum environment, it is possible to achieve a high strength of silicon-glass bonding without inclusion of impurities.
  • an electric voltage is applied using the metallic heater 340 and a metallic film coated on the bottom of the substrate 310, but the application of electric voltage can be implemented in different forms.
  • one or more weights may be used which may be brought into close contact with the top of the heater 340 and apply a predetermined level of weight to the heater 340.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Coupling Of Light Guides (AREA)
  • Light Guides In General And Applications Therefor (AREA)
EP03025413A 2002-11-07 2003-11-05 Method of fabricating an optical fiber block using silicon-glass anodic bonding technique Withdrawn EP1418451A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR2002068849 2002-11-07
KR10-2002-0068849A KR100480273B1 (ko) 2002-11-07 2002-11-07 실리콘-유리 양극 접합 기술을 이용한 광섬유 블록의 제조방법

Publications (1)

Publication Number Publication Date
EP1418451A1 true EP1418451A1 (en) 2004-05-12

Family

ID=32105677

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03025413A Withdrawn EP1418451A1 (en) 2002-11-07 2003-11-05 Method of fabricating an optical fiber block using silicon-glass anodic bonding technique

Country Status (4)

Country Link
US (1) US20040093901A1 (ja)
EP (1) EP1418451A1 (ja)
JP (1) JP2004157541A (ja)
KR (1) KR100480273B1 (ja)

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* Cited by examiner, † Cited by third party
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US12062700B2 (en) 2018-04-04 2024-08-13 Qorvo Us, Inc. Gallium-nitride-based module with enhanced electrical performance and process for making the same
US12046505B2 (en) 2018-04-20 2024-07-23 Qorvo Us, Inc. RF devices with enhanced performance and methods of forming the same utilizing localized SOI formation
CN118213279A (zh) 2018-07-02 2024-06-18 Qorvo美国公司 Rf半导体装置及其制造方法
US11646242B2 (en) 2018-11-29 2023-05-09 Qorvo Us, Inc. Thermally enhanced semiconductor package with at least one heat extractor and process for making the same
US12057374B2 (en) 2019-01-23 2024-08-06 Qorvo Us, Inc. RF devices with enhanced performance and methods of forming the same
CN113632209A (zh) 2019-01-23 2021-11-09 Qorvo美国公司 Rf半导体装置和其制造方法
US12046483B2 (en) 2019-01-23 2024-07-23 Qorvo Us, Inc. RF devices with enhanced performance and methods of forming the same
US12046570B2 (en) 2019-01-23 2024-07-23 Qorvo Us, Inc. RF devices with enhanced performance and methods of forming the same
US12074086B2 (en) 2019-11-01 2024-08-27 Qorvo Us, Inc. RF devices with nanotube particles for enhanced performance and methods of forming the same
US11923238B2 (en) * 2019-12-12 2024-03-05 Qorvo Us, Inc. Method of forming RF devices with enhanced performance including attaching a wafer to a support carrier by a bonding technique without any polymer adhesive
US12062571B2 (en) 2021-03-05 2024-08-13 Qorvo Us, Inc. Selective etching process for SiGe and doped epitaxial silicon

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3397278A (en) * 1965-05-06 1968-08-13 Mallory & Co Inc P R Anodic bonding
US5692089A (en) * 1996-04-11 1997-11-25 Fotron, Inc. Multiple fiber positioner for optical fiber connection
US5774609A (en) * 1996-01-26 1998-06-30 Telefonaktiebolaget Lm Ericsson Method and arrangement for coupling a wave guide to a component

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4475790A (en) * 1982-01-25 1984-10-09 Spire Corporation Fiber optic coupler
JPH05224095A (ja) * 1992-02-14 1993-09-03 Matsushita Electric Ind Co Ltd 光ファイバアレイ及びその作製方法
JP3140247B2 (ja) * 1993-03-26 2001-03-05 京セラ株式会社 光ファイバアレイの製造方法
JP3136870B2 (ja) * 1993-10-12 2001-02-19 日立電線株式会社 光ファイバアレイ及びその製造方法
KR100383383B1 (en) * 2002-06-22 2003-05-16 Fionix Inc Method for fabricating optical fiber block
KR20040032193A (ko) * 2002-10-01 2004-04-17 주식회사 세미텔 정전접합을 이용한 광섬유 어레이 블록 및 그 제조방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3397278A (en) * 1965-05-06 1968-08-13 Mallory & Co Inc P R Anodic bonding
US5774609A (en) * 1996-01-26 1998-06-30 Telefonaktiebolaget Lm Ericsson Method and arrangement for coupling a wave guide to a component
US5692089A (en) * 1996-04-11 1997-11-25 Fotron, Inc. Multiple fiber positioner for optical fiber connection

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
ALTHAUS H. L. ET AL.: "Microsystems and Wafer Processes for Volume Production of Highly Reliable Fiber Optic Components for Telecom- and Datacom-Application", IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY PART B, vol. 21, no. 2, May 1998 (1998-05-01), pages 147 - 156, XP002267245 *
BLASQUEZ G ET AL: "Silicon glass anodic bonding under partial vacuum conditions: problems and solutions", SENSORS AND ACTUATORS A, ELSEVIER SEQUOIA S.A., LAUSANNE, CH, vol. 101, no. 1-2, 30 September 2002 (2002-09-30), pages 156 - 159, XP004380164, ISSN: 0924-4247 *
HENMI H. ET AL: "Vacuum packaging for microsensors by glass-silicon anodic bonding", SENSORS AND ACTUATORS, vol. 43, 1 January 1994 (1994-01-01), pages 243 - 248, XP000604245 *
WALLIS G ET AL: "FIELD ASSISTED GLASS-METAL SEALING", JOURNAL OF APPLIED PHYSICS, AMERICAN INSTITUTE OF PHYSICS. NEW YORK, US, vol. 40, no. 10, 1 September 1969 (1969-09-01), pages 3946 - 3949, XP000601832, ISSN: 0021-8979 *
YOZO KANDA ET AL: "THE MECHANISM OF FIELD-ASSISTED SILICON-GLASS BONDING", SENSORS AND ACTUATORS A, ELSEVIER SEQUOIA S.A., LAUSANNE, CH, vol. A23, no. 1 / 3, 1 April 1990 (1990-04-01), pages 939 - 943, XP000355794, ISSN: 0924-4247 *

Also Published As

Publication number Publication date
KR100480273B1 (ko) 2005-04-07
JP2004157541A (ja) 2004-06-03
US20040093901A1 (en) 2004-05-20
KR20040040661A (ko) 2004-05-13

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