EP1412983A2 - Dispositif electronique et son procede de fabrication - Google Patents

Dispositif electronique et son procede de fabrication

Info

Publication number
EP1412983A2
EP1412983A2 EP02741171A EP02741171A EP1412983A2 EP 1412983 A2 EP1412983 A2 EP 1412983A2 EP 02741171 A EP02741171 A EP 02741171A EP 02741171 A EP02741171 A EP 02741171A EP 1412983 A2 EP1412983 A2 EP 1412983A2
Authority
EP
European Patent Office
Prior art keywords
electronic device
heat
absorbent material
dimensional
electronic circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02741171A
Other languages
German (de)
English (en)
Inventor
Mario Palazzetti
Eugenio Faggioli
Riccardo Groppo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Centro Ricerche Fiat SCpA
Original Assignee
Centro Ricerche Fiat SCpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Centro Ricerche Fiat SCpA filed Critical Centro Ricerche Fiat SCpA
Publication of EP1412983A2 publication Critical patent/EP1412983A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06582—Housing for the assembly, e.g. chip scale package [CSP]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06589—Thermal management, e.g. cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06593—Mounting aids permanently on device; arrangements for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to an electronic device and relative fabrication method, and in particular to a three-dimensional electronic device comprising integrated circuits .
  • a three-dimensional electronic device is defined by a number of electronic circuits stacked and housed in a package made of plastic material, typically epoxy resin, and from which connecting pins project.
  • the fabrication method comprises a step of stacking a number of integrated electronic circuits 1 - only three of which are shown for the sake of simplicity.
  • each integrated electronic circuit 1 comprises a so-called die 2 glued or soldered to a flexible support 3 having a structure similar to that of a printed circuit board, and on which are formed leads 4 connected electrically at one end to respective test pads 5 equally spaced along a peripheral portion of flexible support 3, and, at the other end, to respective regions of die 2 by means of connecting wires .
  • the stacking step is followed by a step of depositing an absorbent material 10 between each integrated electronic circuit 1 and the next.
  • absorbent material 10 is deposited in the gaps between integrated electronic circuits 1, which may, for example, be located 0.2 mm apart, and each be, for example, roughly 1 cm 2 in size.
  • Absorbent material 10 is then soaked with a two- phase mixture of a thermally stable insulating liquid, which impregnates and spreads by capillarity inside absorbent material 10.
  • absorbent material 10 may be a fibrous-structure material capable of forming capillary vessels, such as cotton or cloth or powder.
  • the thermally stable insulating liquid used is a nonionic liquid, preferably an organic solvent, such as a hydrocarbon or a mixture of appropriately selected hydrocarbons, preferably with a boiling point of 50°C to
  • the step of depositing the absorbent material is followed by a molding step, in which a substantially parallelepiped- shaped package 7 made of epoxy resin and enclosing integrated electronic circuits 1 is formed.
  • Package 7 is then sawed to expose leads 4.
  • a plating step is then performed, in which the lateral walls of package 7 are plated with conducting material, e.g. a nickel and gold alloy.
  • the plating step is followed by a connecting step, in which a laser beam defines conducting tracks 8 electrically connecting leads 4 as required, so as to obtain the three-dimensional electronic device indicated as a whole by 9.
  • the liquid serves as a means of transferring heat. That is, the liquid permeates absorbent material 10 contacting integrated circuits 1, is converted to vapor, and then comes into contact with, and transfers heat to, the walls of package 7, which serve as heat-dissipating means .
  • the vapor then cools and returns to the liquid state.
  • the liquid is then reabsorbed by absorbent material 10 and, exploiting the capillarity of the absorbent material, is again brought into contact with integrated circuits 1.
  • Three-dimensional electronic device 9 has the following advantages :
  • the method of fabricating three-dimensional electronic device 9 provides for further miniaturization of the electronic circuits of three-dimensional electronic device 9.
  • the heat-dissipating means may be external to package 7.
  • the present invention may be used for dissipating heat in any type of electronic device, even other than three-dimensional, or comprising even only one electronic circuit.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

L'invention concerne un dispositif électronique tridimensionnel (9) comprenant un certain nombre de circuits électroniques intégrés (1) empilés et formant des trous respectifs, dans lesquels sont déposés une matière absorbante (10) et un liquide imprégnant ladite matière absorbante (10). Lesdits circuits électroniques intégrés (1) sont incorporés dans un boîtier hermétique (7), et au cours du fonctionnement dudit dispositif électronique (9), la chaleur produite par lesdits circuits électroniques intégrés (1) provoque l'évaporation du liquide, la vapeur produite rentre en contact avec les parois du boîtier (7) et leur transfère la chaleur, et puis, lorsqu'elle se refroidit, elle se condense à nouveau à l'état liquide. En raison de la capillarité de la matière absorbante (10), ce liquide rentre à nouveau en contact avec les circuits électroniques intégrés (1).
EP02741171A 2001-06-05 2002-06-05 Dispositif electronique et son procede de fabrication Withdrawn EP1412983A2 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ITTO20010540 2001-06-05
IT2001TO000540A ITTO20010540A1 (it) 2001-06-05 2001-06-05 Dispositivo elettronico e relativo processo di fabbricazione.
PCT/IT2002/000367 WO2002099883A2 (fr) 2001-06-05 2002-06-05 Dispositif electronique et son procede de fabrication

Publications (1)

Publication Number Publication Date
EP1412983A2 true EP1412983A2 (fr) 2004-04-28

Family

ID=11458933

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02741171A Withdrawn EP1412983A2 (fr) 2001-06-05 2002-06-05 Dispositif electronique et son procede de fabrication

Country Status (4)

Country Link
EP (1) EP1412983A2 (fr)
AU (1) AU2002314532A1 (fr)
IT (1) ITTO20010540A1 (fr)
WO (1) WO2002099883A2 (fr)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3673306A (en) * 1970-11-02 1972-06-27 Trw Inc Fluid heat transfer method and apparatus for semi-conducting devices
US5270571A (en) * 1991-10-30 1993-12-14 Amdahl Corporation Three-dimensional package for semiconductor devices
US5349237A (en) * 1992-03-20 1994-09-20 Vlsi Technology, Inc. Integrated circuit package including a heat pipe
JP2001183080A (ja) * 1999-12-24 2001-07-06 Furukawa Electric Co Ltd:The 圧縮メッシュウイックの製造方法、および、圧縮メッシュウイックを備えた平面型ヒートパイプ

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO02099883A3 *

Also Published As

Publication number Publication date
ITTO20010540A1 (it) 2002-12-05
WO2002099883A3 (fr) 2004-03-04
AU2002314532A1 (en) 2002-12-16
WO2002099883A2 (fr) 2002-12-12
ITTO20010540A0 (it) 2001-06-05

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