WO2002099883A3 - Electronic device and relative fabrication method - Google Patents

Electronic device and relative fabrication method Download PDF

Info

Publication number
WO2002099883A3
WO2002099883A3 PCT/IT2002/000367 IT0200367W WO02099883A3 WO 2002099883 A3 WO2002099883 A3 WO 2002099883A3 IT 0200367 W IT0200367 W IT 0200367W WO 02099883 A3 WO02099883 A3 WO 02099883A3
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
electronic circuits
integrated electronic
liquid
fabrication method
Prior art date
Application number
PCT/IT2002/000367
Other languages
French (fr)
Other versions
WO2002099883A2 (en
Inventor
Mario Palazzetti
Eugenio Faggioli
Riccardo Groppo
Original Assignee
Fiat Ricerche
Mario Palazzetti
Eugenio Faggioli
Riccardo Groppo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fiat Ricerche, Mario Palazzetti, Eugenio Faggioli, Riccardo Groppo filed Critical Fiat Ricerche
Priority to AU2002314532A priority Critical patent/AU2002314532A1/en
Priority to EP02741171A priority patent/EP1412983A2/en
Publication of WO2002099883A2 publication Critical patent/WO2002099883A2/en
Publication of WO2002099883A3 publication Critical patent/WO2002099883A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06582—Housing for the assembly, e.g. chip scale package [CSP]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06589—Thermal management, e.g. cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06593—Mounting aids permanently on device; arrangements for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

There is described a three-dimensional electronic device (9) having a number of integrated electronic circuits (1) stacked and forming respective gaps in which are deposited an absorbent material (10) and a liquid impregnating the absorbent material (10). The integrated electronic circuits (1) are enclosed in a hermetic package (7); and, during operation of the electronic device (9), the heat produced by the integrated electronic circuits (1) causes the liquid to evaporate, the vapor comes into contact with, and transfers heat to, the walls of the package (7), and, on cooling, condenses once more to the liquid state, which, by virtue of the capillarity of the absorvent material (10), is brought once more into contact with the integrated electronic circuits (1).
PCT/IT2002/000367 2001-06-05 2002-06-05 Electronic device and relative fabrication method WO2002099883A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU2002314532A AU2002314532A1 (en) 2001-06-05 2002-06-05 Electronic device and relative fabrication method
EP02741171A EP1412983A2 (en) 2001-06-05 2002-06-05 Electronic device and relative fabrication method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ITTO2001A000540 2001-06-05
IT2001TO000540A ITTO20010540A1 (en) 2001-06-05 2001-06-05 ELECTRONIC DEVICE AND RELATED MANUFACTURING PROCESS.

Publications (2)

Publication Number Publication Date
WO2002099883A2 WO2002099883A2 (en) 2002-12-12
WO2002099883A3 true WO2002099883A3 (en) 2004-03-04

Family

ID=11458933

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IT2002/000367 WO2002099883A2 (en) 2001-06-05 2002-06-05 Electronic device and relative fabrication method

Country Status (4)

Country Link
EP (1) EP1412983A2 (en)
AU (1) AU2002314532A1 (en)
IT (1) ITTO20010540A1 (en)
WO (1) WO2002099883A2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3673306A (en) * 1970-11-02 1972-06-27 Trw Inc Fluid heat transfer method and apparatus for semi-conducting devices
US5270571A (en) * 1991-10-30 1993-12-14 Amdahl Corporation Three-dimensional package for semiconductor devices
US5349237A (en) * 1992-03-20 1994-09-20 Vlsi Technology, Inc. Integrated circuit package including a heat pipe
US20010004934A1 (en) * 1999-12-24 2001-06-28 Masaaki Yamamoto Compressed mesh wick, method for manufacturing same, and plate type heat pipe including compressed mesh wick

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3673306A (en) * 1970-11-02 1972-06-27 Trw Inc Fluid heat transfer method and apparatus for semi-conducting devices
US5270571A (en) * 1991-10-30 1993-12-14 Amdahl Corporation Three-dimensional package for semiconductor devices
US5349237A (en) * 1992-03-20 1994-09-20 Vlsi Technology, Inc. Integrated circuit package including a heat pipe
US20010004934A1 (en) * 1999-12-24 2001-06-28 Masaaki Yamamoto Compressed mesh wick, method for manufacturing same, and plate type heat pipe including compressed mesh wick

Also Published As

Publication number Publication date
ITTO20010540A1 (en) 2002-12-05
EP1412983A2 (en) 2004-04-28
AU2002314532A1 (en) 2002-12-16
WO2002099883A2 (en) 2002-12-12
ITTO20010540A0 (en) 2001-06-05

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