ITTO20010540A0 - ELECTRONIC DEVICE AND RELATED MANUFACTURING PROCESS. - Google Patents

ELECTRONIC DEVICE AND RELATED MANUFACTURING PROCESS.

Info

Publication number
ITTO20010540A0
ITTO20010540A0 IT2001TO000540A ITTO20010540A ITTO20010540A0 IT TO20010540 A0 ITTO20010540 A0 IT TO20010540A0 IT 2001TO000540 A IT2001TO000540 A IT 2001TO000540A IT TO20010540 A ITTO20010540 A IT TO20010540A IT TO20010540 A0 ITTO20010540 A0 IT TO20010540A0
Authority
IT
Italy
Prior art keywords
electronic device
manufacturing process
related manufacturing
electronic
manufacturing
Prior art date
Application number
IT2001TO000540A
Other languages
Italian (it)
Inventor
Eugenio Faggioli
Riccardo Groppo
Mario Palazzetti
Original Assignee
Fiat Ricerche
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fiat Ricerche filed Critical Fiat Ricerche
Priority to IT2001TO000540A priority Critical patent/ITTO20010540A1/en
Publication of ITTO20010540A0 publication Critical patent/ITTO20010540A0/en
Priority to AU2002314532A priority patent/AU2002314532A1/en
Priority to PCT/IT2002/000367 priority patent/WO2002099883A2/en
Priority to EP02741171A priority patent/EP1412983A2/en
Publication of ITTO20010540A1 publication Critical patent/ITTO20010540A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06582—Housing for the assembly, e.g. chip scale package [CSP]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06589—Thermal management, e.g. cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06593—Mounting aids permanently on device; arrangements for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
IT2001TO000540A 2001-06-05 2001-06-05 ELECTRONIC DEVICE AND RELATED MANUFACTURING PROCESS. ITTO20010540A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
IT2001TO000540A ITTO20010540A1 (en) 2001-06-05 2001-06-05 ELECTRONIC DEVICE AND RELATED MANUFACTURING PROCESS.
AU2002314532A AU2002314532A1 (en) 2001-06-05 2002-06-05 Electronic device and relative fabrication method
PCT/IT2002/000367 WO2002099883A2 (en) 2001-06-05 2002-06-05 Electronic device and relative fabrication method
EP02741171A EP1412983A2 (en) 2001-06-05 2002-06-05 Electronic device and relative fabrication method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT2001TO000540A ITTO20010540A1 (en) 2001-06-05 2001-06-05 ELECTRONIC DEVICE AND RELATED MANUFACTURING PROCESS.

Publications (2)

Publication Number Publication Date
ITTO20010540A0 true ITTO20010540A0 (en) 2001-06-05
ITTO20010540A1 ITTO20010540A1 (en) 2002-12-05

Family

ID=11458933

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2001TO000540A ITTO20010540A1 (en) 2001-06-05 2001-06-05 ELECTRONIC DEVICE AND RELATED MANUFACTURING PROCESS.

Country Status (4)

Country Link
EP (1) EP1412983A2 (en)
AU (1) AU2002314532A1 (en)
IT (1) ITTO20010540A1 (en)
WO (1) WO2002099883A2 (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3673306A (en) * 1970-11-02 1972-06-27 Trw Inc Fluid heat transfer method and apparatus for semi-conducting devices
US5270571A (en) * 1991-10-30 1993-12-14 Amdahl Corporation Three-dimensional package for semiconductor devices
US5349237A (en) * 1992-03-20 1994-09-20 Vlsi Technology, Inc. Integrated circuit package including a heat pipe
JP2001183080A (en) * 1999-12-24 2001-07-06 Furukawa Electric Co Ltd:The Method for manufacturing compressed mesh wick and flat surface type heat pipe having compressed mesh wick

Also Published As

Publication number Publication date
AU2002314532A1 (en) 2002-12-16
WO2002099883A3 (en) 2004-03-04
ITTO20010540A1 (en) 2002-12-05
WO2002099883A2 (en) 2002-12-12
EP1412983A2 (en) 2004-04-28

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