AU2002314532A1 - Electronic device and relative fabrication method - Google Patents
Electronic device and relative fabrication methodInfo
- Publication number
- AU2002314532A1 AU2002314532A1 AU2002314532A AU2002314532A AU2002314532A1 AU 2002314532 A1 AU2002314532 A1 AU 2002314532A1 AU 2002314532 A AU2002314532 A AU 2002314532A AU 2002314532 A AU2002314532 A AU 2002314532A AU 2002314532 A1 AU2002314532 A1 AU 2002314532A1
- Authority
- AU
- Australia
- Prior art keywords
- electronic device
- fabrication method
- relative fabrication
- relative
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06582—Housing for the assembly, e.g. chip scale package [CSP]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06589—Thermal management, e.g. cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06593—Mounting aids permanently on device; arrangements for alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT2001TO000540A ITTO20010540A1 (en) | 2001-06-05 | 2001-06-05 | ELECTRONIC DEVICE AND RELATED MANUFACTURING PROCESS. |
ITTO2001A000540 | 2001-06-05 | ||
PCT/IT2002/000367 WO2002099883A2 (en) | 2001-06-05 | 2002-06-05 | Electronic device and relative fabrication method |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2002314532A1 true AU2002314532A1 (en) | 2002-12-16 |
Family
ID=11458933
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2002314532A Abandoned AU2002314532A1 (en) | 2001-06-05 | 2002-06-05 | Electronic device and relative fabrication method |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1412983A2 (en) |
AU (1) | AU2002314532A1 (en) |
IT (1) | ITTO20010540A1 (en) |
WO (1) | WO2002099883A2 (en) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3673306A (en) * | 1970-11-02 | 1972-06-27 | Trw Inc | Fluid heat transfer method and apparatus for semi-conducting devices |
US5270571A (en) * | 1991-10-30 | 1993-12-14 | Amdahl Corporation | Three-dimensional package for semiconductor devices |
US5349237A (en) * | 1992-03-20 | 1994-09-20 | Vlsi Technology, Inc. | Integrated circuit package including a heat pipe |
JP2001183080A (en) * | 1999-12-24 | 2001-07-06 | Furukawa Electric Co Ltd:The | Method for manufacturing compressed mesh wick and flat surface type heat pipe having compressed mesh wick |
-
2001
- 2001-06-05 IT IT2001TO000540A patent/ITTO20010540A1/en unknown
-
2002
- 2002-06-05 WO PCT/IT2002/000367 patent/WO2002099883A2/en not_active Application Discontinuation
- 2002-06-05 AU AU2002314532A patent/AU2002314532A1/en not_active Abandoned
- 2002-06-05 EP EP02741171A patent/EP1412983A2/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
EP1412983A2 (en) | 2004-04-28 |
WO2002099883A2 (en) | 2002-12-12 |
WO2002099883A3 (en) | 2004-03-04 |
ITTO20010540A1 (en) | 2002-12-05 |
ITTO20010540A0 (en) | 2001-06-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |