EP1398855A1 - Abisolierung von FFCs - Google Patents
Abisolierung von FFCs Download PDFInfo
- Publication number
- EP1398855A1 EP1398855A1 EP02450195A EP02450195A EP1398855A1 EP 1398855 A1 EP1398855 A1 EP 1398855A1 EP 02450195 A EP02450195 A EP 02450195A EP 02450195 A EP02450195 A EP 02450195A EP 1398855 A1 EP1398855 A1 EP 1398855A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- laser
- laser sources
- covers
- activation
- ffcs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/28—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for wire processing before connecting to contact members, not provided for in groups H01R43/02 - H01R43/26
Definitions
- the invention relates to the stripping of flat, flexible conductors, so-called FFCs.
- FFCs are becoming increasingly common in industry and especially in automotive engineering compared to round cables because they can be processed by machines.
- they allow electrically conductive connections in the form of To create branch points by around the conductor tracks to be contacted Insulation material is removed, the two FFCs are placed on top of each other to match interconnects to be connected and the connection point then again with a potting material or insulating tapes or the like is isolated.
- Such windows are created in the prior art by a combination a punching process with a peeling process or machining and is complex and uncomfortable because of the extrudate particles. It was already tries to make the windows by laser, but this leads to an impairment the surface of the conductor tracks, which must then be chemically treated before the Further processing is possible. The necessary chemical treatment does it in Manufacturing process necessary to provide a work station with the corresponding liquid chemicals are handled, which have appropriate suction and drainage and which has to follow a drying and control step to ensure that the FFCs received are flawless. Such a station is a foreign body in an otherwise electronically, with lasers and the like production line and therefore to be avoided if possible.
- the applicant has developed a method based on laser technology that the problems mentioned above and to technologically perfect windows in the FFC leads.
- This process is patented separately from the present application Registered.
- the present application relates to the arrangement of at least two lasers, between which there is an FFC in which a window is to be created.
- the Arrange two lasers aligned with one another and facing each other frontally at the Manufacturing windows in FFCs is because of the small size of the windows and the need to to create the windows from both sides. If you look at the Processing between stripping the top and stripping the bottom moving the FFC, the required positioning accuracy can only be achieved with disproportionate effort and only in low clock rates. There is inconvenient possibility that by moving the FFC from the stripping on the Top for stripping on the bottom of a window or vice versa to one Offset is coming.
- this problem is reliably and inexpensively avoided by that a cover impenetrable to the laser beam is arranged in front of each laser which is only removed from the area of the laser beam if the assigned one Laser is activated.
- the cover of each laser consists of one rotating disc with corresponding holes or recesses, preferably the two disks for the two lasers are mounted on a common axis of rotation.
- FIG. 1 shows, purely schematically, an arrangement according to the invention.
- Processing station is passed through an FFC 1 and at the points where a Window 2 is to be produced, stopped in the area between 2 lasers 3, 4 and appropriately positioned and fixed to the window 2 with the necessary geometric To be able to produce accuracy.
- the FFC 1 consists of several parallel to one another in one plane Conductor tracks 5, of which only one according to the guidance of the cut in FIG. 1 is visible, and the extrudate 6, which surrounds the conductor tracks and is made of electrically insulating, but within limits of plastically deformable material.
- the two lasers 3, 4, which are purely schematic in FIG. 1 and do not correspond to them actual arrangement are shown, are arranged coaxially along an axis 7 and directed against each other. In most applications, the lasers are in some Distance from the object and the laser beams are each using an optic (which can also include flexible light guides) aimed at their target and appropriately focused.
- the structures denoted by 3 and 4 correspond most closely to the optics, however naturally also belongs to the laser in a broader sense.
- the lasers 3, 4 are in the Area of the window to be formed 2 simultaneously movable to the window with the to create the desired size and shape.
- This essentially consists of a by a (not shown) Motor rotated shaft 9, which carries two cover plates 13, 14, each are assigned to one of the lasers 3, 4.
- the rotor shaft 9 is essentially normal the plane of the FFC 1 and is arranged relatively close to the edge of the FFC 1. On this way, depending on the angular position of the rotor shaft 9 and thus the cover disks 13, 14 sections of these disks in front of the assigned laser 3, 4 or not.
- FIG. 1 shows that angular position in which the cover plate 13 is in front of the laser 3 is located, while the cover plate 14 releases the laser 4 so that it activates can be.
- This alternate activation is preferred by means of a circuit made of the angular position of the axis of rotation 9 and thus the angular position Cover plates 13, 14 is derived.
- Fig. 1 this is schematically at the lower end of the Rotor shaft 9 shown where a switch 23 for the laser 3 and a switch 24 for the Laser 4 is indicated.
- the eccentric cover disks 13, 14 it is possible instead of the eccentric cover disks 13, 14 to provide gear-like structures and thus at the desired high speeds a dynamically balanced situation. Similarly, it is possible instead a gear-like construction to provide perforated disks through which the same purpose is fulfilled.
- the switches 23, 24 do not have to be the lasers 3, 4 directly activate, but give appropriate signals to the actual control electronics for the two lasers. In any case, the provision of the device 8 ensures that the two lasers 3, 4 cannot damage each other.
- FIG. 1 a modified construction 18 is shown in FIG a reciprocal linear movement of two cover disks 13 '14' is based.
- the leadership the purely schematic section of FIG. 2 is normal to the schematic section of FIG 1, so that it can be seen in this illustration that the FFC 1 has a plurality of conductor tracks 5 and how they are arranged to each other.
- the Safety device 18 is based on the pivoting of a pivot lever 10, for example by a connecting rod (not shown) of an engine or by a Electromagnet that directly on a corresponding ferromagnetic part of the Cover discs 13 '14' acts or by a pneumatic drive, and ensures here again that at least one of the disks is in front of the one assigned to it Laser located.
- switches 23, 24 again Control technology release of the laser not covered in each case to create the desired window 2 in FFC 1.
- the two covers can also be arranged on the casing of a drum, in the FFC runs along the drum axis with the drum around its axis rotates.
- the drum could also be used to vacuum the unpleasant Removal of the extrudate vapors and gases are used.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Laser Beam Processing (AREA)
- Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
- Control And Other Processes For Unpacking Of Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Processing Of Terminals (AREA)
Abstract
Description
Claims (8)
- Verfahren zum Abisolieren von Flachleitern, sogenannten FFCs (1), insbesondere von extrudierten FFCs mittels Laserstrahlen, dadurch gekennzeichnet, dass zwei koaxial zueinander angeordnete und aufeinander gerichtete Laserstrahlen zur Entfernung des Extrudates (6) verwendet werden, dass sich der Flachleiter im wesentlichen in der Symmetrieebene zwischen den beiden Laserquellen (3, 4) befindet und dass die beiden Laserquellen alternierend aktiviert werden.
- Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass zumindest während der Aktivierung einer der Laserquellen (3, 4) eine laserstrahlundurchdringliche Abdeckung (13, 14) zwischen den Flachleiter (1) und die nicht aktivierte Laserquelle (3, 4) eingebracht wird.
- Verfahren nach Anspruch 2, dadurch gekennzeichnet, dass zwei Abdeckungen (13, 14) vorgesehen sind, die miteinander mechanisch so verbunden sind, dass sich im Zuge ihrer gemeinsamen Bewegung stets zumindest eine der Abdeckungen zwischen dem FFC und der ihr zugeordneten Laserquelle(3, 4) befindet.
- Vorrichtung zur Durchführung des Verfahrens nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass zwei Laserquellen (3, 4), gegebenenfalls gespeist von einem gemeinsamen Laser, einander koaxial positioniert diametral gegenüberstehen, dass im wesentlichen in der Symmetrieebene zwischen den beiden Laserquellen Führungs- und Positioniervorrichtungen für den abzuisolierenden Flachleiter (1) vorgesehen sind und dass eine Steuereinheit (8) vorgesehen ist, durch die die beiden Laserquellen (3, 4) alternierend aktiviert werden.
- Vorrichtung nach Anspruch 4, dadurch gekennzeichnet, dass auf jeder Seite des Flachleiters (1) zumindest eine Abdeckung (13, 14) vorgesehen ist, die in Abhängigkeit von der Steuereinheit (8) in den Bereich der zugeordneten Laserquelle (3, 4) gebracht oder aus ihm entfernt werden.
- Vorrichtung nach Anspruch 5, dadurch gekennzeichnet, dass die Abdeckungen (13, 14) auf einer gemeinsamen, rotierenden, Welle (9) angeordnet sind und dass die Aktivierung der Laserquellen (3, 4) in Abhängigkeit von der Winkellage der rotierenden Welle (9) erfolgt.
- Vorrichtung nach Anspruch 5, dadurch gekennzeichnet, dass die Abdeckungen (13', 14') mit einer Wippe (9') verbunden sind, durch die hin- und hergehende Bewegung der Wippe (9') abwechselnd in den bzw. aus dem Bereich der zugeordneten Laserquelle (3, 4) geschoben werden und dass die Aktivierung der Laserquellen in Abhängigkeit von der Winkellage der Wippe erfolgt.
- Vorrichtung nach Anspruch 5, dadurch gekennzeichnet, dass die beiden Abdeckungen auf einem gemeinsamen Schlitten und in Bewegungsrichtung des Schlittens zueinander versetzt angeordnet sind und dass die Aktivierung der Laserquellen in Abhängigkeit von der Position des Schlittens erfolgt.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES02450195T ES2263763T3 (es) | 2002-09-03 | 2002-09-03 | Arranque del aislamiento de cables planos. |
DE50206666T DE50206666D1 (de) | 2002-09-03 | 2002-09-03 | Abisolierung von FFCs |
AT02450195T ATE325451T1 (de) | 2002-09-03 | 2002-09-03 | Abisolierung von ffcs |
EP02450195A EP1398855B1 (de) | 2002-09-03 | 2002-09-03 | Abisolierung von FFCs |
US10/654,519 US6936788B2 (en) | 2002-09-03 | 2003-09-03 | Stripping of FFCs |
JP2003311762A JP2004090092A (ja) | 2002-09-03 | 2003-09-03 | Ffcのストリッピング |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02450195A EP1398855B1 (de) | 2002-09-03 | 2002-09-03 | Abisolierung von FFCs |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1398855A1 true EP1398855A1 (de) | 2004-03-17 |
EP1398855B1 EP1398855B1 (de) | 2006-05-03 |
Family
ID=31725560
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP02450195A Expired - Lifetime EP1398855B1 (de) | 2002-09-03 | 2002-09-03 | Abisolierung von FFCs |
Country Status (6)
Country | Link |
---|---|
US (1) | US6936788B2 (de) |
EP (1) | EP1398855B1 (de) |
JP (1) | JP2004090092A (de) |
AT (1) | ATE325451T1 (de) |
DE (1) | DE50206666D1 (de) |
ES (1) | ES2263763T3 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070193985A1 (en) * | 2006-02-20 | 2007-08-23 | Howard Patrick C | Method for removing a coating from a substrate using a defocused laser beam |
AT8993U1 (de) * | 2006-03-06 | 2007-03-15 | Magna Steyr Fahrzeugtechnik Ag | Füllstandssensor für kryogene flüssigkeiten und behälter mit einem solchen |
JP4670767B2 (ja) * | 2006-08-01 | 2011-04-13 | 住友電装株式会社 | 平板状配線部材の加工装置 |
DE102013006361A1 (de) | 2013-04-12 | 2014-04-03 | Daimler Ag | Verfahren und Vorrichtung zum Abisolieren eines elektrischen Leiters |
US9085047B2 (en) * | 2013-05-10 | 2015-07-21 | Corning Optical Communications LLC | Coating removal systems for optical fibers |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4818322A (en) * | 1985-07-19 | 1989-04-04 | Kollmorgen Technologies Corporation | Method for scribing conductors via laser |
US5115555A (en) * | 1991-02-22 | 1992-05-26 | Amp Incorporated | Apparatus for manipulating a high density flat cable |
US5940963A (en) * | 1997-07-21 | 1999-08-24 | Tensolite Company | Finished mass terminated end for a miniature coaxial ribbon cable and method of producing same |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4671848A (en) * | 1984-12-17 | 1987-06-09 | General Laser, Inc. | Method for laser-induced removal of a surface coating |
JP2683926B2 (ja) * | 1988-01-25 | 1997-12-03 | 三菱電機株式会社 | 絶縁被覆電線の被覆剥離方法及びその装置 |
US4970367A (en) * | 1990-02-02 | 1990-11-13 | Miller Richard T | Laser wire stripper apparatus and method therefor |
US5887324A (en) * | 1996-08-30 | 1999-03-30 | The Whitaker Corporation | Electrical terminal with integral capacitive filter |
US5954974A (en) * | 1997-09-25 | 1999-09-21 | Lucent Technologies Inc. | Laser-assisted coating removal from optical fibers |
US6509547B1 (en) * | 2000-04-07 | 2003-01-21 | Resonetics, Inc. | Method for laser stripping of optical fiber and flat cable |
JP2002172479A (ja) * | 2000-09-20 | 2002-06-18 | Seiko Epson Corp | レーザ割断方法、レーザ割断装置、液晶装置の製造方法並びに液晶装置の製造装置 |
JP2002358837A (ja) * | 2001-06-01 | 2002-12-13 | Teijin Ltd | フラットケーブルおよび被覆用ポリエステル樹脂組成物 |
-
2002
- 2002-09-03 EP EP02450195A patent/EP1398855B1/de not_active Expired - Lifetime
- 2002-09-03 AT AT02450195T patent/ATE325451T1/de not_active IP Right Cessation
- 2002-09-03 DE DE50206666T patent/DE50206666D1/de not_active Expired - Fee Related
- 2002-09-03 ES ES02450195T patent/ES2263763T3/es not_active Expired - Lifetime
-
2003
- 2003-09-03 US US10/654,519 patent/US6936788B2/en not_active Expired - Fee Related
- 2003-09-03 JP JP2003311762A patent/JP2004090092A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4818322A (en) * | 1985-07-19 | 1989-04-04 | Kollmorgen Technologies Corporation | Method for scribing conductors via laser |
US5115555A (en) * | 1991-02-22 | 1992-05-26 | Amp Incorporated | Apparatus for manipulating a high density flat cable |
US5940963A (en) * | 1997-07-21 | 1999-08-24 | Tensolite Company | Finished mass terminated end for a miniature coaxial ribbon cable and method of producing same |
Also Published As
Publication number | Publication date |
---|---|
ATE325451T1 (de) | 2006-06-15 |
EP1398855B1 (de) | 2006-05-03 |
DE50206666D1 (de) | 2006-06-08 |
US6936788B2 (en) | 2005-08-30 |
ES2263763T3 (es) | 2006-12-16 |
US20040118822A1 (en) | 2004-06-24 |
JP2004090092A (ja) | 2004-03-25 |
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