EP1378008A2 - Module de puissance - Google Patents

Module de puissance

Info

Publication number
EP1378008A2
EP1378008A2 EP01985858A EP01985858A EP1378008A2 EP 1378008 A2 EP1378008 A2 EP 1378008A2 EP 01985858 A EP01985858 A EP 01985858A EP 01985858 A EP01985858 A EP 01985858A EP 1378008 A2 EP1378008 A2 EP 1378008A2
Authority
EP
European Patent Office
Prior art keywords
power module
carrier body
geometric elements
electronic components
circuit arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP01985858A
Other languages
German (de)
English (en)
Inventor
Hermann Bäumel
Werner Graf
Hermann Kilian
Bernhard Schuch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Conti Temic Microelectronic GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Publication of EP1378008A2 publication Critical patent/EP1378008A2/fr
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/01004—Beryllium [Be]
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    • H01L2924/01013—Aluminum [Al]
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    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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    • H01L2924/30107—Inductance

Definitions

  • electronic assemblies are used for different tasks and applications;
  • electronic modules designed as power modules are used for control purposes, for example for speed and power control of electric motors.
  • Such power modules include electronic components for providing the required power (for example typically in the kW range for electric motors) and for providing control signals and / or for evaluating measurement signals.
  • active components such as power components operating in switching operation with high current change speeds (in particular integrated circuits as circuit breakers), and passive components such as
  • Resistors e.g. shunts for current measurement
  • capacitors have circuitry of the power module to avoid overvoltages, a low-induction structure required.
  • the circuit arrangement of the power module is usually applied to an insulating carrier body (an insulating substrate), which generally consists of a ceramic material.
  • an insulating carrier body an insulating substrate
  • the carrier body is placed on an example.
  • massive metal heat sink e.g. a copper plate or aluminum plate
  • a connecting layer e.g.
  • connection layer between the support body and the heat sink is required (especially in the case of a large-area support body) to equalize the stress (This results in a high thermal resistance, in particular also inclusions in the connection layer which have a negative influence on the thermal conductivity, for example blowholes in a solder layer), so that there is poor heat transfer between the electronic components of the circuit arrangement and the heat sink due to the thermal resistances formed thereby is and the dissipation of the power loss (heat dissipation) of the electronic components is therefore difficult, on the other hand (especially in a large temperature range for the egg Power module and the resulting temperature changes) often affects the connection between the support body and the heat sink,
  • the invention has for its object to provide a power module with a simple structure, simple manufacture, low costs, high reliability and advantageous thermal properties.
  • a (thick) carrier body consisting of an insulating material with high thermal conductivity, for example. as a ceramic carrier made of a ceramic material, e.g. made of aluminum oxide AkO * or aluminum nitride AIN; the carrier body can be manufactured in mold-falling tools, for example. by means of dry presses or by injection molding with subsequent sintering.
  • the thickness of the The carrier body is selected in accordance with its size (surface area) and the mechanical load caused by the installation of the power module (for example by screwing) at its place of use and the cooling (for example by the pressure of the coolant in a cooling circuit connected to the power module).
  • a structured sub-area of the ceramic carrier body acts as a cooling element, in that on its underside, geometric elements made from the material of the carrier body are provided as an array in a specific arrangement and with a specific geometric shape (for example cone-shaped or diamond-shaped) Carrier body with a (metallic) interconnect structure
  • Conductors, pick-up points, contact points and connection points applied directly i.e. without intermediate layers on the surface of the ceramic carrier body
  • active soldering Active Metal Bonding
  • chemically soldering the interconnect structure directly onto the surface of the carrier body via an oxide bond or by the DCB method
  • the electronic components of the circuit arrangement can be electrically conductively connected to one another and / or to connection contacts via the interconnect structure.
  • connection contacts are attached to the connection points of the guideway structure, which are used for the (external) connection of the
  • Power module with other modules or components serve.
  • the heat dissipation of the circuit arrangement takes place from the carrier body.
  • the border of the cooling element which is designed as an array with a multiplicity of (identically) structured geometric elements, is adapted to the shape of the carrier body; the size (area) of the array depends on the power loss to be dissipated, ie the required cooling function must be guaranteed by the geometric elements of the array.
  • a certain number of geometric elements is spaced equidistantly from one another to form a row, while two adjacent rows of geometric elements are offset from one another (preferably such that the geometric elements of one row are positioned in the gap of the adjacent row defined by the spacing of the geometric elements) ).
  • the shape, number and arrangement of the geometric elements are adapted to the particular application of the power module and to the cooling capacity required.
  • the geometric elements are e.g. formed as diamonds, truncated pyramids, cones or lenses and have, for example. a slightly bevelled side.
  • the cooling element is produced in the same manufacturing step and in the same tool as the carrier body, for example. in mold-falling tools, e.g. by means of dry pressing or by means of injection molding with subsequent sintering; ie the geometric elements made of the same material as the carrier body are formed together with the latter from a template having a corresponding shape.
  • the cooling element or the array of geometric elements is, in particular, integrated in a cooling circuit, for example. the array is cooled by the coolant of the cooling circuit (e.g.
  • flow channels for the coolant of the cooling circuit are predetermined by the geometric elements of the array, in that the coolant flows between the geometric elements (between the different rows of the geometric elements).
  • Heat transfer from the carrier body to the coolant can be set via the cooling element.
  • the power module combines several advantages:
  • the carrier body serves both for heat dissipation and as a circuit carrier (substrate) for the electronic components of the circuit arrangement and for sealing in the case of a direct arrangement of the power module in a cooling circuit and thus the integration of the array of geometric elements in the cooling circuit; Thermal problems can be avoided by the direct connection of the electronic components of the circuit arrangement on the carrier body and the direct connection of the cooling element to the carrier body without intermediate layers (therefore low thermal resistance), so that the power module is highly reliable and has a long service life.
  • the predeterminable structure of the cooling element ensures adequate heat dissipation of the electronic components of the circuit arrangement, in particular a variably selectable heat dissipation by appropriate design of the cooling element and thus of the geometric elements, so that, in particular,
  • the flow rate of the coolant and the pressure loss in the cooling circuit can be adapted to the requirements.
  • the production outlay is low, since simple production of the cooling element is possible (in particular together with the carrier body in one production step using the same tool) and production problems can be avoided, so that low production costs are also incurred, in particular also through the use of simple and inexpensive materials.
  • FIG. 1 shows a view of the top of the power module
  • FIG. 2 shows a sectional view of the power module
  • FIG. 3 shows a view of the bottom of the power module.
  • the power module 1 is, for example. used as a power converter for liquid-cooled electric motors in the motor vehicle sector (output, for example, 10 kW); due to the Resulting high power loss, the power converter 1 is coupled directly to the liquid cooling on the electric motor, ie integrated in the cooling circuit of the electric motor operated with the coolant water.
  • the power converter 1 consists of the following components:
  • Ceramic carrier for example.
  • Carrier body 2 consisting of AIN as circuit carrier with the dimensions of example. 90 mm x 57 mm x 3 mm, which is integrated directly into the cooling circuit and thus also seals the cooling circuit against the other components of the power converter 1.
  • Conductor structure 7 consisting of copper (thickness, for example, 0.3 mm) with conductor tracks 8, receiving points 1 3, contact points 9 and connecting points 1 1 applied, for example. chemically soldered onto the carrier body 2 by means of a direct (active) soldering process.
  • the electronic components 5 of the circuit arrangement 6 are contacted, i.e. electrically conductively connected to the interconnect structure 7; at the connection points 1 1, connection contacts 1 2 are attached, for example. soldered by means of the solder 20.
  • circuit arrangement 6 which has electronic components 5 and which, in particular, has power components for realizing the converter function and the resulting control of the electric motor.
  • the electronic components 5 of the circuit arrangement ⁇ are applied as silicon chips at the receiving points 13 on the interconnect structure 7 (for example soldered by means of a soft soldering process) and for example. Connected to the contact points 9 of the conductor tracks 8 of the conductor track structure 7 via bond connections 10 and / or to other electronic components 5.
  • the power loss of the electronic components 5 of the circuit arrangement ⁇ (in particular of the power components) is dissipated via the carrier body 2 and the cooling element 3 into the cooling circuit through which the coolant flows.
  • the cooling element 3 On the underside 15 of the carrier body 2, the one produced together with the carrier body 2 in a mold-removing tool by pressing, for example. made of AIN, cooling element 3 arranged.
  • the cooling element 3 is structured in a certain way to form an array 21 of geometric elements 4, the geometric elements 4 of the cooling element 3, for example. have a diamond-like shape, the side surfaces of which are slightly beveled.
  • the geometric elements 4 of the cooling element 3 are in a certain number in one
  • Ex. Are in a row 1 7 on a length of ex. 80 mm 1 2 geometric elements 4 arranged one behind the other and with a width of e.g. 40 mm 6 different rows 1 7 with geometric elements 4 arranged offset to one another.
  • the geometric elements 4 of the cooling element 3 with a height of e.g. 6 mm protrude into the cooling circuit of the electric motor and the coolant flows through water, a certain flow direction and a certain flow rate of the cooling water being predetermined in accordance with the flow channels 18 formed by the arrangement of the geometric elements 4.

Abstract

L'objectif de l'invention est de créer un module de puissance qui soit de conception simple et économique tout en garantissant un fonctionnement sûr. A cet effet, un circuit comprenant au moins un composant électronique est disposé sur un substrat. Une structure conductrice est formée sur la face supérieure du substrat et un élément de refroidissement structuré constitué du matériau du substrat est disposé sur la face inférieure dudit substrat. L'invention concerne également l'utilisation de ce module de puissance comme convertisseur de puissance pour des moteurs électriques.
EP01985858A 2001-01-20 2001-12-10 Module de puissance Ceased EP1378008A2 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10102621 2001-01-20
DE10102621A DE10102621B4 (de) 2001-01-20 2001-01-20 Leistungsmodul
PCT/EP2001/014464 WO2002058142A2 (fr) 2001-01-20 2001-12-10 Module de puissance

Publications (1)

Publication Number Publication Date
EP1378008A2 true EP1378008A2 (fr) 2004-01-07

Family

ID=7671269

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01985858A Ceased EP1378008A2 (fr) 2001-01-20 2001-12-10 Module de puissance

Country Status (4)

Country Link
US (1) US6952347B2 (fr)
EP (1) EP1378008A2 (fr)
DE (1) DE10102621B4 (fr)
WO (1) WO2002058142A2 (fr)

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US9153960B2 (en) 2004-01-15 2015-10-06 Comarco Wireless Technologies, Inc. Power supply equipment utilizing interchangeable tips to provide power and a data signal to electronic devices
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DE102004057421B4 (de) * 2004-11-27 2009-07-09 Semikron Elektronik Gmbh & Co. Kg Druckkontaktiertes Leistungshalbleitermodul für hohe Umgebungstemperaturen und Verfahren zu seiner Herstellung
US7236368B2 (en) * 2005-01-26 2007-06-26 Power-One, Inc. Integral molded heat sinks on DC-DC converters and power supplies
US7593230B2 (en) * 2005-05-05 2009-09-22 Sensys Medical, Inc. Apparatus for absorbing and dissipating excess heat generated by a system
TWI449137B (zh) * 2006-03-23 2014-08-11 Ceramtec Ag 構件或電路用的攜帶體
DE102006028675B4 (de) 2006-06-22 2008-08-21 Siemens Ag Kühlanordnung für auf einer Trägerplatte angeordnete elektrische Bauelemente
US7996987B2 (en) * 2006-10-17 2011-08-16 Broadcom Corporation Single footprint family of integrated power modules
DE102008018841A1 (de) 2008-04-15 2009-10-22 Conti Temic Microelectronic Gmbh Verfahren zur Herstellung und Aufbau eines Leistungsmoduls
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US6952347B2 (en) 2005-10-04
WO2002058142A3 (fr) 2003-11-06
WO2002058142A2 (fr) 2002-07-25
DE10102621B4 (de) 2006-05-24
US20040057208A1 (en) 2004-03-25
DE10102621A1 (de) 2002-08-01

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