EP1378008A2 - Power module - Google Patents

Power module

Info

Publication number
EP1378008A2
EP1378008A2 EP01985858A EP01985858A EP1378008A2 EP 1378008 A2 EP1378008 A2 EP 1378008A2 EP 01985858 A EP01985858 A EP 01985858A EP 01985858 A EP01985858 A EP 01985858A EP 1378008 A2 EP1378008 A2 EP 1378008A2
Authority
EP
European Patent Office
Prior art keywords
power module
carrier body
geometric elements
electronic components
circuit arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP01985858A
Other languages
German (de)
French (fr)
Inventor
Hermann Bäumel
Werner Graf
Hermann Kilian
Bernhard Schuch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Conti Temic Microelectronic GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Publication of EP1378008A2 publication Critical patent/EP1378008A2/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Definitions

  • electronic assemblies are used for different tasks and applications;
  • electronic modules designed as power modules are used for control purposes, for example for speed and power control of electric motors.
  • Such power modules include electronic components for providing the required power (for example typically in the kW range for electric motors) and for providing control signals and / or for evaluating measurement signals.
  • active components such as power components operating in switching operation with high current change speeds (in particular integrated circuits as circuit breakers), and passive components such as
  • Resistors e.g. shunts for current measurement
  • capacitors have circuitry of the power module to avoid overvoltages, a low-induction structure required.
  • the circuit arrangement of the power module is usually applied to an insulating carrier body (an insulating substrate), which generally consists of a ceramic material.
  • an insulating carrier body an insulating substrate
  • the carrier body is placed on an example.
  • massive metal heat sink e.g. a copper plate or aluminum plate
  • a connecting layer e.g.
  • connection layer between the support body and the heat sink is required (especially in the case of a large-area support body) to equalize the stress (This results in a high thermal resistance, in particular also inclusions in the connection layer which have a negative influence on the thermal conductivity, for example blowholes in a solder layer), so that there is poor heat transfer between the electronic components of the circuit arrangement and the heat sink due to the thermal resistances formed thereby is and the dissipation of the power loss (heat dissipation) of the electronic components is therefore difficult, on the other hand (especially in a large temperature range for the egg Power module and the resulting temperature changes) often affects the connection between the support body and the heat sink,
  • the invention has for its object to provide a power module with a simple structure, simple manufacture, low costs, high reliability and advantageous thermal properties.
  • a (thick) carrier body consisting of an insulating material with high thermal conductivity, for example. as a ceramic carrier made of a ceramic material, e.g. made of aluminum oxide AkO * or aluminum nitride AIN; the carrier body can be manufactured in mold-falling tools, for example. by means of dry presses or by injection molding with subsequent sintering.
  • the thickness of the The carrier body is selected in accordance with its size (surface area) and the mechanical load caused by the installation of the power module (for example by screwing) at its place of use and the cooling (for example by the pressure of the coolant in a cooling circuit connected to the power module).
  • a structured sub-area of the ceramic carrier body acts as a cooling element, in that on its underside, geometric elements made from the material of the carrier body are provided as an array in a specific arrangement and with a specific geometric shape (for example cone-shaped or diamond-shaped) Carrier body with a (metallic) interconnect structure
  • Conductors, pick-up points, contact points and connection points applied directly i.e. without intermediate layers on the surface of the ceramic carrier body
  • active soldering Active Metal Bonding
  • chemically soldering the interconnect structure directly onto the surface of the carrier body via an oxide bond or by the DCB method
  • the electronic components of the circuit arrangement can be electrically conductively connected to one another and / or to connection contacts via the interconnect structure.
  • connection contacts are attached to the connection points of the guideway structure, which are used for the (external) connection of the
  • Power module with other modules or components serve.
  • the heat dissipation of the circuit arrangement takes place from the carrier body.
  • the border of the cooling element which is designed as an array with a multiplicity of (identically) structured geometric elements, is adapted to the shape of the carrier body; the size (area) of the array depends on the power loss to be dissipated, ie the required cooling function must be guaranteed by the geometric elements of the array.
  • a certain number of geometric elements is spaced equidistantly from one another to form a row, while two adjacent rows of geometric elements are offset from one another (preferably such that the geometric elements of one row are positioned in the gap of the adjacent row defined by the spacing of the geometric elements) ).
  • the shape, number and arrangement of the geometric elements are adapted to the particular application of the power module and to the cooling capacity required.
  • the geometric elements are e.g. formed as diamonds, truncated pyramids, cones or lenses and have, for example. a slightly bevelled side.
  • the cooling element is produced in the same manufacturing step and in the same tool as the carrier body, for example. in mold-falling tools, e.g. by means of dry pressing or by means of injection molding with subsequent sintering; ie the geometric elements made of the same material as the carrier body are formed together with the latter from a template having a corresponding shape.
  • the cooling element or the array of geometric elements is, in particular, integrated in a cooling circuit, for example. the array is cooled by the coolant of the cooling circuit (e.g.
  • flow channels for the coolant of the cooling circuit are predetermined by the geometric elements of the array, in that the coolant flows between the geometric elements (between the different rows of the geometric elements).
  • Heat transfer from the carrier body to the coolant can be set via the cooling element.
  • the power module combines several advantages:
  • the carrier body serves both for heat dissipation and as a circuit carrier (substrate) for the electronic components of the circuit arrangement and for sealing in the case of a direct arrangement of the power module in a cooling circuit and thus the integration of the array of geometric elements in the cooling circuit; Thermal problems can be avoided by the direct connection of the electronic components of the circuit arrangement on the carrier body and the direct connection of the cooling element to the carrier body without intermediate layers (therefore low thermal resistance), so that the power module is highly reliable and has a long service life.
  • the predeterminable structure of the cooling element ensures adequate heat dissipation of the electronic components of the circuit arrangement, in particular a variably selectable heat dissipation by appropriate design of the cooling element and thus of the geometric elements, so that, in particular,
  • the flow rate of the coolant and the pressure loss in the cooling circuit can be adapted to the requirements.
  • the production outlay is low, since simple production of the cooling element is possible (in particular together with the carrier body in one production step using the same tool) and production problems can be avoided, so that low production costs are also incurred, in particular also through the use of simple and inexpensive materials.
  • FIG. 1 shows a view of the top of the power module
  • FIG. 2 shows a sectional view of the power module
  • FIG. 3 shows a view of the bottom of the power module.
  • the power module 1 is, for example. used as a power converter for liquid-cooled electric motors in the motor vehicle sector (output, for example, 10 kW); due to the Resulting high power loss, the power converter 1 is coupled directly to the liquid cooling on the electric motor, ie integrated in the cooling circuit of the electric motor operated with the coolant water.
  • the power converter 1 consists of the following components:
  • Ceramic carrier for example.
  • Carrier body 2 consisting of AIN as circuit carrier with the dimensions of example. 90 mm x 57 mm x 3 mm, which is integrated directly into the cooling circuit and thus also seals the cooling circuit against the other components of the power converter 1.
  • Conductor structure 7 consisting of copper (thickness, for example, 0.3 mm) with conductor tracks 8, receiving points 1 3, contact points 9 and connecting points 1 1 applied, for example. chemically soldered onto the carrier body 2 by means of a direct (active) soldering process.
  • the electronic components 5 of the circuit arrangement 6 are contacted, i.e. electrically conductively connected to the interconnect structure 7; at the connection points 1 1, connection contacts 1 2 are attached, for example. soldered by means of the solder 20.
  • circuit arrangement 6 which has electronic components 5 and which, in particular, has power components for realizing the converter function and the resulting control of the electric motor.
  • the electronic components 5 of the circuit arrangement ⁇ are applied as silicon chips at the receiving points 13 on the interconnect structure 7 (for example soldered by means of a soft soldering process) and for example. Connected to the contact points 9 of the conductor tracks 8 of the conductor track structure 7 via bond connections 10 and / or to other electronic components 5.
  • the power loss of the electronic components 5 of the circuit arrangement ⁇ (in particular of the power components) is dissipated via the carrier body 2 and the cooling element 3 into the cooling circuit through which the coolant flows.
  • the cooling element 3 On the underside 15 of the carrier body 2, the one produced together with the carrier body 2 in a mold-removing tool by pressing, for example. made of AIN, cooling element 3 arranged.
  • the cooling element 3 is structured in a certain way to form an array 21 of geometric elements 4, the geometric elements 4 of the cooling element 3, for example. have a diamond-like shape, the side surfaces of which are slightly beveled.
  • the geometric elements 4 of the cooling element 3 are in a certain number in one
  • Ex. Are in a row 1 7 on a length of ex. 80 mm 1 2 geometric elements 4 arranged one behind the other and with a width of e.g. 40 mm 6 different rows 1 7 with geometric elements 4 arranged offset to one another.
  • the geometric elements 4 of the cooling element 3 with a height of e.g. 6 mm protrude into the cooling circuit of the electric motor and the coolant flows through water, a certain flow direction and a certain flow rate of the cooling water being predetermined in accordance with the flow channels 18 formed by the arrangement of the geometric elements 4.

Abstract

The invention relates to a power module having a simple and cost-effective arrangement and ensuring reliable operation. To this end, a circuit comprising at least one electronic component is arranged on a carrier body. A conductor pattern is embodied on the upper side of said carrier body, and a structured cooler element consisting of the material of the carrier body is provided on the lower side of the same. The invention also relates to the use of the power module as a power converter for electric motors.

Description

Leistungsmodul power module
In vielen Bereichen werden elektronische Baugruppen für unterschiedliche Aufgaben und Anwendungen eingesetzt; insbesondere sind als Leistungsmodule ausgebildete elektronische Baugruppen zu Ansteuerzwecken gebräuchlich, beispielsweise zur Drehzahl- und Leistungsregelung von Elektromotoren. Bestandteil derartiger Leistungsmodule sind elektronische Bauteile zum Bereitstellen der benötigten Leistung (bsp. bei Elektromotoren typischerweise im kW-Bereich) und zum Bereitstellen von Steuersignalen und/oder zur Auswertung von Meßsignalen. Insbesondere ist für die in der Regel sowohl aktive Bauteile wie im Schaltbetrieb mit hohen Stromänderungsgeschwindigkeiten arbeitende Leistungsbauteile (insbe- sondere integrierte Schaltkreise als Leistungsschalter) als auch passive Bauteile wieIn many areas, electronic assemblies are used for different tasks and applications; In particular, electronic modules designed as power modules are used for control purposes, for example for speed and power control of electric motors. Such power modules include electronic components for providing the required power (for example typically in the kW range for electric motors) and for providing control signals and / or for evaluating measurement signals. In particular, for the components that are generally both active components, such as power components operating in switching operation with high current change speeds (in particular integrated circuits as circuit breakers), and passive components such as
Widerstände (bsp. Shunts zur Strommessung) und Kondensatoren aufweisende Schaltungsanordnung des Leistungsmoduls zur Vermeidung von Überspannungen ein induktionsarmer Aufbau erforderlich. Demzufolge wird die Schaltungsanordnung des Leistungsmoduls üblicherweise auf einen isolierenden Trägerkörper (ein isolie- rendes Substrat) aufgebracht, der in der Regel aus einem keramischen Material besteht. Zur mechanischen Stabilisierung und zur Wärmeabfuhr der Verlustleistung der Bauteile der Schaltungsanordnung (insbesondere der Leistungsbauteile) wird der Trägerkörper auf einen bsp. an ein Kühlsystem angeschlossenen massiven metallischen Kühlkörper (bsp. eine Kupferplatte oder Aluminiumplatte) aufgebracht und an diesen über eine Verbindungsschicht, bsp. mittels Lot oder Wärmeleitpaste, thermisch angebunden; die Isolation (Potentialtrennung) zwischen den elektronischen Bauteilen der Schaltungsanordnung und dem Kühlkörper wird über den isolierenden Trägerkörper realisiert. Aufgrund der unterschiedlichen thermischen Ausdehnung von Substrat und Kühlkörper (bedingt durch die unterschiedlichen thermischen Ausdehnungskoeffizienten des keramischen Materials des Trägerkörpers und des Metalls des Kühlkörpers) ist zum einen (insbesondere bei einem großflächigen Trägerkörper) zum Spannungs- ausgleich eine relativ dicke Verbindungsschicht zwischen Trägerkörper und Kühlkörper erforderlich (hierdurch ergibt sich ein hoher Wärmewiderstand, insbesondere auch durch das Wärmeleitvermögen negativ beeinflussende Einschlüsse in der Verbindungsschicht, bsp. Lunker in einer Lötschicht), so daß zwischen den elektronischen Bauteilen der Schaltungsanordnung und dem Kühlkörper aufgrund der hier- durch gebildeten Wärmewiderstände ein schlechter Wärmeübergang gegeben ist und sich die Abfuhr der Verlustleistung (Wärmeabfuhr) der elektronischen Bauteilen demzufolge schwierig gestaltet, zum andern (insbesondere bei einem großen Temperaturbereich für den Einsatz des Leistungsmoduls und den hierdurch bedingten Temperaturwechseln) die Verbindung zwischen dem Trägerkörper und dem Kühlkör- per oftmals beeinträchtigt, so daß die Lebensdauer und damit die Zuverlässigkeit des Leistungsmoduls signifikant verringert wird.Resistors (e.g. shunts for current measurement) and capacitors have circuitry of the power module to avoid overvoltages, a low-induction structure required. Accordingly, the circuit arrangement of the power module is usually applied to an insulating carrier body (an insulating substrate), which generally consists of a ceramic material. For mechanical stabilization and heat dissipation of the power loss of the components of the circuit arrangement (in particular the power components), the carrier body is placed on an example. massive metal heat sink (e.g. a copper plate or aluminum plate) attached to a cooling system and attached to this via a connecting layer, e.g. by means of solder or thermal paste, thermally bonded; the insulation (electrical isolation) between the electronic components of the circuit arrangement and the heat sink is realized via the insulating carrier body. Due to the different thermal expansion of the substrate and the heat sink (due to the different thermal expansion coefficients of the ceramic material of the support body and the metal of the heat sink), a relatively thick connection layer between the support body and the heat sink is required (especially in the case of a large-area support body) to equalize the stress (This results in a high thermal resistance, in particular also inclusions in the connection layer which have a negative influence on the thermal conductivity, for example blowholes in a solder layer), so that there is poor heat transfer between the electronic components of the circuit arrangement and the heat sink due to the thermal resistances formed thereby is and the dissipation of the power loss (heat dissipation) of the electronic components is therefore difficult, on the other hand (especially in a large temperature range for the egg Power module and the resulting temperature changes) often affects the connection between the support body and the heat sink, so that the service life and thus the reliability of the power module is significantly reduced.
Der Erfindung liegt die Aufgabe zugrunde, ein Leistungsmodul mit einem einfachen Aufbau, einer einfachen Fertigung, geringen Kosten, einer hohen Zuverlässigkeit und vorteilhaften thermischen Eigenschaften anzugeben.The invention has for its object to provide a power module with a simple structure, simple manufacture, low costs, high reliability and advantageous thermal properties.
Diese Aufgabe wird nach der Erfindung durch die Merkmale des Patentanspruchs 1 gelöst.This object is achieved according to the invention by the features of patent claim 1.
Vorteilhafte Ausgestaltungen der Erfindung sind Bestandteil der übrigen Patentansprüche.Advantageous embodiments of the invention are part of the remaining claims.
Als Bestandteil des Leistungsmoduls sind insbesondere folgende Komponenten vorgesehen:The following components in particular are provided as part of the power module:
• Ein aus einem isolierendem Material mit hoher Wärmeleitfähigkeit bestehender (dicker) Trägerkörper, der bsp. als Keramikträger aus einem keramischen Mate- rial, bsp. aus Aluminiumoxid AkO* oder Aluminiumnitrid AIN, besteht; der Trägerkörper kann in formfallenden Werkzeugen hergestellt werden, bsp. mittels Trok- kenpressen oder mittels Spritzguß mit anschließendem Sintern. Die Dicke des Trägerkörpers wird nach Maßgabe seiner Größe (Fläche) und der durch den (bsp. durch Verschraubung erfolgenden) Einbau des Leistungsmoduls an seinem Einsatzort sowie die Kühlung (bsp. durch den Druck des Kühlmittels in einem an das Leistungsmodul angeschlossenen Kühlkreislauf) bedingten mechanischen Belastung ausgewählt. Gleichzeitig fungiert ein strukturierter Teilbereich des keramischen Trägerkörpers als Kühielement, indem an seiner Unterseite aus dem Material des Trägerkörpers gefertigte Geometrieelemente als Array in einer bestimmten Anordnung und mit einer bestimmten geometrischen Form (bsp. zap- fenförmig oder rautenförmig) vorgesehen sind « Auf die Oberseite des Trägerkörpers wird eine (metallische) Leitbahnstruktur mit• A (thick) carrier body consisting of an insulating material with high thermal conductivity, for example. as a ceramic carrier made of a ceramic material, e.g. made of aluminum oxide AkO * or aluminum nitride AIN; the carrier body can be manufactured in mold-falling tools, for example. by means of dry presses or by injection molding with subsequent sintering. The thickness of the The carrier body is selected in accordance with its size (surface area) and the mechanical load caused by the installation of the power module (for example by screwing) at its place of use and the cooling (for example by the pressure of the coolant in a cooling circuit connected to the power module). At the same time, a structured sub-area of the ceramic carrier body acts as a cooling element, in that on its underside, geometric elements made from the material of the carrier body are provided as an array in a specific arrangement and with a specific geometric shape (for example cone-shaped or diamond-shaped) Carrier body with a (metallic) interconnect structure
Leiterbahnen, Aufnahmestellen, Kontaktstellen und Anschlußstellen direkt aufgebracht (d.h. ohne Zwischenschichten auf die Oberfläche des keramischen Trägerkörpers), bsp. durch Aktivlötung („Active Metal Bonding"), indem die Leitbahnstruktur chemisch über eine Oxidbindung direkt auf die Oberfläche des Trä- gerkörpers gelötet wird, oder durch das DCB-Verfahren, indem die Leitbahnstruktur mechanisch über das aufgeschmolzene Metall der Leitbahnstruktur im Trägerkörper (insbesondere in den Poren eines keramischen Trägerkörpers) verankert wird. Über die Leitbahnstruktur können die elektronischen Bauteile der Schaltungsanordnung untereinander und/oder mit Anschlußkontakten elek- frisch leitend verbunden werden.Conductors, pick-up points, contact points and connection points applied directly (i.e. without intermediate layers on the surface of the ceramic carrier body), e.g. by active soldering ("Active Metal Bonding"), by chemically soldering the interconnect structure directly onto the surface of the carrier body via an oxide bond, or by the DCB method, by mechanically soldering the interconnect structure over the molten metal of the interconnect structure in the carrier body (especially in the pores of a ceramic carrier body) The electronic components of the circuit arrangement can be electrically conductively connected to one another and / or to connection contacts via the interconnect structure.
• Auf die Aufnahmestellen der Leitbahnstruktur werden die elektronischen Bauteile der Schaltungsanordnung, insbesondere die Leistungsbauteile, bsp. in Form von Silizium-Chips, aufgebracht (bsp. mittels Weichlot oder durch Aufpressen), die miteinander und/oder mit der Leitbahnstruktur kontaktiert werden (bsp. entweder mittels Drahtbonden durch Kontaktierung der Anschlüsse der elektronischen Bauteile über Bonddrähte mit bestimmten Kontaktstellen der Leitbahnstruktur oder mit Anschlüssen weiterer Bauteile oder mittels eines Niedertemperatur-Sinterverfahrens durch direktes Aufbringen und Vereintem der Anschlüsse der elektronischen Bauteile). Weiterhin werden an die Anschlußstellen der Leit- bahnstruktur Anschlußkontakte angebracht, die zur (externen) Verbindung des• The electronic components of the circuit arrangement, in particular the power components, eg. in the form of silicon chips, applied (e.g. by means of soft solder or by pressing), which are contacted with one another and / or with the interconnect structure (e.g. either by wire bonding by contacting the connections of the electronic components via bonding wires with specific contact points of the interconnect structure or with Connections of other components or by means of a low-temperature sintering process by directly applying and combining the connections of the electronic components). Furthermore, connection contacts are attached to the connection points of the guideway structure, which are used for the (external) connection of the
Leistungsmoduls mit weiteren Baugruppen oder Bauteilen dienen.Power module with other modules or components serve.
• Über das auf der Unterseite des Trägerkörpers ausgebildete strukturierte Kühle- lement erfolgt die Wärmeabfuhr der Schaltungsanordnung (der Verlustleistung der elektronischen Bauteile der Schaltungsanordnung) vom Trägerkörper her. Die Umrandung des als Array mit einer Vielzahl von (gleichartig) strukturierten Geometrieelementen ausgebildeten Kühlelements ist an die Form des Träger- körpers angepaßt; die Größe (Fläche) des Arrays richtet sich nach der abzuführenden Verlustleistung, d.h. die erforderliche Kühlfunktion muß durch die Geometrieelemente des Arrays gewährleistet werden. Jeweils eine bestimmte Anzahl von Geometrieelementen ist äquidistant zur Bildung einer Reihe hintereinander beabstandet angeordnet, während jeweils zwei benachbarte Reihen Geome- trieelemente gegeneinander versetzt werden (vorzugsweise so, daß die Geometrieelemente einer Reihe in der durch den Abstand der Geometrieelemente definierten Lücke der benachbarten Reihe positioniert sind). Die Form, Anzahl und Anordnung der Geometrieelemente, insbesondere die Anordnung der Geometrieelemente zueinander und die Anordnung der Geometrieelemente im Array, wird an den jeweiligen Anwendungszweck des Leistungsmoduls und an die erforderliche Kühlleistung angepaßt. Die Geometrieelemente sind bsp. als Rauten, Pyramidenstümpfe, Zapfen oder Linse ausgebildet und weisen bsp. eine leicht abgeschrägte Seitenfläche auf. Das Kühlelement wird im gleichen Herstellungsschritt und im gleichen Werkzeug wie der Trägerkörper hergestellt, bsp. in formfallenden Werkzeugen, bsp. mittels Trockenpressen oder mittels Spritzguß mit anschließendem Sintern; d.h. die aus dem gleichen Material wie der Trägerkörper bestehenden Geometrieeiemente werden zusammen mit diesem aus einer eine entsprechende Form aufweisenden Vorlage ausgeformt. Das Kühlelement bzw. das Array der Geometrieelemente ist insbesondere in einen Kühl- kreislauf integriert, bsp. wird das Array vom Kühlmittel des Kühlkreislaufs (bsp.Via the structured cooling formed on the underside of the carrier body element, the heat dissipation of the circuit arrangement (the power loss of the electronic components of the circuit arrangement) takes place from the carrier body. The border of the cooling element, which is designed as an array with a multiplicity of (identically) structured geometric elements, is adapted to the shape of the carrier body; the size (area) of the array depends on the power loss to be dissipated, ie the required cooling function must be guaranteed by the geometric elements of the array. A certain number of geometric elements is spaced equidistantly from one another to form a row, while two adjacent rows of geometric elements are offset from one another (preferably such that the geometric elements of one row are positioned in the gap of the adjacent row defined by the spacing of the geometric elements) ). The shape, number and arrangement of the geometric elements, in particular the arrangement of the geometric elements with respect to one another and the arrangement of the geometric elements in the array, are adapted to the particular application of the power module and to the cooling capacity required. The geometric elements are e.g. formed as diamonds, truncated pyramids, cones or lenses and have, for example. a slightly bevelled side. The cooling element is produced in the same manufacturing step and in the same tool as the carrier body, for example. in mold-falling tools, e.g. by means of dry pressing or by means of injection molding with subsequent sintering; ie the geometric elements made of the same material as the carrier body are formed together with the latter from a template having a corresponding shape. The cooling element or the array of geometric elements is, in particular, integrated in a cooling circuit, for example. the array is cooled by the coolant of the cooling circuit (e.g.
Wasser oder Luft) durchströmt; durch die Geometrieelemente des Arrays werden Strömungskanäle für das Kühlmittel des Kühlkreislaufs vorgegeben, indem das Kühlmittel zwischen den Geometrieeiementen (zwischen den verschiedenen Reihen der Geometrieelemente) durchströmt. Durch die Vorgabe der Anordnung und der Struktur (Form) des Arrays und damit der Geometrieelemente kann derWater or air) flows through; flow channels for the coolant of the cooling circuit are predetermined by the geometric elements of the array, in that the coolant flows between the geometric elements (between the different rows of the geometric elements). By specifying the arrangement and structure (shape) of the array and thus the geometric elements, the
Wärmeübergang vom Trägerkörper via Kühlelement auf das Kühlmittel eingestellt werden. Das Leistungsmodul vereinigt mehrere Vorteile in sich:Heat transfer from the carrier body to the coolant can be set via the cooling element. The power module combines several advantages:
Der Trägerkörper dient sowohl zur Wärmeabfuhr als auch als Schaltungsträger (Substrat) für die elektronischen Bauteile der Schaltungsanordnung sowie zur Abdich- tung bei einer direkten Anordnung des Leistungsmoduls in einem Kühlkreislauf und damit der Integration des Arrays der Geometrieelemente im Kühlkreislauf; durch die unmittelbare Anbindung der elektronischen Bauteile der Schaltungsanordnung auf dem Trägerkörper und der direkten Anbindung des Kühlelements an den Trägerkörper ohne Zwischenschichten (daher geringer thermischer Widerstand) können ther- mische Probleme vermieden werden, so daß eine hohe Zuverlässigkeit und Lebensdauer des Leistungsmoduls gegeben ist.The carrier body serves both for heat dissipation and as a circuit carrier (substrate) for the electronic components of the circuit arrangement and for sealing in the case of a direct arrangement of the power module in a cooling circuit and thus the integration of the array of geometric elements in the cooling circuit; Thermal problems can be avoided by the direct connection of the electronic components of the circuit arrangement on the carrier body and the direct connection of the cooling element to the carrier body without intermediate layers (therefore low thermal resistance), so that the power module is highly reliable and has a long service life.
Durch die vorgebbare Struktur des Kühlelements ist eine ausreichende Wärmeabfuhr der elektronischen Bauteile der Schaltungsanordnung gewährleistet, insbesondere eine variabel wählbare Wärmeabfuhr durch entsprechende Ausgestaltung des Kühlelements und damit der Geometrieelemente, so daß insbesondere bei einerThe predeterminable structure of the cooling element ensures adequate heat dissipation of the electronic components of the circuit arrangement, in particular a variably selectable heat dissipation by appropriate design of the cooling element and thus of the geometric elements, so that, in particular,
Integration des Kühlelements in den Kühlkreislauf eines Kühlsystems die Durchflußgeschwindigkeit des Kühlmittels und der Druckverlust im Kühlkreislauf an die Anforderungen angepaßt werden kann. Der Herstellungsaufwand ist gering, da eine einfache Herstellung des Kühlelements möglich ist (insbesondere zusammen mit dem Trägerkörper in einem Herstellungsschritt mit dem gleichen Werkzeug) und Fertigungsprobleme vermieden werden können, so daß auch geringe Fertigungskosten anfallen, insbesondere auch durch den Einsatz einfacher und kostengünstiger Materialien.Integration of the cooling element in the cooling circuit of a cooling system, the flow rate of the coolant and the pressure loss in the cooling circuit can be adapted to the requirements. The production outlay is low, since simple production of the cooling element is possible (in particular together with the carrier body in one production step using the same tool) and production problems can be avoided, so that low production costs are also incurred, in particular also through the use of simple and inexpensive materials.
Im Zusammenhang mit der Zeichnung (Figuren 1 bis 3) soll das Leistungsmodul anhand eines Ausführungsbeispiels erläutert werden. Hierbei zeigen: Figur 1 eine Ansicht der Oberseite des Leistungsmoduls, Figur 2 eine Schnittdarstellung des Leistungsmoduls, Figur 3 eine Ansicht der Unterseite des Leistungsmoduls.In connection with the drawing (Figures 1 to 3), the power module will be explained using an exemplary embodiment. 1 shows a view of the top of the power module, FIG. 2 shows a sectional view of the power module, FIG. 3 shows a view of the bottom of the power module.
Das Leistungsmodul 1 wird bsp. als Leistungsumrichter für flüssigkeitsgekühlte Elektromotoren im Kraftfahrzeugbereich eingesetzt (Leistung bsp. 10 kW); aufgrund der entstehenden hohen Verlustleistung wird der Leistungsumrichter 1 direkt am Elektromotor an die Flüssigkeitskühlung angekoppelt, d.h. in den mit dem Kühlmittel Wasser betriebenen Kühlkreislauf des Elektromotors integriert.The power module 1 is, for example. used as a power converter for liquid-cooled electric motors in the motor vehicle sector (output, for example, 10 kW); due to the Resulting high power loss, the power converter 1 is coupled directly to the liquid cooling on the electric motor, ie integrated in the cooling circuit of the electric motor operated with the coolant water.
Der Leistungsumrichter 1 besteht aus folgenden Komponenten:The power converter 1 consists of the following components:
• Einem bsp. als Keramiksubstrat (Keramikträger) ausgebildeten, bsp. aus AIN bestehenden Trägerkörper 2 als Schaltungsträger mit den Abmessungen von bsp. 90 mm x 57 mm x 3 mm, der direkt in den Kühlkreislauf integriert ist und damit auch die Abdichtung des Kühlkreislaufs gegenüber den weiteren Kompo- nenten des Leistungsumrichters 1 übernimmt.• An example formed as a ceramic substrate (ceramic carrier), for example. Carrier body 2 consisting of AIN as circuit carrier with the dimensions of example. 90 mm x 57 mm x 3 mm, which is integrated directly into the cooling circuit and thus also seals the cooling circuit against the other components of the power converter 1.
• Auf die Oberseite 1 des Trägerkörpers 2 ist eine bsp. aus Kupfer bestehende Leitbahnstruktur 7 (Dicke bsp. 0.3 mm) mit Leiterbahnen 8, Aufnahmestellen 1 3, Kontaktstellen 9 und Anschlußstellen 1 1 aufgebracht, bsp. mittels eines direkten (aktiven) Lötprozesses auf den Trägerkörper 2 chemisch aufgelötet. An den Kontaktstellen 9 werden die elektronischen Bauteile 5 der Schaltungsanordnung 6 kontaktiert, d.h. mit der Leitbahnstruktur 7 elektrisch leitend verbunden; an den Anschlußstellen 1 1 werden Anschlußkontakte 1 2 angebracht, bsp. mittels des Lots 20 angelötet.• On the top 1 of the carrier body 2 is an example. Conductor structure 7 consisting of copper (thickness, for example, 0.3 mm) with conductor tracks 8, receiving points 1 3, contact points 9 and connecting points 1 1 applied, for example. chemically soldered onto the carrier body 2 by means of a direct (active) soldering process. At the contact points 9, the electronic components 5 of the circuit arrangement 6 are contacted, i.e. electrically conductively connected to the interconnect structure 7; at the connection points 1 1, connection contacts 1 2 are attached, for example. soldered by means of the solder 20.
• Auf dem Trägerkörper 2 ist eine elektronische Bauteile 5 aufweisende Schal- tungsanordnung 6 angeordnet, die insbesondere Leistungsbauteile zur Realisierung der Umrichterfunktion und der sich hieraus ergebenden Ansteuerung des Elektromotors aufweist. Die elektronischen Bauteile 5 der Schaltungsanordnung ό werden als Silizium-Chips an den Aufnahmestellen 13 auf die Leitbahnstruktur 7 aufgebracht (bsp. mittels eines Weichlötprozesses aufgelötet) und bsp. über Bondverbindungen 10 mit den Kontaktstellen 9 der Leiterbahnen 8 der Leitbahnstruktur 7 verbunden und/oder mit anderen elektronischen Bauteilen 5.• On the carrier body 2 there is arranged a circuit arrangement 6 which has electronic components 5 and which, in particular, has power components for realizing the converter function and the resulting control of the electric motor. The electronic components 5 of the circuit arrangement ό are applied as silicon chips at the receiving points 13 on the interconnect structure 7 (for example soldered by means of a soft soldering process) and for example. Connected to the contact points 9 of the conductor tracks 8 of the conductor track structure 7 via bond connections 10 and / or to other electronic components 5.
• Die Verlustleistung der elektronischen Bauteile 5 der Schaitungsanordnung ό (insbesondere der Leistungsbauteile) wird über den Trägerkörper 2 und das Kühlelement 3 in den mit dem Kühlmittel Wasser durchströmten Kühlkreislauf abgeführt. Hierzu ist auf der Unterseite 1 5 des Trägerkörpers 2 das zusammen mit dem Trägerkörper 2 in einem formfallenden Werkzeug durch Pressen hergestellte, bsp. aus AIN bestehende, Kühlelement 3 angeordnet. Das Kühlelement 3 ist in einer bestimmten Weise zur Ausbildung eines Arrays 21 von Geometrieelementen 4 strukturiert, wobei die Geometrieelemente 4 des Kühlelements 3 bsp. eine rautenähnliche Form aufweisen, deren Seitenflächen leicht abgeschrägt sind. Zur Bildung von Strömungskanälen 1 8 für das Kühlmittel sind die Geometrieelemente 4 des Kühlelements 3 in einer bestimmten Anzahl in einer• The power loss of the electronic components 5 of the circuit arrangement ό (in particular of the power components) is dissipated via the carrier body 2 and the cooling element 3 into the cooling circuit through which the coolant flows. For this purpose, on the underside 15 of the carrier body 2, the one produced together with the carrier body 2 in a mold-removing tool by pressing, for example. made of AIN, cooling element 3 arranged. The cooling element 3 is structured in a certain way to form an array 21 of geometric elements 4, the geometric elements 4 of the cooling element 3, for example. have a diamond-like shape, the side surfaces of which are slightly beveled. To form flow channels 18 for the coolant, the geometric elements 4 of the cooling element 3 are in a certain number in one
Reihe 1 7 äquidistant beabstandet hintereinander und in verschiedenen benachbarten Reihen 1 7 versetzt zueinander angeordnet; insbesondere sind zwei benachbarte Reihen 1 7 jeweils so versetzt zueinander angeordnet, daß die Geometrieelemente 4 einer Reihe 1 7 in die durch den Abstand der Geometrieelemente 4 definierten Lücke zwischen den Geometrieelementen 4 der benachbarten Reihe 1 7 positioniert sind. Bsp. sind in einer Reihe 1 7 auf einer Länge von bsp. 80 mm 1 2 Geometrieelemente 4 hintereinander angeordnet und auf einer Breite von bsp. 40 mm 6 verschiedene Reihen 1 7 mit Geometrieelementen 4 versetzt zueinander angeordnet. Die Geometrieelemente 4 des Kühlelements 3 mit einer Höhe von bsp. 6 mm ragen in den Kühlkreislauf des Elektromotors hinein und werden vom Kühlmittel Wasser durchflössen, wobei nach Maßgabe der durch die Anordnung der Geometrieelemente 4 gebildeten Strömungskanäle 1 8 eine bestimme Durchflußrichtung und eine bestimmte Strömungsgeschwindigkeit des Kühlwassers vorgegeben wird. Row 1 7 equidistantly spaced one behind the other and in different adjacent rows 1 7 staggered; in particular, two adjacent rows 17 are each offset from one another in such a way that the geometric elements 4 of one row 17 are positioned in the gap defined by the spacing of the geometric elements 4 between the geometric elements 4 of the adjacent row 17. Ex. Are in a row 1 7 on a length of ex. 80 mm 1 2 geometric elements 4 arranged one behind the other and with a width of e.g. 40 mm 6 different rows 1 7 with geometric elements 4 arranged offset to one another. The geometric elements 4 of the cooling element 3 with a height of e.g. 6 mm protrude into the cooling circuit of the electric motor and the coolant flows through water, a certain flow direction and a certain flow rate of the cooling water being predetermined in accordance with the flow channels 18 formed by the arrangement of the geometric elements 4.

Claims

Patentansprüche claims
1 . Leistungsmodul (1 ) mit einem Trägerkörper (2) zur Aufnahme einer Schaltungsanordnung (6) mit mindestens einem elektronischen Bauteil (5), einer auf der Oberseite (4) des Trägerkörpers (2) gebildeten Leitbahnstruktur (7), und einem auf der Unterseite (1 5) des Trägerkörpers (2) gebildeten, aus dem Material des Trägerkörpers (2) bestehenden strukturierten Kühlelement (3).1 . Power module (1) with a carrier body (2) for receiving a circuit arrangement (6) with at least one electronic component (5), an interconnect structure (7) formed on the top (4) of the carrier body (2), and one on the bottom ( 1 5) of the support body (2) formed from the material of the support body (2) structured cooling element (3).
2. Leistungsmodul nach Anspruch 1 , dadurch gekennzeichnet, daß das Kühlelement2. Power module according to claim 1, characterized in that the cooling element
(3) aus einem Array (21 ) mit einer Vielzahl von eine vorgegebene Anordnung aufweisenden Geometrieelementen (4) gebildet ist.(3) is formed from an array (21) with a multiplicity of geometric elements (4) having a predetermined arrangement.
3. Leistungsmodul nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß die Geo- metrieelemente (4) in mehreren Reihen (1 7) versetzt zueinander angeordnet sind, und daß mehrere Geometrieelemente (4) in einer Reihe (1 7) äquidistant beabstandet zueinander angeordnet sind.3. Power module according to claim 1 or 2, characterized in that the geometry elements (4) in a plurality of rows (1 7) are arranged offset from one another, and that a plurality of geometry elements (4) in a row (1 7) are arranged equidistantly spaced from one another are.
4. Leistungsmodui nach Anspruch 2 oder 3, dadurch gekennzeichnet, daß die Geometrieelemente (4) annähernd rautenförmig ausgebildet sind.4. power module according to claim 2 or 3, characterized in that the geometric elements (4) are approximately diamond-shaped.
5. Leistungsmodul nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, daß die auf der Oberseite (14) des Trägerkörper (2) angeordnete Leitbahnstruktur (7) Leiterbahnen (8), Aufnahmestellen (1 3) zur Aufnahme der elektronischen Bauteile (5) der Schaltungsanordnung (6), Kontaktstellen (9) zur Kontaktierung der elektronischen Bauteile (5) der Schaltungsanordnung (6) und Anschlußstellen (1 1 ) zur Anbindung von Anschlußkontakten (1 2) aufweist. 5. Power module according to one of claims 1 to 4, characterized in that the on the top (14) of the carrier body (2) arranged interconnect structure (7) interconnects (8), receiving points (1 3) for receiving the electronic components (5) the circuit arrangement (6), contact points (9) for contacting the electronic components (5) of the circuit arrangement (6) and connection points (1 1) for connecting connection contacts (1 2).
EP01985858A 2001-01-20 2001-12-10 Power module Ceased EP1378008A2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10102621 2001-01-20
DE10102621A DE10102621B4 (en) 2001-01-20 2001-01-20 power module
PCT/EP2001/014464 WO2002058142A2 (en) 2001-01-20 2001-12-10 Power module

Publications (1)

Publication Number Publication Date
EP1378008A2 true EP1378008A2 (en) 2004-01-07

Family

ID=7671269

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01985858A Ceased EP1378008A2 (en) 2001-01-20 2001-12-10 Power module

Country Status (4)

Country Link
US (1) US6952347B2 (en)
EP (1) EP1378008A2 (en)
DE (1) DE10102621B4 (en)
WO (1) WO2002058142A2 (en)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10204200A1 (en) * 2002-02-01 2003-08-21 Conti Temic Microelectronic power module
DE10349775B4 (en) * 2003-10-24 2006-05-11 Sitronic Gmbh & Co. Kg Circuit carrier for light-emitting diodes
US9153960B2 (en) 2004-01-15 2015-10-06 Comarco Wireless Technologies, Inc. Power supply equipment utilizing interchangeable tips to provide power and a data signal to electronic devices
DE102004024920B4 (en) * 2004-05-19 2009-06-10 Trafag Ag pressure sensor
DE102004057421B4 (en) * 2004-11-27 2009-07-09 Semikron Elektronik Gmbh & Co. Kg Pressure-contacted power semiconductor module for high ambient temperatures and method for its production
US7236368B2 (en) * 2005-01-26 2007-06-26 Power-One, Inc. Integral molded heat sinks on DC-DC converters and power supplies
US7593230B2 (en) * 2005-05-05 2009-09-22 Sensys Medical, Inc. Apparatus for absorbing and dissipating excess heat generated by a system
TWI449137B (en) * 2006-03-23 2014-08-11 Ceramtec Ag Traegerkoerper fuer bauelemente oder schaltungen
DE102006028675B4 (en) * 2006-06-22 2008-08-21 Siemens Ag Cooling arrangement for arranged on a support plate electrical components
US7996987B2 (en) * 2006-10-17 2011-08-16 Broadcom Corporation Single footprint family of integrated power modules
DE102008018841A1 (en) 2008-04-15 2009-10-22 Conti Temic Microelectronic Gmbh Method for producing and constructing a power module
JP5345017B2 (en) 2009-08-27 2013-11-20 三菱電機株式会社 Power semiconductor device and manufacturing method thereof
US8203839B2 (en) * 2010-03-10 2012-06-19 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling devices, power modules, and vehicles incorporating the same
US20110228486A1 (en) * 2010-03-17 2011-09-22 Comarco Wireless Technologies, Inc. Power supply with low touch-temperature surface
DE102010062944A1 (en) * 2010-12-13 2012-06-14 Zf Friedrichshafen Ag Printed circuit board for control device of motor vehicle, has enlarged planar surface that is formed at side surface opposite to planar surface of surface structure formed apart from function structure of board main portion
DE102014107217A1 (en) * 2014-05-19 2015-11-19 Ceram Tec Gmbh The power semiconductor module
DE102015215682A1 (en) * 2015-08-18 2016-09-08 Continental Automotive Gmbh Cooling device, power electronic assembly with a cooling device
DE102016202547A1 (en) * 2016-02-18 2017-08-24 Zf Friedrichshafen Ag Integrated vehicle control unit and method of manufacturing an integrated vehicle control unit
AT519741B1 (en) * 2017-07-18 2018-10-15 Zkw Group Gmbh Thermal coupling of copper expansion surfaces
EP3671828A1 (en) * 2018-12-21 2020-06-24 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Evaporative microchip cooling
DE102019202425A1 (en) 2019-02-22 2020-10-22 Volkswagen Aktiengesellschaft Arrangement for uniform cooling of components and motor vehicle with at least one arrangement
USD942403S1 (en) * 2019-10-24 2022-02-01 Wolfspeed, Inc. Power module having pin fins
USD963574S1 (en) * 2020-04-10 2022-09-13 Fukushima Sic Applied Engineering Inc. Power supply
DE102021208579A1 (en) 2021-08-06 2023-02-09 Zf Friedrichshafen Ag Transmission for a motor vehicle

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT383228B (en) * 1978-07-21 1987-06-10 Bbc Brown Boveri & Cie COOLING ELEMENT WITH FORCED CIRCUIT COOLING FOR SEMICONDUCTOR COMPONENTS OF THE POWER ELECTRONICS
US5158912A (en) * 1991-04-09 1992-10-27 Digital Equipment Corporation Integral heatsink semiconductor package
US5447189A (en) * 1993-12-16 1995-09-05 Mcintyre; Gerald L. Method of making heat sink having elliptical pins
US6039114A (en) * 1996-01-04 2000-03-21 Daimler - Benz Aktiengesellschaft Cooling body having lugs

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3766440A (en) * 1972-08-11 1973-10-16 Gen Motors Corp Ceramic integrated circuit convector assembly
NL174393C (en) 1975-04-18 1984-06-01 Burnham Europa Bv HEAT EXCHANGER FOR HEATING A LIQUID, SUCH AS WATER, BY means of a hot gas.
JPS5769768A (en) 1980-10-20 1982-04-28 Fujitsu Ltd Equipping structure of electronic circuit unit containing high electric power parts
US4546410A (en) * 1983-10-31 1985-10-08 Kaufman Lance R Circuit package with membrane, containing thermoconductive material, ruptured against a heat sink
JPH02276264A (en) * 1989-04-18 1990-11-13 Nec Corp Ceramic package provided with heat sink
US5041902A (en) * 1989-12-14 1991-08-20 Motorola, Inc. Molded electronic package with compression structures
DE9017041U1 (en) * 1990-12-18 1991-03-07 Akyuerek, Altan, Dipl.-Ing., 8560 Lauf, De
DE59107655D1 (en) * 1991-02-22 1996-05-09 Asea Brown Boveri High-performance semiconductor component that can be switched off
JPH05136304A (en) * 1991-11-14 1993-06-01 Mitsubishi Electric Corp Semiconductor module and power controller using same
US5294831A (en) 1991-12-16 1994-03-15 At&T Bell Laboratories Circuit pack layout with improved dissipation of heat produced by high power electronic components
US5212627A (en) * 1992-01-31 1993-05-18 Motorola, Inc. Electronic module housing and assembly with integral heatsink
US6140571A (en) * 1992-08-06 2000-10-31 Pfu Limited Heat-generating element cooling device
US6326678B1 (en) * 1993-09-03 2001-12-04 Asat, Limited Molded plastic package with heat sink and enhanced electrical performance
DE19527867A1 (en) 1995-07-29 1997-01-30 Schulz Harder Juergen Metal substrate for electrical and/or electronic semiconductor circuit - has Peltier chip connected between respective overlapping metallisation structures of upper and lower ceramic layer
DE19817333C5 (en) * 1998-04-18 2007-04-26 Conti Temic Microelectronic Gmbh Electric drive unit consisting of electric motor and electronic module
US6337228B1 (en) * 1999-05-12 2002-01-08 Amkor Technology, Inc. Low-cost printed circuit board with integral heat sink for semiconductor package
US6729383B1 (en) * 1999-12-16 2004-05-04 The United States Of America As Represented By The Secretary Of The Navy Fluid-cooled heat sink with turbulence-enhancing support pins
US20020018338A1 (en) * 2000-01-11 2002-02-14 Mccullough Kevin A. Insert molded heat sink assembly
US6212074B1 (en) * 2000-01-31 2001-04-03 Sun Microsystems, Inc. Apparatus for dissipating heat from a circuit board having a multilevel surface
US6614123B2 (en) * 2001-07-31 2003-09-02 Chippac, Inc. Plastic ball grid array package with integral heatsink

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT383228B (en) * 1978-07-21 1987-06-10 Bbc Brown Boveri & Cie COOLING ELEMENT WITH FORCED CIRCUIT COOLING FOR SEMICONDUCTOR COMPONENTS OF THE POWER ELECTRONICS
US5158912A (en) * 1991-04-09 1992-10-27 Digital Equipment Corporation Integral heatsink semiconductor package
US5447189A (en) * 1993-12-16 1995-09-05 Mcintyre; Gerald L. Method of making heat sink having elliptical pins
US6039114A (en) * 1996-01-04 2000-03-21 Daimler - Benz Aktiengesellschaft Cooling body having lugs

Also Published As

Publication number Publication date
DE10102621A1 (en) 2002-08-01
DE10102621B4 (en) 2006-05-24
US20040057208A1 (en) 2004-03-25
US6952347B2 (en) 2005-10-04
WO2002058142A2 (en) 2002-07-25
WO2002058142A3 (en) 2003-11-06

Similar Documents

Publication Publication Date Title
DE10102621B4 (en) power module
EP0221399B1 (en) Semiconductor power module
EP1982355B1 (en) Power electronics assembly
DE102017200256B4 (en) Electrode terminal, semiconductor device and power conversion device
DE10162966A1 (en) Power semiconductor modules for transformers has multilayer ceramic between heat sink and chip
EP2436032A1 (en) Cooled electric unit
WO1998032213A2 (en) Power module with a circuit arrangement comprising active semiconductor components and passive components, and method for producing same
DE10157362B4 (en) Power module and method for its production
DE102016115221A1 (en) Method for connecting at least two substrates to form a module
DE10204200A1 (en) power module
WO2007045112A1 (en) Power housing for semiconductor chips and the arrangement thereof for heat dissipation
EP3751602A1 (en) Insulated metal substrate for a power electronic module
DE19529237C1 (en) High power semiconductor circuit device
WO2018134332A1 (en) Semiconductor module having a base plate with a concave curvature
WO2018037047A1 (en) Power module, method for producing same, and power electronics circuit
DE10134187A1 (en) Cooler for power semiconductor components and modules with individual cooling elements in two-dimensional matrix
DE10217214B4 (en) Cooling arrangement for a circuit arrangement
DE10125697B4 (en) Power semiconductor module and method for manufacturing a power semiconductor module
DE19931694B4 (en) Method for producing electrical circuits or modules and electrical circuit or electrical module produced by this method
EP1166355A1 (en) Multi-chip module
DE102019108932B4 (en) Semiconductor module and method for its manufacture
DE10121969C1 (en) Circuit arrangement in pressure contact and method for its production
DE10102619A1 (en) Power module for supplying electric motors has corrugated heat sink attached to underside of thick thermally conductive base
DE19735074A1 (en) Power module
WO2003071601A2 (en) Circuit module and method for the production thereof

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20030612

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

17Q First examination report despatched

Effective date: 20050223

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: CONTI TEMIC MICROELECTRONIC GMBH

REG Reference to a national code

Ref country code: DE

Ref legal event code: R003

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN REFUSED

18R Application refused

Effective date: 20190530